JP2003091367A - Touch panel - Google Patents

Touch panel

Info

Publication number
JP2003091367A
JP2003091367A JP2001281145A JP2001281145A JP2003091367A JP 2003091367 A JP2003091367 A JP 2003091367A JP 2001281145 A JP2001281145 A JP 2001281145A JP 2001281145 A JP2001281145 A JP 2001281145A JP 2003091367 A JP2003091367 A JP 2003091367A
Authority
JP
Japan
Prior art keywords
touch panel
auxiliary particles
particle size
silver powder
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001281145A
Other languages
Japanese (ja)
Other versions
JP4428609B2 (en
Inventor
Toshiro Yukinari
俊郎 行成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawaguchiko Seimitsu Co Ltd
Kawaguchiko Seimitsu KK
Original Assignee
Kawaguchiko Seimitsu Co Ltd
Kawaguchiko Seimitsu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawaguchiko Seimitsu Co Ltd, Kawaguchiko Seimitsu KK filed Critical Kawaguchiko Seimitsu Co Ltd
Priority to JP2001281145A priority Critical patent/JP4428609B2/en
Publication of JP2003091367A publication Critical patent/JP2003091367A/en
Application granted granted Critical
Publication of JP4428609B2 publication Critical patent/JP4428609B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Push-Button Switches (AREA)
  • Conductive Materials (AREA)
  • Liquid Crystal (AREA)
  • Position Input By Displaying (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable touch panel with a driving electrode having a less dispersed resistance value. SOLUTION: The resistance film type analog touch panel comprises a transparent electrode formed on an upper board and a transparent electrode formed on a lower board, both of which are opposed to each other in spaced relation, and the driving electrode connected to the transparent electrodes. The driving electrode is formed with a fired film of conductive paste consisting of a 30-45 wt.% silver powder 32 and 15-25 wt.% insulating auxiliary particles 30 mixed in a resin solution. The particle size of the silver powder 32 is within a range of 0.1-5 μm, and the insulating auxiliary particles 30 are plastic balls, ceramic balls or glass balls with their average particle size being within a range of 1-20 μm and satisfied with the conditions of 3-10 times the particle size of the silver powder 32.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、コンピュータ、各
種端末機、自動販売機、ATM等の機器において、液晶
ディスプレイやブラウン管等の画面上に配置し、透視し
た画面の指示に従って使用者が情報の表示画面を指やペ
ン等で直接押してデータの入カが行われる抵抗膜方式の
アナログ型タッチパネルに関し、特に電極の信頼性の高
いタッチパネルに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in devices such as computers, various terminals, vending machines, and ATMs, which are arranged on the screen of a liquid crystal display, a cathode ray tube or the like, and the user can display information according to the instructions on the screen seen through. The present invention relates to a resistive film type analog touch panel in which data is input by directly pressing a display screen with a finger, a pen or the like, and particularly to a touch panel with highly reliable electrodes.

【0002】[0002]

【従来の技術】表示装置一体型の入力スイッチとしての
抵抗膜方式のアナログ型タッチパネルは、表示装置の表
示面上に配置されて使用される。前記タッチパネルは、
透明基板とその下面に形成された透明電極とからなる上
基板と、透明基板とその上面に形成された透明電極とか
らなる下基板とが、所定の空間を隔てて透明電極同士が
対面するように配置されている。
2. Description of the Related Art A resistive film type analog touch panel as an input switch integrated with a display device is used by being arranged on a display surface of the display device. The touch panel is
An upper substrate composed of a transparent substrate and a transparent electrode formed on the lower surface thereof and a lower substrate composed of a transparent substrate and a transparent electrode formed on the upper surface of the transparent substrate face each other with a predetermined space therebetween. It is located in.

【0003】このタッチパネルにおいて、上基板の上部
を入力ペンまたは指で押圧したとき、上基板が撓んでそ
の押圧点において上基板の透明電極が下基板の透明電極
と接触する。そして、その接触点の座標が電気抵抗の測
定によって検知されて、入力情報が読取られる。以下、
従来技術におけるタッチパネルの例を図を用いて説明す
る。
In this touch panel, when the upper portion of the upper substrate is pressed with an input pen or a finger, the upper substrate is bent and the transparent electrode of the upper substrate comes into contact with the transparent electrode of the lower substrate at the pressing point. Then, the coordinates of the contact point are detected by measuring the electric resistance, and the input information is read. Less than,
An example of a touch panel in the related art will be described with reference to the drawings.

