JP2003059824A - Development processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To carry out development processing effectively in a short time, while carrying a processing substrate on a carrying path laid in the horizontal direction. SOLUTION: A development unit(DEV) 94 is formed, by arranging a plurality of modules M1 to M8 , which form a carry path 108 extending along a process line B continuously in a single line. The module M1 among the modules M1 to M8 , which is positioned at the uppermost end, constitutes a substrate carry-in part 110. The four modules M2 to M5 , which follow it, constitute a development part 112, the next module M6 constitutes a rinse part 114, the next module M7 constitutes a drying part 116, and the last module M8 constitutes a substrate carry-out part 118. A pre-wet part 124, a developer supply part 126 and the rinse part 114 are provided with a prewetting liquid supply nozzle PN, which is movable in both directions along the carrying path 108 with its nozzle discharge port facing the carry path 108, a developer supply nozzle DN and a rinse liquid supply nozzle RN, respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a development processing apparatus which carries out a series of development processing steps while horizontally transporting a substrate to be processed.

[0002]

2. Description of the Related Art Recently, LCD (Liquid Crystal Display)
In the resist coating development processing system in manufacturing, LC
As a development method that can advantageously cope with the increase in the size of the D substrate, a series of development such as development, rinsing, and drying during transportation while transporting the LCD substrate on the substrate transport path formed by horizontally laying the transport roller and the transport belt. Attention has been paid to a so-called flat flow system in which a treatment process is performed. Compared to the spinner method, which rotates the substrate,
The substrate is easy to handle, the transport system and the drive system are simple in structure, and there are advantages such as generation of mist and little redeposition on the substrate.

[0003]

In the conventional flat-flow method, the developing solution supply nozzle and the rinse solution supply nozzle are fixedly arranged at predetermined positions on the substrate transport path, and the substrate is placed beside each nozzle (usually just below). When passing, the processing liquid (developing liquid, rinse liquid) is ejected from each nozzle to supply the processing liquid to the surface to be processed of the substrate. Here, when the length dimension of the substrate in the transport direction is L and the transport speed is V, the time (treatment liquid supply time) T required to supply the treatment liquid to the entire surface to be treated of one substrate is approximate. Is given by T = L / V ‥‥‥‥‥‥‥‥‥‥‥ (1)

According to the above equation (1), the processing liquid supply time T becomes longer in proportion to the increase in the substrate size (L), which is a troublesome problem in the development processing step. That is, in the flat flow system, the processing liquid supply time T
Is also the time difference between the one end portion (front end portion) and the other end portion (rear end portion) of the substrate transfer direction when receiving the supply of the processing liquid, and when the processing liquid is the developing liquid, it becomes the time difference of the start of development. As this time difference (T) is larger, there is a problem that the development quality on the substrate varies and the in-plane uniformity decreases.

To solve this problem, the transport speed V has been conventionally used.
Although the method of increasing the transfer speed has been promoted, the flat-flow method has a limit in the transfer speed V, and the higher the transfer speed V, the higher the possibility that the substrate is damaged on the transfer path. I can't say.

The present invention has been made in view of the above-mentioned problems of the prior art, and enables the development processing to be efficiently performed in a short time while the substrate to be processed is transported on the transport path laid in the horizontal direction. It is an object of the present invention to provide a development processing device having the above structure.

Another object of the present invention is to provide a development processing apparatus capable of performing high-quality development processing while transferring a substrate to be processed on a transfer path laid horizontally.

[0008]

In order to achieve the above object, the development processing apparatus of the present invention is a substrate in which a carrier for laying and carrying a substrate to be processed is laid horizontally. A transport path, a transport driving means for driving the transport body to transport the substrate on the transport path, and a predetermined processing liquid for developing processing on a surface to be processed of the substrate on the transport path. The processing liquid supply unit includes one or a plurality of nozzles, and the nozzle scanning unit for moving at least one nozzle of the processing liquid supply unit as a movable nozzle along the transport path.

In the above structure, the movable nozzle of the processing liquid supply means moves or scans the substrate to be processed transported along the transport path along the transport path while the movable nozzle of the processing liquid supply means does not discharge the processing liquid. As a result, the processing liquid can be evenly supplied to the entire surface to be processed of the substrate in a short time without being substantially affected by the substrate transport speed and the substrate size.

In the development processing apparatus of the present invention, in order to make the liquid film on the substrate uniform, it is preferable that the processing liquid supply means includes means for changing the flow rate of the processing liquid ejected from the nozzle. In this case, as a preferred mode, the substrate front end vicinity region within the first distance from the substrate front end edge and the substrate rear end vicinity region within the second distance from the substrate rear end edge in the transport direction of the surface to be processed of the substrate and the substrate Divided into three parts, a board middle area sandwiched between a front end vicinity area and a board rear end vicinity area,
A configuration may be adopted in which the amount of the processing liquid ejected when the processing liquid is supplied to the three regions is set individually.
Preferably, the amounts of the processing liquid ejected to the region near the front end of the substrate and the regions near the rear end of the substrate may be substantially equal to each other, and may be smaller than the amounts of the processing liquid ejected toward the intermediate region of the substrate.

In order to make the liquid film on the substrate uniform,
The nozzle scanning unit may include a unit that changes the moving speed of the movable nozzle. In this case, as a preferred mode, the substrate front end vicinity region within the first distance from the substrate front end edge and the substrate rear end vicinity region within the second distance from the substrate rear end edge in the transport direction of the surface to be processed of the substrate and the substrate A structure in which the nozzle moving speed when supplying the processing liquid from the movable nozzle to each of the three regions is divided into a front region and a substrate intermediate region sandwiched between the front region and the rear region. Good as Preferably, the nozzle moving speeds for the substrate front end vicinity region and the substrate rear end vicinity region may be substantially equal to each other and may be higher than the nozzle movement speed for the substrate middle region.

In a preferred embodiment of the nozzle scanning means, a nozzle support part for supporting the movable nozzle, a guide part for guiding the nozzle support part above the conveying path, and a guide part for moving along the guide part. And a drive section for driving the nozzle support section. In such a configuration, the movable nozzle can be stably moved at high speed integrally with the nozzle support portion. Further, means for raising and lowering the nozzle may be provided, for example, in the nozzle support portion so that the height position of the movable nozzle can be adjusted or changed.

Further, by covering the space on the movable transport path of the movable nozzle with the cover, it is possible to form a clean processing space inside the cover in which foreign matter from the outside does not easily enter.

In the developing processing apparatus of the present invention, as a basic form, a developing section for supplying a developing solution to the surface to be processed of the substrate for development along the transport path, and a substrate on the downstream side of this developing section. A rinse portion for supplying pure water to the surface to be processed and stopping the development may be provided. In this case, a first liquid collecting unit for collecting the liquid that has fallen below the transport path in the developing unit,
A second liquid collecting unit for collecting the liquid that has fallen below the transport path in the rinse unit may be provided.

According to one aspect of the present invention, the processing liquid supply means includes a first movable nozzle for spraying the developing solution onto the surface to be processed of the substrate in the developing portion, and the nozzle scanning means is at least in the area of the developing portion. It includes a first nozzle scanning unit for moving the first movable nozzle along the transport path. With this configuration, the spray developing process can be efficiently performed in a short time by the nozzle scanning system of the present invention, and good developing quality can be obtained.

According to another aspect of the present invention, the processing liquid supply means includes a second movable nozzle for pouring the developing solution on the surface to be processed of the substrate in the developing portion, and the nozzle scanning means at least the developing portion. And a second nozzle scanning unit for moving the second movable nozzle along the transport path in the area. With this configuration, the paddle type developing process can be efficiently performed in a short time by the nozzle scanning method of the present invention, and good developing quality can be obtained.

According to another aspect of the present invention, the processing liquid supply means includes a third movable nozzle for spraying the processing liquid for pre-wetting onto the surface to be processed of the substrate in the developing section prior to the development, and the nozzle is provided. The scanning unit includes a third nozzle scanning unit for moving the third movable nozzle along the transport path at least in the area of the developing unit. With this configuration, the pre-wetting process prior to the regular developing process can be efficiently performed in a short time by the nozzle scanning method of the present invention, and good pre-wetting quality can be obtained.

