CN1391128A - Videograph processing devices - Google Patents

Videograph processing devices Download PDF

Info

Publication number
CN1391128A
CN1391128A CN02126281A CN02126281A CN1391128A CN 1391128 A CN1391128 A CN 1391128A CN 02126281 A CN02126281 A CN 02126281A CN 02126281 A CN02126281 A CN 02126281A CN 1391128 A CN1391128 A CN 1391128A
Authority
CN
China
Prior art keywords
substrate
mentioned
nozzle
carrying path
processing devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN02126281A
Other languages
Chinese (zh)
Other versions
CN1252514C (en
Inventor
宫崎一仁
佐田彻也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1391128A publication Critical patent/CN1391128A/en
Application granted granted Critical
Publication of CN1252514C publication Critical patent/CN1252514C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/02—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of milling cutters
    • B24B3/06—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of milling cutters of face or end milling cutters or cutter heads, e.g. of shank type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

To carry out development processing effectively in a short time, while carrying a processing substrate on a carrying path laid in the horizontal direction. A development unit(DEV) 94 is formed, by arranging a plurality of modules M1 to M8, which form a carry path 108 extending along a process line B continuously in a single line. The module M1 among the modules M1 to M8, which is positioned at the uppermost end, constitutes a substrate carry-in part 110. The four modules M2, M3, M4, M5, which follow it, constitute a development part 112, the next module M6 constitutes a rinse part 114, the next module M7 constitutes a drying part 116, and the last module M8 constitutes a substrate carry-out part 118. A pre-wet part 124, a developer supply part 126 and the rinse part 114 are provided with a prewetting liquid supply nozzle PN, which is movable in both directions along the carrying path 108 with its nozzle discharge port facing the carry path 108, a developer supply nozzle DN and a rinse liquid supply nozzle RN, respectively.

