JP2003051251A - Manufacturing method of gas electric discharge display panel, support stand, and manufacturing method of the support stand - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a setter who can reduce generation of poor quality, in the baking process of a gas electric discharge display panel. SOLUTION: In the process, which bakes materials arranged on a substrate that is used as a base of the gas electric discharge display panel, the setter 200 is used for loading the substrate, to which the arrangement has been made, at the time of the baking. On an upper surface, to which the substrate is loaded, the setter 200 has at least one slot 250 astride to an exposed region, which has not been covered by the substrate, from a covered domain, which has been covered by the substrate, when it is made if the loading were performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a gas discharge display panel used for a display device, etc.
The present invention relates to a method for supporting a glass substrate in a firing step of forming an electrode, a dielectric layer and the like on the glass substrate of a gas discharge display panel by firing.

[0002]

2. Description of the Related Art In recent years, gas discharge display panels such as plasma display panels (hereinafter referred to as "PDPs") in display devices used in computers, televisions and the like have a large size and can be made thin and lightweight. Has attracted attention as a display device that can.

FIG. 12 shows a general AC (AC) PD.
It is a schematic diagram of P. As shown in this figure, the PDP 1100
Is a front plate 1090 arranged such that its main surfaces face each other.
And a rear plate 1091. Front plate 1090
Is a front glass substrate 1101, a display electrode 1102,
It is composed of a dielectric layer 1106 and a protective layer 1107.

The front glass substrate 1101 is a front plate 109.
This front glass substrate 1101 is a base material of 0.
The display electrode 102 is formed on the top. This display electrode 1
102 includes a transparent electrode 1103, a black electrode film 1104, and a bus electrode 1105. The display electrode 1102 and the front glass substrate 1101 are further covered with a dielectric layer 1106 and a protective layer 1107.

The rear plate 1091 is a rear glass substrate 111.
1, an address electrode 1112, a dielectric layer 1113,
The partition 1114 and the phosphor layer 1115 formed on the wall surface of the gap between the adjacent partitions 1114 (hereinafter, referred to as “partition groove”). Front plate 1090 and back plate 1
As shown in FIG. 12, 091 is sealed in a stacked state, and a discharge space 1116 is formed inside.

Although the rear plate 1091 is illustrated as if the end in the Y-axis direction is open in this drawing,
This is shown for convenience of explanation of the structure, and in practice, the outer peripheral edge portion is bonded and sealed with sealing glass. In the discharge space 1116, 500 discharge gas (filled gas) composed of rare gas components such as He, Xe, and Ne is filled.
It is sealed at a pressure of about 600 Torr (66.5 to 79.8 kPa).

A region where a pair of adjacent display electrodes 1102 and one address electrode 1112 intersect with each other across the discharge space 1116 becomes a cell that contributes to image display. PDP
A plasma display device is constructed by connecting a drive circuit to 1100. In this plasma display device, two adjacent display electrodes 110 are provided after a voltage is applied between the X electrode and the address electrode 1112 of the cell to be turned on to cause address discharge.
A sustain discharge is generated by applying a pulse voltage to the two sets.

In the PDP 1100, the discharge space 111
In No. 6, ultraviolet rays are generated by this sustain discharge, the generated ultraviolet rays strike the phosphor layer 1115, the ultraviolet rays are converted into visible light, and the cells are lit.
The image is displayed. By the way, in the process of forming the black electrode film 1104 and the bus electrode 1105 and the process of forming the dielectric layer 1106, the front glass substrate 1101 is baked.

Further, in the process of forming the address electrode 1112, the dielectric layer 1113, the partition wall 1114 and the phosphor layer 1115, the back glass substrate 1111 coated with these materials is also baked. In the firing step, the front glass substrate 1101 and the back glass substrate 1111 (hereinafter, collectively referred to as “glass substrate”) on which the firing target such as the black electrode film 1104 or the dielectric layer 1113 is arranged are shown in FIG. As shown in FIG. 4, a flat plate-shaped heat-resistant material larger than the outer size of these substrates, that is, the setter 11
It is placed on top of 20 and fired.

The setter 1120 is conveyed by a hearth roller 1130 in a continuous firing furnace, for example,
In the temperature profile in which the peak temperature is set to 590 ° C., the glass substrates are fired in a stacked state.

[0011]

However, this firing step has the following problems. That is, as shown in FIG. 14, at room temperature, the front glass substrate 1101 or the rear glass substrate 1111 placed in the regular position of the setter 1120 moves from the regular position during firing (hereinafter,
It is called "misalignment". However, there is a case where so-called uneven heat distribution occurs, in which an object to be fired such as a dielectric layer on the front glass substrate 1101 or the rear glass substrate 1111 cannot be fired at a uniform temperature.

In particular, as the outer size of the front glass substrate 1101 or the rear glass substrate 1111 increases, the frequency of positional deviation tends to increase. If the firing target becomes incomplete because the firing target cannot be fired at a uniform temperature, the regular characteristics of the firing target may not be obtained. For example, in the dielectric layer 1106, when the firing is incomplete, the desolvation is insufficient and organic components such as resin remain in the dielectric layer 1106, so that the specified transparency and insulating characteristics can be secured. It will be difficult.

In addition, in the partition 1114, if the firing is incomplete, the strength of the partition 1114 itself may be insufficient, and the partition 1114 may be cracked, and the above-mentioned firing is incomplete. In some cases, the surface roughness of the wall surface of the partition wall 1114 becomes non-uniform, and the phosphor layer 1115 having a uniform film thickness cannot be formed on this wall surface in a later step.

That is, the quality of the gas discharge display panel is deteriorated in the firing process. Therefore, the present invention has been made in view of the above problems, in the firing step,
An object of the present invention is to provide a method for manufacturing a gas discharge display panel that is less likely to cause quality defects, a setter that can reduce the occurrence of quality defects in the firing process of the gas discharge display panel, and a method for manufacturing such a setter. And

[0015]

In order to achieve the above object, in a method of manufacturing a gas discharge display panel according to the present invention, any one of an electrode, a dielectric layer, a partition wall and a phosphor layer is placed on a substrate. And a firing step of loading and firing the substrate on which the placement has been performed on a support base, wherein the support base is provided on a top surface on which the substrate is loaded from a coating region covered by the substrate to It has at least one groove extending over an exposed region which is not covered by the substrate, and in the step of firing the material disposed on the substrate serving as the base of the gas discharge display panel, the arrangement described above is performed. A support base for loading the substrates at the time of baking, wherein the support base has a plurality of through holes that lead from the upper surface covered with the substrates to the lower surface of the support base when the loading is performed. Characterized in that it has.