According to another aspect of the present invention, the processing liquid supply means includes a fourth movable nozzle for spraying the rinsing liquid onto the surface to be processed of the substrate in the rinse portion, and the nozzle scanning means is at least in the area of the rinse portion. A fourth nozzle scanning unit for moving the fourth movable nozzle along the transport path is included therein. With this configuration, the rinse step for stopping the development can be efficiently performed in a short time, and good development quality can be obtained.

In the development processing apparatus of the present invention, preferably, there may be provided a substrate inclination means for inclining the substrate on the transfer path in order to drop the processing liquid from the substrate by gravity. By such substrate tilting means, the liquid after the liquid processing can be efficiently dropped from the substrate in a short time, and at the same time, the liquid can be efficiently collected.

As one aspect of the substrate tilting means in the present invention, the substrate is tilted to drop the developing solution used for development from the substrate by gravity, or the processing solution used for pre-wetting is dropped from the substrate by gravity. Therefore, it is possible to incline the substrate. The direction in which the substrate is inclined is preferably the front or the rear of the transport path.

Further, as a substitute for the substrate tilting means or in combination therewith, a predetermined physical force is relatively horizontal along the surface of the substrate in order to remove the processing liquid from the substrate in the horizontal position on the transfer path. A configuration having a processing liquid removing unit that moves in the direction is also preferable.

As one mode of this processing liquid removing means, gas injection is performed in which a sharp gas flow is applied to the surface of the substrate at the first position in order to brush off the developing liquid used for the development from the substrate transported on the transport path. It is possible to provide a means or a gas injection means for applying a sharp gas flow to the surface of the substrate at the second position in order to remove the rinse liquid used for stopping the development from the substrate transported on the transport path. Is.

In the development processing apparatus of the present invention, by providing the substrate tilting means and the gas jetting means as described above, for example, a developer collecting liquid for mainly collecting the developing liquid used for the developing in the developing portion. It is preferable that a part is provided or a prewetting liquid collecting part for mainly collecting and collecting the processing liquid used for the prewetting in the developing part.

A preferred embodiment of the transport path in the developing processing apparatus of the present invention is a roller transport type transport path in which a substrate transport body including at least a pair of rollers coupled to a rotatable shaft is laid horizontally. .

[0025]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows a coating and developing treatment system as one constitutional example to which the developing treatment apparatus of the present invention can be applied. The coating and developing treatment system 10 is installed in a clean room, and uses, for example, an LCD substrate as a substrate to be treated, and performs various treatments such as cleaning, resist coating, prebaking, developing and postbaking in the photolithography process in the LCD manufacturing process. It is a thing. The exposure process is performed by an external exposure device 12 installed adjacent to this system.

In the coating and developing system 10, a horizontally long process station (P / S) 16 is arranged at the center, and cassette stations (C / S) 14 and interface stations (P / S) 16 are provided at both ends in the longitudinal direction (X direction). I
/ F) 18 are arranged.

The cassette station (C / S) 14 is
A cassette stage 20 which is a cassette loading / unloading port of the system 10 and on which a plurality of cassettes C capable of accommodating a plurality of substrates G can be placed side by side in a horizontal direction, for example, in the Y direction, on the stage 20. And a transport mechanism 22 for loading / unloading the substrate G into / from the cassette C. The transfer mechanism 22 has a means for holding the substrate G, for example, a transfer arm 22a, and can operate on four axes of X, Y, Z, and θ, and the adjacent process station (P / S) 16 side and the substrate G. It can be handed over.

The process station (P / S) 16 is
The processing units are arranged in the order of process flow or steps on a pair of parallel and opposite lines A and B extending in the system longitudinal direction (X direction). More specifically, in the upstream process line A from the cassette station (C / S) 14 side to the interface station (I / F) 18 side, a cleaning process section 24 and a first thermal processing section 26 are provided.
The coating process section 28 and the second thermal processing section 30 are arranged in a horizontal row. On the other hand, from the interface station (I / F) 18 side to the cassette station (C /
S) In the process line B on the downstream side toward the 14 side, the second
The thermal processing section 30, the development processing section 32, the decolorization processing section 34, and the third thermal processing section 36 are arranged in a horizontal row. In this line form, the second thermal processing unit 30
Is located at the end of the upstream process line A and at the beginning of the downstream process line B,
It straddles both lines A and B.

An auxiliary transfer space 38 is provided between the two process lines A and B, and a shuttle 40 capable of horizontally mounting the substrates G one by one is arranged in a line direction (X direction) by a drive mechanism (not shown). You can move in both directions.

In the upstream process line A, the cleaning process section 24 includes a scrubber cleaning unit (SCR) 4
This includes 2 scrubber cleaning units (SCR)
An excimer UV irradiation unit (e-UV) 41 is arranged at a location adjacent to the cassette station (C / S) 14 in 42. Although not shown, the cleaning section in the scrubber cleaning unit (SCR) 42 brushes the upper surface (processed surface) of the substrate G while horizontally transporting the LCD substrate G by the roller transport or the belt transport in the line A direction. And blow cleaning.

The first thermal processing unit 26 adjacent to the downstream side of the cleaning process unit 24 is provided with a vertical transfer mechanism 46 at the center along the process line A, and a plurality of units are provided on both the front and rear sides thereof in multiple stages. Are arranged in layers. For example, as shown in FIG. 2, the upstream multi-stage unit (TB) 44 has a substrate transfer pass unit (PASS) 50,
Heating units (DHP) 52 and 54 for dehydration baking and an adhesion unit (AD) 56 are stacked in order from the bottom. Here, the pass unit (PASS) 50
Is used to transfer the substrate G to and from the scrubber cleaning unit (SCR) 42 side. Further, the downstream multi-stage unit (TB) 48 includes a substrate transfer pass unit (PASS) 60, a cooling unit (CL) 62,
64 and adhesion unit (AD) 66 are stacked in order from the bottom. Here, pass unit (PAS
S) 60 is for transferring the substrate G to and from the coating process unit 28 side.

As shown in FIG. 2, the transport mechanism 46 includes an elevating / conveying body 70 which can be moved up and down along a guide rail 68 extending in the vertical direction, and a rotation or turning in the θ direction on the elevating / conveying body 70. It has a rotatable carrier 72 and a carrier arm or tweezers 74 that can move forward and backward or extend and retract while supporting the substrate G on the rotary carrier 72. A drive unit 76 for raising and lowering the elevation carrier 70
Is provided on the base end side of the vertical guide rail 68, and a drive unit 78 for driving the turning carrier 72 to rotate is provided on the vertical carrier 7.
A drive unit 80, which is attached to 0 and drives the transport arm 74 forward and backward, is attached to the rotary transport body 72.
Each drive unit 76, 78, 80 may be composed of, for example, an electric motor or the like.

The transport mechanism 46 constructed as described above is
It is possible to move up and down or rotate at high speed to access an arbitrary unit in the multi-stage unit sections (TB) 44 and 48 on both sides, and to transfer the substrate G to and from the shuttle 40 on the auxiliary transfer space 38 side. .

The coating process section 28 adjacent to the downstream side of the first thermal processing section 26 is, as shown in FIG. 1, a resist coating unit (CT) 82 and a reduced pressure drying unit (VD) 8.
4 and the edge remover unit (ER) 86 are arranged in a line along the process line A. Although not shown, in the coating process unit 28, the substrate G is provided in these three units (CT) 82, (VD) 84, and (ER) 86.
A transport device is provided for loading and unloading the sheets one by one in the order of steps, and each unit (CT) 82, (VD) 8
4. In the (ER) 86, each process is performed on a substrate-by-substrate basis.

The second thermal processing section 30 adjacent to the downstream side of the coating process section 28 has the same structure as the first thermal processing section 26, and is located between both process lines A and B. Is provided with a vertical transfer mechanism 90, one multi-stage unit (TB) 88 is provided on the process line A side (last), and the other multi-stage unit (T) is provided on the process line B side (head).
B) 92 is provided.

