JP2003092277A - Wet treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wet treatment apparatus in which a treatment solution can be supplied/recovered stably during an operation and in which the flow of the treatment solution to the discharge side from the introduction side of the treatment solution can be maintained uniform. SOLUTION: In the wet treatment apparatus, a face facing a substrate W to be treated is provided with a nozzle 1 which comprises a treatment-solution introduction part 3 used to introduce the treatment solution 10 to the substrate W to be treated, a treatment-solution recovery part 4 used to recover the treatment solution 10 from the substrate W to be treated and a board 2 used to connect the part 3 to the part 4. In the apparatus, a treatment-solution inlet port 16 which passes the board 2 and to which the treatment solution is introduced and a treatment-solution recovery port 17 are formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wet process including a nozzle for supplying a processing liquid onto an object to be processed in a wet processing step such as cleaning and etching in a manufacturing process of semiconductor devices, liquid crystal display panels and the like. The present invention relates to a processing device.

[0002]

2. Description of the Related Art In the field of electronic devices such as semiconductor devices and liquid crystal display panels, a step of cleaning a semiconductor substrate or a glass substrate, which is an object to be processed, is essential during the manufacturing process. In the cleaning process, various treatment liquids such as ultrapure water, electrolytic ion water, ozone water and hydrogen water are used to remove various substances to be removed during the manufacturing process. Is supplied onto the substrate from the nozzle of the cleaning device. However, when the conventional general cleaning nozzle is used, there is a problem that the amount of the processing liquid used increases.
For example, a substrate having a size of 500 mm square is washed with a treatment liquid such as electrolytic ion water, and after the washing with the treatment liquid and the rinse with the rinse water, the residual amount of particles on the substrate is 0.5 particles / cm. ^In order to achieve a cleaning level of ² levels, it was necessary to use a processing solution and a rinse processing solution of about 25 to 30 liters / minute.

Therefore, as a liquid-saving type cleaning nozzle capable of significantly reducing the amount of the processing liquid used as compared with the conventional type, when the processing liquid is supplied onto the substrate to be processed and the substrate to be processed is wet-processed. A wet processing nozzle used, wherein an introduction passage having an introduction port for introducing a treatment liquid at one end and a discharge passage having a discharge port for discharging a used treatment liquid to the outside are formed at one end. There has been proposed a wet processing nozzle in which an introduction opening and a discharge opening that open toward the substrate to be processed are provided at the other ends of the introduction path and the discharge path, respectively.

FIG. 7 is a cross-sectional view showing an example of a wet processing nozzle having the above-described structure. The wet processing nozzle 100 shown in this figure shows a substrate W to be processed, for example, an arrow A.
While moving in the direction of, the processing liquid is supplied onto the substrate W to be cleaned. This wet processing nozzle 100 has an inlet pipe 101 having an inlet 101a for introducing the treatment liquid 110 at one end, and an outlet 102a having one end for discharging the treatment liquid 110 after the wet treatment to the outside. A pipe 102 is provided, the other ends of the introduction pipe 101 and the discharge pipe 102 are connected to each other, and a connecting portion 103 facing the substrate W to be processed is formed, and the introducing pipe 101 is opened to this connecting portion 103. First opening 1
01b and the second opening 10 where the discharge pipe 102 is open
2b is provided. In the space between the connecting portion 103 and the substrate W to be processed, a processing region 105 for performing wet processing is formed. Further, the connecting portion 103 is provided with an ultrasonic transducer for applying ultrasonic vibration to the treatment liquid 110 in the treatment area 105. The ultrasonic transducer here includes a vibrating plate 106, side plates 107 rising from both ends of the main surface of the vibrating plate 106, and an ultrasonic vibrator main body 108 provided on the main surface of the vibrating plate 106. There is. The ultrasonic transducer 108 here is connected to a power source (not shown). In addition, the discharge port 10 of the discharge pipe 102
A decompression pump (not shown) is connected to 2a. In addition, the processing liquid 110 that is introduced into and discharged from the first opening 101b and the second opening 102b through the openings 101b and 102b is uniformly introduced onto the substrate W to be processed. The rectifying members 111 and 112 are provided for this purpose. These rectifying members 111 and 112 are
The processing liquid is uniformly supplied to the entire region to be processed of the substrate W to be processed, and a sheet made of Teflon (registered trademark) or the like having a plurality of small through holes is used.

The treatment liquid 110 is supplied from the introduction port 101a of the introduction pipe 101 and reaches the rectifying member 111 of the first opening 101b, but the discharge port 102a of the discharge pipe 102 has the decompression pump as described above. (Not shown) is connected, so by controlling the suction pressure of the decompression pump,
The pressure difference between the pressure (including the surface tension of the processing liquid 110 and the surface tension of the surface to be processed of the substrate W to be processed) of the processing liquid 110 supplied to the introduction pipe 101 on the side of the first opening 101b and the atmospheric pressure. Can be controlled. That is, the processing liquid 1 in contact with the atmosphere at the first opening 101b
The relationship between the pressure Pw of 10 (including the surface tension of the processing liquid and the surface tension of the surface to be processed of the substrate W to be processed) and the atmospheric pressure Pa is P
By setting w≈Pa, the processing liquid 110, which is supplied to the substrate W to be processed through the rectifying member 111 of the first opening 101b and is in contact with the substrate W to be processed, is the nozzle 1 for the wet process.
00 is discharged to the discharge pipe 102 without leaking to the outside. Therefore, the wet process nozzle 100 of FIG.
The amount of the processing liquid 110 used can be significantly reduced.
Further, in the wet processing nozzle 100 shown in FIG. 7, when the substrate W to be processed is cleaned, the processing liquid 11 is applied to the processing region 105.
With the supply of 0, ultrasonic vibration can be applied by the ultrasonic vibrator main body 108, and the substrate W to be processed can be cleaned in cooperation with the processing liquid 110.

