JPH11339669A - Plasma display substrate and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate improved in bond strength between a dielectric layer and barrier ribs, suppressing break of the barrier ribs wen gas is sealed, and having a high yield by burying part of the barrier ribs a specific quantity into the dielectric layer. SOLUTION: Electrodes 2, a dielectric layer 3 and barrier ribs 4 are formed on a glass substrate 1, and part of the barrier ribs 4 are buried in the dielectric layer 3, and buried quantity A is set to 1-10 μm. The dielectric layer 3 and the barrier ribs 4 are formed on the glass substrate 1 with a dielectric paste mainly made of glass powder and na organic binder and a barrier rib paste mainly made of glass powder and an organic binder in this manufacturing method for the substrate 1, and the relation 5<=Tr-Td<=50 is preferably satisfied, where Tr( deg.C) is the thermosoftening temperature of the glass powder in the barrier rib paste, and Td( deg.C) is the thermosoftening temperature of the glass powder in the dielectric paste. The baking temperature when the dielectric layer 3 is formed is preferably set lower by 5-40 deg.C than the baking temperature when the barrier ribs 4 are formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a novel plasma display substrate and a method of manufacturing the same, and more particularly to a plasma display substrate suitable for a wall-mounted television or a computer monitor and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, plasma displays have attracted attention as large displays.

[0003] A typical type of AC plasma display is constructed by laminating a front plate and a back plate. On the front plate, a transparent electrode made of yttrium or tin oxide is formed on the back surface of a glass substrate. I have. A plurality of the transparent electrodes are formed in a strip shape, and a discharge for display is obtained by applying a pulsed AC voltage of usually 10 kHz to several tens kHz between adjacent transparent electrodes, but the sheet resistance of the transparent electrodes is several tens.
Since the resistance is as high as Ω / cm ² , the electrode resistance becomes about several tens of kΩ, and the driving becomes difficult because the imprint voltage pulse does not sufficiently rise. Therefore, usually, a metal bus electrode is formed on the transparent electrode to reduce the resistance value.

[0004] These electrodes are further covered with a transparent dielectric layer, and the transparent dielectric layer is formed using a low melting glass containing lead glass or bismuth. On the transparent dielectric layer, a protective layer formed by depositing MgO by an electron beam evaporation method is formed.

On the other hand, the back plate is provided with data electrodes for writing display data on a glass substrate, and is covered with a white dielectric layer. A white or black partition is formed thereon, and a phosphor layer that emits red, green, and blue light is formed thereon. At this time, (Y, Gd) BO ₃ : Eu (average particle diameter 3.6 μm) was used as the red phosphor powder,
Green phosphor powder (Zn, Mn) ₂ SiO (average particle diameter 3.5 μm), blue phosphor powder (Ba,
Eu) MgAl ₁₀ O ₇ (average particle diameter 3.7 μm) or the like is used.

The front plate and the back plate having the above-described configuration are
After sealing so as to enable matrix driving, exhaust gas, mixed gas such as He, Ne, Xe, etc.
A plasma display is manufactured by mounting a driving circuit.

In a plasma display having such a structure, when a pulsed AC voltage is applied between adjacent transparent electrodes, gas discharge occurs, and plasma is formed. The ultraviolet rays generated here excite the phosphor to emit visible light, and display light is obtained through the front plate. The transparent electrode that generates a discharge is composed of a scan electrode and a sustain electrode. In an actual panel drive, a sustain discharge pulse is applied to the transparent electrode, which is a discharge electrode, and when a discharge is to be generated, a voltage is applied between the data electrode on the back panel and a counter discharge to generate a discharge. This discharge is maintained between the discharge electrodes by the sustain pulse.

The back plate of the plasma display having the above-described electrodes, dielectrics, and partition walls can be manufactured, for example, by the following method. That is, an electrode pattern is formed on a substrate by pattern printing or photolithography using a paste composed of a metal powder and an organic binder, and then fired to form an electrode. Next, a dielectric paste made of glass powder and an organic binder is screen-printed in a region used for electric discharge, and then fired to form a dielectric layer. Further, a partition wall pattern is formed by pattern printing, sandblasting, lift-off, a photosensitive paste method, or the like using a paste for partition walls made of glass powder and an organic binder, and then fired to form partition walls.