Although not shown, for example, in the multi-stage unit section (TB) 88 on the process line A side, a substrate transfer pass unit (PASS) is placed at the lowermost stage, and a prebaking heating unit (PASS) is placed thereon. PREBAKE)
May be stacked in three layers, for example. In the multi-stage unit (TB) 92 on the process line B side, a substrate transfer pass unit (PASS) is placed at the bottom.
For example, a cooling unit (COL) is stacked on top of it, and a heating unit for pre-baking (PREBA) is placed on it.
KE) may for example be stacked in two layers.

The transport mechanism 9 in the second thermal processing section 30.
0 indicates the coating process unit 2 via the respective pass units (PASS) of the multi-stage unit units (TB) 88, 92.
8 and the development process unit 32 and the substrate G can be delivered one by one, and also the shuttle 40 in the auxiliary transfer space 38 and an interface station (I / F) described later.
The substrate 18 can be handed over in a unit of 18.

In the process line B on the downstream side, the developing process section 32 includes a so-called flat-flow developing unit (DEV) 94 which carries out a series of developing processing steps while the substrate G is conveyed in a horizontal posture. The structure and operation of the developing unit (DEV) 94 will be described later in detail.

A third thermal processing section 36 is arranged downstream of the developing process section 32 with a decoloring process section 34 interposed therebetween. The decolorization processing unit 34 irradiates the surface to be processed of the substrate G with i-line (wavelength 365 nm) to perform the decolorization process.
A line UV irradiation unit (i-UV) 96 is provided.

The third thermal processing section 36 has the same structure as the first thermal processing section 26 and the second thermal processing section 30, and is of a vertical type along the process line B. Transport mechanism 10
0 and a pair of multi-stage unit parts (TB) 9 on the front and back sides
8, 102 are provided.

Although not shown, for example, a pass unit (PASS) is placed at the lowermost stage in the multi-stage unit (TB) 98 on the upstream side, and a heating unit (POBAKE) for post-baking is provided on the pass unit (PASS) 3 for example. It may be stacked. In addition, the downstream multi-stage unit (TB) 1
02 has a post-baking unit (PO
BAKE) may be placed on top of which one pass / cooling unit (PASS / COL) for substrate transfer and cooling may be stacked, and two heating units (POBAKE) for post-baking may be stacked thereon.

The transport mechanism 1 in the third thermal processing section 36
00 is an i-ray UV irradiation unit (i-UV) 96 and a cassette station (C / C) via a pass unit (PASS) and a pass cooling unit (PASS / COL) of both multi-stage unit sections (TB) 98 and 102, respectively. S) 14 and the substrate G can be delivered not only in the unit of one sheet, but also the substrate G can be delivered in the unit of one sheet with the shuttle 40 in the auxiliary transport space 38.

Interface station (I / F) 1
8 has a transfer device 104 for exchanging the substrate G with the adjacent exposure device 12, around which a buffer stage (BUF) 106, an extension cooling stage (EXT / COL) 108 and a peripheral device 1 are provided.
10 are arranged. Buffer stage (BUF) 1
A stationary buffer cassette (not shown) is placed at 06. Extension cooling stage (EXT
-COL) 108 is a substrate transfer stage having a cooling function, and is a process station (P / S) 16
It is used when exchanging the substrate G with the side. Peripheral device 1
10 may have a structure in which, for example, a TITLER and an edge exposure apparatus (EE) are vertically stacked. The transfer device 104 has a means for holding the substrate G, for example, a transfer arm 104 a, and is provided with an adjacent exposure device 12 and each unit (BUF) 106, (EXT · COL) 10.
8. (TITLER / EE) 110 and the substrate G can be transferred.

FIG. 3 shows a processing procedure in this coating and developing processing system. First, the cassette station (C
/ S) 14, the transport mechanism 22 takes out one substrate G from the predetermined cassette C on the stage 20,
It is carried into the excimer UV irradiation unit (e-UV) 41 of the cleaning process section 24 of the process station (P / S) 16 (step S1).

Excimer UV irradiation unit (e-UV) 4
In 1 the substrate G is subjected to dry cleaning by UV irradiation (step S2). This ultraviolet cleaning mainly removes organic substances on the substrate surface. After the UV cleaning is completed, the substrate G is transferred to the scrubber cleaning unit (SCR) 42 of the cleaning process unit 24 by the transfer mechanism 22 of the cassette station (C / S) 14.

In the scrubber cleaning unit (SCR) 42, the substrate G is brushed on the upper surface (processed surface) of the substrate G while being horizontally conveyed by the roller conveyance or belt conveyance in the horizontal direction in the process line A direction as described above. By performing cleaning or blow cleaning, particulate dirt is removed from the substrate surface (step S3). After the cleaning, the substrate G is drained by an air knife or the like while being transported in a uniform flow to dry the substrate G.

The substrate G which has been cleaned in the scrubber cleaning unit (SCR) 42 is passed through the pass unit (P) in the upstream multi-stage unit (TB) 44 of the first thermal processing section 26.
ASS) 50.

In the first thermal processing section 26, the substrate G is rotated by the transport mechanism 46 in a predetermined unit in a predetermined sequence. For example, the substrate G may be first processed from the pass unit (PASS) 50 to the heating unit (DHP) 52, 5
It is moved to one of 4 and undergoes dehydration treatment there (step S4). Next, the substrate G is cooled by the cooling unit (COL) 6
It is moved to one of the Nos. 2 and 64 and cooled there to a constant substrate temperature (Step S5). Thereafter, the substrate G is transferred to the adhesion unit (AD) 56, where it is subjected to a hydrophobic treatment (step S6). After the completion of the hydrophobic treatment, the substrate G is cooled by one of the cooling units (COL) 62, 64.
Then, it is cooled to a constant substrate temperature (step S7).
Finally, the substrate G is transferred to the pass unit (PASS) 50 belonging to the downstream multi-stage unit section (TB) 48.

As described above, in the first thermal processing section 26, the substrate G via the transfer mechanism 46 has the upstream multi-stage unit section (TB) 44 and the downstream multi-stage unit section (TB).
You can go back and forth between the 48 and the other. The second and third thermal processing units 30 and 36 can perform the same substrate transfer operation.

The substrate G that has been subjected to the series of thermal or thermal processing as described above in the first thermal processing section 26 is a pass unit (PASS) in the downstream multi-stage unit section (TB) 48.
From 60, it is moved to the resist coating unit (CT) 82 of the coating process unit 28 on the downstream side.

The substrate G is a resist coating unit (CT) 8
In 2, the resist solution is applied to the upper surface (the surface to be processed) of the substrate by, for example, the spin coating method, and immediately after that, the vacuum drying unit (VD) 84 adjacent on the downstream side is subjected to the drying processing under reduced pressure,
Next to the downstream edge remover unit (ER) 8
In step 6, excess (unnecessary) resist on the peripheral portion of the substrate is removed (step S8).

The substrate G which has been subjected to the resist coating process as described above passes from the reduced pressure drying unit (VD) 84 to the pass unit (TB) 88 belonging to the upstream multi-stage unit (TB) 88 of the second thermal processing unit 30 adjacent thereto. PASS).

In the second thermal processing section 30, the substrate G is rotated by the transfer mechanism 90 in a predetermined unit in a predetermined sequence. For example, the substrate G is the first from the pass unit (PASS) to the heating unit (PREBAKE).
And is subjected to baking after resist application (step S9). Next, the substrate G is transferred to one of the cooling units (COL) and cooled there to a constant substrate temperature (step S10). Thereafter, the substrate G is transferred to the path unit (PA) on the downstream multi-stage unit (TB) 92 side.
It is transferred to the extension / cooling stage (EXT / COL) 108 on the side of the interface station (I / F) 18 via the SS or not.