Further, the support base according to the present invention is a support base for stacking the arranged substrates at the time of baking in the step of baking the material arranged on the substrate serving as the base of the gas discharge display panel. The support base has at least one groove extending from a covering region covered by the substrate to an exposed region not covered by the substrate on the upper surface on which the substrates are stacked, when the stacking is performed. In addition, in the step of baking the material arranged on the substrate that becomes the base of the gas discharge display panel, a support base for stacking the arranged substrate at the time of baking, It is characterized in that the support base has a plurality of through-holes that communicate from the upper surface covered with the substrate to the lower surface of the support base when the stacking is performed.

The method of manufacturing the support base according to the present invention is
In a step of firing a material arranged on a substrate which is a base of a gas discharge display panel, there is provided a method of manufacturing a supporting base for loading the arranged substrate at the time of baking, the base of the supporting base being provided. A flat plate upper surface, which has a groove forming step of forming at least one groove extending from a covering region covered by the substrate to an exposed region not covered by the substrate when the stacking is performed, Also, in the step of baking the material arranged on the substrate that is the base of the gas discharge display panel, there is provided a method of manufacturing a support base for loading the arranged substrate at the time of baking. In a flat plate serving as a base, a through hole is formed from the upper surface of the flat plate covered with the substrate to the lower surface of the flat plate when the stacking is performed. Characterized in that it has a throughbore formed steps.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail with reference to the drawings. (Embodiment) <Structure> FIG. 1 shows a PDP 1 according to an embodiment of the present invention.
FIG.

The PDP 100 is an AC type PDP, and is composed of a front plate 90 and a rear plate 91 arranged so that their main surfaces face each other.
I do not change. In the figure, the z direction is the thickness direction of the PDP, and xy
The plane corresponds to the plane parallel to the PDP plane.

The front plate 90 includes a front glass substrate 101,
The display electrode 102, the dielectric layer 106, and the protective layer 107 are included. The front glass substrate 101 is a material that becomes the base of the front plate 90, and the display electrodes 102 are formed on the front glass substrate 101. The display electrode 102 includes a transparent electrode 103, a black electrode film 104, and a bus electrode 105.

The transparent electrode 103 is the front glass substrate 101.
ITO, SnO with the x direction as the longitudinal direction on the upper surface.
_2. A plurality of conductive metal oxides such as ZnO are formed in rows. The black electrode film 104 is formed by laminating a material containing ruthenium oxide as a main component on the transparent electrode 103 described above with a width narrower than that of the transparent electrode 103.

The bus electrode 105 is formed by laminating a conductive material containing Ag on the black electrode film 104. The dielectric layer 106 is a layer made of a dielectric material that covers the entire surface of the front glass substrate 101 on which the display electrodes 102 are formed.
Generally, lead-based low-melting glass is used, but it may be formed of bismuth-based low-melting glass or a laminate of lead-based low-melting glass and bismuth-based low-melting glass.

The protective layer 107 is made of magnesium oxide (Mg
O) is a thin layer that covers the entire surface of the dielectric layer 106. The back plate 91 is a back glass substrate 111.
, Address electrode 112, dielectric layer 113, and partition wall 1
14 and the phosphor layer 115 laminated on the wall surface of the partition groove formed by the gap between the adjacent partitions 114.

The rear glass substrate 111 is a material that becomes the base of the rear plate 91, and the address electrodes 112 are formed on the rear glass substrate 111. Address electrode 11
2 is a metal electrode (for example, a silver electrode or Cr-Cu-
Cr electrode), and a plurality of conductive materials containing Ag are formed in a row on one surface of the rear glass substrate 111 with the y direction as the longitudinal direction.

The dielectric layer 113 is a layer made of a dielectric material formed to cover the entire surface of the rear glass substrate 111 on the side where the address electrodes 112 are formed.
Although lead-based low-melting glass is used, it may be formed of bismuth-based low-melting glass or a laminate of lead-based low-melting glass and bismuth-based low-melting glass. In addition, this dielectric layer 1
A partition 114 is formed on 13 to match the interval between adjacent address electrodes 112.

A phosphor layer 115 corresponding to any of RGB is formed on the wall surface of the partition groove formed by the gap between the adjacent partition walls 114. More specifically, there are three types of phosphor layers 115 that emit light of different wavelengths of red, green, and blue by discharged ultraviolet rays, and red, green, and blue fluorescent light is emitted on the inner wall of the partition groove. It is applied repeatedly in the order of the body.

As shown in FIG. 1, the front plate 90 and the rear plate 91 are sealed in a stacked state, and the discharge space 1 is provided inside.
16 are formed. In the discharge space 116, He, X
The discharge gas (filled gas) composed of rare gas components such as e and Ne is 500 to 600 Torr (66.5 to 79.8k).
It is sealed at a pressure of about Pa).

A region where a pair of adjacent display electrodes 102 and one address electrode 112 intersect with each other across the discharge space 116 becomes a cell that contributes to image display. As shown in FIG. 2, a plasma display display device 220 is configured by the PDP 100 and the panel drive device 119, and a voltage is applied between the X electrode and the address electrode 112 of the cell to be lit in the plasma display display device. After the address discharge is generated by the pulse discharge, the sustain discharge is generated by applying the pulse voltage to the pair of the two adjacent display electrodes 102.

By this sustain discharge, ultraviolet rays (wavelength of about 147
(nm) is generated and the generated ultraviolet rays impinge on the phosphor layer 115, the ultraviolet rays are converted into visible light, and the cells are turned on to display an image. <PDP Manufacturing Method> The PDP 100 is manufactured by stacking and sealing the front plate 90 and the rear plate 91 as described above, and further filling the discharge gas.

The method of manufacturing the front plate 90 will be described below. In the method for manufacturing a gas discharge display panel of the present invention, a known technique such as a vapor deposition method or a sputtering method is used, and a thickness of about 1400 angstrom is formed on the surface of the front glass substrate 101 made of soda glass having a thickness of about 2.8 mm. Transparent electrode 1 by forming a plurality of parallel rows of conductive material such as ITO (Indium Tin Oxide) or SnO ₂
Form 03.