【0004】従来のタッチパネルは、図4に示すように
可撓性を有するタッチ側(入力側)の上基板11に形成
した透明電極16と下基板12に形成した透明電極19
とが絶縁性の貼り合わせ剤13を介して隙間を設けて対
向配置されている。又、前記上基板11の透明電極16
に接続される平行な一対のX側駆動電極14、15と、
前記下基板12の前記透明電極19に接続される平行な
一対のY側駆動電極21、22とが方形配置となるよう
に対向配置されている。更に、前記上基板11のX側駆
動電極14、15にそれぞれ接続する接続電極17、1
8が、前記下基板12に設ける接続電極23、24に導
電性接着剤で、それぞれ接続されている。尚、通常は前
記下基板を透明ガラス、前記上基板を透明フィルムで構
成している。
As shown in FIG. 4, the conventional touch panel has a transparent electrode 16 formed on the upper substrate 11 on the touch side (input side) and a transparent electrode 19 formed on the lower substrate 12 having flexibility.
And are opposed to each other with a gap therebetween with an insulating bonding agent 13 interposed therebetween. In addition, the transparent electrode 16 of the upper substrate 11
A pair of parallel X-side drive electrodes 14 and 15 connected to
A pair of parallel Y-side drive electrodes 21 and 22 connected to the transparent electrode 19 of the lower substrate 12 are arranged to face each other in a square arrangement. Furthermore, connection electrodes 17 and 1 connected to the X-side drive electrodes 14 and 15 of the upper substrate 11, respectively.
Reference numeral 8 is connected to the connection electrodes 23 and 24 provided on the lower substrate 12 with a conductive adhesive, respectively. The lower substrate is usually made of transparent glass and the upper substrate is usually made of a transparent film.

【0005】前記X側駆動電極14、15、及びY側駆
動電極21、22は、上基板11、下基板12にそれぞ
れ銀ペーストを印刷し、焼成して低抵抗の電極として形
成されていた。前記銀ペ一ストは、エポキシ樹脂、或い
はアクリル樹脂等の熟硬化性樹脂の溶液に銀粉末を60
〜85重量%の割合で混合し作成される。前記銀粉末の
粒径は、0.5〜1.0μmのものが一般的である。
The X-side drive electrodes 14 and 15 and the Y-side drive electrodes 21 and 22 were formed as low-resistance electrodes by printing silver paste on the upper substrate 11 and the lower substrate 12, respectively, and firing the paste. The silver paste is prepared by adding silver powder to a solution of an aging curable resin such as an epoxy resin or an acrylic resin.
It is prepared by mixing at a ratio of ~ 85% by weight. The particle size of the silver powder is generally 0.5 to 1.0 μm.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、銀に限
らず、金属粒を液体中に浸すと比重の関係で当然沈殿す
るが、5μm以下程度の微粒子になると完全に沈殿せ
ず、一部浮遊した状態になる。この現象は液体の粘性が
高まればより顕著になる。従って金属微粒子はペースト
中では拡散状態に近くなる。但し、高粘性の液体中での
金属微粒子は、金属粒同士が互いに引き合う性質があ
り、この性質により銀粉末が塊となり易いと考えられ、
ある範因で沈殿が発生する。特に、銀粉末は比重が高い
ために硬化前の樹脂溶液中で沈殿したり、銀粉末同士が
集積した塊となって樹脂溶液中に点在するという状況が
発生し、銀粉末を均一に拡散し、安定した導電性を得る
ことが困難であった。
However, when not only silver but also metal particles are immersed in a liquid, they naturally precipitate because of their specific gravity, but when they become fine particles of about 5 μm or less, they do not completely precipitate and they partially float. It becomes a state. This phenomenon becomes more remarkable as the viscosity of the liquid increases. Therefore, the metal fine particles are close to a diffusion state in the paste. However, the metal fine particles in the highly viscous liquid have the property that the metal particles attract each other, and it is considered that this property tends to cause the silver powder to agglomerate.
Precipitation occurs for some reason. In particular, since silver powder has a high specific gravity, it may precipitate in the resin solution before curing or may be scattered in the resin solution as a lump in which silver powders are accumulated. However, it is difficult to obtain stable conductivity.

【0007】この為、銀ぺ一ストによる電極の良好な導
電性を確保する為には、樹脂溶液中の銀粉末の含有量を
多めにすることが必要であり、その結果、ペーストとい
うよりは湿り気を帯びた粉未といった様相を呈する状態
となって、印刷自体がやりにくく、このことが形成され
る駆動電極の膜厚の均一化の阻害要因となり焼成後の抵
抗値が20〜30%もばらつく結果となっていた。この
ように、樹脂の溶液に銀粉末を拡散させて、硬化後導体
とする原理は確率的なもので、どこかの銀粉末が繋がっ
ていて全体として導通が確保されるという発想である。
従って導電性ペースト中における銀粉末の均一拡散に関
する技術は重要な位置付けとなる。
Therefore, in order to ensure good conductivity of the electrode by the silver paste, it is necessary to increase the content of the silver powder in the resin solution, and as a result, it is preferable to use paste. In a state where it looks like a moist powder, it is difficult to print itself, which becomes an impediment to the uniformization of the film thickness of the formed drive electrode, and the resistance value after firing is 20 to 30%. The result was scattered. In this way, the principle of diffusing silver powder into the resin solution to form a conductor after curing is stochastic, and the idea is that somewhere silver powder is connected and electrical continuity is secured as a whole.
Therefore, the technique regarding uniform diffusion of silver powder in the conductive paste is an important position.

【0008】上記問題への対応策として、電極パターン
の印制幅Hを大きくするか、若しくは厚い印刷膜を形成
することによって、抵抗値のばらつきを回避する方法が
開示されている。しかし、この様な方法では、タッチパ
ネルの外形寸法の大型化につながったり、工数が増加す
るなどの問題があった。
As a measure against the above problem, there is disclosed a method of avoiding the variation of the resistance value by increasing the printing width H of the electrode pattern or forming a thick print film. However, such a method has problems that the external dimensions of the touch panel are increased and the number of steps is increased.