Interface station (I / F) 1
8, the substrate G is moved from the extension / cooling stage (EXT / COL) 108 to the peripheral device 110.
Is carried into the peripheral exposure apparatus (EE), where it is exposed to remove the resist adhering to the peripheral portion of the substrate G during development, and then sent to the adjacent exposure apparatus 12 (step S11).

In the exposure device 12, the resist on the substrate G is exposed with a predetermined circuit pattern. Then, the substrate G that has undergone the pattern exposure is returned from the exposure device 12 to the interface station (I / F) 18 (step S1).
1) First, the peripheral device 110 Titler (TITLRE
R), where predetermined information is written on a predetermined portion on the substrate (step S12). After that, the substrate G is mounted on the extension / cooling stage (EXT / CO).
L) 108. Substrate G Transport and Exposure Apparatus 1 at Interface Station (I / F) 18
The transfer device 104 exchanges the substrate G with the substrate 2.

In the process station (P / S) 16, the transfer mechanism 90 in the second thermal processing section 30 has an extension / cooling stage (EXT / COL).
The exposed substrate G is received from 108 and is transferred to the developing process unit 32 via the pass unit (PASS) in the multi-stage unit unit (TB) 92 on the process line B side.

In the developing process section 32, the substrate G received from the pass unit (PASS) in the multi-stage unit section (TB) 92 is carried into the developing unit (DEV) 94. In the developing unit (DEV) 94, the substrate G is transported in the horizontal posture in the flat flow direction toward the downstream of the process line B, and a series of developing processing steps of developing, rinsing and drying are performed during the transportation (step S13). .

The substrate G which has been subjected to the development processing in the development processing section 32 is carried into the adjacent decolorization processing section 34 on the downstream side, where it is subjected to the decolorization processing by i-ray irradiation (step S14).
The substrate G that has been subjected to the decolorization treatment is passed through the pass unit (P) in the upstream multi-stage unit (TB) 98 of the third thermal treatment unit 36.
ASS).

In the third thermal processing section (TB) 98,
The substrate G is first transferred from the pass unit (PASS) to one of the heating units (POBAKE), where it is post-baked (step S15). Next, the substrate G
Is transferred to the pass cooling unit (PASS COL) in the downstream multi-stage unit (TB) 102, where it is cooled to a predetermined substrate temperature (step S16). Third
The transfer of the substrate G in the thermal processing section 36 is performed by the transfer mechanism 10.
Performed by 0.

On the cassette station (C / S) 14 side, the transfer mechanism 22 transfers the substrate G from the pass cooling unit (PASS / COL) of the third thermal processing section 36 to which all the steps of coating / developing processing have been completed. The received substrate G is received and accommodated in any one of the cassettes C (step S
1).

In the coating and developing treatment system 10, the developing unit (DEV) 94 of the developing process section 32.
The present invention can be applied to. Hereinafter, FIGS.
One embodiment in which the present invention is applied to the developing unit (DEV) 94 will be described with reference to FIG.

FIG. 4 schematically shows the entire structure of the developing unit (DEV) 94 according to one embodiment of the present invention. The developing unit (DEV) 94 has a continuous transport path 1 extending in the horizontal direction (X direction) along the process line B.
08 forming a plurality of modules, for example, eight modules M1 to M8
Are continuously arranged in a line.

Of these modules M1 to M8, the module M1 located at the most upstream end constitutes the substrate loading section 110, and the four modules M2, M3, M4,
The developing unit 112 is composed of M5, the rinsing unit 114 is composed of the next module M6, the drying unit 116 is composed of the next module M7, and the substrate unloading unit 118 is composed of the last module M8. .

The substrate carry-in section 110 is provided with a plurality of lift pins 120 that can move up and down to receive the substrate G handed from an adjacent substrate transfer mechanism (not shown) in a horizontal posture and transfer it onto the transfer path 108. It is provided. Substrate unloading section 11
8 is also provided with a plurality of lift pins 122 capable of moving up and down for lifting the substrate G in a horizontal posture and handing it to an adjacent substrate transfer mechanism (not shown).

More specifically, the developing section 112 includes a module M2 provided with a pre-wet section 124, and a module M3,
A developing solution supply section 126 is provided in M4, and a developing solution dropping section 128 is provided in the module M5. To the pre-wet portion 124, the nozzle discharge port is directed to the transport path 108,
One or a plurality of pre-wet liquid supply nozzles PN for supplying a pre-wet liquid, for example, pure water, to the substrate are provided so as to be movable in both directions. To the developer supply unit 126, direct the nozzle discharge port to the transport path 108,
One or a plurality of developing solution supply nozzles DN that are movable in both directions along the transport path 108 are provided. In this configuration example, independently movable developer supply nozzles DNa and DNb are provided for each of the modules M3 and M4. The developing solution dropping section 128 and the pre-wet section 124 have a substrate G
A substrate tilting mechanism 180 (see FIG. 1) for tilting
1, FIG. 12) are provided.

The rinse portion 114 has a nozzle discharge port directed to the transfer path 108, is movable in both directions along the transfer path 108, and is a rinse liquid supply nozzle for supplying a rinse liquid such as pure water to the substrate G. One or more RNs are provided. The drying unit 116 is provided with one or more pairs of air knives EN for draining the liquid (mainly the rinse liquid) attached to the substrate G along the transfer path 108 with the transfer path 108 interposed therebetween. .

The developing section 112 and the rinsing section 114 are provided with pans 130, 132, and 134 for collecting the liquid that has fallen below the transport path 108, respectively. In the developing section 112, more specifically, the pre-wet section 124, the developing solution supply section 126, and the developing solution dropping section 1
28 and dedicated breads 130 and 132 are respectively filled. A drainage port is provided at the bottom of each pan 130, 132, 134, and drainage pipes 131, 133, 135 are connected thereto.

5 to 8 show the structure around the transport path 108 in the substrate loading section 110 and the pre-wet section 124.

The transport path 108 includes the rotatable shaft 13
6, a pair of conveying rollers 1 fixed at a predetermined interval
38A and 138B are horizontally laid along the process line B to constitute a roller-conveyance type conveyance path.

More specifically, the bearings 142A, 142 are provided on the upper portions of the left and right side walls of each module M or the shaft leg member 140.
B is attached at a constant interval in the direction of the process line B, and the pair of bearings 142A, 142 are arranged so that the transport rollers 138A, 138B are located inside the left and right side walls.
The shaft 136 is rotatably mounted on B. A screw gear 144 is fixed to one end portion of each shaft 136 extending outward from the bearing 142A on one side, and a rotary drive shaft 146 side extending in the process line B direction is attached to each screw gear 144 on the shaft 136 side. The respective screw gears 148 of the above mesh with each other from the right angle direction. Rotary drive shaft 14
6 is coupled to the rotating shaft of the electric motor 150. When the electric motor 150 rotationally drives the rotary drive shaft 146 in a predetermined direction, the rotational driving force is transmitted from each screw gear 148 on the rotary shaft 146 side to the screw gear 144 on the transport shaft 136 side, and the transport rollers on each shaft 136. 138A and 138B move in a predetermined direction (the substrate G is transferred to the transport path 108).
It is designed to rotate in the direction of sending to the front).

In the substrate carrying-in section 110, the substrate transfer lift pins 120 are discretely erected or planted at predetermined intervals on an elevating plate 152 arranged horizontally under the transport path 108. Below the lift plate 152, a lift drive unit 154 including, for example, an air cylinder (not shown) is installed.

As shown in FIG. 7, when the lift drive unit 154 lifts the lift plate 152 to a predetermined height, the lift pins 1
20 projects through the gap between the shafts 136 onto the transfer path 108, and at the height position thereof, the substrate G can be received in a horizontal posture from an adjacent substrate transfer mechanism (not shown).

When the substrate G is transferred onto the lift pins 120, as shown in FIG. 8, the elevating drive unit 154 lowers the elevating plate 152 to the original position, so that both ends of the substrate G ( The width of the transport path 108 (both ends in the width direction) is set on the transport rollers 138A and 138B, so that the substrate G
Are transferred in a horizontal posture on the transport path 108. The outer diameter of each of the transport rollers 138A and 138B is narrowed toward the inside (center side of the shaft), and one end of the substrate G is placed on the small diameter portion 139.