[0006]

However, in the wet processing nozzle 100 shown in FIG. 7, the processing liquid 110 is applied to the processing region 105 while the processing liquid 110 is being supplied while the substrate W to be processed is being wet-processed. It was found that there may be a problem that the product is not supplied. In the wet process nozzle 100, the side plate 107 of the connecting portion 103 is formed by bending the plate material so as to rise from both ends of the vibrating plate 106.
The present inventor has considered that the curved surface portions 107R are formed at the corners at both ends of the bottom portion of the. That is, when such a curved surface portion 107R is present, fine bubbles entrained in the processing liquid 110 supplied from the lower surface of the rectifying member 111 toward the substrate W to be processed generate the rectifying member 111 and the curved surface portion 107R.
The bubbles are retained in the groove 101A having a substantially wedge-shaped cross section formed by and the bubbles increase with the lapse of time in the wet treatment. Then, when the bubbles reach the size of the substrate W to be processed, the flow of the processing liquid 110 in the processing region 105 is partially or wholly blocked by the bubbles. Since the wet processing apparatus 100 controls the pressure of the processing liquid 110 by the decompression pump connected to the discharge passage 102, when the processing liquid 110 is divided in the processing region 105, the processing liquid 110 is discharged through the first opening portion. The force of drawing from 101b to the processing region 105 becomes weak, and the supply of the processing liquid 110 is stopped. Then, when the supply of the processing liquid 110 is stopped, the cleaning ability is lowered, and the cleaning of the substrate W to be processed becomes insufficient.

Therefore, the present invention has been made to solve the above-mentioned problems, and its purpose is to be able to stably supply / recover the treatment liquid during operation and to introduce the treatment liquid from the introduction side. It is an object of the present invention to provide a wet processing apparatus capable of maintaining a uniform flow of processing liquid to the discharge side.

[0008]

In order to achieve the above object, the present invention has the following constitutions. The wet processing apparatus of the present invention, on the surface facing the object to be processed, a processing solution introducing section for introducing a processing solution into the object to be processed, a processing solution recovery section for recovering the processing solution from the object, and It is a wet processing device provided with a nozzle which has a connecting part which connects a processing liquid introduction part and a processing liquid recovery part, A processed object side surface of the connection part, and an object side of the processing liquid introduction part. And the surface of the treatment liquid recovery section on the side of the object to be treated are formed flush with each other,
In a portion flush with the connecting portion of the treatment liquid introducing portion,
A treatment liquid introducing port for introducing the treatment liquid is formed, and a treatment liquid collecting port is formed in a portion of the treatment liquid collecting unit that is flush with the connecting portion.

The wet processing apparatus of the present invention is configured such that the processing liquid is supplied from the processing liquid introduction port to the object to be processed and the processing liquid used for the wet processing of the object is recovered from the processing liquid recovery port. It is a processing device. That is, a region sandwiched between the nozzle and the object to be processed and extending from the processing liquid introduction port to the processing liquid recovery port is a processing region where the processing liquid flows and the object to be processed is wet-processed. And, the wet processing apparatus of the present invention, the surface of the processing liquid introduction section and the processing object side of the processing solution recovery section, and the surface of the processing object side of the connecting portion are formed flush with each other, In the processing region, there is realized a structure in which no place where bubbles stay is formed in the path from the processing liquid introduction port to the processing liquid recovery port. Therefore, unlike the above-described conventional wet processing nozzle 100, the wet processing apparatus of the present invention does not block the flow of the processing liquid by growing bubbles in the processing region 105, and prevents the processing liquid from flowing in the processing region. The flow can be maintained stable.

Next, in the wet processing apparatus of the present invention, the surface of the connecting portion on the side of the object to be processed, the surface of the processing liquid introducing portion on the side of the object to be processed, and the surface of the processing liquid collecting portion on the side of the object to be processed. The surface of
The processing liquid introduction port and the processing liquid recovery port may be formed from the same substrate and formed so as to penetrate the substrate.

In the wet processing apparatus of this structure, a substrate is arranged on the side of the nozzle facing the object to be processed, and a processing liquid introduction port and a processing liquid recovery port are formed by penetrating the substrate. With such a configuration, since the processing region from the processing liquid introduction port to the processing liquid recovery port is a region sandwiched between the surface of the substrate on the side of the object to be processed and the object to be processed, It is possible to form the surface of the nozzle on the side of the processing region more evenly, thereby more effectively preventing retention of bubbles entrained in the processing liquid introduced from the processing liquid inlet in the processing region. be able to.

Next, in the wet processing apparatus of the present invention, the hollow partition member sandwiched by the substrate and a supporting plate arranged to face the surface of the substrate opposite to the object to be processed is used. A treatment liquid introduction part and a treatment liquid recovery part are formed,
A processing liquid can be stored in a hollow portion of the partition member, and the hollow portion, the processing liquid introduction port, and the processing liquid recovery port are respectively connected to form a processing liquid flow path. It can also be configured.

A hollow partition member provided on the substrate forms a processing liquid introducing portion and a processing liquid collecting portion, and the processing liquid can be stored in the hollow portion so that the processing liquid can be connected to the hollow portion. The flow rate of the processing liquid in supplying the processing liquid to the processed processing liquid inlet or collecting the processing liquid from the processing liquid recovery port can be adjusted by the storage in the hollow portion, and the flow of the processing liquid can be made uniform. be able to. Furthermore, by using the substrate, the partition member, and the support plate as the basic structure as described above, it is possible to simplify the structure and reduce the manufacturing cost of the nozzle, and to realize a nozzle that is easy to maintain and has no trouble. it can. Further, it is needless to say that by forming the surface facing the object to be processed on the one surface side of the substrate, it is possible to prevent the bubbles entrained in the processing liquid from staying in the processing region.