Further, the transparent electrode 1 is formed by using a known technique such as a screen printing method or a photolithography method.
03 and the front glass substrate 101, a precursor of the black electrode film 104 containing ruthenium oxide as a main component (hereinafter,
It is called "black electrode film precursor 104a". ) And Ag precursor of the bus electrode 105 (hereinafter referred to as “bus electrode precursor 1”).
05a ”. ) And form.

The above is the same as the conventional method for manufacturing a gas discharge display panel. Front glass substrate 101 on which black electrode film precursor 104a and bus electrode precursor 105a are formed
Is loaded on the setter 200, and the peak temperature is 5
The black electrode film precursor 104a and the bus electrode precursor 10 are baked by firing with a profile set to 90 ° C.
5a is sintered to form the black electrode film 104 and the bus electrode 105.
Is formed.

The black electrode film 104 and the bus electrode 105 are used for the display electrode 1 together with the already formed transparent electrode 103.
02. Then, a precursor of the dielectric layer 106 (hereinafter referred to as "dielectric layer precursor 106a") is formed on the surface of the front glass substrate 101 on which the black electrode film 104 and the bus electrode 105 are formed by a known technique such as a printing method. The front glass substrate 101 is stacked on the setter 200 and fired.

As a result, the dielectric layer precursor 106a is sintered to form the dielectric layer 106. Furthermore, the protective layer 10 is formed thereon by a known technique such as a sputtering method.
7 will be formed. As described above, in the method for manufacturing the gas discharge display panel of the present invention, the front glass substrate 101 is formed by using the setter 200 having the groove formed on the surface thereof instead of the conventional setter 120 having a flat surface during the above-mentioned firing. Unlike the conventional method, the back glass substrate 111 is fired.

Similar to the firing in manufacturing the front plate 90,
The above-mentioned setter 200 can be used also in the baking in the manufacture of the back plate 91. Hereinafter, a method of manufacturing the back plate 91 will be described. In the method for manufacturing the gas discharge display panel of the present invention, the thickness of about 2.
Rear glass substrate 111 made of 6 mm soda glass
A conductive material containing Ag as a main component is applied in a stripe pattern at regular intervals on the surface of the film, so that a thickness of about 5 to 1 is obtained.
The rear glass substrate 111 on which a precursor of the address electrode 112 of 0 μm (hereinafter, referred to as “address electrode precursor 112a”) is formed is stacked on the setter 200 and baked.

As a result, the address electrode precursor 112a
Are sintered to form the address electrodes 112. In addition,
In order to make the PDP to be a 40-inch class high-definition television, two adjacent address electrodes 112
Is set to about 0.2 mm or less.

Then, a lead glass paste is coated on the entire surface of the rear glass substrate 111 on which the address electrodes 112 are formed, and the rear glass substrate 111 is stacked on the setter 200 and baked to have a thickness of about 20-3
A 0 μm dielectric layer 113 is formed. Further, a paste-like partition wall material containing lead glass as a main component and alumina powder as an aggregate is applied and formed on the dielectric layer 113 by using a coating method by die coating, and a sandblast method is used. A partition wall 114 precursor (hereinafter referred to as a “partition wall precursor 114a”) is formed by shaving off only a region other than the partition wall shape region.
By firing, the partition wall 114 having a height of about 100 to 150 μm is formed.

At this time, the rear glass substrate 111 on which the partition wall precursor 114a is formed is loaded on the setter 200 and is fired. The interval between the partition walls 114 is
For example, it is about 0.36 mm. Then, any of red (R), phosphor, green (G) phosphor, and blue (B) phosphor is formed on the wall surface of the partition wall 114 and the surface of the dielectric layer 113 exposed between the adjacent partition walls 114. Phosphor ink containing the is applied.

After that, the phosphor ink is dried and then baked to form the phosphor layer 115 of each color. Also at this time, the rear glass substrate 111 coated with the phosphor ink is stacked on the setter 200 and is fired. Incidentally, as the phosphor material forming the phosphor layer 115, wherein the red _{phosphor: (Y X Gd 1-X} ) BO 3: Eu Green phosphor: Zn ₂ SiO _4: Mn Blue phosphor: BaMgAl ₁₀ O ₁₇ : Eu ³⁺ shall be used.

As each phosphor material, for example, powder having an average particle size of about 3 μm is used. To apply the phosphor ink,
For example, phosphor ink is ejected from an ultrafine nozzle. After applying the phosphor ink, the phosphor layer 115 is formed by baking the profile at a maximum temperature of about 520 ° C. for 2 hours. After the front plate 90 and the rear plate 91 are created as described above, the front plate 90 and the rear plate 91 are bonded and sealed by using a known PDP manufacturing technique, and the impure gas inside is exhausted, Filled with discharge gas, PDP1
00 will be completed.

The method of manufacturing the gas discharge display panel according to the present invention relates to a firing step in manufacturing the front plate 90 and the rear plate 91, and the detailed manufacturing method after the bonding of the front plate 90 and the rear plate 91 will be described. The description is omitted. <Specifications of Setter> Here, the above-mentioned setter 200 used in the firing step will be described in detail.

FIG. 3 is a schematic diagram of the setter 200 according to the embodiment of the present invention. The setter 200 supports the front glass substrate 101 and the rear glass substrate 111 when firing an object to be fired such as the dielectric layer precursor 106a, and supports the glass substrate and conveys it to a continuous firing furnace for firing. It is a support base. In the firing process, the setter 200 has a peak temperature of 5 as shown in FIG.
It is used repeatedly with a profile set to 90 ° C and has high heat fatigue resistance. For example, from a transparent heat resistant glass material such as Neoceram N-0 or N-11 (trade name of Nippon Electric Glass) Become.

The plate thickness of the setter 200 is about 5 to 8 mm, though it depends on the size of the glass substrate to be loaded. The outer size of the setter 200 differs depending on the size of the glass substrate to be loaded, but is at least a size that exceeds the outer size of the glass substrate in both length and width. Also,
As shown in FIG. 3, the setter 200 includes a plurality of grooves arranged perpendicularly to the transport direction, that is, the groove 250 and the groove 25.
Has 1.

The groove 250 and the groove 251 have the same groove shape, for example, the groove width (W) is 70 mm, the groove depth is 2 mm, and the space between the grooves is also set. (D) is 400 mm. Groove 250 and groove 251
When the glass substrates are stacked on the setter 200, each is formed so as to extend from the region where the front glass substrate 101 is stacked to the outside of the region.