In FIG. 4, the pre-wetting liquid supply nozzle PN, the developing liquid supply nozzles DNa and DNb, and the rinse liquid supply nozzle RN are nozzle scanning mechanisms SC _P and SC _N , respectively.
And conveying path 10 above the conveying path 108 by SC _R
It is designed to move in parallel with 8.

9 and 10 show the structure of the nozzle scanning mechanism SC (SC _P , SC _N , SC _R ) according to one embodiment. The nozzle scanning mechanism SC includes a movable nozzle N (PN,
Nozzle support 156 having an inverted U-shaped cross section for supporting DNa, DNb, RN) and a guide rail 158 for guiding the nozzle support 156 parallel to the transport path 108 above the transport path 108 (see FIG. 9) and the scanning drive unit 160 that drives the nozzle support 156 so as to move along the guide rail 158.

As shown in FIG. 10, the scan driver 160
Is, for example, one or more endless belts 162 coupled to the nozzle carrier 156 via one or more vertical support members 161, and guide rails 158 (FIG. 9).
Drive pulley 1 parallel to (that is, parallel to the transport path 108)
The drive pulley 164 is operatively connected to the rotating shaft of the electric motor 168 by bridging between the drive shaft 164 and the floating pulley 166. The rotational driving force of the electric motor 168 is the pulleys 164, 1
It is converted into a linear motion of the noise carrier 156 in the belt length direction (X direction) via 66 and the belt 162. By controlling the rotation speed of the electric motor 168, the rectilinear movement speed of the nozzle carrier 156 can be adjusted to a desired value, and by changing the rotation direction of the electric motor 168, the rectilinear movement direction of the nozzle carrier 156 can be switched. . In FIG. 10, for simplification of illustration,
The guide rail 158 is not shown.

In the nozzle transfer body 156, the elevating and lowering drive section 170 composed of an actuator such as an air cylinder is attached to the inner walls on the left and right side surfaces, respectively.
A horizontal support rod 172 made of, for example, a hollow tube is horizontally bridged between the pair of left and right lifting drive units 170. Then, a vertical support rod 174, which is formed of, for example, a hollow tube, extends vertically downward from the center of the horizontal support rod 172.
A movable nozzle N having a cylindrical shape is horizontally attached to the lower end of the with the discharge port n facing downward. The discharge ports n of the nozzles N may be formed in large numbers at regular intervals in the nozzle longitudinal direction within a range in which the processing liquid can be supplied substantially uniformly from one end to the other end of the substrate G in the width direction of the transfer path 108.

In the nozzle carrier 156, the movable nozzle N
The horizontal support rod 17 is driven by the lifting drive of the lifting drive unit 170.
2 and the vertical support rod 174, and can be moved up and down. Normally, the height position Ha for discharging the processing liquid toward the substrate G on the transfer path 108 and the transfer path during the time when the processing liquid is not discharged. It is adapted to move up and down with respect to a height position Hb for retracting from 108. A flexible processing liquid supply pipe 176 from a processing liquid supply source (not shown) installed outside the transport path 108 is drawn into one end of the horizontal support rod 172. The processing liquid supply pipe 176 passes through the horizontal support rod 172 and the vertical support rod 174, and the nozzle N
It is connected to the processing liquid introduction port.

As shown in FIG. 9, preferably, the transport path 1
A cover 178 having an inverted U-shaped cross section may be provided along the transport path 108 to shield the movable area (X direction and Z direction) of the movable nozzle N on the 08 from the outside. In the illustrated configuration example, the right and left side surfaces of the cover 178 are provided on the corresponding module M.
It hangs down to the upper ends of the left and right side walls or to the shaft leg member 140 to reduce the gap as much as possible. Cover 178
A slit (opening) 178a for passing the horizontal support rod 172 may be formed on the upper surface or the ceiling of the. in this way,
By shielding or isolating the movable nozzle N from the scanning drive system by the cover 178, the processing liquid can be supplied from the movable nozzle N to the substrate G on the transfer path 108 in the processing space PS with less foreign matter inside the cover 178. There is.

In FIGS. 5 and 6, the prewetting portion 124 is provided with a substrate tilting mechanism 180 according to one embodiment. The substrate tilting mechanism 180 is provided on the transfer path 108.
A base plate 182 that can be lifted up and down and tilted in the front-rear direction, and a plurality of lift pins 184 that are discretely erected or planted on the upper surface of the base plate 182 at predetermined intervals. The base plate 182 is supported from below through a lifting shaft 186, and a driving unit 188 for performing lifting driving and tilting driving is provided. The elevating shaft 186 passes through an opening 190 formed in the bottom plate of the module M2 and the developer pan 130. The inner wall of the developer pan 130 has a cylindrical wall portion 13 around the opening 190 for preventing liquid leakage.
0a is formed.

Immediately behind the lift pins 184 in the last row, a branch pin 192 that branches backward from the lift pins 184 and stands upright is provided as fall prevention means for receiving the rear end of the substrate G and preventing the fall when tilting. For example, a rubber cylindrical stopper member 194 is rotatably attached.

Now, the operation of the substrate tilting mechanism 180 will be described with reference to FIGS. 11 and 12. When the substrate G approaches the substrate tilting mechanism 180 on the transport path 108, a predetermined position sensor (not shown) detects the substrate G and responds to a signal output from the sensor to transport the drive system. The control unit of at least all the conveyance rollers 138A in the module,
The rotation of 138B is stopped and the substrate G is stopped.

Immediately after that, the controller (not shown) of the substrate tilting mechanism 180 is operated to operate the drive unit 188,
The elevating shaft 186 is raised. Then, as shown in FIG. 11, the base plate 182 and the lift pins 184 also rise, and the lift pins 184 push up from below to lift the substrate G above the transport path 108.

Next, the controller controls the drive unit 188 to move the base plate 182 in the front-rear direction about the shaft 196 extending in the width direction of the transport path 108, preferably backward as shown in the drawing. Angle (for example, 10 ° to 20
Rotate only ゜). Then, as shown in FIG. 12, a portion above the base plate 182, that is, the lift pin 19
2. The stopper member 194 and the substrate G also incline backward on the transport path 108 by the same angle. At that time, the substrate G slides slightly backward on the lift pins 184, and the stopper member 1
94. However, the liquid Q piled up or adhered on the substrate G slides backward on the inclined surface of the substrate due to gravity and falls out of the substrate. The liquid Q dropped from the substrate G is received and collected in a pan (the prewetting liquid pan 130 in the prewetting unit 124) installed in the module.

After the tilted posture as described above is maintained for a certain period of time, under the control of the controller, the drive unit 188 rotates the base plate 182 in the opposite direction to the above-mentioned angle equal to the horizontal posture (FIG. 11 state), and then the lifting shaft 186 is lowered to the original position (position in FIG. 6).

In the pre-wet section 124, the substrate G
In the carrying direction, and the developing solution supply unit 126 for performing the next step
Since it is inclined so that the side is the upper side, the pre-wet portion 12
When the substrate G is tilted to be drained in step 4, it is possible to reduce the possibility that the liquid that has dropped into the prewetting liquid pan 130 and rebounded will adhere to the substrate G on the side of the developing solution supply unit 126 that performs the next step.

Next, the operation of the developing unit (DEV) 94 will be described. As described above with reference to FIGS. 7 and 8, the substrate loading unit 110 receives the substrates G in units of one sheet from the adjacent substrate transport mechanism (not shown) and transports the transport path 10.
Reprinted in 8. The transport rollers 138A, 138B of the transport shaft 136 constituting the transport path 108 are rotated by the rotational drive force of the electric motor 150 via the transmission drive mechanism such as the rotary drive shaft 146 and the screw gears 148, 144 as described above. Therefore, the substrate G placed on the transport path 108 is immediately transported to the adjacent developing unit 112.