Next, the wet processing apparatus of the present invention is configured such that the connecting portion is provided with vibration applying means for applying vibration to the processing liquid between the connecting portion and the object to be processed. You can also

With such a structure, when the wet processing apparatus of the present invention is used as a cleaning apparatus, for example, the vibration applied to the processing liquid (cleaning liquid) by the vibration imparting means makes it possible to remove adhering substances. The cleaning efficiency can be improved. Further, this vibration applying means may be detachable from the nozzle, and with such a configuration, it can be easily replaced with another vibration applying means having a different vibration frequency or a light irradiation means. Therefore, the versatility of the wet processing apparatus can be improved.

Next, in the wet processing apparatus of the present invention, the surface of the connecting portion on the side of the object to be processed is formed of a member that transmits ultraviolet rays, and the connecting portion faces the object to be processed. It is also possible to adopt a configuration in which an ultraviolet ray irradiation means for emitting ultraviolet rays is provided.

With such a structure, it is possible to realize a wet processing apparatus which can generate ozone in the treatment liquid to ozone-treat the object to be treated and can sterilize the treatment liquid. Further, it is needless to say that this ultraviolet irradiation means can also be attached to and detached from the nozzle similarly to the vibration applying means.

Next, in the wet processing apparatus of the present invention, an ultraviolet irradiation means is housed in a space surrounded by the connecting portion, the support plate and the partition member, and the inside of the space is filled with an inert gas. There may be provided a gas replacement means for replacing

With such a structure, it is possible to prevent the ultraviolet rays radiated from the ultraviolet ray radiating means from being absorbed by ambient oxygen and being attenuated. Therefore, according to this configuration, it is possible to increase the amount of ultraviolet rays that pass through the connecting portion and reach the object to be processed, and increase the ozone generation efficiency in the processing liquid and the sterilization efficiency of the processing liquid.

Next, in the wet processing apparatus of the present invention, it is preferable that the substrate is made of a hydrophilic material. With such a configuration, the affinity between the processing liquid that flows in contact with the substrate and the substrate can be increased,
The flow of the processing liquid in the processing region can be made smoother, and the uniformity and controllability of the flow of the processing liquid can be improved.

Next, in the wet processing apparatus of the present invention, fine irregularities may be formed on the surface of the substrate on the side of the object to be processed. With such a configuration, the resistance of the substrate surface against the flow of the processing liquid can be reduced, the flow of the processing liquid can be made smoother, and the controllability of the flow of the processing liquid can be improved.

Next, in the wet processing apparatus of the present invention, it is preferable that a member made of a hydrophobic material is arranged in the peripheral portion of the substrate on the processing liquid introducing port side. With such a configuration, since the spread of the treatment liquid to the outside of the treatment liquid inlet can be regulated by the hydrophobic material, the treatment liquid can be easily confined in the treatment area, and as a result, The controllability of the flow of the processing liquid can be improved.

Next, in the wet processing apparatus of the present invention, it is preferable that a member made of a hydrophobic material is arranged in the peripheral portion of the substrate on the processing liquid recovery port side. With such a configuration, the treatment liquid can be easily confined in the treatment region on the treatment liquid inlet side as well as the treatment liquid inlet side, and the controllability of the flow of the treatment liquid can be improved.

Next, the wet processing apparatus of the present invention comprises a nozzle or a means for moving the object to be processed, which moves the nozzle and the object to be processed relative to each other while keeping a constant distance from each other. be able to. With such a configuration, it is possible to perform the wet processing of the object to be processed while moving the nozzle on the surface to be processed of the object to be processed, and to realize a wet processing apparatus with higher work efficiency. You can

[0025]

Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to the following embodiments.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
FIG. 2 is a perspective configuration diagram schematically showing the overall configuration of the cleaning apparatus (wet processing apparatus) which is the embodiment of FIG. 2, and FIG. 2 is a diagram showing a sectional structure taken along line BB ′ shown in FIG. 1. Further, FIG. 3 is a plan view of the cleaning nozzle 1 shown in FIGS. As shown in FIGS. 1 and 2, the cleaning apparatus according to the present embodiment includes a moving unit (not shown) that moves a substrate W to be processed, which is an object to be processed, in a moving direction A with respect to the cleaning nozzle 1. It is roughly configured.

The cleaning nozzle 1 shown in FIGS. 1 to 3 has a flat plate-shaped substrate (connecting portion) 2, a partition member 11 surrounding the outer periphery of the substrate 2 and arranged on the substrate 2, and a partition member. 11
It comprises a support plate 7 arranged above and a vibration applying means 13 provided on the surface of the substrate 2 opposite to the substrate W to be processed. The substrate 2 is composed of a metal substrate such as stainless steel, quartz, a glass substrate, or the like, depending on the type of cleaning process performed on the substrate W to be processed. As shown in FIGS. 2 and 3, the substrate 2 is a member that forms a surface of the cleaning nozzle 1 that faces the substrate W to be processed, and a plurality of processing liquid inlets 16 are provided along the long side edges on both sides thereof. Also, a processing liquid recovery port 17 is formed. More specifically, on the surface of the substrate 2 opposite to the substrate W to be processed, groove portions 2A and 2B having a rectangular shape in plan view are engraved along the long side edges on both sides thereof. A plurality of processing liquid introducing ports 16 are formed so as to penetrate to the processed substrate W side, and a plurality of processing liquid recovery ports 17 are formed so as to penetrate from the bottom surface of the groove portion 2B to the processed substrate W side. In the cleaning nozzle 1 of the present embodiment, the processing liquid (cleaning processing liquid) 10 is supplied to the target substrate W through the processing liquid inlet 16 and the cleaning liquid 10 is supplied through the processing liquid recovery port 17. It is designed to be collected from W.
A region between the processing liquid inlet 16 and the processing liquid recovery port 17 that is sandwiched between the substrate 2 and the substrate W to be processed is a processing region 5 in the cleaning apparatus of the present embodiment. The surface of the substrate W to be processed that is in contact with is subjected to cleaning (wet processing).