【0009】(発明の目的)本発明の目的は、上記の問
題点を解決し駆動電極の抵抗値のばらつきを回避し、信
頼性の高いタッチパネルを提供することにある。
(Object of the Invention) An object of the present invention is to solve the above-mentioned problems, to avoid variations in the resistance value of the drive electrodes, and to provide a highly reliable touch panel.

【0010】[0010]

【課題を解決するための手段】前述した目的を達成する
ために、本発明のうちで請求項1の発明に係わるタッチ
パネルは、上基板に形成した透明電極と下基板に形成し
た透明電極とを隙間を設けて対向配置し、前記各透明電
極に接続する駆動電極を有するタッチパネルにおいて、
前記駆動電極が、樹脂溶液に30〜45重量%の銀粉末
と共に15〜25重量%の球状補助粒を混合した導電性
ぺ一ストの焼成膜で形成され、前記銀粉末の粒径が0.
1〜5μmの範囲にあり、前記球状補助粒の平均粒径は
1〜20μmの範囲にあると共に、前記銀粉末の粒径の
3〜10倍の条件を満たすことを特徴とする。
In order to achieve the above-mentioned object, a touch panel according to a first aspect of the present invention comprises a transparent electrode formed on an upper substrate and a transparent electrode formed on a lower substrate. In a touch panel having a driving electrode connected to each of the transparent electrodes, which is arranged to face each other with a gap,
The drive electrode is formed of a fired film of a conductive paste in which a resin solution is mixed with 30 to 45% by weight of silver powder and 15 to 25% by weight of spherical auxiliary particles.
The spherical auxiliary particles are in the range of 1 to 5 μm, the average particle size of the spherical auxiliary particles is in the range of 1 to 20 μm, and 3 to 10 times the particle size of the silver powder is satisfied.

【0011】又、本発明のうちで請求項2の発明に係わ
るタッチパネルは、請求項1記載のタッチパネルにおい
て、前記球状補助粒の平均粒径が1〜5μm未満の場合
には粒径のばらつきが平均粒径の30%以下であり、平
均粒径が5〜20μmの場合には粒径のばらつきが平均
粒径の50%以下であることを特徴とする。
The touch panel according to the second aspect of the present invention is the touch panel according to the first aspect, wherein when the average particle size of the spherical auxiliary particles is 1 to less than 5 μm, the variation in particle size is caused. The average particle size is 30% or less, and when the average particle size is 5 to 20 μm, the variation in particle size is 50% or less of the average particle size.

【0012】又、本発明のうちで請求項3の発明に係わ
るタッチパネルは、請求項1又は請求項2記載のタッチ
パネルにおいて、前記球状補助粒が、プラスチック球、
ガラス球、又はセラミック球等の絶縁性補助粒からなる
ことを特徴とする。
The touch panel according to claim 3 of the present invention is the touch panel according to claim 1 or 2, wherein the spherical auxiliary particles are plastic balls.
It is characterized by being made of insulating auxiliary particles such as glass spheres or ceramic spheres.

【0013】又、本発明のうちで請求項4の発明に係わ
るタッチパネルは、請求項1又は請求項2記載のタッチ
パネルにおいて、前記球状補助粒が、前記絶縁性補助粒
に導電膜を被覆した導電性補助粒からなることを特徴と
する。
Further, in the touch panel according to the invention of claim 4 of the present invention, in the touch panel according to claim 1 or 2, the spherical auxiliary particles have a conductive property obtained by coating the insulating auxiliary particles with a conductive film. It is characterized in that it is composed of sex auxiliary grains.

【0014】又、本発明のうちで請求項5の発明に係わ
るタッチパネルは、請求項4記載のタッチパネルにおい
て、前記導電膜の膜厚が0.05〜0.2μmであるこ
とを特徴とする請求項4記載のタッチパネルである。
The touch panel according to claim 5 of the present invention is the touch panel according to claim 4, wherein the conductive film has a thickness of 0.05 to 0.2 μm. The touch panel according to item 4.

【0015】又、本発明のうちで請求項6の発明に係わ
るタッチパネルは、請求項4又は請求項5記載のタッチ
パネルにおいて、前記導電膜が金であることを特徴とす
る。
The touch panel according to claim 6 of the present invention is the touch panel according to claim 4 or 5, wherein the conductive film is gold.

【0016】又、本発明のうちで請求項7の発明に係わ
るタッチパネルは、請求項1記載のタッチパネルにおい
て、前記導電性ペーストを用いた駆動電極パターンの形
成は印刷によることを特徴とする。
The touch panel according to claim 7 of the present invention is the touch panel according to claim 1, wherein the drive electrode pattern is formed by using the conductive paste by printing.