In the developing section 112, the substrate G is first carried into the prewetting section 124, and pure water or a low-concentration developing solution as a prewetting solution is sprayed from the prewetting solution supply nozzle PN during the roller conveyance. In this embodiment, the nozzle PN moves horizontally along the transfer path 108 by the scanning drive of the nozzle scanning mechanism SC _P as described above with reference to FIGS. 9 and 10, and the upper surface (processed surface) of the substrate G being transferred. Spray the pre-wetting liquid toward. The prewetting liquid that has hit the substrate G and scattered outside the substrate or the prewetting liquid that has not hit the substrate G is
It is collected in a pre-wet liquid pan 130 installed under the transport path 108.

As shown in FIG. 13A, the transport path 10
While discharging the prewetting liquid toward the substrate G on the
Set the scanning direction of the cheat PN in the opposite direction to the substrate transfer direction.
If set, the nozzle scanning speed V_NAnd substrate transfer speed V_GWhen
Relative speed (V _N+ V_G) Nozzle N (P
N) scans from the front edge to the rear edge of the substrate G,
Even if the size of the board G is large, the board G can be
Wet the entire surface to be treated (resist surface) with prewetting liquid
You can

When the substrate G reaches a predetermined position on the downstream side in the pre-wet portion 124, the substrate tilting mechanism 180 operates to lift the substrate G above the transfer path 108 as described above with reference to FIGS. 11 and 12. Tilt backwards. Due to the inclined posture of the substrate G, most of the prewetting liquid remaining or adhering on the substrate G flows down to the rear of the substrate and is collected in the prewetting liquid pan 130.

The substrate G which has been subjected to the above-mentioned pre-wet processing in the pre-wet section 124 is then carried on the transport path 108 and is carried into the developing solution supply section 126. Developer supply unit 1
In 26, the developer is sprayed from the developer supply nozzle DNa while passing through the first module M3, and the developer is sprayed from the developer supply nozzle DNb while passing through the next module M4. Each developing solution supply nozzle DNa,
DNb is a top (to be processed of the substrate G in the roller conveyor while moving horizontally along the conveying path 108 above the conveying path 108 by the scanning driving of the nozzle scanning mechanism SC _N as described above per FIGS. 9 and 10 Spray the developer onto the surface. The liquid that has fallen out of the substrate G due to the spraying of the developer is
It is received and collected in the developing solution pan 132 installed under the transport path 108.

Similar to the above-mentioned pre-wet portion 124,
Also in the developing solution supply unit 126, as shown in FIG. 13A, the direction in which the nozzle DN is scanned while the developing solution is discharged toward the substrate G on the transport path 108 is set to the opposite direction to the substrate transport direction. You may As a result, the nozzle DN scans from the front end to the rear end of the substrate G at a relative speed (V _N + V _G ) that is the sum of the nozzle scanning speed V _N and the substrate transport speed V _G, and the size of the substrate G is reduced. Even if it is large, the developer can be supplied to the entire surface to be processed (resist surface) of the substrate G in a very short time.

In this embodiment, the modules M3 and M4 are
Since it is provided a separate developer supply nozzle DNa, DNb a nozzle scanning mechanism SC _N for each substrate on the conveying path 108 G
On the other hand, it is possible to supply the developing solution a plurality of times at intervals of time and space, and the characteristics (concentration etc.) of the developing solution can be changed between the first and second times.

The substrate G, to which the developing solution has been supplied to the entire surface to be processed by the developing solution supply section 126 as described above, is carried on the transport path 108 as it is and carried into the developing solution dropping section 128. Then, when it arrives at a predetermined position on the downstream side within the developer dropping unit 128, the substrate tilting mechanism 180 installed there operates to lift the substrate G above the transport path 108 to transport the substrate G in the transport direction. Moreover, for example, the substrate G is inclined so that it faces forward, that is, the side of the developing solution supply unit 126 that performs the previous step is the upper side. Due to this inclined posture, most of the developing solution deposited on the substrate G flows down to the front side of the substrate and the developing solution pan 13
Recovered to 2. In this way, the substrate G is tilted so that the side of the developing solution supply unit 126 that performs the pre-process is on the upper side. Therefore, when the substrate G is tilted by the developing solution removing unit 128 and drained, the developing solution pan 132 is used. It is possible to reduce the possibility that the splashed liquid adheres to the substrate G on the developer supply unit 126 side.

The substrate G, which has been supplied and collected with the developing solution as described above in the developing section 112, is carried into the rinsing section 114 along the transport path 108. The rinsing unit 114, the scan driver of the nozzle scanning mechanism SC _R as described above per FIGS. 9 and 10 are rinsing liquid supply nozzle RN conveying path 108
A rinsing liquid, such as pure water, is sprayed toward the upper surface (the surface to be processed) of the substrate G that is being transported while moving horizontally along the direction.
The rinse liquid that has fallen outside the substrate G is collected in the rinse liquid pan 134 that is installed below the transport path 108.

Also in the rinse section 114, as shown in FIG. 13A, the direction in which the nozzle RN is scanned while the developing solution is discharged toward the substrate G on the transfer path 108 is set to the opposite direction to the substrate transfer direction. You can do it. Thus, it becomes possible to scan at a relative speed nozzle RN is the sum of the nozzle scanning speed V _N and the substrate transport speed V _G (V _N + V _G) from the front end of the substrate G to the rear end, the size of the substrate G Even if it is large, the rinse liquid can be supplied to the entire surface to be processed (resist surface) of the substrate G within a very short time, and the replacement with the rinse liquid (stop development) can be quickly performed. A rinse liquid supply nozzle (not shown) for cleaning the back surface of the substrate G may be provided below the transport path 108.

The substrate G, which has been subjected to the above-described rinsing process in the rinsing unit 114, rides on the transport path 108 and is dried in the drying unit 116.
Be delivered to. In the drying unit 116, as shown in FIG. 4, the upper and lower air knives EN installed at a predetermined position with respect to the substrate G transported on the transport path 108 has a knife-shaped sharp edge on the upper surface (processed surface) and the back surface of the substrate. By applying a gas flow such as air, the liquid (mainly the rinse liquid) adhering to the substrate G is blown off (removed) to the rear of the substrate.

The substrate G that has been drained by the drying unit 116 is sent to the substrate unloading unit 118 along the transport path 108 as it is. The substrate carry-out unit 118 has the same configuration as the substrate carry-in unit 110, and operates in the same manner as the substrate carry-in unit 110 except that the substrate carrying directions are opposite between carrying-in and carrying-out. That is, the lift pins 122 for transferring the substrate are connected to the transport path 108.
The substrate G on the upstream side (drying unit 1
16) Waiting for the flow from the substrate G, the board G lift pin 1
When it reaches a predetermined position immediately above 22, the lift pin 122 is pushed upward to lift the substrate G in a horizontal posture, and the substrate G is transferred to an adjacent substrate transfer mechanism (not shown).

In this developing unit (DEV) 94, a large number of substrates G are conveyed in a line at a predetermined interval on the conveying path 108 while pre-wetting section 124 and developing solution supplying section 1 are being carried out.
26, the developing solution dropping unit 128, the rinsing unit 114, and the drying unit 116 are sequentially performed, so that a high-efficiency or high-throughput development processing step by a pipeline system can be realized.

Particularly, in the pre-wet section 124, the developing solution supply section 126 and the rinse section 114, the nozzles PN for supplying the processing solution (pre-wet solution, developing solution, rinse solution) to the substrate G on the transfer path 108, By scanning DNa, DNb, and RN above the transport path 108 along the transport path 108, the entire surface of the substrate to be processed can be processed even if the size of the substrate G is large or the transport speed of the transport path 108 is not high. It is possible to supply the treatment liquid uniformly and quickly in a short time.
In particular, in the developing solution supply step, the time difference of the processing solution supply between one end (front end) and the other end (rear end) in the transport direction of the substrate G, that is, the time difference of the start of development can be shortened as much as possible. The in-plane uniformity of development quality on the substrate can be improved.