The processing liquid inlet 16 and the processing liquid recovery port 1
7 are formed with predetermined intervals and hole diameters, respectively, so that the cleaning liquid 10 can be uniformly supplied and collected in the width direction of the target substrate W (longitudinal direction of the substrate 2). In FIG. 3, as an example, fifteen processing liquid inlets 16 (processing liquid recovery ports 17) having the same hole diameter are provided in the groove 2A (the groove 2).
Although the example in which the array is formed at equal intervals along the length direction of B) is shown, it is not limited to these hole diameters, intervals, and shapes, and the array of the processing liquid introduction port 16 and the processing liquid recovery port 17 is shown. If the flow rate of the processing liquid 10 in the direction (longitudinal direction of the substrate 2) can be made uniform, any shape and arrangement interval can be adopted.

At least the surface of the substrate 2 on the side of the substrate to be processed W is preferably hydrophilic, and the inner surfaces of the processing liquid inlet 16 and the processing liquid recovery port 17 formed through the substrate 2 are formed. The side is also preferably hydrophilic. By making the surface of the substrate 2 forming the processing region 5 hydrophilic,
The flow of the processing liquid 10 in the processing region 5 can be made smooth and the controllability thereof can be improved. Further, by making the inner surfaces of the processing liquid inlet 16 and the processing liquid recovery port 17 hydrophilic, the introduction and recovery of the processing liquid 10 can be performed smoothly,
The flow of the processing liquid 10 can be made more stable.

The partition member 11 provided on the substrate 2 has a substantially frame shape in plan view as shown in FIGS. 2 and 3, and a part of its peripheral portion is projected to the outer peripheral side of the substrate 2 and The surface of the peripheral portion on the side of the target substrate W is the target substrate W of the substrate 2.
It is flush with the side surface. In other words, in other words, the substrate 2 is fitted to the stepped portion formed along the inner circumference of the frame-shaped partition wall member 11 on the substrate W side to be processed. Hollow portions 11A and 11B are formed in the partition member 11 along both long sides thereof in the thickness direction of the partition member 11, and these hollow portions 11A and 11B are formed.
Are groove portions 2A, 2A formed in the substrate 2 and having a rectangular shape in plan view.
The groove 2A and the groove 2B are formed at the positions corresponding to B in substantially the same planar shape as the grooves 2A and 2B, and the hollow portion 11A and the groove portion 2A communicate with the hollow portion 11B and the groove portion 2B, respectively. The portion including the hollow portion 11A and the treatment liquid introduction port 16 is the treatment liquid introduction portion 3, and the hollow portion 11B and the treatment liquid recovery port 1 are provided.
A portion including 7 is a treatment liquid recovery unit 4. The processing liquid 10 can be stored in the hollow portions 11A and 11B, so that the processing liquid 10 can be more uniformly supplied to the processing liquid introducing port 16 in the processing liquid introducing unit 3. In the processing liquid recovery unit 4, the processing liquid 10 can be recovered from the substrate W to be processed more uniformly.

The partition member 11 is preferably made of a hydrophobic material such as Teflon (registered trademark).
Since the partition member 11 is made of a hydrophobic material, the treatment liquid 10 can be easily confined in a region (the processing region 5) inside the partition member 11 that surrounds the outer peripheral side of the substrate 2 and faces the substrate W to be processed. The controllability of the flow of the processing liquid 10 in the processing region 5 can be improved, and the processing liquid 10 can be made to flow more stably more easily. Further, since the amount of the processing liquid 10 flowing out of the processing region 5 can be suppressed, the usage amount of the processing liquid 10 can be reduced, and reattachment of particles taken into the processing liquid 10 can be suppressed. .

A support plate 7 is provided on the upper side of the partition member 11 in FIG. 2, and a central portion of the support plate 7 in the longitudinal direction is provided.
The processing liquid introduction pipe 7A and the processing liquid recovery pipe 7B are the partition member 1
The processing liquid introduction pipe 7A and the processing liquid recovery pipe 7B extend through the support plate 7 and communicate with the opposite side of the support plate 7. ing. The support plate 7 side of the treatment liquid introduction pipe 7A is disposed above the hollow portion 11A so that the inside of the treatment liquid introduction pipe 7A communicates with the hollow portion 11A, and the treatment liquid recovery pipe 7B has a support plate 7 side. The processing liquid recovery pipe 7 is disposed above the hollow portion 11B.
The inside of B and the hollow portion 11B communicate with each other.

Thus, the cleaning nozzle 1 of this embodiment
Then, from the processing liquid introducing pipe 7A, the hollow portion 11A and the groove portion 2 are formed.
The processing liquid 10 is introduced into the substrate W to be processed through a path reaching the processing liquid introducing port 16 via A.
The treatment liquid 10 passes through the path from the treatment liquid recovery port 17 to the treatment liquid recovery pipe 7B via the groove 2B and the hollow portion 11B.
Are collected from the substrate W to be processed and are discharged to the outside.

The joint surfaces between the partition member 11 and the substrate 2 and between the partition member 11 and the support plate 7 shown in FIG.
In order to prevent leakage of the processing liquid 10 flowing in 1B,
It is sealed with a sealing material (not shown) or the like. The sealing of the joint surfaces is not particularly limited in terms of material and structure as long as the treatment liquid 10 can be prevented from leaking to the outside through these joint surfaces. For example, an O ring may be provided on these joint surfaces. Alternatively, the joint surface may be sealed by applying an adhesive or the like.

In the cleaning nozzle 1 of this embodiment, the substrate 2
Vibration imparting means 1 for imparting vibration to the treatment liquid 10 in a space S surrounded by the support plate 7 and the partition member 11.
3 is housed, and one surface side thereof is joined to the inner surface side of the substrate 2. Further, a cable 18 for driving and controlling the vibration applying means 13 is connected to the vibration applying means 13, and the cable 18 penetrates the support plate 7 on the end side of the support plate 7 and is connected to the cleaning nozzle 1. It is led out to the outside and connected to a drive control unit (not shown). As the vibration imparting means, an ultrasonic vibrator that generates ultrasonic waves with a vibration frequency of about 0.7 to 1.5 MHz, or a vibration frequency of 28 to 60 kHz
A bolted Langevin type oscillator that generates ultrasonic waves of a relatively low frequency of about z can be used, and an appropriate frequency can be selected depending on the type of the substrate W to be cleaned and the purpose of cleaning. .