【0017】(作用)本発明のタッチパネルにおける導
電性ペーストは、樹脂溶液中に銀粉末よりも大きいサイ
ズのセラミック球、ガラス球、又はプラスチック球等の
絶縁性補助粒が銀粉末と共に拡散され、該絶縁性補助粒
の周囲に銀粉末が分布するようになっている。これによ
って、導電性ペースト中に銀粉末が集積した塊となって
樹脂溶液中に点在するという状況の発生を押さえ、銀粉
末を均等に拡散し、安定した導電性を有する駆動電極を
得ることができる。
(Function) In the conductive paste for the touch panel of the present invention, the insulating auxiliary particles such as ceramic spheres, glass spheres, or plastic spheres having a size larger than the silver powder are dispersed in the resin solution together with the silver powder. The silver powder is distributed around the insulating auxiliary particles. As a result, it is possible to suppress the occurrence of the situation in which silver powder is accumulated in the conductive paste as lumps and scattered in the resin solution, and the silver powder is evenly diffused to obtain a drive electrode having stable conductivity. You can

【0018】更に、前記絶縁性補助粒に導電膜を被覆し
た導電性補助粒を樹脂溶液中に銀粉末と共に拡散するこ
とにより、より安定した導電性を得ることができ、導電
膜に形成する駆動電極の導電性に関する品質を更に向上
させる。以下、本発明の実施の形態により詳述する。
Furthermore, more stable conductivity can be obtained by diffusing the conductive auxiliary particles obtained by coating the insulating auxiliary particles with the conductive film together with the silver powder in the resin solution, and driving the conductive film to be formed. Further improve the quality of the conductivity of the electrode. Hereinafter, the embodiments of the present invention will be described in detail.

【0019】[0019]

【発明の実施の形態】(第1の実施の形態)図1、図2
を用いて本発明の第1の実施の形態を説明する。図1
は、本実施形態におけるタッチパネルのY側駆動電極4
2の一部を示す断面図である。又、図2は、本実施形態
における導電性ペースト中の絶縁性補助粒30と銀粉末
32との拡散状態示す部分拡大図である。尚、本実施形
態におけるタッチパネルの全体構造は、従来例と同様で
あるため、説明を省略する。以下図を用いて本実施形態
について説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIGS. 1 and 2
The first embodiment of the present invention will be described using. Figure 1
Is the Y-side drive electrode 4 of the touch panel in the present embodiment.
It is sectional drawing which shows a part of 2. Further, FIG. 2 is a partially enlarged view showing a diffusion state of the insulating auxiliary particles 30 and the silver powder 32 in the conductive paste in the present embodiment. The overall structure of the touch panel in this embodiment is the same as that of the conventional example, and thus the description thereof is omitted. This embodiment will be described below with reference to the drawings.

【0020】図1、図2に示すように本実施形態におけ
るタッチパネルのY側駆動電極42は、熟硬化性樹脂の
エポキシ樹脂溶液に銀粉末32と共に球状補助粒として
の絶縁性補助粒30を混合した導電性ペーストを下基板
12に印刷し、焼成して低抵抗の電極として形成され
る。
As shown in FIGS. 1 and 2, the Y-side drive electrode 42 of the touch panel according to the present embodiment is a mixture of the epoxy powder of the aging curable resin and the insulating auxiliary particles 30 as spherical auxiliary particles together with the silver powder 32. The conductive paste is printed on the lower substrate 12 and fired to form a low resistance electrode.

【0021】前記導電性ペーストに添加する銀粉末32
の割合は、従来方法の約半分の乾燥前で30〜45重量
%に設定する。叉、前記銀粉末32と共に粒径をある程
度整えた絶縁性補助粒30を乾燥前で15〜25重量%
添加する。前記絶縁性補助粒はプラスチック球、セラミ
ック球、叉はガラス球等が使用でき、例えば、前記セラ
ミック球としては、アルミナ(Al)、ガラス球
としてはシリカガラス(SiO)等がある。
Silver powder 32 added to the conductive paste
Is set to 30 to 45% by weight before drying, which is about half that of the conventional method. In addition, the insulating auxiliary particles 30 whose particle size has been adjusted to some extent together with the silver powder 32 are contained in an amount of 15 to 25% by weight before drying.
Added. As the insulating auxiliary particles, plastic spheres, ceramic spheres, or glass spheres can be used. For example, the ceramic spheres include alumina (Al 2 O 3 ) and the glass spheres include silica glass (SiO).

【0022】前記セラミツク球(比重1.9前後)およ
び前記シリカガラス(比重2.0前後)と、前記プラス
チック球(比重1.0前後)とでは、比重が異なるにも
関わらず顕著な差は見られず、同様の効果が得られた。
その理由としては、セラミツク球が多孔質の構造の場
合、実効的比重はプラスチック球と大差なくなるためと
考えられる。
Despite the difference in specific gravity between the ceramic sphere (specific gravity of about 1.9) and the silica glass (specific gravity of about 2.0) and the plastic sphere (specific gravity of about 1.0), there is no significant difference. It was not seen and the same effect was obtained.
It is considered that the reason is that when the ceramic sphere has a porous structure, the effective specific gravity is almost the same as that of the plastic sphere.