Further, separate pans 13 are provided for the pre-wet section 124, the developing solution supply section 126, and the rinse section 114, respectively.
By providing 0, 132, and 134, the separation recovery rate of each processing liquid (prewetting liquid, developing liquid, rinse liquid) is increased. Further, in the pre-wetting section 124 and the developing solution dropping section 128, the substrate tilting mechanism 180 efficiently collects the respective processing solutions (pre-wetting solution and developing solution) from the substrate G after the solution processing. The rate can be further improved.

It is also possible to provide the rinse portion 114 with the substrate tilting mechanism 180. When inclining the substrate G in the rinse section 114, it is preferable to incline the substrate G in the transport direction, for example, so that the developing solution supply unit 126 side is on the upper side. Since the substrate G is tilted so that the developing solution supply unit 126 side is the upper side, the rinse solution discharged from the rinse solution supply nozzle RN bounces on the inclined substrate G, and the bounced rinse solution is on the developing solution supply unit 126 side. The possibility of being attached to the substrate G can be reduced.

The nozzle scanning mechanism SC of this embodiment
In this case, since the nozzle N is configured to be capable of bidirectionally scanning along the transport path 108, the surface to be processed of the substrate G while scanning the nozzle N in the same direction as the substrate transport direction as shown in FIG. It is also possible to supply the treatment liquid Q to the whole.
In this case, it is necessary to set the nozzle scanning speed V _N 'to a speed higher than the substrate transfer speed V _G.

Further, in this embodiment, the pre-wet section 1
24 and the developing solution supply unit 126 are configured to perform spray-type development. However, it is easy to change to the paddle system, and in the developing solution supply section 126, the developing solution supply nozzles DNa and DNb may be replaced with a spray type discharge type structure. Further, in the paddle system, the pre-wet portion 124 is unnecessary.

In the developing solution supply section 126, one of the developing solution supply nozzles DNa and DNb (usually the downstream side D
It is also possible to omit Nb). Further, the scannable area of each movable nozzle N on the transport path 108 may be set in a range exceeding one module M, and it is also possible to adopt a configuration in which the adjacent movable nozzles can get into each other on a common guide rail. .

In this embodiment, as described above, the substrate inclining mechanism 180 arranged in the downstream portion of the developing unit 122 efficiently collects the developing solution from the substrate G before carrying it into the rinse unit 114. . Dropping the developing solution from the substrate G just before the rinsing step also has an advantage that the replacement with the rinsing solution or the stop of the development can be accelerated in the rinsing step.

It is also effective to provide an air knife mechanism as shown in FIG. 14 in the vicinity of the boundary between the developing section 122 and the rinse section 114, instead of or in combination with such an inclination method. In FIG. 14, the air knife F
N has an innumerable air ejection port or slit-shaped air ejection port extending from one end to the other end of the substrate W in the width direction of the transport path 108, and a substrate passing by (directly below) at a predetermined position. A sharp knife-like gas stream (usually an air stream or a nitrogen gas stream) is applied to G. As a result, while the substrate G passes through the air knife FN, the developing solution Q on the substrate is swept up to the rear end side of the substrate and is wiped out of the substrate.

The configuration of each part in the above-described embodiment is an example, and various modifications can be made. For example, the configurations of the nozzle support 156 and the scan driver 160 in the nozzle scanning mechanism SC can be modified arbitrarily. Further, the substrate inclining mechanism 180 in the above-described embodiment is configured to incline the substrate G after raising it in the horizontal posture above the transport path 108. However, as another method, a substrate tilting mechanism in which a member whose upper end surface is tilted from the beginning is pushed up from below the substrate G is also possible.

In the above-described embodiment, the roller conveying type conveying path 108 is constructed by horizontally laying a pair of conveying rollers 138A and 138B fixed to the rotatable shaft 136 at a predetermined interval. In such a roller transport type transport path, a substrate transport roller may be attached at an intermediate position between both transport rollers 138A and 138B. It is also possible to divide the drive system of the transport path 108 into a plurality in the transport direction and independently control the transport operation (speed, stop, etc.) on each of the split transport paths. Further, a belt-conveying type conveying path in which a pair of belts are laid horizontally in a certain interval is also possible.

Further, in the pre-wet portion 124, the developing solution dropping portion 128 and the rinse portion 114, even if the direction of tilting the substrate is set to a direction different from the above-mentioned direction, or the substrate is processed in a horizontal state or a tilted state. It goes without saying that it is good.

Further, the nozzle scanning means for moving the movable nozzle along the transport path may include means for variably controlling the moving speed of the movable nozzle. For example, in the nozzle scanning mechanism SC as shown in 10,
The rotation speed of the electric motor 168 may be variably controlled stepwise or continuously by a known speed control method such as voltage control or field control, or the electric motor 16
A transmission (not shown) may be provided between the drive gear 8 and the drive pulley 164.

Generally, the processing liquid ejected from the nozzle is
It tends to flow toward the front edge or the rear edge of the substrate, and tends to collect at the front and rear edges of the substrate. Therefore, in the region near the front end edge and the region near the rear end edge of the substrate, the relative moving speed of the movable nozzle with respect to the substrate is relatively increased to reduce the pool of the processing liquid. On the other hand, in the intermediate region of the substrate, the processing liquid does not escape so much, so the relative moving speed of the movable nozzle is made relatively small so that the liquid surface height becomes a certain level. For example, when the substrate size is 680 mm (width) x 880 mm (length), within about 60 mm from the front edge of the substrate and within about 100 mm from the area near the front edge and the rear edge of the substrate. The relative moving speed of the movable nozzle is set to about 300 mm / sec in the area near the rear edge, and the relative moving speed of the movable nozzle is set to about 200 mm in the middle area of the substrate.
/ sec. In this way, the surface to be processed of the substrate is divided into a plurality of (for example, three) regions in the transport direction, and the relative moving speed of the movable nozzle with respect to each region is changed stepwise or continuously, whereby the liquid on the substrate is changed. The film can be made uniform. The setting value (size or ratio) of each area
May be selected according to the substrate size, the type of processing liquid, and the like.

As another embodiment, the treatment liquid supply means may include means for changing the flow rate of the treatment liquid ejected from the nozzle. For example, in the above-described embodiment, a configuration may be adopted in which a flow rate control valve (not shown) is provided in the middle of the processing liquid supply pipe 176 (FIG. 9). In this case also, the surface to be processed of the substrate is divided into a plurality of regions in the transport direction, for example, a region near the front end of the substrate, a region near the intermediate region of the substrate, and a region near the rear end of the substrate, and the ejection amounts of the processing liquid from the nozzles for these three regions are individually divided. By setting, the liquid film on the substrate can be made uniform. Normally, the amount of the processing liquid ejected is relatively small for the region near the front end of the substrate and the region near the rear end of the substrate, and the amount of the processing liquid ejected for the intermediate region of the substrate is relatively large so that the liquid film becomes uniform Can be changed.

The substrate to be processed in the present invention is not limited to the LCD substrate, but includes any substrate to which development processing can be applied.

[0116]

As described above, according to the development processing apparatus of the present invention, the development processing can be efficiently performed in a short time while the substrate to be processed is conveyed on the conveyance path laid in the horizontal direction. It is also possible to obtain excellent development quality.

[Brief description of drawings]

FIG. 1 is a plan view showing a configuration of a coating and developing treatment system to which a developing treatment apparatus of the present invention can be applied.

FIG. 2 is a side view showing a configuration of a thermal processing unit in the coating and developing treatment system of the embodiment.

FIG. 3 is a flowchart showing a processing procedure in the coating and developing processing system according to the embodiment.

FIG. 4 is a front view showing the overall configuration of the developing unit of the embodiment.

FIG. 5 is a plan view showing a configuration around a substrate loading unit and a pre-wet unit in the developing unit of the embodiment.

FIG. 6 is a partial cross-sectional front view showing the configuration around the substrate loading unit and the pre-wet unit in the developing unit of the embodiment.

FIG. 7 is a partial cross-sectional side view showing the configuration and operation (substrate transfer) of the substrate loading unit in the embodiment.