Description

Videograph processing devices
Technical field
The present invention relates to the Videograph processing devices that horizontal feed processed substrate in one side carries out a series of developing treatment process on one side.
Background technology
Recently, in the resist coating developing disposal system that LCD (LCD) makes, as the developing mode ground that advantageously maximizes corresponding to the LCD substrate, on the substrate carrying path of laying conveying roller and travelling belt in the horizontal direction and constituting, carry on one side the LCD substrate, on one side in conveying, carry out a series of developing treatment process such as developing, flushing, drying so-called advection mode caused that people note.This advection mode is compared with the rotation mode that substrate is rotatablely moved, and the formation of the processing of substrate and induction system and drive system is comparatively simple, exists smog to take place and adhere to advantages such as few again to substrate.
In the advection mode in the past, on the precalculated position in the substrate carrying path, difference fixed configurations developer supply nozzle and washing fluid supply nozzle, when substrate passes through each nozzle next door (normally), each nozzle ejection treating fluid (developer, washing fluid), processed for the treatment of fluid being supplied with substrate.When being L at the substrate length setting of throughput direction, when transporting velocity is set at V, giving required time (treating fluid service time) T of whole processed providing chemical liquid of 1 substrate can be by the following formula budgetary estimate:
T＝L/V ……(1)
By (1) formula as seen, sizes of substrate (L) is big more, and treating fluid service time T is long more, and this is a problem cumbersome in the developing treatment process.In other words, in the advection mode, treating fluid service time T accepts the mistiming that treating fluid is supplied with between an end of substrate throughput direction (leading section) and other one (rearward end), when treating fluid is developer, be the mistiming that developing begins.This mistiming, (T) was big more, and on-chip developing quality is inconsistent more, the problem that exists inner evenness to reduce.
At this problem, developed the method that improves transporting velocity V in the past, yet in the advection mode, transporting velocity V is limited, and transporting velocity is when very high, substrate is big more in the possibility of carrying damage in transit, and this is not an effective solution.
Summary of the invention
The problem that The present invention be directed to above-mentioned prior art is developed, and carries processed substrate to carry out the Videograph processing devices that developing is handled quickly and efficiently in a kind of carrying path that lays in the horizontal direction while it provides.
Another object of the present invention provides in a kind of carrying path that lays in the horizontal direction while carrying processed substrate to carry out the Videograph processing devices that developing is handled in high quality.
For achieving the above object, Videograph processing devices of the present invention has: level is laid and to be used for approximate horizontal ground and to load and carry the transfer unit of processed substrate and the carrying path that forms; For on above-mentioned carrying path, carrying this substrate to drive the transport driving of above-mentioned transfer unit; Have one or more processed treating fluid feed mechanisms of supplying with the developing processing with the nozzle of predetermined process liquid that are used for to this substrate on above-mentioned carrying path; As flap nozzle make above-mentioned treating fluid feed mechanism at least one nozzle along nozzle scan mechanism that above-mentioned carrying path moves.
In the above-described configuration, the flap nozzle for the treatment of fluid feed mechanism sprays treating fluid by nozzle scan mechanism to the processed substrate of carrying on one side in carrying path, one edge carrying path moves or scans, thus one, be not subjected to the influence of substrate transporting velocity and sizes of substrate in fact and can apace treating fluid be supplied with whole processed of substrate.
In Videograph processing devices of the present invention, a preferred implementing form nozzle scan mechanism has: the nozzle support sector of support activities nozzle; The guide part of guiding nozzle support sector above carrying path; Driving is along the drive division of the nozzle support sector that this guide part moves.Under the situation of this structure, can make flap nozzle and nozzle support sector high-speed mobile stably integratedly.And, the mechanism of nozzle lifting is set in the nozzle support sector, can regulate or change the height and position of flap nozzle thus.
In addition, by cover the removable space of the flap nozzle on the carrying path with cover, form foreign thus and be difficult to enter the interior normal process space of cover.
In Videograph processing devices of the present invention, can be provided with: developer is supplied with processed of substrate and carry out the development part of developing along carrying path as citation form ground; In the downstream of this development part pure water is supplied with processed of substrate and stop the rinse part of developing.In this case, in development part, be provided with and collect the first liquid collecting portion drop on the liquid below the carrying path, the second liquid collecting portion that drops on the liquid below the carrying path of collecting is set in rinse part.
According to one embodiment of present invention, the treating fluid feed mechanism has in development part first flap nozzle that developer is injected on processed of the substrate, and this nozzle scan mechanism has at least in the zone of development part along the first nozzle scan portion that carrying path moves this first flap nozzle.Adopt this structure, can carry out atomizing developing operation quickly and efficiently and can obtain good developing quality according to nozzle scan mode of the present invention.
According to another embodiment of the invention, the treating fluid feed mechanism is included in and makes second flap nozzle of developer covered with processed of substrate in the development part, and this nozzle scan mechanism comprises at least in the development part zone along the second nozzle scan portion that the conveyance path moves this second flap nozzle.Adopt this formation, can carry out vane type developing operation quickly and efficiently and can obtain good developing quality according to nozzle scan mode of the present invention.
According to another embodiment of the invention, the treating fluid feed mechanism is included in and will drenches use reason liquid before the inherent developing of development part in advance and be injected in the 3rd flap nozzle on processed of the substrate, and nozzle scan mechanism comprises at least in the zone of development part along the 3rd nozzle scan portion that carrying path moves the 3rd flap nozzle.Adopt this formation, can before regular developing operation, drench operation in advance expeditiously with the short time, obtain the good quality of drenching in advance according to nozzle scan mode of the present invention.
According to another form of implementation of the present invention, the treating fluid feed mechanism is included in the rinse part the 4th flap nozzle that washing fluid is injected on processed of the substrate, and nozzle scan mechanism comprises at least in the zone of rinse part along the 4th nozzle scan portion that carrying path moves the 4th flap nozzle.Adopt this mechanism, can be used to stop the flushing operation of developing quickly and efficiently and obtain good developing quality.
In Videograph processing devices of the present invention, preferably adopt to have on carrying path, making treating fluid lean on gravity to fall the structure of the substrate leaning device that makes the substrate inclination from substrate.Utilize this substrate leaning device, can at the liquid after making processing quickly and efficiently when substrate falls, reclaim efficiently.
As a kind of form of substrate leaning device of the present invention, make structure that substrate tilts and drench used treating fluid in advance to fall the structure that substrate is tilted by gravity from substrate all be feasible for making for the used developer of developing is fallen from substrate by gravity.Make direction that substrate tilts the preferably the place ahead or the rear of carrying path.
In addition, replace above-mentioned substrate leaning device or be used in combination ground with it, preferred such structure, promptly it has for remove treating fluid from the substrate that is flat-hand position on carrying path and makes certain physical force remove mechanism along the treating fluid that substrate surface relatively moves horizontally.
Remove a kind of form of mechanism as this treating fluid, be provided with on the carrying path from carry substrate sweep the used developer of developing on the primary importance to substrate surface spray sharp keen air-flow the gas injecting-unit structure and be provided with on carrying path, all being feasible in the second place to the structure that substrate surface sprays the gas injecting-unit of sharp keen air-flow from carry substrate to sweep falling to stopping the used washing fluid of developing.
In Videograph processing devices of the present invention, by above-mentioned substrate leaning device and gas injection equipment are set, for example preferably in development part, be provided with the used developer of main collection developing developer liquid collecting portion structure and the structure that the pre-wetting liquid liquid collecting portion of used treating fluid is drenched in main collection in advance is set in development part.
The ideal form of the carrying path of Videograph processing devices of the present invention is such, i.e. laying in the horizontal direction has the substrate transfer unit of at least one pair of roller that is connected with turning axle and constituted roller conveying-type carrying path.The invention effect
As mentioned above, according to Videograph processing devices of the present invention, on the carrying path that can lay in the horizontal direction,, handle Yi Bian carry out developing quickly and efficiently, thereby can access good developing quality Yi Bian carry processed substrate.
Description of drawings
Fig. 1 is the planimetric map of expression Videograph processing devices of the present invention coating developing applicatory disposal system structure.
Fig. 2 is the side view of thermal treatment portion structure of the coating developing disposal system of expression embodiment.
Fig. 3 is the process flow diagram of processing sequence of the coating developing disposal system of expression embodiment.
Fig. 4 is the integrally-built front elevation of picture display unit of expression embodiment.
Fig. 5 is the substrate input part of picture display unit of expression embodiment and the planimetric map of the structure around the pre-pre-wet part.
Fig. 6 is that the substrate input part of the picture display unit of expression embodiment cuts open front view with the office of pre-pre-wet part structure on every side.
Fig. 7 is that side view cuts open in the structure of substrate input part of expression embodiment and the office of effect (substrate handover).
Fig. 8 is that side view cuts open in the structure of substrate input part of expression embodiment and the office of effect (substrate transfer).
Fig. 9 is that side view cuts open in the office of structure of the nozzle scan mechanism of expression embodiment.
Figure 10 is the oblique view of structure of the nozzle scan mechanism of expression embodiment.
