JP2003077953A5 - - Google Patents

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Publication number
JP2003077953A5
JP2003077953A5 JP2001269826A JP2001269826A JP2003077953A5 JP 2003077953 A5 JP2003077953 A5 JP 2003077953A5 JP 2001269826 A JP2001269826 A JP 2001269826A JP 2001269826 A JP2001269826 A JP 2001269826A JP 2003077953 A5 JP2003077953 A5 JP 2003077953A5
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JP
Japan
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JP2001269826A
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JP2003077953A (ja
JP4710205B2 (ja
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Priority to JP2001269826A priority Critical patent/JP4710205B2/ja
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Publication of JP2003077953A5 publication Critical patent/JP2003077953A5/ja
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JP2001269826A 2001-09-06 2001-09-06 フリップチップ実装方法 Expired - Fee Related JP4710205B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001269826A JP4710205B2 (ja) 2001-09-06 2001-09-06 フリップチップ実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001269826A JP4710205B2 (ja) 2001-09-06 2001-09-06 フリップチップ実装方法

Publications (3)

Publication Number Publication Date
JP2003077953A JP2003077953A (ja) 2003-03-14
JP2003077953A5 true JP2003077953A5 (ja) 2008-10-02
JP4710205B2 JP4710205B2 (ja) 2011-06-29

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ID=19095572

Family Applications (1)

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JP2001269826A Expired - Fee Related JP4710205B2 (ja) 2001-09-06 2001-09-06 フリップチップ実装方法

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JP (1) JP4710205B2 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1241174C (zh) * 2002-01-26 2006-02-08 新科实业有限公司 将含有各向异性导电胶(acp)的硬盘驱动器磁头稳定在磁头-万向节组件(hga)上防止静电放电(esd)的方法和装置
EP1845556A4 (en) * 2005-02-02 2010-02-10 Sony Chem & Inf Device Corp ATTACHING DEVICE FOR ELECTRICAL COMPONENTS
JP4925669B2 (ja) * 2006-01-13 2012-05-09 ソニーケミカル&インフォメーションデバイス株式会社 圧着装置及び実装方法
WO2008032510A1 (fr) * 2006-09-15 2008-03-20 Lintec Corporation Procédé de production d'un dispositif à semi-conducteur
JP2010034423A (ja) * 2008-07-30 2010-02-12 Fujitsu Ltd 加圧加熱装置及び方法
JP5842322B2 (ja) * 2010-10-15 2016-01-13 住友ベークライト株式会社 樹脂組成物、及び電子装置の製造方法
JP2013214619A (ja) * 2012-04-02 2013-10-17 Sekisui Chem Co Ltd 半導体装置の製造方法
TWM450049U (zh) * 2012-11-20 2013-04-01 Ableprint Technology Co Ltd 具有延伸連通腔道結構之半導體封裝載熱裝置
JP6172654B2 (ja) * 2013-03-14 2017-08-02 アルファーデザイン株式会社 部品加圧装置及び部品加圧装置を用いた加熱システム
US10147702B2 (en) 2016-10-24 2018-12-04 Palo Alto Research Center Incorporated Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste
EP3428954B1 (en) * 2017-07-14 2021-05-19 Infineon Technologies AG Method for establishing a connection between two joining partners
CN113383442A (zh) * 2019-01-23 2021-09-10 武藏能源解决方案有限公司 电极制造系统以及电极制造方法
KR20210138263A (ko) 2020-05-12 2021-11-19 삼성전자주식회사 반도체 칩 실장용 테이프 및 상기 테이프를 이용한 반도체 패키지 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01199440A (ja) * 1988-02-04 1989-08-10 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH0671032B2 (ja) * 1988-11-01 1994-09-07 松下電器産業株式会社 電子部品の実装装置
JP3928753B2 (ja) * 1996-08-06 2007-06-13 日立化成工業株式会社 マルチチップ実装法、および接着剤付チップの製造方法
JP4032317B2 (ja) * 1996-08-06 2008-01-16 日立化成工業株式会社 チップ実装法
JP4045471B2 (ja) * 1997-04-18 2008-02-13 日立化成工業株式会社 電子部品実装法
JP4223581B2 (ja) * 1997-04-18 2009-02-12 日立化成工業株式会社 マルチチップ実装法
JP4097379B2 (ja) * 1999-01-29 2008-06-11 松下電器産業株式会社 電子部品の実装方法及びその装置
JP2002016108A (ja) * 2000-06-30 2002-01-18 Toshiba Corp 半導体装置及びその製造装置

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