In the cleaning nozzle 1 of the present embodiment, the treatment liquid recovery pipe 7B of the support plate 7 is provided with a pressure control unit (not shown). The pressure controller is connected to the atmosphere on the side of the processing liquid introducing port 16 so that the processing liquid 10 supplied from the processing liquid introducing port 16 and contacting the substrate W to be processed is collected by the processing liquid collecting port 17 after the cleaning process. The pressure of the processing liquid 10 in contact (including the surface tension of the processing liquid and the surface tension of the substrate to be processed) and the atmospheric pressure are balanced. More specifically, the pressure control unit can be configured by a decompression pump connected to the treatment liquid recovery pipe 7B, and the decompression pump controls the force for sucking the treatment liquid 10 in the treatment liquid recovery pipe 7B. By doing so, the pressure is balanced with the atmospheric pressure. In this way, the processing liquid 10 introduced into the processing area 5 does not leak to the outside of the processing area 5,
It is recovered to the processing liquid recovery port 17. That is, the substrate W to be processed
The processing liquid 10 introduced into the processing liquid 5 is collected in the processing liquid collecting unit 4 without touching a region other than the surface of the target substrate W in the processing region 5.

The cleaning nozzle 1 of the present embodiment having the above configuration
The substrate 2 is disposed on the surface facing the substrate W to be processed, and the processing liquid introducing port 16 and the processing liquid collecting port 17 are formed so as to penetrate the substrate 2, so that the processing liquid is introduced from the processing liquid introducing port 16. The surface that contacts the processing area 5 that reaches the recovery port 17 is within one surface of the substrate 2. That is, the end of the processing liquid introducing port 16 on the processed substrate W side, the surface of the substrate 2 on the processed substrate W side, and the end of the processing liquid recovery port 17 on the processed substrate W side are flush with each other. Has been formed. With such a structure, when air bubbles are entrained in the treatment liquid 10 and enter the treatment area 5, the position where the air bubbles can stay is eliminated, and the flow of the treatment liquid 10 due to the stay of the air bubbles is eliminated. The interruption does not occur. Therefore, according to the cleaning nozzle 1 and the cleaning apparatus of the present embodiment, the flow of the processing liquid 10 in the processing area 5 can be stably maintained, and the substrate W to be processed can be uniformly and uniformly cleaned. Is possible.

Further, in the cleaning nozzle 1 having the above structure, if the vibration is applied from the vibration applying means 13 while the processing liquid 10 is being supplied to the processing region 5, the processing liquid 10 and this vibration are caused to cooperate with each other. The processed substrate W can be cleaned, and the cleaning efficiency can be further improved.

Although FIG. 2 shows the case where the cleaning nozzle 1 is arranged only on one surface side of the substrate W to be processed, the cleaning nozzle 1 according to the present embodiment is processed as shown in FIG. It can be arranged on both sides of the substrate W for use. Figure 4
Since the structure of the cleaning nozzle shown in FIG. 2 is the same as that in FIG. 2, its description is omitted. As shown in FIG. 4, by disposing the cleaning nozzles 1 on both sides of the substrate W to be processed, both surfaces of the substrate W to be processed can be cleaned at one time, and the cleaning process can be performed efficiently. By cleaning both sides simultaneously,
The contamination of the substrate W to be processed after cleaning can be minimized.

As shown in FIG. 4, when the cleaning nozzles 1 are arranged on both sides of the substrate W to be processed, the partition member 11 of the cleaning nozzle 1 arranged on the lower surface side of the substrate W to be processed is the substrate. It may be formed so as to slightly project to the processed substrate W side from the surface of the processed substrate W side. With such a configuration, even in the lower cleaning nozzle in which it is difficult to hold the processing liquid 10 in the processing region 5 as compared with the cleaning nozzle arranged on the upper side of the substrate W to be processed. The treatment liquid 10 can be easily confined in the treatment region 5, and the treatment liquid 1
The stability of the zero flow can be further increased.

(Second Embodiment) Next, a cleaning apparatus (wet processing apparatus) according to a second embodiment of the present invention will be described below with reference to FIG. FIG. 5 is a diagram showing a cross-sectional structure of the cleaning nozzle 20 of this embodiment. The cleaning nozzle 20 shown in this figure is different from the cleaning nozzle 1 shown in FIG. 2 in that the substrate 22 is made of a material that transmits ultraviolet rays, and the substrate 22, the support plate 7, and the partition member 11 are provided. The ultraviolet irradiation means 23 is housed in a space S surrounded by and a gas introduction pipe 25 and a gas discharge pipe 26, one end of which is inserted into the space S, are provided. Since the configuration of the cleaning nozzle 20 of the present embodiment is the same as that of the first embodiment shown in FIG. 2 except for the characteristic points, the same components as those shown in FIG. The detailed description thereof will be omitted.

If the substrate 22 is made of a material capable of transmitting ultraviolet rays, it can be applied without any problem. For example, quartz or the like can be used as its constituent material. Further, similarly to the substrate 2 according to the first embodiment, the surface of the substrate 22 on the processed substrate W side is made hydrophilic in order to enhance the controllability of the flow of the processing liquid 10 in the processing region 5. Preferably.

Since the cleaning nozzle 20 of this embodiment is provided with the ultraviolet irradiation means 23, the ultraviolet rays emitted from the ultraviolet irradiation means 23 cause impurities from the surface of the processing liquid 10 and the surface of the substrate W to be processed. Can be removed, sterilized, or ozone can be generated in the treatment liquid 10 to subject the substrate W to be treated to ozone treatment. Further, a drive control unit (not shown) for driving and controlling the ultraviolet irradiation means 23 is connected via a cable 18.