Figure 11 is that side view cuts open in the structure of substrate leaning device of expression embodiment and the office of effect (lifting substrate).
Figure 12 is the formation of substrate leaning device of expression embodiment and innings disconnected side view of effect (substrate inclinations).
Figure 13 is the diagrammatic side view of the nozzle scan effect of expression embodiment.
Figure 14 is the diagrammatic side view of the air knife effect of expression embodiment.
The explanation of best form of implementation
Below, the embodiment that the present invention is fit to reference to description of drawings.
Fig. 1 represents to be applicable to a kind of coating developing disposal system of Videograph processing devices of the present invention.This coating developing disposal system 10 is arranged in the clean room, is processed substrate with the LCD substrate for example, carries out various processing such as cleaning in the photo-mask process, resist coating, prebake conditions, developing and back baking in LCD manufacturing process.Exposure-processed is undertaken by the outside exposure device 12 that is adjacent to be provided with this system.
Coating developing disposal system 10 is provided with horizontal processing stations (P/S) 16 and is provided with box casket station (C/S) 14 and interface station (I/F) 18 at vertical (directions X) two ends at central part.
Box casket station (C/S) the 14th, the box casket IO channel of system 10, it has: in the horizontal direction as on the Y direction 4 load the objective table 20 make the multistage stacked a plurality of box casket C of substrate G abreast; Box casket C on the objective table 20 is carried out the conveying mechanism that picks and places 22 of substrate G.Conveying mechanism 22 has the parts that can keep substrate G also can comply with action on X, Y, Z, Q 4 as carrying support arm, and it carries out the substrate G handing-over with adjacent processing stations (P/S) 16.
Processing stations (P/S) 16 a pair of extend system vertically parallel and opposite production line A, the B of (directions X) be last dispose each handling part by work flow or process sequence.Exactly, from box casket station (C/S) 14 sides on the machining line A of the upstream portion of interface station (I/F) 18 sides, be provided with to clean in one linely and add the Ministry of worker 24, the first thermal treatment portion 26, coating and add the Ministry of worker 28, the second thermal treatment portion 30.In addition, from interface station (I/F) 18 sides on the machining line B of the downstream portion of box casket station (C/S) 14 sides, be provided with in one linely that the second thermal treatment portion 30, developing add the Ministry of worker 32, decolouring adds the Ministry of worker 34, the 3rd thermal treatment portion 36.In this production line form, the second thermal treatment portion 30 is positioned at the foremost of the machining line B that is positioned at the downstream backmost and simultaneously of the machining line A of upstream side, and it is across between two lines A, the B.
Between two machining line A, B, auxiliary conveying space 38 is set, can with 1 be unit ground level load the carriage 40 of substrate G can be two-way mobile on production line direction (directions X) by unshowned driving mechanism.
On the machining line A of upstream portion, clean and to add the Ministry of worker 24 and comprise scrubber and clean unit (SCR) 42, in the localities adjacent at box casket station (C/S) 14 that cleans in the unit (SCR) 42 with this scrubber, excimer laser UV illumination unit (e-UV) 41 is set.Do not come although draw, but the clean portions that scrubber is cleaned in the unit (SCR) 42 can carry or belt be flat-hand position ground on one side carry LCD substrate G on production line A direction by roller, on one side on substrate G (processed face) carry out that scratch brushing is cleaned and winding-up is cleaned.
The first thermal treatment portion 26 adjacent with cleaning the downstream add the Ministry of worker 24 is provided with longitudinal type conveying mechanism 46 along machining line A at the center, before and after it multistage stacked arrangement in both sides a plurality of unit.For example as shown in Figure 2, in the multi-level unit portion (TB) 44 of upstream side, stacked from the bottom up substrate handover with channel unit (PASS) 50, dehydration baking with heating unit (DHP) 52,54 and coherent unit (AD) 56.Here, channel unit (PASS) 50 carries out cleaning with scrubber the substrate G handing-over of unit (SCR) 42 sides.In addition, in the multi-level unit portion (TB) 48 in downstream, stacked from the bottom up substrate handover is with channel unit (PASS) 60, cooling unit (CL) 62,64 and coherent unit (AD) 66.Here, channel unit (PASS) 60 carries out adding with coating the substrate G handing-over of the Ministry of worker's 28 sides.
As shown in Figure 2, conveying mechanism 46 has: the lifting transfer unit 70 of guide rail 68 liftings that can vertically extend; At the rotary conveying part 72 that can on the θ direction, rotate or rotate on the lifting transfer unit 70; Support substrate G also can front and back advance and retreat or flexible conveying support arm or pliers 74 on rotary conveying part 72.The drive division 76 that orders about 70 elevating movements of lifting transfer unit is arranged on the bottom of vertical guide rail 68, the drive division 78 of driven in rotation transfer unit 72 rotations is installed on the vertical transport parts 70, drives to carry the drive division 80 of support arm 74 advance and retreat to be installed on the rotary conveying part 72.Each drive division 76,78,80 can be made of motor etc.
As constituted above conveying mechanism 46 high speed liftings or rotatablely move and can near any unit in the adjacent multi-level unit portion (TB) 44,48 and also can with the carriage 40 handing-over substrate G of auxiliary conveying space 38 sides.
The coating adjacent with the first thermal treatment portion 26 downstreams adds the Ministry of worker 28 and is provided with resist coating element (CT) 82, drying under reduced pressure unit (VD) 84 and edge along machining line A as illustrated in fig. 1 with forming a line and removes unit (ER) 86.Among 3 unit (CT) 82 in coating adds the Ministry of worker 28, (VD) 84, (ER) 86, the conveying device of pressing 1 substrate G of process sequence input and output is set, in each unit (CT) 82, (VD) 84, (ER) 86, substrate ground carries out various processing piecewise.
Has same formation in abutting connection with the second thermal treatment portion 30 in downstream that coating adds the Ministry of worker 28 with the above-mentioned first thermal treatment portion 26, longitudinal type conveying mechanism 90 is set between two machining line A, B, in machining line A side (backmost) a multi-level unit portion (TB) 88 is set, another multi-level unit portion (TB) 92 is set in machining line B side (foremost).
Come although draw, for example at multi-level unit portion (TB) 88 places of machining line A side substrate handover is arranged on subordinate with channel unit (PASS), in the above, prebake conditions can stackedly be 3 grades with heating unit (PREBAKE).In addition, in the multi-level unit portion (TB) 92 of machining line B side, substrate handover is arranged on subordinate with channel unit (PASS), and cooling unit (COL) is stacked in the above is 1 grade, and prebake conditions is stacked with heating unit (PREBAKE) in the above is 2 grades.
The conveying mechanism 90 of the second thermal treatment portion 30 each channel unit (PASS) by two multi-level unit portions (TB) 88,92 not only can add the Ministry of worker 28 with coating one by one and developing adds the 32 handing-over substrate G of the Ministry of worker, can also be one by one with auxiliary conveying space 38 in carriage 40 and interface station described later (I/F) 18 handing-over substrate G.
In the machining line B of downstream portion, developing adds the Ministry of worker 32 and carries substrate G with flat-hand position on one side, Yi Bian carry out a series of developing treatment process, comprising the picture display unit (DEV) 94 of so-called advection mode.Formation of this picture display unit (DEV) 94 and effect will describe in detail in the back.
Add the downstream of the Ministry of worker 32 at developing, clamping decolouring and adding 34 configurations the 3rd thermal treatment portion 36 of the Ministry of worker.Decolouring adds the Ministry of worker 34 and has the i line UV illumination unit (i-UV) 96 that decolours and handle at processed of substrate G irradiation i line (wavelength 365nm).
The 3rd thermal treatment portion 36 has the same formation with the above-mentioned first thermal treatment portion 26 and the second thermal treatment portion 30, longitudinal type conveying mechanism 100 is set and a pair of multi-level unit portion (TB) 98,102 of both sides before and after it along machining line B.
In the multi-level unit portion (TB) 98 of upstream side, channel unit (PASS) is arranged on subordinate, back oven dry in the above with heating unit (POBAKE) be 3 grades stacked.Multi-level unit portion (TB) 102 in the downstream, back drying unit (POBAKE) is arranged on subordinate, substrate handover and cooling in the above with passage cooling unit (PASSCOL) be 1 grade stacked, in the above the back dry with heating unit (POBAKE) be 2 grades stacked.
The conveying mechanism 100 of the 3rd thermal treatment portion 36 by two multi-level unit portions (TB) 98,102 channel unit (PASS) and passage cooling unit (PASSCOL) not only piecewise substrate ground respectively with i line UV illumination unit (i-UV) 96 and box casket station (C/S) 14 handing-over substrate G, substrate ground and auxiliary conveying space 38 interior carriages 40 join substrate G piecewise.
Interface station (I/F) 18 has the exposure device 12 of adjacency and the conveying device 104 of carrying out substrate G handing-over, configuration buffering objective table (BUF) 106, expansion cooling stage (EXTCOL) 108 and peripheral unit 110 around it.At buffering objective table (BUF) 106 fixation type buffer pocket casket (not shown) is set.Expand cooling stage (EXTCOL) the 108th, have the substrate handover objective table of refrigerating function concurrently, it is used when meeting substrate G with processing stations (P/S) 16 top-cross.Peripheral unit 110 can be the formation of stacked captions video camera (TITLER) and external exposure device (EE) up and down.Conveying device 104 has the conveying support arm 104a that can keep substrate G, carries out the handing-over of substrate G with exposure device 12 and each unit (BUF) 106, (EXTCOL) 108, (TITLER/EE) 110 of adjacency.
Fig. 3 represents the processing sequence of this coating developing disposal system.At first, at box casket station (C/S) 14, take out 1 substrate G conveying mechanism 22 certain box casket C from objective table 20, the clean excimer laser UV illumination unit (e-UV) 41 (step S1) that adds the Ministry of worker 24 of input processing stations (P/S) 16.
In excimer laser UV illumination unit (e-UV) 41, substrate G carries out thermal drying (step S2) by the ultraviolet ray irradiation.Cleaning with this ultraviolet ray mainly is the organism of removing substrate surface.After ultraviolet ray was cleaned and finished, by the conveying mechanism 22 of box casket station (C/S) 14, substrate G was shifted into and cleans the clean unit (SCR) 42 of the scrubber that adds the Ministry of worker 24.
Clean in the unit (SCR) 42 at scrubber, carry or the belt conveying by roller, carry substrate G with flat-hand position towards machining line A advection, meanwhile, (processed face) carries out that scratch brushing is cleaned and winding-up is cleaned on substrate G, removes particle shape impurity (step 3) from substrate surface.After cleaning, on one side advection conveying substrate G, carry out liquid with air knife on one side and cut, so that substrate G drying.