【0023】叉、添加する絶縁性補助粒30のサイズは
粒径1〜20μmのものが使えるが、本発明の場合、同
時に添加する銀粉末32の粒径の3〜10倍のサイズに
選定することが、効果を得る為に重要である。
The insulating auxiliary particles 30 to be added may have a particle size of 1 to 20 μm, but in the present invention, the size is selected to be 3 to 10 times the particle size of the silver powder 32 to be added at the same time. Is important for getting the effect.

【0024】又、添加する絶縁性補助粒30の外径のば
らつきは、前記絶縁性補助粒30の平均粒径が1〜5μ
m未満の場合には粒径のばらつきが平均粒径の30%以
下、平均粒径が5〜20μmの場合には粒径のばらつき
が平均粒径の50%以下に押さえるのが望ましい。
The variation in the outer diameter of the insulating auxiliary particles 30 to be added is such that the average particle diameter of the insulating auxiliary particles 30 is 1 to 5 μm.
When it is less than m, it is desirable to suppress the variation of the particle diameter to 30% or less of the average particle diameter, and when the average particle diameter is 5 to 20 μm, it is desirable to suppress the variation of the particle diameter to 50% or less of the average particle diameter.

【0025】尚、本実施形態においては、Y駆動電極を
例として説明したが、X駆動電極についても同様である
ことは言うまでもない。
In the present embodiment, the Y drive electrode has been described as an example, but it goes without saying that the same applies to the X drive electrode.

【0026】以上本実施形態によれば、適正な状態に拡
散されたセラミック球、プラスチック球、又はガラス球
等の絶縁補助粒30の周囲に銀粉末32が分布すること
によって良好な導電特性を得ることができた。又、銀粉
末32よりも大きい粒径の絶縁性補助粒30が適度に拡
散されたことにより、銀粉末32が集積する現象を押さ
えることが可能となった。これによって、駆動電極の形
状寸法(電極の幅H、厚さ)を従来方法と同一条件とし
た場合で、抵抗値のばらつきを5%以下に低減すること
ができた。
As described above, according to the present embodiment, the silver powder 32 is distributed around the insulating auxiliary particles 30 such as the ceramic spheres, the plastic spheres, or the glass spheres diffused in an appropriate state, thereby obtaining good conductive characteristics. I was able to. Further, since the insulating auxiliary particles 30 having a particle size larger than that of the silver powder 32 are appropriately diffused, it is possible to suppress the phenomenon that the silver powder 32 is accumulated. As a result, it was possible to reduce the variation in the resistance value to 5% or less when the geometrical dimensions (width H, thickness of the electrode) of the drive electrode were set to the same conditions as in the conventional method.

【0027】(第2の実施形態)次に図3を用いて本発
明の第2の実施の形態を説明する。図3は、本実施形態
における導電性ペースト中の球状補助粒としての導電性
補助粒33と銀粉末32との接触状態を示す部分拡大図
である。尚、第1の実施形態と同様な部分については、
説明を省略する。以下図を用いて本実施形態について説
明する。
(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a partially enlarged view showing a contact state between the conductive auxiliary particles 33 as the spherical auxiliary particles in the conductive paste and the silver powder 32 in the present embodiment. Incidentally, regarding the same parts as those of the first embodiment,
The description is omitted. This embodiment will be described below with reference to the drawings.

【0028】図3に示すように本実施形態における導電
性ペーストは、熟硬化性樹脂のエポキシ樹脂溶液に銀粉
末32と共に球状補助粒としての導電性補助粒33を混
合した点が第1の実施形態と異なり、その他は同様であ
る。
As shown in FIG. 3, the first embodiment of the conductive paste of this embodiment is that the conductive auxiliary particles 33 as spherical auxiliary particles are mixed with the silver powder 32 in the epoxy resin solution of the aging curable resin. Unlike the form, the others are the same.

【0029】本実施形態においては、導電性ペーストに
添加する銀粉末32の割合は、第1の実施形態と同じく
30〜45重量%に設定する。叉、前記銀粉末32と共
に粒径をある程度整えた絶縁性補助粒30の表面を、無
電解メッキ等の方法で金の導電膜31で被覆した導電性
補助粒33を乾燥前重量比で15−25%添加する。
叉、前記絶縁性補助粒30は、第1の実施形態と同様に
プラスチック球、セラミック球、叉はガラス球等が使用
でき、添加する絶縁性補助粒30の粒径も第1の実施形
態と同様である。
In this embodiment, the proportion of the silver powder 32 added to the conductive paste is set to 30 to 45% by weight, as in the first embodiment. In addition, the surface of the insulating auxiliary particles 30 whose particle size has been adjusted to some extent together with the silver powder 32 is coated with a conductive film 31 of gold by a method such as electroless plating to form conductive auxiliary particles 33 in a weight ratio before drying of 15- Add 25%.
The insulating auxiliary particles 30 may be plastic spheres, ceramic spheres, glass spheres or the like as in the first embodiment, and the particle size of the insulating auxiliary particles 30 to be added is the same as in the first embodiment. It is the same.

