JP2003101193A - 回路基板の製造方法 - Google Patents

回路基板の製造方法

Info

Publication number
JP2003101193A
JP2003101193A JP2002011743A JP2002011743A JP2003101193A JP 2003101193 A JP2003101193 A JP 2003101193A JP 2002011743 A JP2002011743 A JP 2002011743A JP 2002011743 A JP2002011743 A JP 2002011743A JP 2003101193 A JP2003101193 A JP 2003101193A
Authority
JP
Japan
Prior art keywords
film
reinforcing plate
thickness
flexible film
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002011743A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003101193A5 (https=
Inventor
Takayoshi Akamatsu
孝義 赤松
Yoshio Matsuda
良夫 松田
Yutaka Enomoto
裕 榎本
Masahiro Kokuni
昌宏 小國
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2002011743A priority Critical patent/JP2003101193A/ja
Publication of JP2003101193A publication Critical patent/JP2003101193A/ja
Publication of JP2003101193A5 publication Critical patent/JP2003101193A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP2002011743A 2001-07-19 2002-01-21 回路基板の製造方法 Pending JP2003101193A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002011743A JP2003101193A (ja) 2001-07-19 2002-01-21 回路基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-219295 2001-07-19
JP2001219295 2001-07-19
JP2002011743A JP2003101193A (ja) 2001-07-19 2002-01-21 回路基板の製造方法

Publications (2)

Publication Number Publication Date
JP2003101193A true JP2003101193A (ja) 2003-04-04
JP2003101193A5 JP2003101193A5 (https=) 2005-07-28

Family

ID=26618989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002011743A Pending JP2003101193A (ja) 2001-07-19 2002-01-21 回路基板の製造方法

Country Status (1)

Country Link
JP (1) JP2003101193A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005175445A (ja) * 2003-11-19 2005-06-30 Toray Ind Inc 回路基板用部材と回路基板用部材の製造方法
WO2010071145A1 (ja) * 2008-12-19 2010-06-24 東洋紡績株式会社 積層体およびその製造方法、積層体回路板
WO2011030716A1 (ja) * 2009-09-08 2011-03-17 旭硝子株式会社 ガラス／樹脂積層体、及びそれを用いた電子デバイス
JP2011245674A (ja) * 2010-05-25 2011-12-08 Toyobo Co Ltd 積層体、電気回路付加積層板、半導体付加積層体およびその製造方法
JP7279840B1 (ja) 2022-08-23 2023-05-23 Ａｇｃ株式会社 積層体

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005175445A (ja) * 2003-11-19 2005-06-30 Toray Ind Inc 回路基板用部材と回路基板用部材の製造方法
WO2010071145A1 (ja) * 2008-12-19 2010-06-24 東洋紡績株式会社 積層体およびその製造方法、積層体回路板
JPWO2010071145A1 (ja) * 2008-12-19 2012-05-31 東洋紡績株式会社 積層体およびその製造方法、積層体回路板
JP2012232594A (ja) * 2008-12-19 2012-11-29 Toyobo Co Ltd 積層体
WO2011030716A1 (ja) * 2009-09-08 2011-03-17 旭硝子株式会社 ガラス／樹脂積層体、及びそれを用いた電子デバイス
US8609229B2 (en) 2009-09-08 2013-12-17 Asahi Glass Company, Limited Glass/resin laminate, and electronic device using same
JP2011245674A (ja) * 2010-05-25 2011-12-08 Toyobo Co Ltd 積層体、電気回路付加積層板、半導体付加積層体およびその製造方法
JP7279840B1 (ja) 2022-08-23 2023-05-23 Ａｇｃ株式会社 積層体
JP2024030000A (ja) * 2022-08-23 2024-03-07 Ａｇｃ株式会社 積層体

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