The gas introduction pipe 25 and the gas discharge pipe 26 constitute gas replacement means for replacing the gas in the space S with an inert gas. That is, an inert gas supply source (not shown) connected to the other end of the gas introducing pipe 25 introduces the gas in the space S from the gas discharging pipe 26 while introducing the gas in the space S through the gas introducing pipe 25. By discharging, the atmosphere in the space S is replaced with an inert gas, and the ultraviolet rays emitted from the ultraviolet ray irradiating means 23 are absorbed by oxygen in the space S and are attenuated, so that the substrate W or the processing liquid 10 is treated. The amount of ultraviolet rays applied is not reduced. Therefore, in the cleaning nozzle 20 of the present embodiment equipped with the gas replacement means as described above, the treatment liquid 10 or the substrate W to be treated can be efficiently irradiated with ultraviolet rays, and impurities can be efficiently removed and sterilized. In addition, when ozone is generated in the treatment liquid, a sufficient ozone generation amount can be obtained.

Since the gas in the space S is replaced in the cleaning nozzle 20 of this embodiment, it is preferable that the space S has a structure capable of blocking the outside air. When the space S is cut off from the outside air, the inert gas introduced into the space S does not leak to the outside and the outside air does not mix into the space S, so that a predetermined amount of the inert gas is introduced into the space S. It is economical because the supply of the inert gas can be stopped when the gas replacement is completed and the gas replacement is completed, and the amount of the inert gas used can be reduced.

Further, in the cleaning nozzle 20 of the present embodiment shown in FIG. 5, the substrate W to be processed is supplied from the processing liquid introducing port 16.
Similar to the first embodiment, the processing liquid 10 is supplied to the processing region 5 to flow through the processing region 5 to clean the substrate W to be processed and the processing liquid 10 after cleaning is recovered to the processing liquid recovery port 17. Similarly, the flow of the processing liquid 10 in the processing region 5 can be stably maintained, and the substrate W to be processed can be efficiently cleaned. Further, similarly to the two cleaning nozzles 1 shown in FIG. 5, the cleaning nozzles 20 may be arranged on both sides of the substrate to be processed W to simultaneously clean both sides of the substrate to be processed W. Is.

(Third Embodiment) Next, an example of a cleaning apparatus including the wet processing apparatus according to any one of the above embodiments will be described with reference to FIG. FIG. 6 is a diagram showing a schematic configuration of the cleaning apparatus 51 of the present embodiment. For example, a large glass substrate (hereinafter, simply referred to as a substrate) having a size of several hundreds mm square is subjected to single-wafer cleaning as a substrate to be processed. It is a device for. In the figure, reference numeral 52 is a cleaning unit, 53 is a stage (substrate holding means), 54 to 56 and 89 are cleaning nozzles, 57 is a substrate transfer robot, 58 is a loader cassette, 59 is an unloader cassette, and 60 is hydrogen water / ozone water. Generator, 61
Is a treatment liquid regenerator, and W is a glass substrate (object to be treated).

As shown in the figure, the cleaning unit 5 is located at the center of the upper surface of the apparatus.
2 and a stage 53 for holding the substrate W is provided. The stage 53 is provided with a rectangular step portion conforming to the shape of the substrate W, and the substrate W is fitted onto the step portion, and the surface of the substrate W and the surface of the stage 53 are held on the stage 53 in a flush state. It is supposed to be done. Also,
A space is formed below the step, and a substrate elevating shaft (not shown) projects from below the stage 53 in this space. A shaft drive source (not shown) such as a cylinder is provided at the lower end of the substrate elevating shaft, and the substrate elevating shaft is moved up and down by the operation of the cylinder when the substrate W is transferred by the substrate transfer robot 57. The substrate W moves up or down as it moves up and down.

A pair of rack bases 62 are provided at positions facing each other with the stage 53 interposed therebetween.
Cleaning nozzles 54, 55, 56 and 89 are installed between the two. The cleaning nozzle is composed of four nozzles arranged in parallel, and the cleaning nozzles 54, 55, 56, 89 perform cleaning by different cleaning methods. In the case of the present embodiment, these four nozzles supply ozone to the substrate and irradiate the ultraviolet lamp 63 with ultraviolet rays to irradiate the ultraviolet rays, and the ultraviolet cleaning nozzle 54 mainly decomposes and removes organic substances. A hydrogen water ultrasonic cleaning nozzle 56 for cleaning by applying ultrasonic vibrations by the vibrator body 48, and a pure water rinse cleaning nozzle 89 for supplying pure water for rinse cleaning.

Cleaning nozzles 54, 55, 56, 89
Is a push-pull type nozzle (liquid-saving type nozzle). Of these four nozzles, the ozone water ultrasonic cleaning nozzle 55 and the hydrogen water ultrasonic cleaning nozzle 56 have the same configuration as the cleaning nozzle described with reference to FIGS. 1 to 3, or One cleaning nozzle is provided with a plurality of any of the cleaning nozzles described with reference to FIGS. 1 to 3. However, for convenience of illustration, only the ultrasonic transducer main body 48 is illustrated here, and the illustration of the processing liquid introducing unit, the processing liquid collecting unit, and the like is omitted. Further, the cleaning nozzle 54 has substantially the same configuration as the cleaning nozzle of the above-described embodiment except that the ultraviolet lamp 63 is provided in place of the ultrasonic vibrator main body 48, and the cleaning nozzle 89.
Except that the ultrasonic transducer body 48 is not provided,
It has substantially the same configuration as the cleaning nozzle of the above embodiment. However, here, for convenience of illustration, the illustration of the processing liquid introducing unit, the processing liquid collecting unit, and the like is omitted. In the cleaning device 51, the four cleaning nozzles sequentially move above the substrate W along the rack base 62 while keeping a constant distance from the substrate W, thereby cleaning the entire surface of the substrate W to be cleaned. The entire processing surface) is cleaned by four kinds of cleaning methods.