Therefore, as shown in FIG. 3, the groove 250 is divided into a groove portion 250a covered with a glass substrate and a groove portion 250b and a groove portion 250c not covered with the glass substrate, and the groove 251 is covered with a glass substrate. Groove 25
1a and groove portion 251b and groove portion 2 not covered with the glass substrate
51c. Here, in the firing step, the setter 200 made of the heat-resistant glass material having the above-mentioned groove is used.
The reason for using is explained. <Effect of Surface Shape of Setter 200> Microscopically, the surface of the setter does not have a mirror-like state but has warpage or undulation, and a minute gap exists between the glass substrate and the setter 120.

At room temperature, the front glass substrate 101 or the rear glass substrate 111 placed at the regular position of the setter 120.
However, the cause of the so-called misalignment, which is the movement from the regular position during firing, is caused by the convection of the gas existing in the above-mentioned gap as the temperature rises in the firing process, and the inside of the above-mentioned gap. It is considered that this is because the pressure rises, a gas layer as shown in FIG. 14 is formed between the front glass substrate 101 and the setter 120, and the glass substrate floats on the order of tens to hundreds of μm.

This convection of gas is considered to occur because a temperature difference occurs between the glass substrate and the setter due to the difference in the physical properties such as heat capacity and heat conductivity between the glass substrate and the setter. If so, then
It is conceivable that the degree of convection of this gas will increase. The setter 200 according to the embodiment of the present invention is
Since the groove 250 and the groove 251 are formed as described above, even if a gas is generated between the front glass substrate 101 and the setter 120 as shown in FIG.
50a and groove 251a, groove 250b, groove 2
50c, the groove portion 251b, and the groove portion 250c are discharged, so that the buoyancy is reduced, the buoyancy to the extent that the glass substrate floats is less likely to occur, and the above-mentioned displacement is less likely to occur.

Further, since the setter 200 according to the embodiment of the present invention has the grooves arranged perpendicularly to the carrying direction, heating is started from the tip of the setter 200 in the carrying direction, and the temperature is raised. When rising, temperature and pressure gradients are less likely to occur inside each groove,
There is no local buoyancy in one groove,
The glass substrate is difficult to float.

Furthermore, since the setter transport direction is usually aligned with the longitudinal direction of the glass substrate, the grooves 250 and 251 are arranged in a direction substantially orthogonal to the longitudinal direction of the glass substrate. Groove 25 covered with substrate
The areas of 0a and the groove 251a can be made smaller than in any other direction. As a result, the volume of the gas existing in the gap between the groove portion 250a and the groove portion 251a is also reduced, and the relaxation time of the pressure increase due to the release of the gas is also reduced. Therefore, the transfer speed of the setter 200 is high,
This is advantageous when the setter 200 is rapidly overheated.

By preventing the above-mentioned displacement from occurring, the object to be fired arranged on the glass substrate can be fired at a more uniform temperature and the firing quality can be improved. <Effect of material of setter 200> By the way, the setter 2
Since 00 has a groove that cannot directly contact the glass substrate on the surface on which the glass substrate is loaded, a portion that is not in contact with the setter on the glass substrate is larger than that of the setter 120 having no groove. Area of the groove 250
Since the area in the range of a and the groove portion 251a becomes large, the heat conduction performance between the setter 200 and the glass substrate is deteriorated.

Generally, it is desirable that the temperature difference between the setter and the glass substrate is small, and it is necessary to secure a certain degree of heat conduction performance. Therefore, when forming a groove in a setter made of a material having a low emissivity such as metal. There is a limit to increase the groove width and the groove depth. On the other hand, since the setter 200 in the embodiment of the present invention is a transparent heat-resistant glass material, not only heat conduction but also radiant heat can greatly contribute to heat conduction. It is considered that the width and the depth of the groove can be increased, and it is considered that the degree of freedom in designing the setter in the embodiment of the present invention is further increased.

Further, although the glass substrate and the setter are not the same material, they are made of the same glass material, and thus have similar physical properties such as specific heat, thermal expansion coefficient and thermal conductivity. Therefore, it is considered that the temperature difference between the glass substrate and the setter hardly occurs, which contributes to the suppression of the generation of the convection. <Specific specifications of groove> Setter 20, which is a heat-resistant glass material
In No. 0, empirically, when the groove width is from 5 mm to 200 mm, even if the groove depth is increased to about 2.00 mm, the problem of soaking unevenness during firing does not occur.

On the other hand, with respect to the lower limit of the groove depth, whether or not the gas can escape to the extent that buoyancy to the extent that the above-mentioned displacement occurs is not generated becomes a problem. It is considered that the value of warpage or waviness is also affected, and experience shows that it is not effective as a gas communication path unless the groove depth is at least 0.05 mm or more. In addition, the proportion of the groove in the range where the glass substrate is placed, that is,
When the area ratio of the groove portion 250a and the groove portion 251a is small, the contact area between the glass substrate and the setter 200 is large, and the convection of the gas existing in the contact portion may cause a buoyancy to float the glass substrate. is there.

On the contrary, if the above-mentioned ratio is too large, the contact area becomes small, and it may not be able to be firmly supported. In order to prevent these inconveniences, the proportion of the groove in the range is 10% or more 7
It is preferably 0% or less. Needless to say, the contact portion means that in the top view of FIG.
It means a range excluding the range of the groove portion 250a and the groove portion 251a from the range where the glass substrate (here, the front glass substrate 101) is placed.

Further, it is desirable that the formation positions of the grooves in the setter 200 are formed over the entire range where the glass substrates are stacked. That is, it is desirable to disperse the buoyancy reduction range due to gas convection so as not to locally generate a large buoyancy. From this point of view, the groove 250 and the groove 251 are arranged so as to be substantially symmetrical with respect to the center point of the setter 200. <Manufacturing method of setter> Hereinafter, the front plate 90 and the rear plate 9
1, the setter 20 used in the firing step
An example of the manufacturing method of 0 will be described.

FIG. 6 is a diagram showing a manufacturing process of the setter 200. FIG. 6A is a first step (photosensitive resist film forming step). In this step, for example,
It is a plate having a length of 1280 mm, a width of 800 mm, and a thickness of 5 mm, and has a roll temperature of 80 ° C. and a wire on a transparent heat-resistant glass 201 such as Neoceram N-0 or N-11 (trade name of Nippon Electric Glass). A photosensitive resist film (hereinafter referred to as DFR) 210 having a thickness of 50 μm is laminated under the conditions of a pressure of 4 kg / cm ² and a substrate feeding speed of 1 m / min.

