JP2003051561A5 - - Google Patents

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Publication number
JP2003051561A5
JP2003051561A5 JP2002155593A JP2002155593A JP2003051561A5 JP 2003051561 A5 JP2003051561 A5 JP 2003051561A5 JP 2002155593 A JP2002155593 A JP 2002155593A JP 2002155593 A JP2002155593 A JP 2002155593A JP 2003051561 A5 JP2003051561 A5 JP 2003051561A5
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JP
Japan
Prior art keywords
cap
cavity
devices
package
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002155593A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003051561A (ja
Filing date
Publication date
Priority claimed from US10/154,047 external-priority patent/US20020180032A1/en
Application filed filed Critical
Publication of JP2003051561A publication Critical patent/JP2003051561A/ja
Publication of JP2003051561A5 publication Critical patent/JP2003051561A5/ja
Withdrawn legal-status Critical Current

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JP2002155593A 2001-05-29 2002-05-29 デバイス基板上のデバイス間のクロストークを低減するためのパッケージとその製造方法 Withdrawn JP2003051561A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US29406601P 2001-05-29 2001-05-29
US60/294066 2001-05-29
US10/154,047 US20020180032A1 (en) 2001-05-29 2002-05-23 Package for reducing cross-talk between devices on a device substrate and a method of manufacture therefor
US10/154047 2002-05-23

Publications (2)

Publication Number Publication Date
JP2003051561A JP2003051561A (ja) 2003-02-21
JP2003051561A5 true JP2003051561A5 (enExample) 2005-04-14

Family

ID=26851098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002155593A Withdrawn JP2003051561A (ja) 2001-05-29 2002-05-29 デバイス基板上のデバイス間のクロストークを低減するためのパッケージとその製造方法

Country Status (3)

Country Link
US (1) US20020180032A1 (enExample)
EP (1) EP1263044A2 (enExample)
JP (1) JP2003051561A (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10132683A1 (de) * 2001-07-05 2003-01-16 Bosch Gmbh Robert Mikromechanische Kappenstruktur und entsprechendes Herstellungsverfahren
US7383058B2 (en) * 2002-07-16 2008-06-03 Intel Corporation RF/microwave system with a system on a chip package or the like
US20060262623A1 (en) 2002-10-15 2006-11-23 Sehat Sutardja Phase locked loop with temperature compensation
FR2875948B1 (fr) * 2004-09-28 2006-12-08 Commissariat Energie Atomique Composant d'encapsulation de micro-systeme electromecaniques integres et procede de realisation du composant
US8559570B2 (en) * 2005-06-30 2013-10-15 Silicon Laboratories Inc. Cancellation of undesired portions of audio signals
EP1760780A3 (en) * 2005-09-06 2013-05-15 Marvell World Trade Ltd. Integrated circuit including silicon wafer with annealed glass paste
US20070178666A1 (en) * 2006-01-31 2007-08-02 Stats Chippac Ltd. Integrated circuit system with waferscale spacer system
US7414310B2 (en) * 2006-02-02 2008-08-19 Stats Chippac Ltd. Waferscale package system
DE102006016260B4 (de) * 2006-04-06 2024-07-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vielfach-Bauelement mit mehreren aktive Strukturen enthaltenden Bauteilen (MEMS) zum späteren Vereinzeln, flächiges Substrat oder flächig ausgebildete Kappenstruktur, in der Mikrosystemtechnik einsetzbares Bauteil mit aktiven Strukturen, Einzelsubstrat oder Kappenstruktur mit aktiven Strukturen und Verfahren zum Herstellen eines Vielfach-Bauelements
US7995543B2 (en) * 2006-05-05 2011-08-09 Marvell World Trade Ltd. Network device for implementing multiple access points and multiple client stations
US7636245B2 (en) * 2007-06-25 2009-12-22 Novatel Wireless, Inc. Electronic component cover and arrangement
TWI328563B (en) * 2007-08-28 2010-08-11 Ind Tech Res Inst A stacked package structure for reducing package volume of an acoustic microsensor
DE102008016004B4 (de) * 2008-03-27 2024-07-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikroelektromechanischer Inertialsensor mit atmosphärischer Bedämpfung
JP5732203B2 (ja) * 2010-05-21 2015-06-10 日立オートモティブシステムズ株式会社 複合センサの製造方法
JP2016012737A (ja) * 2015-10-06 2016-01-21 三菱電機株式会社 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2998662B2 (ja) * 1996-11-15 2000-01-11 日本電気株式会社 半導体装置
SE511926C2 (sv) * 1997-04-16 1999-12-20 Ericsson Telefon Ab L M Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje

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