As the moving means (nozzle / processed object relative moving means) for each cleaning nozzle, sliders that can be horizontally moved along a linear guide on each rack base 62 are provided, and the upper surface of each slider is provided. Stanchions are erected on the stanchions, and cleaning nozzles 54, 55, 5
Both ends of 6, 89 are fixed. A drive source such as a motor is installed on each slider, and each slider is configured to run on the rack base 62 by itself. And
The cleaning nozzles 54, 55, 56, 89 are individually horizontally moved by operating the motors on the sliders in response to a control signal supplied from a controller (not shown) of the apparatus. A drive source such as a cylinder (not shown) is provided on the column, and the column moves up and down to raise the height of each cleaning nozzle 54, 55, 56, 89, that is, each cleaning nozzle 54, 55, 56,89
The distance between the substrate and the substrate W can be adjusted.

A hydrogen water / ozone water generator 60 and a treatment liquid regenerator 61 are provided on the side of the cleaning unit 52. A hydrogen water production device 64 and an ozone water production device 65 are incorporated in the hydrogen water / ozone water production unit 60. Any treatment liquid can be generated by dissolving hydrogen gas or ozone gas in pure water. Then, the hydrogen water produced by the hydrogen water producing apparatus 64 is supplied to the hydrogen water ultrasonic cleaning nozzle 56 by a liquid feed pump 67 provided in the middle of the hydrogen water supply pipe 66. Similarly, the ozone water produced by the ozone water producing device 65 is supplied to the ozone water supply pipe 68 by a liquid delivery pump 69.
The ozone water is supplied to the nozzle 55 for ultrasonic cleaning. Pure water is supplied to the pure water rinse cleaning nozzle 89 from a pure water supply device (not shown) in the production line.

Further, the treatment liquid regenerator 61 is provided with filters 70 and 71 for removing particles and foreign substances contained in the treatment liquid after use. A hydrogen water filter 70 for removing particles in hydrogen water and an ozone water filter 71 for removing particles in ozone water are provided in different systems. That is, the used hydrogen water (discharged liquid) discharged from the discharge port of the hydrogen water ultrasonic cleaning nozzle 56 is supplied to the hydrogen water filter 70 by the liquid feed pump 73 provided in the middle of the hydrogen water recovery pipe 72.
It is supposed to be collected at. Similarly, the used ozone water (exhaust liquid) discharged from the discharge port of the ozone water ultrasonic cleaning nozzle 55 is supplied to the ozone water filter 71 by the liquid feed pump 75 provided in the middle of the ozone water recovery pipe 74.
It is supposed to be collected at.

After passing through the hydrogen water filter 70, the hydrogen water ultrasonic cleaning nozzle 56 is supplied by the liquid feed pump 77 provided in the middle of the regenerated hydrogen water supply pipe 76.
To be supplied to. Similarly, the ozone water that has passed through the ozone water filter 71 is supplied to the ozone water ultrasonic cleaning nozzle 55 by the liquid feeding pump 79 provided in the middle of the recycled ozone water supply pipe 78. There is. Further, the hydrogen water supply pipe 66 and the regenerated hydrogen water supply pipe 76 are connected in front of the hydrogen water ultrasonic cleaning nozzle 56, and new hydrogen water is introduced into the hydrogen water ultrasonic cleaning nozzle 56 by the valve 80 or regenerated. It is possible to switch whether to introduce hydrogen water. Similarly, ozone water supply pipe 6
8 and the regenerated ozone water supply pipe 78 can switch whether new ozone water or regenerated ozone water is introduced into the ozone water ultrasonic cleaning nozzle 55. The hydrogen water and the ozone water after passing through the filters 70 and 71 are
Although the particles have been removed, the concentration of the gas in the liquid is low, so the gas may be returned to the hydrogen water producing device 64 or the ozone water producing device 65 again through the pipe to supplement the hydrogen gas or ozone gas. .

The loader cassette 5 is provided on the side of the cleaning section 62.
8. An unloader cassette 59 is detachably provided. These two cassettes 58 and 59 have the same shape capable of accommodating a plurality of substrates W, and the loader cassette 58 accommodates the substrates W before cleaning (before wet processing).
The unloader cassette 59 has been cleaned (after wet processing)
Substrate W is accommodated. A substrate transfer robot 57 is installed at an intermediate position between the cleaning unit 52, the loader cassette 58, and the unloader cassette 59. The substrate transfer robot 57 has an arm 82 having an expandable link mechanism on the upper part thereof, and the arm 82 is rotatable and can be moved up and down. The tip of the arm 82 supports and transfers the substrate W. Has become.

In the cleaning apparatus 51 having the above structure, the operator sets various cleaning conditions such as the distance between the cleaning nozzles 54, 55, 56 and 89 and the substrate W, the moving speed of the cleaning nozzle, the flow rate of the processing liquid, and the like. Other than that, the operation of each unit is controlled by the control unit, and the configuration is such that automatic operation is performed.
Therefore, when the cleaning device 51 is used, the substrate W before cleaning is set in the loader cassette 58, and the operator operates the start switch, so that the substrate transfer robot 57 can be used.
The substrate W from the loader cassette 58 onto the stage 53.
Of the cleaning nozzles 54, 5 on the stage 53.
Ultraviolet cleaning, ozone water ultrasonic cleaning, hydrogen water ultrasonic cleaning, and rinse cleaning are sequentially and automatically performed by 5, 56, 89, and after cleaning, the substrate transfer robot 57 stores them in the unloader cassette 59.