The substrate G that has cleaned processing in scrubber is cleaned unit (SCR) 42 is transfused to the channel unit (PASS) 50 in the multi-level unit portion (TB) 44 of upstream side of the first thermal treatment portion 26.
In the first thermal treatment portion 26, substrate G is forwarded to scheduled unit by conveying mechanism 46 according to predefined procedure.For example, substrate G is shifted into from channel unit (PASS) 50 at first and also accepts processed (step S4) one of heating unit (DHP) 52,54 there.Then, substrate G is shifted in one of cooling unit (COL) 62,64 and is cooled to certain substrate temperature (step S5) there.After this, substrate G is shifted into coherent unit (AD) 56 and accepts hydrophobization there and handle (step S6).After the hydrophobization processing finished, substrate G was cooled to certain substrate temperature (step S7) in one of cooling unit (COL) 62,64.At last, substrate G is shifted into the channel unit (PASS) 50 that belongs to downstream multi-level unit portion (TB) 48.
Like this, in the first thermal treatment portion 26, substrate G can contact arbitrarily between the multi-level unit portion (TB) 48 in (TB) 44 of multi-level unit portion of upstream side and downstream by conveying mechanism 46.Second, third thermal treatment portion 30,36 also carries out identical substrates and carries action.
The substrate G that has accepted above-mentioned a series of heat or hot series of processes in the first thermal treatment portion 26 is shifted into the resist coating element (CT) 82 that the adjacent coating in downstream adds the Ministry of worker 28 from the channel unit (PASS) 60 in the downstream multi-level unit portion (TB) 48.
Substrate G for example is coated in resist liquid on its end face (processed face) by the spin coating method in resist coating element (CT) 82, then, accepting drying under reduced pressure in adjacent drying under reduced pressure unit (VD) 84, downstream handles, then, remove unnecessary (the not needing) resist (step S8) that removes substrate perimeter in the unit (ER) 86 at adjacent edge, downstream.
The substrate G that has accepted above-mentioned resist coating processing is transferred to the channel unit (PASS) of the upstream side multi-level unit portion (TB) 88 of the second thermal treatment portion 30 that belongs to adjacent from drying under reduced pressure unit (VD) 84.
In the second thermal treatment portion 30, substrate G is forwarded to certain unit by conveying mechanism 90 according to predefined procedure.For example, the baking (step S9) after substrate G is shifted into 1 heating unit (PREBAKE) and accepts the resist coating there from this channel unit (PASS) at first.Then, substrate G is shifted into 1 cooling unit (COL) and is cooled to certain substrate temperature (step 10) there.After this, substrate G passes through or is handed to without the channel unit of downstream multi-level unit portion (TB) 92 sides (PASS) the expansion cooling stage (EXTCOL) 108 of interface station (I/F) 18 sides.
On interface station (I/F) 18, substrate G is transfused to the external exposure device (EE) of peripheral unit 110 from expansion cooling stage (EXTCOL) 108, there, its acceptance is used for removing the exposure attached to the resist of substrate G outer part when developing, be sent to subsequently in the adjacent exposure device 12 (step S11).
In exposure device 12, the resist on the substrate G is by the predetermined circuit patterns exposure.Then, when the substrate G that finishes pattern exposure when exposure device 12 returns interface I position (I/F) 18 (step S11), it at first is transfused to the captions video camera (TITLRER) of peripheral unit 110, there, notes predetermined information (step S12) on on-chip predetermined position.After this, substrate G returns expansion cooling stage (EXTCOL) 108.The conveying of substrate G on interface station (I/F) 18 and undertaken by conveying device 104 with the handing-over of the substrate G of exposure device 12.
On processing stations (P/S) 16, in the second thermal treatment portion 30, conveying mechanism 90 receives the substrate G that has exposed and gives developing by the channel unit (PASS) in the multi-level unit portion (TB) 92 of machining line B side with it from expansion cooling stage (EXTCOL) 108 and adds the Ministry of worker 32.
Add in the Ministry of worker 32 the substrate G input picture display unit (DEV) 94 that will receive from the channel unit (PASS) in the multi-level unit portion (TB) 92 at developing.In picture display unit (DEV) 94, substrate G with advection mode horizontal feed, carries out a series of developing treatment process (step S13) such as developing, flushing, drying to the downstream of machining line B in this course of conveying.
Add the substrate G that has carried out the developing processing in the Ministry of worker 32 at developing and be transfused to the decolouring processing (step S14) that the adjacent decolouring in downstream adds the Ministry of worker 34 and accepts the irradiation of i line there.Finishing substrate G that decolouring handles and being given channel unit (PASS) in the upstream side multi-level unit portion (TB) 98 of the 3rd thermal treatment portion 36.
In the 3rd thermal treatment portion (TB) 98, substrate G at first is sent to 1 heating unit (POBAKE) and accepts back oven dry (step S15) there from channel unit (PASS).Then, substrate G is sent to the passage cooling unit (PASSCOL) in the downstream multi-level unit portion (TB) 102 and is cooled to predetermined substrate temperature (step S16) there.The conveying of substrate G in the 3rd thermal treatment portion 36 is undertaken by conveying mechanism 100.
In box casket station (C/S) 14 sides, conveying mechanism 22 finishes receiving the coating developing from the passage cooling unit (PASSCOL) of the 3rd thermal treatment portion 36 and handles the substrate G of whole operations and the substrate G that receives is contained among any box casket C (step S1).
In this coating developing disposal system 10, the present invention can be applicable to that developing adds the picture display unit of the Ministry of worker 32 (DEV) 94.Below, illustrate in picture display unit (DEV) 94 employing one embodiment of the present of invention with reference to Fig. 4～Figure 14.
Fig. 4 is the integrally-built mode chart in the picture display unit (DEV) 94 in one embodiment of the invention.Picture display unit (DEV) 94 is provided with a plurality of as 8 module M1～M8 along machining line B with forming a line continuously, and they have formed (directions X) last continuous carrying path 108 that extends in the horizontal direction.
Among these modules M1～M8, the module M1 that is positioned at upstream constitutes substrate input part 110, and continuous 4 module M2, the M3 of back, M4, M5 constitute development part 112, and module M6 constitutes rinse part 114, module M7 constitutes drying section 116, and last module M8 constitutes substrate efferent 118.
In substrate input part 110, be provided with flat-hand position and receive substrate G that from adjacent substrate conveying mechanism (not shown), transmits and a plurality of liftable elevating lever 120 that moves at carrying path 108.On substrate efferent 118, also be provided with flat-hand position and lift substrate G and pass to a plurality of liftable elevating lever 122 of adjacent substrate conveying mechanism (not shown).
At development part 112 or pre-pre-wet part 124 exactly is set on module M2, developer supply unit 126 is set on module M3, M4, developer is set on module M5 falls portion 128.One or more nozzle spouts that make are set facing to carrying path 108 and can move so that pre-wetting liquid such as pure water are supplied with the pre-wetting liquid supply nozzle PN of substrate along carrying path 108 is two-way on pre-pre-wet part 124.One or more spouts that make nozzle are set facing to carrying path 108 and can two-way mobile developer supply nozzle DN along carrying path 108 on developer supply unit 126.In having such example of structure, movably developer supply nozzle DN is set independently all on each module M3, M4 a, DN bFall the aftermentioned substrate leaning device 180 (Figure 11, Figure 12) that setting is tilted substrate G on portion 128 and the pre-pre-wet part 124 at developer.
One or more nozzle spouts that make are set on rinse part 114 also can be moved so that supply the washing fluid supply nozzle RN of washing fluid such as pure water to substrate along carrying path 108 twocoueses facing to carrying path 108.Be provided with on the drying section 116 one or more pairs of that clamp carrying path 108 and carry out the air knife EN that liquid is cut attached to the liquid on the substrate G (mainly being washing fluid) along 108 pairs of carrying paths.
On development part 112 and rinse part 114, be provided for collecting the basin 130,132,134 of the liquid below carrying path 108 of dropping respectively.Fall in the portion 128 at development part 112, pre-pre-wet part 124 and developer supply unit 126 and developer, also laid special-purpose basin 130,132 respectively.Bottom at each basin 130,132,134 is provided with leakage fluid dram, and it is connected with discharging tube 131,133,135.
Fig. 5～Fig. 8 is illustrated in carrying path 108 formation on every side of substrate input part 110 and pre-pre-wet part 124.
Carrying path 108 is to lay along machining line B level a pair ofly to be fixed on conveying roller 138A, the 138B on the turning axle 136 and the roller type carrying path that constitutes by predetermined space.
Exactly, on the top or axle pin member 140 of the left and right sides of each module M wall, along machining line B direction bearing 142A, 142B have been installed at regular intervals, make conveying roller 138A, 138B be positioned at wall inboard, the left and right sides, make axle 136 rotatably across between pair of bearings 142A, the 142B.On the end that extends each turning axle 136 one-sided bearing 142A outsides, fixing cross helical gear 144, each cross helical gear 148 of rotating driveshaft 146 sides of extending along machining line B direction intersect vertically with each cross helical gear 144 engagement of each turning axle 136 side.Rotating driveshaft 146 is connected with the turning axle of motor 150.When motor 150 is pressed 146 rotations of predetermined direction driven in rotation driving shaft, rotary driving force is passed at the cross helical gear of carrying with axle 136 sides 144 from each cross helical gears 148 of turning axle 146 sides, and conveying roller 138A, the 138B of each turning axle 136 rotates by predetermined direction (substrate G is delivered to direction before the carrying path 108).
On substrate input part 110, substrate handover disperses upright if be installed in horizontal arrangement on the lifter plate under the carrying path 108 152 with elevating lever 120 by predetermined space.Below lifter plate 152, the lifting drive division 154 of band cylinder (not shown) is set.
As shown in Figure 7, when lifting drive division 154 rises to predetermined altitude with lifter plate 152, elevating lever 120 is given prominence on carrying path 108 by gap between the turning axle 136, on this height and position, can receive substrate G from adjacent substrate conveying mechanism (not shown) with flat-hand position.
When handing-over substrate G on elevating lever 120, as shown in Figure 8, lifting drive division 154 makes lifter plate 152 original position that falls back, in the way that descends, substrate G two ends (two ends of the Width of carrying path 108) ride on conveying roller 138A, the 138B, and substrate G moves on carrying path 108 with flat-hand position.The external diameter of each conveying roller 138A, 138B is thinner at inboard (axle central side), and substrate G one end rides over minor diameter 139.