FIG. 6B shows a second step (exposure and development step). In this step, since 400 mm intervals are provided and two parallel grooves having a width of 70 mm are provided, patterning is performed in such a shape. The exposed portion 211 and the non-exposed portion 212 are formed by irradiating ultraviolet light (UV light) with a super-high pressure mercury lamp of 15 mW / cm ² output using the negative type photomask thus prepared.

The exposure amount at this time is, for example, 7
It is 00 mJ. Further, for example, the unexposed portion 212 is removed by performing development with a developing solution of a 1% sodium carbonate aqueous solution and then washing with water. As a result, as shown in FIG. 6C, stripe-shaped grooves are formed in the DFR 210.

FIG. 6D shows a third step (blasting step), in which the DFR2 is formed after the groove is formed.
Sandblasting is performed from the side where 10 is formed. More specifically, the abrasive material 230 such as a glass bead material is blasted from the blast nozzle 229 at an air flow rate of 1500 N.
By spraying on the heat-resistant glass 201 under the conditions of L / min and the abrasive supply amount of 1500 g / min,
The heat resistant glass 201 is blasted to form a groove.

The blasting time is adjusted so that the concave portion of the heat resistant glass has a depth of about 2 mm. Figure 6
(E) is a fourth step (peeling step of the photosensitive resist film), in which a stripping solution, for example, 5%
The DFR 210 is peeled off by immersing the heat resistant glass 201 in the aqueous sodium hydroxide solution.

As a result, the setter 200 having the predetermined grooves, that is, the grooves 250 and 251 is obtained. As described above, according to the present embodiment, in the firing process of the gas discharge display panel, the glass substrate is placed on the setter 200 in the embodiment of the present invention and fired to move the glass substrate on the setter, that is, The position shift can be prevented.

Although the groove width (W) of the setter 200 in the embodiment of the present invention is 70 mm, it is not limited to this groove width as long as the area of the groove of the setter can be secured to the extent that the glass substrate is not floated. The groove width may have other values. Further, the setter 200 according to the embodiment of the present invention
The groove depth is 2 mm, and the distance (d) between the grooves is 4
Although it is supposed to be 00 mm, it is not limited to this value, and may be changed within a range in which the firing target on the glass substrate does not cause firing failure.

Further, although the material of the setter 200 in the embodiment of the present invention is a heat resistant glass material, it is assumed that it is made of a material containing a metal as a main component, a material containing an oxide of a metal as a main component, a ceramic or the like. Good. In that case, it is necessary to review the groove shape of the setter so that the specified firing quality can be ensured and the positional deviation does not occur.

Further, the setter 20 according to the present embodiment.
Although 0 has a shape in which two grooves are arranged side by side on a flat plate, the number of grooves is not limited to two and may be more. Further, the setter 20 according to the present embodiment
0 has a plurality of grooves arranged perpendicularly to the carrying direction, but is not limited to this, and may have a plurality of grooves arranged substantially parallel to the carrying direction, for example.

In that case, the setter 20 in the carrying direction
When heating is started from the front end of 0, the gas moves to the rear end where the pressure is low, so that heat is conducted in the longitudinal direction of the groove.
Originally, the formation of the groove on the setter acts to hinder the heat conduction between the glass substrate and the setter,
When the transfer speed of the setter is slow, heat transfer in the transfer direction between the glass substrate and the setter is more important than the heat transfer between the glass substrate and the setter (upper and lower), so at least the entire area where the glass substrate is placed on the surface of the setter. By providing multiple grooves that are substantially parallel to the transport direction over the glass substrate, the gas that escapes to the rear end also conducts heat to the rear end even if the setter is gradually heated from the front end. Further, it is possible to suppress the occurrence of a temperature gradient in the transport direction of the setter and make it more difficult to cause uneven heating.

Further, the setter 20 according to the present embodiment.
Although 0 has a shape in which two grooves are arranged in parallel on a flat plate, the shape is not limited to this groove shape, and any groove capable of discharging the gas existing between the setter and the glass substrate to the outside may be used. For example, as shown in FIG. 7, it may be a setter 300 having a cross groove 350. In that case, when the glass substrate is loaded on the setter 300, the groove 350 is
Groove 350a covered with this glass substrate, and groove 350b, groove 350c, and groove 3 not covered with this glass substrate
It has 50d and the groove part 350e.

Further, as in the above, as another variation of the setter, as shown in FIG. 8, a setter 400 having a groove 450 arranged on a diagonal line of the setter may be used. In that case, when a glass substrate is loaded on the setter 400, the groove 450 includes a groove portion 450a covered with this glass substrate and a groove portion 4 not covered with this glass substrate.
50b, groove 450c, groove 450d and groove 450e
Have and.

Further, as shown in FIG. 9, the grid-like grooves 5 are formed.
It may be a setter 500 having 50. In that case, when a glass substrate is loaded on the setter 500,
The groove 550 is a groove portion 550a covered with this glass substrate.
And the groove portion 550b and the groove portion 5 which are not covered with the glass substrate.
50 c, a groove portion 550 d, and a groove portion 550 e.

Further, as another variation of the setter, as shown in FIG. 10, a setter 600 having one groove 650 may be used. In that case, when a glass substrate is loaded on the setter 600, the groove 650 has a groove portion 650a covered with this glass substrate, a groove portion 650b not covered with this glass substrate, and a groove portion 650c.

Further, the setter 20 according to the present embodiment.
No. 0 has a groove on a flat surface (hereinafter, referred to as a "loading surface") on which the glass substrates of the setter 200 are loaded,
Instead of providing the groove on the loading surface, as shown in FIG. 11, a setter 700 having a plurality of through holes 750 penetrating from the loading surface in the range where the glass substrate is placed to the back surface thereof may be used.

In this case, even if a part of the lower surface side is closed by the hearth roller 130 or the like, it is essential that the through hole existing in the other part can discharge the gas to the extent that the glass substrate does not float up. Becomes Further, in the present embodiment, the groove of the setter 200 of the present invention is formed by the sandblast method, but the method is not limited to this method, and for example, the glass surface is melted by using an aqueous solution of hydrofluoric acid. It may be created by a chemical etching method, or a material on the glass surface, such as a thermal spraying method,
The groove may be formed by stacking the groove in a region other than the region where the groove is to be arranged and providing a convex portion.

[0072]

As is apparent from the above description, in the method for manufacturing a gas discharge display panel according to the present invention, an arranging step of arranging any material of electrodes, dielectric layers, barrier ribs and phosphor layers on a substrate. And a baking step of stacking and baking the arranged substrate on a support base, the support base covering the substrate from a coating region covered by the substrate on an upper surface on which the substrate is mounted. It is characterized by having at least one groove that spans an unexposed exposed area.