[0009]

However, when a plasma display is manufactured using the back plate of the plasma display formed by such a method, after the front plate and the back plate are sealed and before gas sealing is performed. In addition, when the inside of the panel is depressurized to exhaust air, atmospheric pressure is applied to the front plate and the back plate, and the partition may be damaged when the adhesive strength between the partition and the dielectric layer is low. If the partition walls are damaged, a panel defect occurs, and normal display cannot be performed.

[0010] Originally, since the dielectric and the partition are formed differently from each other in purpose and purpose, the materials used are generally different. For example, in order to control the amount of the filler component added and the porosity after firing, the composition of the glass component is different, and this is one of the causes of insufficient adhesive strength at the interface.

Accordingly, the present invention provides a plasma display substrate and a method of manufacturing the same, which can improve the adhesive strength between the dielectric layer and the partition walls, thereby suppressing breakage of the partition walls during gas filling, and can be manufactured at a high yield. The purpose is to provide.

[0012]

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma display substrate in which a dielectric layer is formed on a glass substrate and a partition is formed thereon, and a part of the partition is formed on the dielectric layer. This is achieved by a substrate for a plasma display characterized by being buried 1 to 10 μm.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION According to the present invention, in order to suppress breakage of a partition wall at the time of gas filling, a study was conducted to increase the adhesive strength between the dielectric layer and the partition wall. It has been found that, when the shape is buried in the substrate, the adhesive strength between the partition and the dielectric layer is improved, and sufficient strength can be secured against the atmospheric pressure at the time of gas filling.

FIG. 1 is a cross-sectional view showing a preferred example of a plasma display substrate according to the present invention, which comprises an electrode 2 formed on a glass substrate 1, a dielectric layer 3, and a partition 4. . As shown in FIG. 1, in the present invention, a part of the partition wall 4 is buried in the dielectric layer 3, and the buried amount A is 1 to 1
It must be 0 μm, and it is preferable that it is embedded 1 to 5 μm.

When the buried amount is smaller than 1 μm, the adhesive strength is not sufficient, and when the buried amount is larger than 10 μm, it is difficult to make the buried amount uniform within the substrate surface, so that uniformity of the discharge voltage cannot be secured. However, none of them can achieve the object of the present invention. Here, the buried amount is the depth at which the partition wall is buried in the dielectric layer, that is, the depth is determined by observing the cross-section of the plasma display substrate with an optical microscope photograph or an electron microscopic photograph. It means the depth at which the constituents of the partition are buried. Specifically, the average dielectric thickness T where no partition is formed
And the difference (T−
t). Further, the average dielectric thickness of the portion where the barrier ribs are formed can be obtained as an average value by measuring the thickness of the dielectric formed below the center in the width direction of each partition at a plurality of locations.

In the present invention, examples of the glass substrate include soda glass and heat-resistant glass for a plasma display.

An electrode made of a material such as gold, silver, copper, nickel, chromium, or aluminum is formed on the glass substrate, and has a general shape having a striped display region and a terminal lead portion. Is fine. The electrode uses, for example, a metal paste composed of a metal powder and an organic component,
After forming a required pattern by a method such as pattern screen printing or photolithography, 500 to 62
It can be formed by baking at 0 ° C. to remove organic components and sintering metal.
A glass frit containing lead or bismuth may be added to the metal paste. Further, it may be formed by performing pattern processing by resist patterning after sputtering a metal film.

A dielectric layer is formed on the electrode for the purpose of stabilizing discharge. In some cases, the dielectric layer is formed for the purpose of protecting electrodes, improving the formability of partition walls, improving brightness by whitening, and the like.