【0030】前記導電膜31の膜厚は0.05〜0.2
μmが好ましい。膜厚0.05μmの下限値について
は、これ以上薄くすると本発明の機能を果たさなくなる
限界値である。叉膜厚0.2μmの上限値は、これ以上
厚くすると、温度変化により、導電膜31の表面にクラ
ックが生じやすくなる。叉、膜厚を厚くすることは経済
的にも好ましくない。厳密には絶縁性補助粒30の粒径
に対応した厚みの導電膜31を形成することが望まし
い。(絶縁性補助粒30の粒径が小さくなるに従って導
電膜31の厚さを薄くする)。
The thickness of the conductive film 31 is 0.05 to 0.2.
μm is preferred. The lower limit value of the film thickness of 0.05 μm is a limit value at which the function of the present invention cannot be achieved if the film thickness is further reduced. If the upper limit of the fork thickness of 0.2 μm is thicker than this, cracks are likely to occur on the surface of the conductive film 31 due to temperature changes. Moreover, it is economically unfavorable to increase the film thickness. Strictly speaking, it is desirable to form the conductive film 31 having a thickness corresponding to the particle size of the insulating auxiliary particles 30. (The thickness of the conductive film 31 is reduced as the particle size of the insulating auxiliary particles 30 is reduced).

【0031】以上本実施形態によれば、絶縁性補助粒3
0の表面に金からなる導電膜31を被覆した導電性補助
粒33が、比重も金属に比べて低く、粒径も銀粉末の3
2の3〜10倍と、より大きいことにより、ペースト中
で良好(均一)に拡散し、更に銀粉末32が導電性補助
粒33の周囲に付着する。この導電性補助粒33が仲介
役となって導通性の安定化をもたらすことになる。又、
導電性補助粒30の表面以外のぺ一スト部分では銀粉末
32同士の付着がある範囲で発生するが、導電性補助粒
33が適当な仲介となって、この現象をある程度抑制す
る。
As described above, according to this embodiment, the insulating auxiliary particles 3 are used.
The conductive auxiliary particles 33 having the surface of 0 covered with the conductive film 31 made of gold have a lower specific gravity than the metal and a particle size of 3 of silver powder.
When it is 3 to 10 times larger than 2, it diffuses well (uniformly) in the paste, and the silver powder 32 adheres to the periphery of the conductive auxiliary particles 33. The conductive auxiliary particles 33 act as an intermediary to stabilize the conductivity. or,
In the paste portion other than the surface of the conductive auxiliary particles 30, the silver powder 32 adheres to each other within a certain range, but the conductive auxiliary particles 33 serve as an appropriate intermediary to suppress this phenomenon to some extent.

【0032】このように、高粘性の液体中での金属微粒
子は、金属に接近して行く性質があり、銀粉末32が金
を導電膜として被覆形成した導電性補助粒33の表面に
付着するのも、この性質によるものと考えられる。この
ように銀粉末32が導電性補助粒33の表面に接近し接
触する現象については、発明者が顕微鏡で観察し確認し
ており、更に試作実険を行って導電性が安定する効果も
確認している。
As described above, the metal fine particles in the highly viscous liquid have the property of approaching the metal, and the silver powder 32 adheres to the surface of the conductive auxiliary particles 33 formed by coating gold as a conductive film. It is thought that this is also due to this property. The phenomenon in which the silver powder 32 approaches and contacts the surface of the conductive auxiliary particles 33 in this way has been confirmed by observing with a microscope by the inventor, and the effect of stabilizing the conductivity is also confirmed by conducting a trial run. is doing.

【0033】又、本実施形態においても第1の実施形態
と同様に、適正な状態に拡散された導電性補助粒33の
周囲に銀粉末32が分布することによって良好な導電特
性を得ることができた。又、銀粉末32よりも大きい粒
径の導電性補助粒33が適度に拡散されたことにより、
銀粉末32が集積する現象を押さえることが可能となっ
た。これによって、駆動電極の形状寸法(電極の幅H、
厚さ)を従来方法と同一条件とした場合で、抵抗値のば
らつきを5%以下に低減することができた。
Also in this embodiment, as in the first embodiment, good conductive characteristics can be obtained by distributing the silver powder 32 around the conductive auxiliary particles 33 diffused in an appropriate state. did it. Further, since the conductive auxiliary particles 33 having a particle size larger than that of the silver powder 32 are appropriately diffused,
It has become possible to suppress the phenomenon that the silver powder 32 accumulates. As a result, the geometrical dimensions of the drive electrode (electrode width H,
When the thickness was the same as that of the conventional method, the variation in the resistance value could be reduced to 5% or less.

【0034】尚、本実施形態においては、導電膜31の
材質として金を例として説明したが、前述の金の他に、
二ッケル、銀或いは銅を絶縁性補助粒30にメッキ又は
コーティングし導電性補助粒を形成した場合でもほぼ同
様な効果が得られた。長期間の耐酸化性及び導通性の点
では他の金属より優れた性質を有する金が最も好ましい
が、導電性を良好にするという性質においては他の、ニ
ッケル、銀、或いは銅でも、ほぼ同様な効果が得られ
る。
Although gold has been described as an example of the material of the conductive film 31 in this embodiment, in addition to the above-mentioned gold,
Similar effects were obtained when the conductive auxiliary particles were formed by plating or coating the insulating auxiliary particles 30 with nickel, silver or copper. Gold is most preferable in terms of long-term oxidation resistance and conductivity in comparison with other metals, but other properties such as nickel, silver, or copper are almost the same in terms of improving conductivity. Can be obtained.