As a result, the gas existing in the groove portion can freely move over the covering region and the exposed region. That is, when the gas pressure rises in the gap between the substrate and the support base, the substrate is likely to be displaced due to buoyancy, but according to the manufacturing method, the covering region is Since the gas in the vicinity of the groove is discharged through the groove, the pressure increase in the gap is reduced and the buoyancy of the substrate is reduced.

Therefore, the positional deviation during firing is suppressed and uneven heating is less likely to occur, so that the firing quality can be improved. Further, there may be a plurality of the grooves, and the grooves may be dispersed and arranged in the covering region. This allows
Since the area in which the buoyancy of the substrate is reduced is dispersed, the buoyancy is efficiently reduced.

A continuous firing furnace may be used for the firing, and the plurality of grooves may be arranged substantially perpendicular to the conveying direction of the firing furnace. Accordingly, when heating is started from the tip of the support table in the carrying direction and the temperature rises, the support table has grooves arranged perpendicular to the carrying direction, and Inside, temperature and pressure gradients are less likely to occur.

Therefore, no local buoyancy is generated in one groove, and the floating of the substrate is suppressed.
A continuous firing furnace may be used for the firing, and the plurality of grooves may be arranged substantially parallel to the conveying direction of the firing furnace. As a result, when heating is started from the front end of the support table in the transport direction, the gas moves to the rear end where the pressure is low, so that heat is conducted in the longitudinal direction of the groove.

That is, when the support table is transported at a slow speed, the heat transfer in the transfer direction between the substrate and the support table is more important than the heat transfer between the substrate and the support table (upper and lower). By providing a plurality of grooves substantially parallel to the transport direction over at least the entire area on which the substrate is placed, even if the groove is gradually heated from the front end of the support table, the gas that escapes to the rear end part The heat is also conducted to the rear end portion, the generation of a temperature gradient in the transport direction of the substrate and the support is suppressed, and the occurrence of uneven heat distribution is suppressed.

The plurality of grooves may be arranged substantially symmetrically with respect to the center point or center line of the covering region. As a result, the grooves are easily evenly arranged. That is, in the gap between the substrate and the support,
If the gas pressure rises, the gas passes through the grooves arranged substantially symmetrically with respect to the center point or the center line of the coating region, so that the pressure rise of the gap on the substrate is increased. Since the reduced range is dispersed and the local pressure increase is unlikely to occur, the displacement of the substrate is more easily suppressed.

When the above-mentioned loading is performed,
The area of the non-contact area in which the substrate and the support base are not in contact with each other in the coating area may be 10% or more and 70% or less of the area of the substrate. This makes it easy to firmly hold the substrate while suppressing the floating of the substrate. Further, the support base may be made of a material containing glass as a main component.

As a result, the glass material promotes the heat conduction between the substrate and the support base due to the radiation, so that the influence of the groove on the deterioration of the heat conduction performance is reduced. The depth of the groove may be 0.05 mm or more and 2.0 mm or less, and the width of the groove may be 5 mm or more and 200 mm or less. As a result, deterioration of the heat conduction performance between the substrate and the support is suppressed.

That is, the heat conduction performance between the substrate and the support can be ensured to the extent that the firing quality is not deteriorated. In addition, the method for manufacturing a gas discharge display panel according to the present invention includes an arranging step of arranging any material of an electrode, a dielectric layer, a partition wall and a phosphor layer on a substrate, and a supporting base for the substrate thus arranged. And a firing step of firing the support base, wherein the support base has a plurality of through-holes that communicate with the lower surface of the support base from the upper surface portion covered with the substrate when the loading is performed. To do.

As a result, the gas existing in the gap between the substrate and the support can freely move to the back surface side through the through hole. That is, when the gas pressure rises in the gap between the substrate and the support, the substrate is likely to be displaced due to buoyancy, but according to the manufacturing method, the substrate is Since the gas in the covered upper surface passes through the plurality of through holes and is discharged to the lower surface, the pressure increase in the gap is reduced and the buoyancy of the substrate is reduced.

Therefore, the positional deviation during firing is suppressed and uneven heating is less likely to occur, so that the firing quality can be improved. Further, the support base according to the present invention is a support base for loading the arranged substrate at the time of baking in the step of baking the material arranged on the substrate serving as the base of the gas discharge display panel. The support base has at least one groove on an upper surface on which the substrates are stacked, which extends from a covered region covered by the substrates to an exposed region not covered by the substrates when the substrates are stacked. Is characterized by.

If the substrate having the above arrangement is placed on the support table and baked, the gas existing in the groove portion is freely moved across the coating region and the exposed region. obtain. That is, when the gas pressure rises in the gap between the substrate and the support base, the substrate is likely to be displaced due to buoyancy, but according to the manufacturing method, the covering region is Since the gas in the vicinity of the groove is discharged through the groove, the pressure increase in the gap is reduced and the buoyancy of the substrate is reduced.

Therefore, the positional deviation during firing is suppressed and uneven heating is less likely to occur, so that the firing quality can be improved. Further, there may be a plurality of the grooves, and the grooves may be dispersed and arranged in the covering region. If the substrate thus arranged is placed on the support table and fired, the range in which the buoyancy of the substrate is reduced is dispersed, so that the buoyancy is efficiently reduced. It

A continuous firing furnace may be used for the firing, and the plurality of grooves may be arranged substantially perpendicular to the conveying direction of the firing furnace. If the substrate thus arranged is placed on the support table and baked, the support table is transferred when heating starts from the tip of the support table in the transfer direction and the temperature rises. Since the groove is arranged perpendicularly to the direction, temperature and pressure gradients are unlikely to occur inside each groove.

Therefore, no local buoyancy is generated in one groove, and the floating of the substrate is suppressed.
A continuous firing furnace may be used for the firing, and the plurality of grooves may be arranged substantially parallel to the conveying direction of the firing furnace. If it is assumed that the substrate having the arrangement is placed on the support table and fired, by this, when heating is started from the front end portion in the transport direction of the support table, gas is discharged to the rear end portion having a low pressure. Because it moves
Heat is conducted in the longitudinal direction of the groove.