In Fig. 4, pre-wetting liquid supply nozzle PN, developer supply nozzle DN a, DN bAnd washing fluid supply nozzle RN is respectively by the SC of nozzle scan mechanism p, SC NAnd SC RAbove carrying path 108, move abreast with carrying path 108.
In Fig. 9 and Figure 10, the SC (SC of nozzle scan mechanism of an embodiment of expression P, SC N, SC R) formation.The SC of nozzle scan mechanism has: support activities nozzle N (PN, DN a, DN b, RN) section be the font of falling コ nozzle support sector 156; Above carrying path 108, guide the guide rail 158 (Fig. 9) of nozzle support sector 156 abreast with carrying path 108; Drive the scanning driving part 160 that nozzle support sector 156 moves along guide rail 158.
As shown in figure 10, one or more endless-belts 162 that scanning driving part 160 will be connected with nozzle transfer unit 156 by one or more vertical support members 161 are parallel to guide rail 158 (Fig. 9) and are erected between drive pulley 164 and the unsteady belt pulley 166 (promptly being parallel to carrying path 108), and the drive pulley 164 and the rotating shaft of motor 168 are dynamically connected.The rotary driving force of motor 168 is converted into along the translatory movement of the nozzle transfer unit 156 of strap length direction (directions X) by belt pulley 164,166 and belt 162.The rotational speed of control motor 168 can be adjusted to desirable value with the translational speed of directly advancing of nozzle transfer unit 156, and the sense of rotation of conversion motor 168 is directly advanced moving direction with regard to convertible nozzle transfer unit 156.In Figure 10, for simplicity and not shown guide rail 158.
On the inwall of nozzle transfer unit 156 left and right sides faces, the lifting drive division of being made up of actuators such as cylinders 170 has been installed respectively, between pair of right and left lifting drive division 170, level has been set up the horizontal strut 172 as being made of hollow tube.On the bottom of the vertical beanpole of being made up of the hollow tube that extends from the center vertical lower of horizontal strut 172 174, its spout n down level is installed with tubular flap nozzle N.Can also form the spout n of a plurality of nozzle N at regular intervals along the nozzle length direction along roughly evenly supplying with in the scope for the treatment of fluid from substrate G end to end ground on carrying path 108 Widths.
In nozzle transfer unit 156, flap nozzle N normally sprays the height and position H for the treatment of fluid because the lifting of lifting drive division 170 drives and can pass through horizontal strut 172 and vertical struts 174 liftings at the substrate G on carrying path 108 aWith during not spraying treating fluid in get out of the way the height and position H of carrying path 108 bBetween move up and down.On an end of horizontal strut 172, introduce from the treating fluid that is arranged on the treating fluid supply source (not shown) outside the carrying path 108 and supply with flexible pipe 176.Treating fluid is supplied with flexible pipe 176 is connected nozzle N with vertical struts 174 by horizontal strut 172 treating fluid introducing port.
As shown in Figure 9, can along carrying path 108 be provided for from the flap nozzle N of external lid on carrying path 108 zone of action (directions X and Z direction) and section be the cover 178 of the font of falling コ.Shown in legend, the left and right sides face that covers 178 is hung down on the upper end or axle pin member 140 of module M left and right sides wall, reduce the gap thus as far as possible.On the end face or ceiling of cover 178, can form slit (opening) 178a that horizontal strut 172 is passed.Like this, can utilize cover 178 flap nozzle N and scan drive system are separated or to block, thus among the processing space PS of the few foreign in cover 178 by flap nozzle N with the substrate G for the treatment of fluid supply on carrying path 108.
In Fig. 5 and Fig. 6, on pre-pre-wet part 124, substrate leaning device 180 is set.Substrate leaning device 180 has: can be below carrying path 108 lifting and base plate 182 that can tilt at fore-and-aft direction; A plurality of elevating levers 184 of on base plate 182, setting up or install by the predetermined space dispersion; By lifting shaft 186 from following support base 182 and carry out the drive division 188 of lifting driving and pitch drives.Lifting shaft 186 connects the opening 190 that forms on the base plate of module M2 and developer dish 130.On the inner bottom surface of developer dish 130, formed and prevented from around opening 190, to take place the 130a of cylindrical wall portion that liquid leaks.
The rear of the elevating lever 184 of row in the end just as the anti-fall lower member ground of bearing substrate G rear end when tilting to prevent to drop, rotatably is installed in rubber system tubular link stopper member 194 from elevating lever 184 branch's vertical branches bar 192 of going out backward.
Effect according to the substrate leaning device 180 of Figure 11 and Figure 12 is described here.On carrying path 108, when substrate G arrive substrate leaning device 180 just above the time, preposition sensor (not shown) detects substrate G, signal according to this sensor output, the conveying driving system control part stops the whole conveying roller 138A in this module, the rotation of 138B at least, and substrate G is become quiet.
Subsequently, the controller of substrate leaning device 180 (not shown) action makes drive division 188 work and lifting shaft 186 is risen.So, as shown in figure 11, base plate 182 and elevating lever 184 also rise, and elevating lever 184 is from the following top that upwards pushes away and substrate G is risen to carrying path 108.
Then, this controller controlling and driving portion 188 makes base plate 182 be the middle heart certain angle (for example 10 °～20 °) that rotates backward as shown in figure backward and preferably forward with the axle 196 that extends on carrying path 108 Widths.So, as shown in figure 12, the top part of base plate 182 is elevating lever 192, link stopper member 194, the substrate G same angle that also recedes on carrying path 108.At this moment, substrate G is just being blocked by block spare 194 after the landing on the elevating lever 184 slightly backward.But, on substrate G or adhere on it liquid Q because of the gravity landing to the substrate dip plane to the rear and fall outside the substrate.The liquid Q that falls from substrate G is collected in the dish (are pre-wetting liquid dishes 130 at pre-pre-wet part 124) that is arranged on this module.
After keeping above-mentioned inclination attitude to reach certain hour, under the control of controller, drive division 188 make base plate 182 along and above-mentioned opposite direction rotate with above-mentioned angle same and return flat-hand position (state of Figure 11), make lifting shaft 186 drop to original position (position of Fig. 6) then.
On pre-pre-wet part 124, under the situation that throughput direction so tilts substrate G, developer supply unit 126 sides of promptly carrying out next operation are upside, so reduced when falling the liquid that jumps back on the pre-wetting liquid dish 130 when tiltedly liquid is cut substrate G in pre-pre-wet part 124 updips attached to the possibility on the substrate G of developer supply unit 126 sides of carrying out next operation.
Below, the effect of this picture display unit (DEV) 94 is described.Substrate input part 110 receives substrate G and mobile at carrying path 108 from adjacent substrate conveying mechanism (not shown) as shown in Figure 7 and Figure 8 piecewise.By driver such as above-mentioned rotating driveshaft 146, cross helical gear 148,144 and by the rotary driving force rotation of motor 150, the substrate G that is contained on the carrying path 108 is sent to adjacent development part 112 immediately with conveying roller 138A, the 138B of axle 136 in the conveying that constitutes carrying path 108.
In development part 112, substrate G is transfused to earlier in the pre-pre-wet part 124, in roller is carried, by pure water or the low concentration developer of pre-wetting liquid supply nozzle PN injection as pre-wetting liquid.In the present embodiment, the SC of nozzle scan mechanism by Fig. 9 and Figure 10 PTurntable driving, nozzle PN one edge carrying path 108 moves horizontally, on one side the end face (processed face) of substrate G in carrying spray pre-wetting liquid.The pre-wetting liquid of meeting substrate G and being splashed to the pre-wetting liquid outside the substrate or not meeting substrate G all is collected in the pre-wetting liquid dish 130 that is arranged at below the carrying path 108.
Shown in Figure 13 (A), when the substrate G on carrying path 108 on one side sprays pre-wetting liquid and on one side the direction of scanning of nozzle PN is set at when opposite with the substrate throughput direction, nozzle N (PN) is with nozzle scan speed V NWith substrate transporting velocity V GRelative velocity (the V of addition N+ V G) sweep to the rear end from the front end of substrate G, even the size of substrate G is bigger, also can use processed (the keeping the film surface) of the wetting whole substrate G of pre-wetting liquid very fast.
When substrate G reached the precalculated position, downstream in pre-pre-wet part 124, as Figure 11 and shown in Figure 12,180 actions of substrate leaning device raised the top of carrying path 108 with substrate G thus and recede.Because it is the inclination attitude of substrate G, residual or wander the substrate rear and reclaim by pre-wetting liquid dish 130 attached to the most of pre-wetting liquid on the substrate G.
The substrate G that has accepted above-mentioned pre-leaching wet process in pre-pre-wet part 124 is transfused to developer supply unit 126 through carrying path 108.In developer supply unit 126, during by initial module M3 in, by developer supply nozzle DN aSpray developer, during by next module M4 in, by developer supply nozzle DN bSpray developer.Each developer supply nozzle DN a, DN bBy Fig. 9, the 10 described nozzle scan SC of mechanism NTurntable driving above carrying path 108, move horizontally on one side along carrying path 108, on one side spray developer to the end face (processed face) of the substrate G in roller is carried.Dropping on liquid outside the substrate G in developer sprays is collected in the developer dish 132 that is arranged at below the carrying path 108.
The same with above-mentioned pre-pre-wet part 124, in developer supply unit 126, also shown in Figure 13 (A) on one side the substrate G on carrying path 108 spray developer, Yi Bian make the direction of scanning of nozzle DN opposite with the substrate throughput direction.So, nozzle DN is with nozzle scan speed V NWith substrate transporting velocity V GRelative velocity (the V of addition N+ V G) sweep to the rear end from the front end of substrate G, even the size of substrate G is bigger, also can very fast developer be supplied with processed (the diaphragm surface) of whole substrate G.
In the present embodiment, because developer supply nozzle DN all is set respectively in each module M3, M4 a, DN bWith the SC of nozzle scan mechanism NSo, can be if having time at interval and space interval ground repeatedly developer is supplied with substrate G on carrying path 108, also can be in change developer characteristic (concentration etc.) for the first time and during the second time.
Still be transfused to developer through carrying path 108 in developer supply unit 126, for as described above whole processed substrate G that has supplied developer and fall portion 128.Then, when falling at developer in the portion 128 when arriving the precalculated position, downstream, be arranged on substrate leaning device 180 actions there, substrate G is raised above the carrying path 108, promptly on forward the direction substrate G is tilted at throughput direction, developer supply unit 126 sides of operation are upside before promptly carrying out.By this inclination attitude, the most of developer on substrate G will be wandered substrate the place ahead and be reclaimed by developer dish 132.Like this, by substrate G is tilted, developer supply unit 126 sides of operation are upside before promptly carrying out, and can reduce when developer falls portion 128 places liquid is cut substrate G obliquely at the liquid that jumps back on the developer dish 132 attached to the possibility on the substrate G of developer supply unit 126 sides.