【0035】第1の実施例と第2の実施例とを実験によ
り比較した場合、第2の実施例の方が導電性、即ち抵抗
値のばらつきにおいて若干の優位性が確認されている。
これは導電性補助粒表面に付着した銀粉末同士が互いに
導通状態となること、前述のように補助粒表面に金続被
膜が形成され、銀粉末を引き付けやすいことが理由と考
えられるが、顕微鏡観察の結果では第1の実施例におい
ても絶縁性補助粒表面に銀粉末が均質に付着して行く様
子が確認される。この現象は、粘性流体中では質量の大
きな粒子に質量の小さな粒子が接近、付着する性質があ
るため、と考えられる。それ故に、補助粒表面に金属被
膜を形成しない。第1の実施例においても、第2の実施
例に比較し、それほど遜色ない効果が得られる。
When the first embodiment and the second embodiment are compared by experiments, it is confirmed that the second embodiment is slightly superior in the conductivity, that is, the variation in the resistance value.
It is considered that this is because the silver powders adhering to the surface of the conductive auxiliary particles are in a conductive state with each other, and as described above, a gold coating is formed on the surface of the auxiliary particles, which makes it easy to attract the silver powder. As a result of the observation, it is confirmed that the silver powder uniformly adheres to the surfaces of the insulating auxiliary particles even in the first embodiment. This phenomenon is considered to be due to the fact that particles with a small mass approach and adhere to particles with a large mass in a viscous fluid. Therefore, no metal coating is formed on the surface of the auxiliary particles. Also in the first embodiment, an effect comparable to that in the second embodiment can be obtained.

【0036】[0036]

【発明の効果】本発明によれば、タッチパネルの基板上
の駆動電極を形成する導電性ペースト中において、球状
補助粒が媒体の役割を担って銀粉末の均一拡散が実現す
る。従って銀粉末の添加割合が低減でき本来のペースト
印刷が可能になる。この結果、駆動電極の導電性に関す
る品質が向上し、タッチパネルの経時変化を含めた信頼
性、及び歩留りが向上する。又、前記駆動電極の幅Hを
従来方法に比して狭く形成することが可能になり、タッ
チパネルの額縁部分の寸法を少ないエリアで構成でき、
表示面に対する外形寸法の小形化が実現できる。更に、
前記駆動電極の印刷が従来方法より容易に行えるように
なり、工数削減、コストダウンを実現することができ
る。
According to the present invention, the spherical auxiliary particles play the role of a medium in the conductive paste forming the drive electrode on the substrate of the touch panel to realize uniform diffusion of the silver powder. Therefore, the addition ratio of silver powder can be reduced, and the original paste printing becomes possible. As a result, the quality of the drive electrodes with respect to conductivity is improved, and the reliability of the touch panel including the change over time and the yield are improved. Further, the width H of the drive electrode can be formed narrower than that in the conventional method, and the frame portion of the touch panel can be formed in a small area.
It is possible to reduce the external dimensions of the display surface. Furthermore,
The drive electrodes can be printed more easily than in the conventional method, and the number of steps and the cost can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のタッチパネルにおける駆動電極を示す
部分拡大図である。
FIG. 1 is a partially enlarged view showing drive electrodes in a touch panel of the present invention.

【図2】本発明の第1の実施形態における絶縁性補助粒
と銀粉末との混合状態を示す部分拡大図である。
FIG. 2 is a partially enlarged view showing a mixed state of insulating auxiliary particles and silver powder according to the first embodiment of the present invention.

【図3】本発明の第2の実施形態における導電性補助粒
と銀粉末との接触状態を示す部分拡大図である。
FIG. 3 is a partially enlarged view showing a contact state between conductive auxiliary particles and silver powder according to the second embodiment of the present invention.

【図4】従来例におけるタッチパネルを示す分解斜視図
である。
FIG. 4 is an exploded perspective view showing a touch panel in a conventional example.

【符号の説明】[Explanation of symbols]

11 上基板 12 下基板 13 貼り合わせ剤 14、15、X側駆動電極 16 上基板の透明電極 17、18上基板の接続電極 19 下基板の透明電極 21、22、42Y側駆動電極 23、24下基板の接続電極 30 絶縁性補助粒 31 導電膜 32 銀粉末 33 導電性補助粒 11 Upper substrate 12 Lower substrate 13 Laminating agent 14, 15, X-side drive electrode 16 Transparent electrode on upper substrate 17, 18 Upper substrate connection electrodes 19 Transparent electrode on the lower substrate 21, 22, 42 Y side drive electrode 23, 24 lower substrate connection electrodes 30 Insulating auxiliary particles 31 conductive film 32 silver powder 33 conductive auxiliary particles