In other words, when the transfer speed of the support is low, the heat transfer in the transfer direction between the substrate and the support is more important than the heat transfer between the substrate and the support (upper and lower). By providing a plurality of grooves substantially parallel to the transport direction over at least the entire area on which the substrate is placed, even if the groove is gradually heated from the front end of the support table, the gas that escapes to the rear end part The heat is also conducted to the rear end portion, the generation of a temperature gradient in the transport direction of the substrate and the support is suppressed, and the occurrence of uneven heat distribution is suppressed.

The grooves may be arranged substantially symmetrically with respect to the center point or the center line of the covering region. As a result, the grooves are easily evenly arranged. That is, when the substrate having the arrangement is placed on the support table and baked, if the gas pressure rises in the gap between the substrate and the support table, the gas is covered by the coating region. Since it passes through the grooves arranged substantially symmetrically with respect to the center point or the center line of, the range in which the pressure increase of the gap on the substrate is reduced is dispersed, and the local pressure increase hardly occurs. Therefore, the displacement of the substrate is more easily suppressed.

When the above-mentioned loading is performed,
The area of the non-contact area in which the substrate and the support base are not in contact with each other in the coating area may be 10% or more and 70% or less of the area of the substrate. If the substrate thus arranged is placed on the support table and fired, it is possible to suppress the floating of the substrate and easily hold the substrate firmly.

Further, the support base may be made of a material containing glass as a main component. If the substrate having the arrangement is loaded on the support base and baked, the
Since the heat conduction between the substrate and the support base due to the radiation is promoted, the influence of the groove on the deterioration of the heat conduction performance is reduced. The depth of the groove is 0.05 mm or more and 2.0 mm or less, and the width of the groove is 5 mm or more and 20 mm or more.
It may be 0 mm or less.

If the substrate thus arranged is placed on the support table and fired, the reduction of the heat conduction performance between the substrate and the support table is suppressed. That is, heat conduction performance between the substrate and the support can be ensured to the extent that firing quality is not deteriorated. Further, the support base according to the present invention is a support base for loading the arranged substrate at the time of baking in the step of baking the material arranged on the substrate serving as the base of the gas discharge display panel. The supporting base has a plurality of through holes that communicate with the lower surface of the supporting base from the upper surface covered with the substrate when the stacking is performed.

When the substrate thus arranged is loaded on the supporting base and baked, the through hole covered with the substrate is provided on the side opposite to the side covered with the substrate. From which the gas is released. In addition, the method for manufacturing a support base according to the present invention is a support base for stacking the arranged substrate at the time of baking in the step of baking the material arranged on the substrate that is the base of the gas discharge display panel. In the manufacturing method of the above, at least one groove extending from a covered region covered by the substrate to an exposed region not covered by the substrate when the stacking is performed on the flat plate upper surface serving as the base of the support base. It is characterized by having a groove forming step for forming.

When the substrate arranged as described above is loaded on the support table produced by the manufacturing method of the present invention and baked, the gas existing in the groove portion is thereby exposed to the coating region and the exposed region. You can move freely across. That is, when the gas pressure rises in the gap between the substrate and the support base, the substrate is likely to be displaced due to buoyancy, but according to the manufacturing method, the covering region is Since the gas in the vicinity of the groove is discharged through the groove, the pressure increase in the gap is reduced and the buoyancy of the substrate is reduced.

Therefore, positional deviation during firing is suppressed and uneven heating is less likely to occur, so that the firing quality can be improved. Moreover, even if the area of the non-contact area in which the substrate and the support are not in contact with each other in the covering area when the stacking is performed is 10% or more and 70% or less of the area of the substrate. Good.

If the above-arranged substrate is placed on the support table and baked, the floating of the substrate is suppressed and the substrate is easily held firmly. Further, in the groove forming step, the groove may be generated by scraping off the upper surface portion by a sandblast method. As a result, when the area of the non-contact region is kept small, the groove is easily formed by the sandblast method.

In the groove forming step, the groove may be formed by melting the upper surface portion by a chemical etching method. Thereby, when the area of the non-contact region is kept small, the groove is easily formed by the chemical etching method. Further, in the groove forming step, the groove may be formed by stacking a material on the upper surface portion in a region other than the region where the groove is to be arranged by a thermal spraying method and providing a convex portion.

Accordingly, when a large area of the non-contact area is secured, the groove is easily formed by the thermal spraying method. Further, the manufacturing method of the support base according to the present invention,
In a step of firing a material arranged on a substrate which is a base of a gas discharge display panel, there is provided a method of manufacturing a supporting base for loading the arranged substrate at the time of baking, the base of the supporting base being provided. In this flat plate, a through hole forming step of forming a through hole that communicates from an upper surface of the flat plate covered with the substrate to a lower surface of the flat plate when the flat plate is stacked is provided.

When the substrate arranged as described above is loaded on the support base prepared by the manufacturing method of the present invention and baked, the gas existing in the gap between the substrate and the support base is penetrated. It is free to move through the holes to the back side. That is, in the gap between the substrate and the support,
When the gas pressure rises, buoyancy is generated in the substrate, which easily causes the displacement of the substrate. However, according to the manufacturing method, the gas in the upper surface portion covered with the substrate causes the plurality of through holes to pass through. Since it passes through and is discharged to the lower surface, the pressure increase in the gap is reduced, and the buoyancy of the substrate is reduced.

Therefore, positional deviation during firing is suppressed and uneven heating is less likely to occur, so that the firing quality can be improved.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a PDP 100 according to an embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a plasma display display device.

FIG. 3 is a schematic diagram of a setter in the embodiment of the present invention.

FIG. 4 is a diagram showing an example of a temperature profile in a firing process.

FIG. 5 is a diagram showing an effect of a shape of a setter.

FIG. 6 is a diagram showing a manufacturing process of a setter in the embodiment of the present invention.

FIG. 7 is a diagram showing another variation of the setter shape in the embodiment of the present invention.

FIG. 8 is a diagram showing another variation of the setter shape in the embodiment of the present invention.

FIG. 9 is a diagram showing another variation of the setter shape in the embodiment of the present invention.

FIG. 10 is a diagram showing another variation of the setter shape in the embodiment of the present invention.

FIG. 11 is a diagram showing another variation of the setter shape in the embodiment of the present invention.

FIG. 12 is a schematic diagram of a general alternating current (AC) PDP.

FIG. 13 is a diagram showing a state of a glass substrate and a setter in a firing step.

FIG. 14 is a diagram illustrating movement of a glass substrate placed on a setter.