The substrate G that finishes above-mentioned developer supply and reclaim in development part 112 is transfused to rinse part 114 through carrying path 108.By Fig. 9,10 said nozzle scanning mechanism SC RTurntable driving, washing fluid supply nozzle RN one edge carrying path 108 moves horizontally, on one side end face (processed face) jet douche liquid such as the pure water of substrate G in carrying.Dropping on the outer washing fluid of substrate G is collected in the washing fluid dish 134 that is arranged at below the carrying path 108.
On rinse part 14, shown in Figure 13 (A), on one side substrate G on carrying path 108 spray developer, make the direction of scanning of nozzle RN opposite on one side with the substrate throughput direction.Like this, nozzle RN is with nozzle scan speed V NWith substrate transporting velocity V GRelative velocity (the V of addition N+ V G) sweep to the rear end from the front end of substrate G, even the size of substrate G is bigger, also can soon washing fluid be supplied with processed (the diaphragm surface) of whole substrate G, can promptly carry out the replacing (developing stops) of washing fluid.The washing fluid supply nozzle (not shown) that is used for cleaning the substrate G back side also can be arranged on carrying path 108 below.
The substrate G that finishes above-mentioned flushing operation in rinse part 114 is transfused to drying section 116 through carrying path 108.In drying section 116, as shown in Figure 4, the EN of air knife up and down by being arranged on the precalculated position sweeps (liquid is cut) attached to the liquid on the substrate G (mainly being washing fluid) to the end face (processed face) of the substrate G that carries and the sharp keen air-flow of inner face injection cutter shape airflow for example to the substrate rear on carrying path 108.
The substrate G that cuts through liquid in drying section 116 still is sent in the substrate efferent 118 through carrying path 108.Substrate efferent 118 has the structure same with substrate input part 110, and just the input of substrate throughput direction is opposite with output and it moves the same with the substrate input part.In other words, substrate handover is being lower than the position standby of carrying path 108 with elevating lever 122, wait for that substrate G arrives from upstream side (drying section 116), when the precalculated position directly over the substrate G arrival elevating lever 122, elevating lever 122 lifts substrate G and gives adjacent substrate conveying mechanism (not shown) with flat-hand position to scalp.
In picture display unit (DEV) 94, on carrying path 108, carry a plurality of substrate G by being provided with at interval on one side with forming a line, fall and carry out every processing on portion 128, rinse part 114 and the drying section 116 successively at pre-pre-wet part 124, developer supply unit 126, developer on one side, thereby can realize efficiently or the developing treatment process of high yield with pipeline system.
Particularly in pre-pre-wet part 124, developer supply unit 126 and rinse part 114, above the carrying path 108 along carrying path 108 inswept nozzle PN, the DN that treating fluid (pre-wetting liquid, developer, washing fluid) supplied with the substrate G on carrying path 108 a, DN b, RN, thus one, even the size of substrate G is big and transporting velocity carrying path 108 is not high, also can very promptly treating fluid be supplied with processed of whole substrate.Particularly supply with in the operation at developer, it is poor to shorten as far as possible in end (leading section) on the substrate G throughput direction and the treating fluid service time between the other end (rearward end), be the mistiming that developing begins, thereby improve the uniform plane of on-chip developing quality.
In addition, by on pre-pre-wet part 124, developer supply unit 126, rinse part 114, being provided with dish 130,132,134 respectively, improved the recovery separately of each treating fluid (pre-wetting liquid, developer, washing fluid).And, fall in the portion 128 at pre-pre-wet part 124 and developer, reclaim each treating fluid (pre-wetting liquid, developer) on the substrate G efficiently by substrate leaning device 180, thereby can further improve the recovery separately.
On rinse part 114, also substrate leaning device 180 can be set.When at rinse part medium dip substrate G, substrate G is tilted, for example making developer supply unit 126 sides is that upside ground makes it inclination.Because making developer supply unit 126 sides is that upside ground makes substrate G inclination, so the washing fluid that washing fluid supply nozzle RN is sprayed rebounds on inclination substrate G, the washing fluid that rebounds has reduced the possibility on the substrate G that is attached to developer supply unit 126 sides.
In the SC of nozzle scan mechanism of present embodiment, owing to be can be along the structure of carrying path 108 two-way inswept nozzle N, so shown in Figure 13 (B), can be on one side and the inswept in the same way nozzle N of substrate throughput direction, on one side treating fluid Q is supplied with whole processed of substrate G.In this case, must sweep merit speed V to nozzle N 'Set greater than substrate transporting velocity V greatly G
In the present embodiment, employing is the structure of carrying out the atomizing developing at pre-pre-wet part 124 and developer supply unit 126 places.Yet it also is simple becoming vane type, in developer supply unit 126, and can be with developer supply nozzle DN a, DN bBe converted to liquid from aerosol type and be full of the type injection structure.In the blade mode, do not need pre-pre-wet part 124.
In developer supply unit 126, save developer supply nozzle DN a, DN bOne of (the DN in downstream normally b) structure also be feasible.In addition, but the scanning area of each the flap nozzle N on carrying path 108 can be set at the scope that surpasses 1 module M, the structure that the adjacent activities nozzle can enter into common guide rail mutually also is feasible.
In the present embodiment, as mentioned above, before sending into rinse part 114, utilize the developer on the substrate leaning device 180 high efficiente callback substrate G that are arranged on development part 122 downstreams.Like this, before the flushing operation, sweep developer to the displacement of accelerated wash-out liquid the flushing operation or to stop that developing stops be favourable from substrate G.
Replace such inclination mode or with it and land used, at the boundary vicinity of development part 122 and rinse part 114, air knife mechanism as shown in figure 14 is set, this also is resultful.In Figure 14, air knife FN has numerous puff prot or the seam shape puff prot that extends to the other end on carrying path 108 Widths from the end of substrate W, make on the precalculated position through its next door (under) substrate G touch the sharp keen air-flow of cutter shape (normally airflow or nitrogen stream).So, by in during the air knife FN, the developer Q on the substrate G focuses on the substrate rear end side and is swept and fall outside the substrate at substrate G.
The each several part structure of the foregoing description only is an example, can have various flexible programs.For example, can change arbitrarily the nozzle support sector 156 of the SC of nozzle scan mechanism and the structure of scanning driving part 160.In addition, the structure of substrate leaning device 180 in the above-described embodiments is, is flat-hand position with the top that substrate G raises carrying path 108, makes its inclination then.Yet another kind of possible mode is also to adopt the prominent substrate leaning device of member that the upper surface is tilted earlier.
In the above-described embodiments, formed to lay in the horizontal direction and a pair ofly be fixed on conveying roller 138A, the 138B on the turning axle 136 and the roller conveying type carrying path 108 that constitutes by predetermined space.In this roller conveying type carrying path, also can carry and use roller at the middle mounted substrate of two conveying roller 138A, 138B.In addition, also can be on throughput direction the drive system of carrying path 108 is divided into a plurality of, each conveying action on carrying along separate routes of independent control (speed, stop etc.).Vacate that a pair of belt is laid on certain intervals ground in the horizontal direction and the belt conveying type carrying path that constitutes, this also is feasible.
Obviously, fall in portion 128, the rinse part 114, the direction setting of inclination substrate can be become the direction different with above-mentioned direction at pre-pre-wet part 124, developer, perhaps can be under horizontality and heeling condition treatment substrate.
Although not shown, the nozzle scan mechanism of the flap nozzle that moves along carrying path also can comprise the mechanism that changes the flap nozzle translational speed.From the general easy front-end edge and the end edge that flows to substrate for the treatment of fluid of nozzle ejection, thereby easily accumulate on the front and back ora terminalis of substrate.Therefore, by in substrate front-end edge near zone and end edge near zone, improving the relative velocity of the relative substrate of nozzle, then suppressed accumulating for the treatment of fluid.On the other hand, in the substrate zone line, treating fluid less runs off, and therefore forms the relative velocity that certain liquid reduces nozzle to heavens.The concrete numerical value that exemplifies out is: when sizes of substrate is 680mm (wide) * 880mm (length), in the zone of distance substrate front-end edge 60mm with in the zone of substrate end edge 100mm, the relative velocity of nozzle for example is 300mm/sec, in the zone line of substrate, for example is 200mm/sec.So, by changing the relative velocity of nozzle, liquid film is become evenly.About length, can set according to sizes of substrate, treating fluid kind apart from the ora terminalis zone, front and back of above-mentioned substrate.
As another embodiment, the treating fluid feed mechanism also can comprise the mechanism of change from the treating fluid flow of nozzle ejection.In this case, for liquid film is become evenly,, reduce from the treating fluid flow of nozzle ejection in the zone of the certain distance of distance substrate front-end edge with in the zone of substrate end edge certain distance, in the zone line of substrate, strengthen from the treating fluid flow of nozzle ejection.
Processed substrate of the present invention is not limited to the LCD substrate, also comprises any processed substrate of handling applicable to developing.
Symbol description 10-coating developing treatment system; 16 (P/S)-processing stations; 32-applies processing department; 94-is coated with Apply the unit; The 108-carrying path; 110-substrate input part; The 112-development part; The 114-rinse part; The 116-drying section; 118-substrate efferent; The pre-pre-wet part of 124-; 126-developer supply unit; 128-Developer falls section; 130-pre-wetting liquid dish; 132-developer dish; 134-flushing liquor dish; N-Flap nozzle; PN-pre-wetting liquid supply nozzle; DNa, DNb-developer supply nozzle; The RN-punching The washing lotion supply nozzle; SCP, SCN, SCR-nozzle scan mechanism; 156-nozzle support sector; 158-Guide rail; The 160-scanning driving part; 170-lifting drive division; 180-substrate leaning device;