FIG. 8 is a partial cross-sectional side view showing the configuration and operation (substrate transfer) of the substrate loading unit in the embodiment.

FIG. 9 is a partial cross-sectional side view showing the configuration of the nozzle scanning mechanism in the embodiment.

FIG. 10 is a perspective view showing a configuration of a nozzle scanning mechanism in the embodiment.

FIG. 11 is a partial cross-sectional side view showing the configuration and operation (substrate lifting) of the substrate tilting mechanism in the embodiment.

FIG. 12 is a partial cross-sectional side view showing the configuration and operation (substrate tilt) of the substrate tilt mechanism in the embodiment.

FIG. 13 is a schematic side view showing the action of nozzle scanning in the embodiment.

FIG. 14 is a schematic side view showing the operation of the air knife in the embodiment.

[Explanation of symbols]

10 Coating and developing system 16 (P / S) process station 32 Coating Process Department 94 Coating unit 108 transport path 110 Substrate loading section 112 Development Department 114 Rinse 116 Drying section 118 substrate unloading section 124 Pre-wet part 126 Developer Supply Unit 128 developer drop 130 Pre-wet liquid pan 132 developer pan 134 Rinse pan N movable nozzle PN prewetting liquid supply nozzle DNa, DNb developer supply nozzle RN rinse liquid supply nozzle SCP, SCN, SCR nozzle scanning mechanism 156 nozzle support 158 Guide rail 160 scan driver 170 Lift drive 180 Substrate tilting mechanism

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2H096 AA27 AA28 GA17 GA23 GA24                       GA26                 5F046 LA11 LA18

Claims (27)

[Claims] 1. A transport path in which a transport body for horizontally placing and transporting a substrate to be processed is laid in a horizontal direction, and a transport for driving the transport body to transport the substrate on the transport path. At least one of a driving unit, a processing liquid supply unit including one or a plurality of nozzles for supplying a predetermined processing liquid for development processing to the surface to be processed of the substrate on the transport path, and at least one of the processing liquid supply units. And a nozzle scanning unit for moving one nozzle as a movable nozzle along the transport path. 2. The development processing apparatus according to claim 1, wherein the movable nozzle of the processing liquid supply unit has a large number of ejection openings arranged at regular intervals in the width direction of the transport path. 3. The development processing apparatus according to claim 1, wherein the processing liquid supply unit includes a unit that changes a flow rate of the processing liquid ejected from the nozzle. 4. A substrate front end vicinity region within a first distance from a substrate front end edge and a substrate rear end vicinity region within a second distance from a substrate rear end edge in the transport direction of the surface to be processed of the substrate and the substrate front end. 3. A substrate intermediate region sandwiched between a region near the substrate and a region near the rear end of the substrate is divided into three regions, and the amount of the processing liquid ejected when the processing liquid is supplied from the nozzle to the three regions is individually set. Item 4. The development processing apparatus according to Item 3. 5. The development processing apparatus according to claim 4, wherein the processing liquid jetting amount is substantially equal to the substrate front end vicinity region and the substrate rear end vicinity region and is smaller than the processing liquid ejection amount to the substrate middle region. . 6. The development processing apparatus according to claim 1, wherein the nozzle scanning unit includes a unit that changes a moving speed of the movable nozzle. 7. A substrate front end vicinity region within a first distance from a substrate front end edge and a substrate rear end vicinity region within a second distance from a substrate rear end edge in the transport direction of the surface to be processed of the substrate and the substrate front end. A nozzle moving speed when the processing liquid is supplied from the movable nozzle to each of the three regions is divided into a near region and a substrate intermediate region sandwiched by the substrate rear end near region, and the nozzle moving speed is individually set. Item 7. The developing device according to Item 6. 8. The development processing apparatus according to claim 7, wherein the nozzle moving speeds for the substrate front end vicinity region and the substrate rear end vicinity region are set to be substantially equal to each other and are higher than the nozzle movement speed for the substrate middle region. 9. The nozzle scanning means includes a nozzle support portion that supports the movable nozzle, a guide portion that guides the nozzle support portion above the transport path, and moves along the guide portion. 9. The development processing apparatus according to claim 1, further comprising: a drive unit that drives the nozzle support unit. 10. The development processing apparatus according to claim 1, further comprising a nozzle elevating unit that elevates and lowers the movable nozzle in order to adjust or change a height position of the movable nozzle. 11. The development processing apparatus according to claim 1, further comprising a cover that covers a space on the transport path where the movable nozzle is movable. 12. A developing unit for supplying a developing solution to the surface to be processed of the substrate for development along the transport path, and pure water on the surface to be processed of the substrate downstream of the developing unit. The development processing apparatus according to any one of claims 1 to 11, further comprising a rinsing section for supplying the toner to stop the development. 13. A first liquid collecting part for collecting the liquid that has fallen under the transport path in the developing part, and a first liquid collecting part for collecting the liquid that has fallen under the transport path in the rinse part. Two
13. The developing processing apparatus according to claim 12, further comprising: 14. A first means for spraying a developing solution onto the surface to be processed of the substrate in the developing section by the processing solution supply means.
14. The nozzle scanning unit includes a first nozzle scanning unit for moving the first movable nozzle along the transport path at least in the area of the developing unit. The development processing apparatus described in 1. 15. A second means for the processing solution supply means to puddle a developing solution on the surface to be processed of the substrate in the developing section.
15. The nozzle scanning means includes a second nozzle scanning unit for moving the second movable nozzle along the transport path at least in the area of the developing unit.
The development processing apparatus according to any one of 1. 16. The processing solution supply means includes a third movable nozzle for spraying a processing solution for pre-wetting onto the surface to be processed of the substrate in the developing section prior to the development, and the nozzle scanning means is provided. And a third nozzle scanning unit for moving the third movable nozzle along the transport path at least in the area of the developing unit.
The development processing apparatus according to any one of 1. 17. The processing liquid supply means includes a fourth movable nozzle for spraying a rinse liquid onto the surface to be processed of the substrate in the rinse portion, and the nozzle scanning means is at least in the area of the rinse portion. 12. A fourth nozzle scanning unit for moving the fourth movable nozzle along the transport path according to claim 12,
6. The development processing apparatus according to any one of 6. 18. The development processing apparatus according to claim 1, further comprising a substrate inclining unit that inclines the substrate to drop the processing liquid by gravity on the transport path. 19. The substrate tilting means tilts the substrate toward the front or the rear of the transport path.
The development processing apparatus described in 1. 20. The development processing according to claim 18, wherein the substrate tilting means includes a first substrate tilting part that tilts the substrate in order to drop the developer used for development from the substrate by gravity. apparatus. 21. The substrate inclining means includes a second substrate inclining portion for inclining the substrate in order to drop the processing liquid used for prewetting on the substrate by gravity.
The development processing apparatus according to any one of 0. 22. A processing liquid removing unit that moves a predetermined physical force relatively horizontally along the surface of the substrate to remove the processing liquid from the substrate in a horizontal posture on the transfer path. Item 22. The development processing apparatus according to any one of items 1 to 21. 23. The processing liquid removing means applies a sharp gas flow to the surface of the substrate at a first position in order to brush off the developing liquid used for development from the substrate transported on the transport path. The development processing apparatus according to claim 22, further comprising a gas injection unit. 24. The treatment liquid removing unit applies a sharp gas flow to the surface of the substrate at the second position in order to brush off the rinse liquid used for stopping the development from the substrate transported on the transport path. 23. A gas injection means for applying the gas is included.
The development processing apparatus according to item 3. 25. The developing solution collecting section for collecting mainly the developing solution used for development in the developing section, wherein the first collecting section includes a developing solution collecting section. The described development processing apparatus. 26. The pre-wet liquid collecting part for mainly collecting and collecting the processing liquid used for pre-wetting in the developing part, wherein the first liquid collecting part contains a pre-wet liquid collecting part. The development processing apparatus according to item. 27. The substrate carrier includes at least a pair of rollers coupled to a rotatable shaft.
The development processing apparatus according to any one of 1.