[Explanation of symbols]

90 Front plate 91 Back plate 100 PDP 101 Front glass substrate 102 Display electrode 103 Transparent electrode 104 Black electrode film 104a Black electrode film precursor 105 Bus electrode 105a Bus electrode precursor 106 Dielectric layer 106a Dielectric layer precursor 107 Protective layer 111 Back glass substrate 112 Address electrode 112a Address electrode precursor 113 Dielectric layer 114 Partition wall 114a Partition wall precursor 115 Phosphor layer 116 Discharge space 119 Panel drive device 120 Setter 130 Hearth roller 200, 300, 400, 500, 600, 700
Setter 201 Heat resistant glass 210 DFR 220 Plasma display device 229 Blast nozzle 230 Abrasive material 250, 251, 350, 450, 550, 650
Grooves 250a, 250b, 250c Grooves 251a, 251b, 251c Grooves 350a, 350b, 350c, 350d, 350e
Grooves 450a, 450b, 450c, 450d, 450e
Grooves 550a, 550b, 550c, 550d, 550e
Groove portion 650a, 650b, 650c Groove portion 750 Through hole

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Keisuke Sumita             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Morio Fujitani             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Hideki Ashida             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Sadao Uemura             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5C027 AA01 AA05 AA09                 5C028 FF01 FF06 FF14                 5C040 GC19 GD09 GF19 GG09 JA21                       JA31 JA34 LA17 MA23

Claims (24)

[Claims] 1. An arranging step of arranging any material of an electrode, a dielectric layer, a partition wall and a phosphor layer on a substrate, and a firing step of loading the substrate thus arranged on a support base and firing it. The gas discharge display panel, wherein the support base has at least one groove extending from a covering region covered by the substrate to an exposed region not covered by the substrate on an upper surface on which the substrate is stacked. Manufacturing method. 2. The method for manufacturing a gas discharge display panel according to claim 1, wherein there are a plurality of the grooves, and the grooves are dispersed and arranged in the covering region. 3. A continuous firing furnace is used for the firing, and the plurality of grooves are arranged substantially perpendicular to a conveying direction of the firing furnace. Gas discharge display panel manufacturing method. 4. The continuous firing furnace is used for the firing, and the plurality of grooves are arranged substantially parallel to a conveying direction of the firing furnace. Gas discharge display panel manufacturing method. 5. The method of manufacturing a gas discharge display panel according to claim 2, wherein the plurality of grooves are arranged substantially symmetrically with respect to a center point or a center line of the covering region. 6. The area of a non-contact area in which the substrate and the support are not in contact with each other in the covering area when the loading is performed is 10% or more and 70% or less of the area of the substrate. Claim 2 characterized by the above.
A method for manufacturing the gas discharge display panel according to. 7. The method of manufacturing a gas discharge display panel according to claim 1, wherein the support base is made of a material containing glass as a main component. 8. The depth of the groove is 0.05 mm or more.2.
0 mm or less, and the width of the groove is 5 mm or more and 2
The method for manufacturing a gas discharge display panel according to claim 7, wherein the gas discharge display panel has a thickness of 00 mm or less. 9. An arranging step of arranging any material of an electrode, a dielectric layer, a partition wall and a phosphor layer on a substrate, and a calcination step of mounting the arranging substrate on a support and firing it. The method for manufacturing a gas discharge display panel according to claim 1, wherein the support base has a plurality of through holes that communicate with the lower surface of the support base from an upper surface portion covered by the substrate when the stacking is performed. 10. In a step of baking a material arranged on a substrate which is a base of a gas discharge display panel, a supporting table for loading the arranged substrate at the time of baking, the supporting table comprising: A support having at least one groove extending from a covering region covered by the substrate to an exposed region not covered by the substrate on the upper surface on which the substrates are stacked, when the stacking is performed. Stand. 11. A plurality of the grooves are provided, and the grooves are arranged dispersedly in the covering region.
The support base described in 0. 12. A continuous firing furnace is used for the firing, and the plurality of grooves are arranged substantially perpendicular to a conveying direction of the firing furnace. Support stand. 13. A continuous firing furnace is used for the firing, and the plurality of grooves are arranged substantially parallel to a conveying direction of the firing furnace. Support stand. 14. The support base according to claim 11, wherein the grooves are arranged substantially symmetrically with respect to a center point or a center line of the covering region. 15. The area of the non-contact area in which the substrate and the support are not in contact with each other in the covering area when the loading is performed is 10% or more and 70% or less of the area of the substrate. The support base according to claim 11, wherein the support base is provided. 16. The support base according to claim 10, wherein the support base is made of a material containing glass as a main component. 17. The depth of the groove is 0.05 mm or more and 2.0 mm or less, and the width of the groove is 5 mm or more and 20 mm or more.
The support base according to claim 16, which is 0 mm or less. 18. In a step of firing a material arranged on a substrate which is a base of a gas discharge display panel, a supporting stand for loading the arranged substrate at the time of baking, wherein the supporting stand is The support base having a plurality of through holes that communicate with the lower surface of the support base from the upper surface covered with the substrate when the stacking is performed. 19. A method of manufacturing a support base for stacking the arranged substrate at the time of baking in a step of baking a material arranged on a substrate which is a base of a gas discharge display panel, comprising: A groove forming step of forming at least one groove extending from a covered region covered by the substrate to an exposed region not covered by the substrate on the upper surface of the flat plate serving as the base of the support base when the stacking is performed. A method of manufacturing a support base, which is characterized by the above. 20. The area of a non-contact region in which the substrate and the support are not in contact with each other in the covering region when the stacking is performed is 10% or more and 70% or less of the area of the substrate. The method for manufacturing a support base according to claim 19, wherein the support base is provided. 21. The method of manufacturing a support base according to claim 20, wherein in the groove forming step, the groove is generated by scraping off the upper surface portion by a sandblast method. 22. The method of manufacturing a support base according to claim 20, wherein in the groove forming step, the groove is generated by melting the upper surface portion by a chemical etching method. 23. In the groove forming step, the groove is formed by stacking a material on the upper surface portion in a region other than the region where the groove is to be arranged by a thermal spraying method to form a convex portion. 21. The method for manufacturing a support base according to claim 20. 24. A method of manufacturing a support base for stacking the arranged substrate at the time of baking in a step of baking a material arranged on a substrate which is a base of a gas discharge display panel, In the flat plate serving as the base of the support base, a through hole forming step of forming a through hole communicating from an upper surface of the flat plate covered with the substrate to a lower surface of the flat plate when the stacking is performed is provided. Method of manufacturing support base.