Claims (23)

1, a kind of Videograph processing devices, it has:
Level is laid and to be used for approximate horizontal ground and to load and carry the transfer unit of processed substrate and the carrying path that forms;
For on above-mentioned carrying path, carrying this substrate to drive the transport driving of above-mentioned transfer unit;
Have one or more processed treating fluid feed mechanisms of supplying with the developing processing with the nozzle of predetermined process liquid that are used for to this substrate on above-mentioned carrying path;
As flap nozzle make above-mentioned treating fluid feed mechanism at least one nozzle along nozzle scan mechanism that above-mentioned carrying path moves.
2, Videograph processing devices as claimed in claim 1, wherein the flap nozzle of this treating fluid supply unit has a plurality of spouts that are provided with at certain intervals on this carrying path Width.
3, Videograph processing devices as claimed in claim 1 or 2, wherein this nozzle scan portion has: the nozzle support sector that supports this flap nozzle; The guide part of this nozzle support sector of guiding above this carrying path; Drive the drive division that this nozzle support sector moves along this guide part.
4, Videograph processing devices as claimed in claim 1, wherein it has the nozzle elevating mechanism that makes above-mentioned flap nozzle lifting for the height and position of regulating or change this flap nozzle.
5, Videograph processing devices as claimed in claim 1, wherein it has the movably cover in space of this flap nozzle of covering on the above-mentioned carrying path.
6, Videograph processing devices as claimed in claim 1, wherein it is provided with: give processed of this substrate development part of supplying developer and carrying out developing along this carrying path; In the downstream of this development part to processed supply pure water of this substrate and stop the rinse part of developing.
7, Videograph processing devices as claimed in claim 6, wherein it has: collect the first liquid collecting portion drop on the liquid below this carrying path in above-mentioned development part; In this rinse part, collect the second liquid collecting portion drop on the liquid below the above-mentioned carrying path.
8, Videograph processing devices as claimed in claim 6, wherein above-mentioned treating fluid feed mechanism are included in interior processed first flap nozzle that sprays developer to this substrate of above-mentioned development part; This nozzle scan mechanism has at least in the zone of above-mentioned development part along the first nozzle scan portion that above-mentioned carrying path moves this first flap nozzle.
9, as the Videograph processing devices of claim 6 record, wherein above-mentioned treating fluid feed mechanism has in above-mentioned development part on processed of this substrate second flap nozzle covered with developer; This nozzle scan mechanism has at least in the zone of above-mentioned development part along the second nozzle scan portion that this carrying path moves this second flap nozzle.
10, Videograph processing devices as claimed in claim 6, wherein above-mentioned treating fluid feed mechanism have the 3rd flap nozzle that drenches use reason liquid in above-mentioned development part in processed injection of this substrate of developing forward direction in advance; The said nozzle scanning mechanism comprises at least in above-mentioned development part zone along the 3rd nozzle scan portion that above-mentioned carrying path moves above-mentioned the 3rd flap nozzle.
11, Videograph processing devices as claimed in claim 6, wherein above-mentioned treating fluid feed mechanism comprise the 4th flap nozzle to processed jet douche liquid of the inherent above-mentioned substrate of above-mentioned rinse part; The said nozzle scanning mechanism comprises at least in above-mentioned rinse part zone along the 4th nozzle scan portion that above-mentioned carrying path moves above-mentioned the 4th flap nozzle.
12, Videograph processing devices as claimed in claim 1, wherein it has above-mentioned substrate so that the substrate leaning device that treating fluid relies on gravity to fall from above-mentioned substrate on above-mentioned carrying path.
13, Videograph processing devices as claimed in claim 12, wherein above-mentioned substrate leaning device make above-mentioned substrate tilt towards the place ahead or the rear of this carrying path.
14, Videograph processing devices as claimed in claim 12, wherein above-mentioned substrate leaning device comprise tilting above-mentioned substrate so that the first substrate rake that the used developer of developing falls from above-mentioned substrate by gravity.
15, Videograph processing devices as claimed in claim 11, wherein above-mentioned substrate leaning device comprise tilting above-mentioned substrate so that drench the second substrate rake that used treating fluid falls from above-mentioned substrate by gravity in advance.
16, Videograph processing devices as claimed in claim 1, wherein it has predetermined physical power is relatively moved so that the treating fluid of removing treating fluid from this substrate that is flat-hand position on above-mentioned carrying path is removed mechanism in the horizontal direction along above-mentioned substrate surface.
17, Videograph processing devices as claimed in claim 16, wherein above-mentioned treating fluid are removed mechanism and are had on primary importance and spray sharp keen air-flow so that sweep the gas injection equipment of the used developer of developing from the above-mentioned substrate of carrying at above-mentioned carrying path to this substrate surface.
18, Videograph processing devices as claimed in claim 16, wherein above-mentioned treating fluid are removed mechanism and are had on the second place and to sweep the gas injection equipment that falls to stopping the used washing fluid of developing to stating that substrate surface sprays sharp keen air-flow so that from this substrate of carrying at above-mentioned carrying path.
19, Videograph processing devices as claimed in claim 7, the wherein above-mentioned first liquid collecting portion has main developer liquid collecting portion of collecting the used developer of developing in above-mentioned development part.
20, Videograph processing devices as claimed in claim 7, the wherein above-mentioned first liquid collecting portion has the pre-wetting liquid liquid collecting portion that used treating fluid is drenched in main collection in advance in this development part.
21, Videograph processing devices as claimed in claim 1, wherein above-mentioned substrate transfer unit has the roller that at least one pair of is connected with turning axle.
22, Videograph processing devices as claimed in claim 1, wherein the said nozzle scanning mechanism has the mechanism of the translational speed that changes above-mentioned flap nozzle.
23, Videograph processing devices as claimed in claim 1, wherein above-mentioned treating fluid feed mechanism have the mechanism of change from the flow of the treating fluid of said nozzle ejection.
CNB021262810A 2001-06-07 2002-06-07 Videograph processing devices Expired - Fee Related CN1252514C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP172418/2001 2001-06-07
JP172418/01 2001-06-07
JP2001172418 2001-06-07