The cleaning apparatus 51 of the present embodiment is provided with the cleaning nozzles 55, 56 of the embodiment of the present invention and the above-mentioned nozzle / processed object relative moving means. Substrate W with the advantages of a nozzle
The entire surface to be cleaned can be cleaned. Further, the cleaning device 51 of the present embodiment has four cleaning nozzles 54, 55,
Since each of 56 and 89 is configured to perform cleaning processing by different cleaning methods such as ultraviolet cleaning, ozone water ultrasonic cleaning, hydrogen water ultrasonic cleaning, and rinse cleaning, various cleaning methods should be performed with this device alone. You can

[0058]

As described above in detail, the wet processing apparatus of the present invention comprises the surface of the connecting portion on the side of the object to be processed,
A portion of the processing liquid introducing portion on the side of the processed object and a surface of the processing liquid collecting portion on the side of the processing object are flush with each other, and are flush with the connecting portion of the processing liquid introducing portion. Further, the processing liquid introducing port for introducing the processing liquid is formed, and the processing liquid collecting port is formed in a portion flush with the connecting portion of the processing liquid collecting unit. It is possible to prevent bubbles that are entrained in the processing liquid and mixed in the processing region from staying in the processing region from the introduction port to the processing liquid recovery port. Therefore, according to the wet processing apparatus of the present invention, the flow of the processing liquid in the processing region can be stably maintained, and the wet processing of the object to be processed can be efficiently performed.

Next, in the wet processing apparatus of the present invention, the surface of the connecting part on the side of the object to be processed, the surface of the processing liquid introducing part on the side of the object to be processed, and the surface of the processing liquid collecting part on the side of the object to be processed. Surface is formed from the same substrate, and if the processing liquid introducing port and the processing liquid collecting port are formed so as to penetrate the substrate, the processing liquid collecting port and the processing liquid collecting port are formed. Since the flow path of the processing liquid reaching the substrate is composed of the one surface of the substrate and the object to be processed, there is no formation of a place where bubbles entrained in the processing liquid can stay on the nozzle side. Will be able to maintain a stable flow.

[Brief description of drawings]

FIG. 1 is a perspective view showing an overall configuration of a cleaning device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line BB ′ shown in FIG.

FIG. 3 is a plan view of the cleaning nozzle 1 shown in FIG. 2 viewed from the side of the substrate to be cleaned.

FIG. 4 is a cross-sectional view showing another application example of the cleaning apparatus according to the first embodiment of the present invention.

FIG. 5 is a diagram showing a cross-sectional structure of a cleaning device according to a second embodiment of the present invention.

FIG. 6 is a plan view showing a schematic configuration of a cleaning device according to a third embodiment of the present invention.

FIG. 7 is a diagram showing a cross-sectional structure in an example of a conventional cleaning device.

[Explanation of symbols]

1,20 Cleaning nozzle 2,22 substrate (connecting part) 3 Processing liquid introduction part 4 Processing liquid recovery unit 7 Support plate 11 Partition member 11A, 11B hollow part 16 Processing liquid inlet 17 Processing liquid recovery port 13 Vibration imparting means 23 Ultraviolet irradiation means 25 Gas introduction pipe (gas replacement means) 26 Gas discharge pipe (gas replacement means)

Claims (11)

[Claims] 1. A processing liquid introducing unit for introducing a processing liquid to the object to be processed, a processing liquid collecting unit for collecting the processing liquid from the object, and a processing liquid introducing unit on a surface facing the object to be processed. A wet treatment apparatus having a nozzle having a connecting portion that connects the processing portion and the processing liquid recovery portion, wherein a surface of the connecting portion on the side of the object to be processed and a surface of the processing liquid introducing portion on the side of the object to be processed. A surface of the treatment liquid recovery portion on the side of the object to be treated is formed flush with the portion of the treatment liquid introduction portion that is flush with the connecting portion,
A wet processing apparatus, characterized in that a processing liquid introducing port for introducing the processing liquid is formed, and the processing liquid collecting port is formed at a portion of the processing liquid collecting part that is flush with the connecting portion. 2. A surface of the connecting portion on the side of the object to be processed, a surface of the processing liquid introducing portion on the side of the object to be processed, and a surface of the processing liquid recovery part on the side of the object to be processed are from the same substrate. The wet processing apparatus according to claim 1, wherein the wet processing apparatus is formed, and the processing liquid introduction port and the processing liquid recovery port are formed so as to penetrate the substrate. 3. The treatment liquid introducing part and the treatment liquid collecting part by a hollow partition member sandwiched by the substrate and a support plate arranged to face the surface of the substrate opposite to the object to be treated. Is formed, and the treatment liquid can be stored in the hollow portion of the partition member, and the hollow portion, the treatment liquid introduction port, and the treatment liquid recovery port are connected to each other to flow the treatment liquid. The wet processing apparatus according to claim 1, wherein a channel is formed. 4. The wet method according to claim 1, wherein the connecting portion is provided with vibration applying means for applying vibration to the processing liquid between the connecting portion and the object to be processed. Processing equipment. 5. The surface of the connecting portion on the side of the object to be processed is formed of a member that transmits ultraviolet rays, and the connecting portion has
The wet processing apparatus according to claim 1, further comprising an ultraviolet irradiation unit for irradiating the object to be processed with ultraviolet rays. 6. An ultraviolet irradiation means is housed in a space surrounded by the connecting portion, the support plate, and the partition member, and a gas replacement means for replacing the inside of the space with an inert gas is provided. The wet processing apparatus according to claim 3, wherein the wet processing apparatus is provided. 7. The wet processing apparatus according to claim 2, wherein the substrate is made of a hydrophilic material. 8. The wet processing apparatus according to claim 2, wherein fine irregularities are formed on the surface of the substrate on the side of the object to be processed. 9. The wet processing apparatus according to claim 2, wherein a member made of a hydrophobic material is arranged in a peripheral portion of the substrate on the processing liquid introducing port side. 10. The wet processing apparatus according to claim 2, wherein a member made of a hydrophobic material is arranged in the peripheral portion of the processing liquid recovery port side of the substrate. 11. A nozzle or an object-to-be-processed moving means for moving the nozzle and the object to be processed relative to each other while maintaining a constant interval therebetween.
The wet processing apparatus described in 1.