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 上基板に形成した透明電極と下基板に形
成した透明電極とを隙間を設けて対向配置し、前記各透
明電極に接続する駆動電極を有するタッチパネルにおい
て、 前記駆動電極が、樹脂溶液に30〜45重量%の銀粉末
と共に15〜25重量%の球状補助粒を混合した導電性
ぺ一ストの焼成膜で形成され、前記銀粉末の粒径が0.
1〜5μmの範囲にあり、前記球状補助粒の平均粒径は
1〜20μmの範囲にあると共に、前記銀粉末の粒径の
3〜10倍の条件を満たすことを特徴とするタッチパネ
ル。
1. A touch panel comprising a transparent electrode formed on an upper substrate and a transparent electrode formed on a lower substrate facing each other with a gap therebetween, and a drive electrode connected to each transparent electrode, wherein the drive electrode is a resin. The solution is formed of a fired film of a conductive paste in which 30 to 45% by weight of silver powder and 15 to 25% by weight of spherical auxiliary particles are mixed, and the particle size of the silver powder is 0.
The touch panel is in the range of 1 to 5 μm, the average particle size of the spherical auxiliary particles is in the range of 1 to 20 μm, and satisfies the condition of 3 to 10 times the particle size of the silver powder.
【請求項2】 前記球状補助粒の平均粒径が1〜5μm
未満の場合には粒径のばらつきが平均粒径の30%以下
であり、平均粒径が5〜20μmの場合には粒径のばら
つきが平均粒径の50%以下であることを特徴とする請
求項1記載のタッチパネル。
2. The average particle size of the spherical auxiliary particles is 1 to 5 μm.
When the average particle size is less than 30%, the variation of the particle size is 30% or less, and when the average particle size is 5 to 20 μm, the variation of the particle size is 50% or less of the average particle size. The touch panel according to claim 1.
【請求項3】 前記球状補助粒が、プラスチック球、ガ
ラス球、又はセラミック球等の絶縁性補助粒からなるこ
とを特徴とする請求項1又は請求項2記載のタッチパネ
ル。
3. The touch panel according to claim 1, wherein the spherical auxiliary particles are insulating auxiliary particles such as plastic spheres, glass spheres, or ceramic spheres.
【請求項4】 前記球状補助粒が、前記絶縁性補助粒に
導電膜を被覆した導電性補助粒からなることを特徴とす
る請求項1又は請求項2記載のタッチパネル。
4. The touch panel according to claim 1, wherein the spherical auxiliary particles are conductive auxiliary particles obtained by coating the insulating auxiliary particles with a conductive film.
【請求項5】 前記導電膜の膜厚が0.05〜0.2μ
mであることを特徴とする請求項4記載のタッチパネ
ル。
5. The conductive film has a thickness of 0.05 to 0.2 μm.
The touch panel according to claim 4, wherein the touch panel is m.
【請求項6】 前記導電膜が金であることを特徴とする
請求項4叉は5記載のタッチパネル。
6. The touch panel according to claim 4, wherein the conductive film is gold.
【請求項7】 前記導電性ペーストを用いた駆動電極パ
ターンの形成は印刷によることを特徴とする請求項1記
載のタッチパネル。
7. The touch panel according to claim 1, wherein the drive electrode pattern is formed by using the conductive paste by printing.
JP2001281145A 2001-09-17 2001-09-17 Touch panel Expired - Fee Related JP4428609B2 (en)

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JP4428609B2 JP4428609B2 (en) 2010-03-10

Family

ID=19105026

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Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012495A (en) * 2005-07-01 2007-01-18 Matsushita Electric Ind Co Ltd Mobile contact body for panel switch
JP2010176297A (en) * 2009-01-28 2010-08-12 Fujitsu Component Ltd Touch panel
JP5165000B2 (en) * 2008-01-30 2013-03-21 京セラ株式会社 Touch panel and touch panel display device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04284525A (en) * 1991-03-13 1992-10-09 Nitto Denko Corp Substrate for analog type touch panel
JPH07302510A (en) * 1994-05-10 1995-11-14 Sumitomo Metal Mining Co Ltd Conductive paste composition
JPH08245239A (en) * 1994-12-06 1996-09-24 E I Du Pont De Nemours & Co Thick conductive composition with improved adhesiveness
JP2001188342A (en) * 1999-12-27 2001-07-10 Sumitomo Bakelite Co Ltd Photosensitive silver paste and image display using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04284525A (en) * 1991-03-13 1992-10-09 Nitto Denko Corp Substrate for analog type touch panel
JPH07302510A (en) * 1994-05-10 1995-11-14 Sumitomo Metal Mining Co Ltd Conductive paste composition
JPH08245239A (en) * 1994-12-06 1996-09-24 E I Du Pont De Nemours & Co Thick conductive composition with improved adhesiveness
JP2001188342A (en) * 1999-12-27 2001-07-10 Sumitomo Bakelite Co Ltd Photosensitive silver paste and image display using same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012495A (en) * 2005-07-01 2007-01-18 Matsushita Electric Ind Co Ltd Mobile contact body for panel switch
JP4622705B2 (en) * 2005-07-01 2011-02-02 パナソニック株式会社 Movable contact for panel switch
JP5165000B2 (en) * 2008-01-30 2013-03-21 京セラ株式会社 Touch panel and touch panel display device
JP2010176297A (en) * 2009-01-28 2010-08-12 Fujitsu Component Ltd Touch panel

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