Publications (2)

Publication Number Publication Date
CN1391128A true CN1391128A (en) 2003-01-15
CN1252514C CN1252514C (en) 2006-04-19

Family

ID=19014038

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB021262810A Expired - Fee Related CN1252514C (en) 2001-06-07 2002-06-07 Videograph processing devices

Country Status (4)

Country Link
JP (1) JP3920156B2 (en)
KR (1) KR100937153B1 (en)
CN (1) CN1252514C (en)
TW (1) TW541620B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111383974A (en) * 2018-12-27 2020-07-07 东京毅力科创株式会社 Substrate processing apparatus and substrate processing method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159295A (en) * 2003-09-18 2005-06-16 Nec Kagoshima Ltd Device and method for treating substrate
JP4492875B2 (en) * 2005-06-21 2010-06-30 東京エレクトロン株式会社 Substrate processing system and substrate processing method
KR100862987B1 (en) * 2008-01-28 2008-10-13 주식회사 디엠에스 Transferring apparatus of substrate
KR102245499B1 (en) * 2014-02-03 2021-04-29 삼성디스플레이 주식회사 Developing apparatus and developing method using the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100529872B1 (en) * 1998-09-09 2005-11-22 동경 엘렉트론 주식회사 Developing method and developing apparatus
TW457518B (en) * 1998-11-18 2001-10-01 Tokyo Electron Ltd Image processing apparatus
US6382849B1 (en) * 1999-06-09 2002-05-07 Tokyo Electron Limited Developing method and developing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111383974A (en) * 2018-12-27 2020-07-07 东京毅力科创株式会社 Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
TW541620B (en) 2003-07-11
KR20020093631A (en) 2002-12-16
CN1252514C (en) 2006-04-19
KR100937153B1 (en) 2010-01-15
JP3920156B2 (en) 2007-05-30
JP2003059824A (en) 2003-02-28

Similar Documents

Publication Publication Date Title
CN100341113C (en) Coating method and coating device
CN1311303C (en) Developing method and apparatus
CN1746776A (en) Substrate processing apparatus and substrate positioning device
KR101194975B1 (en) Substrate processing apparatus
CN1286152C (en) Liquid processing apparatus and method thereof
US9511394B2 (en) Cleaning apparatus
CN1873535A (en) Coating method and coating device
CN1572015A (en) Film removing apparatus, film removing method and substrate processing system
US6605153B2 (en) Coating film forming apparatus
CN1737692A (en) Developing apparatus and method
KR20060136336A (en) Substrate processing apparatus
CN1908819A (en) Developing treatment apparatus and developing treatment method
CN1933100A (en) Apparatus for and method of processing substrate subjected to exposure process
CN1808704A (en) Substrate disposing device and method
CN1260801C (en) Fragile sheel transporting device and fragile sheet processing
CN1252514C (en) Videograph processing devices
JP2007300129A (en) Substrate processing device
CN1407378A (en) Liquid treating device and method
CN1262888C (en) Substrate processing device, liquid processing device and liquid processing method
JP3837720B2 (en) Substrate processing method and substrate processing apparatus
KR101927536B1 (en) Substrate processing apparatus and substrate processing method
JP3763125B2 (en) Substrate processing equipment
CN1457083A (en) Treating method and treating device
JP2007311450A (en) Protection film covering apparatus
JP2001232269A (en) Coating film formation device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060419

Termination date: 20150607

EXPY Termination of patent right or utility model