The dielectric layer is formed by applying a glass paste containing a glass powder and an organic component by screen printing, a die coater or a roll coater, and then applying
It can be formed by firing at ℃. Low melting glass containing lead oxide or bismuth oxide can be used in the glass paste for the dielectric layer. Further, whiteness can be improved by adding 5 to 40% by weight of a filler component such as silica, alumina, titanium oxide and zirconium oxide.

Further, partition walls are formed on the dielectric layer. The partition wall pattern is formed by pattern screen printing of a glass paste composed of glass powder and an organic component, or by a photosensitive method using a photosensitive material as an organic component. It can be formed by a method of forming a pattern by photolithography after applying a conductive glass paste. Also, a method of transferring from a mold having a partition mold, such as a sand blast method, can be used. After forming the partition pattern by such a method, by baking at 450 to 600 ° C., the removal of the organic component and the sintering of the glass proceed to form the partition.

As the material of the glass powder, borosilicate glass containing lead or bismuth or alkali-containing borosilicate glass containing sodium, potassium and lithium can be used.

Also, the thermal softening temperature T of the material forming the partition
r (° C.) and the thermal softening temperature Td of the material forming the dielectric layer
The use of a material that satisfies the following relationship between (° C)
It is preferable in that the adhesive strength between the partition and the dielectric layer is enhanced.

5 ≦ Tr−Td ≦ 50 In the present invention, the thermal softening temperature is defined as differential thermal analysis (DT
Using the method A), about 100 mg of a glass sample is heated in air at 20 ° C./min, and the temperature is plotted on the abscissa and the amount of heat is plotted on the ordinate, and a DTA curve is drawn. The value is read from the curve.

Next, a preferred method of manufacturing the plasma display substrate of the present invention will be described.

The substrate for a plasma display of the present invention comprises:
A method for manufacturing a plasma display substrate, comprising forming a dielectric layer and a partition on a glass substrate using a dielectric paste mainly composed of a glass powder and an organic binder and a partition paste mainly composed of the glass powder and an organic binder. For a plasma display in which a relation of 5 ≦ Tr−Td ≦ 50 is established between the thermal softening temperature Tr (° C.) of the glass powder in the paste for partition walls and the thermal softening temperature Td (° C.) of the glass powder in the dielectric paste. It can be easily manufactured by a method for manufacturing a substrate.

In particular, a dielectric paste is applied and baked on a glass substrate to form a dielectric layer, and then a partition pattern is formed and baked using a partition paste to form a partition, thereby forming a dielectric layer. By lowering the baking temperature at the time of the baking by 5 to 40 ° C. than the baking temperature at the time of forming the partition walls, it becomes easy to manufacture the plasma display substrate of the present invention. At this time, the firing temperature of the dielectric paste was 400 ° C.
It is preferable that it is above.

The sintering temperature in the present invention means the maximum temperature at the time of heating to remove the organic components and to soften and sinter the glass components. It can be performed using a firing furnace.

In the above-described manufacturing method, after a dielectric paste is applied on a glass substrate, a partition pattern is formed using a partition paste, and then the dielectric paste application layer and the partition pattern are simultaneously fired. preferable. In particular, at this time, the firing temperature of the dielectric paste application layer and the partition pattern is preferably set to 450 to 600C. According to this method, the number of firing steps can be reduced, and there is an effect of cost reduction. In addition, since the binder removal of the dielectric paste coating layer and the partition pattern (heat removal of the organic component) and the softening and sintering of the glass component occur at the same time, the stress during firing can be reduced, and the dielectric / partition interface can be reduced. Has the advantage of being more robust.

After the formation of the partition walls, a reflection layer may be formed on the side surfaces of the partition walls and on the upper surface of the dielectric for the purpose of improving the reflectance of visible light and the withstand voltage of the dielectric layer.

[0030]

The present invention will be described below with reference to examples. However, the present invention is not limited to these.

Example 1 A 450 mm square glass substrate ("PD20" manufactured by Asahi Glass Co., Ltd.)
0 "), after screen printing a photosensitive silver paste (" Fodel DC202 "manufactured by DuPont) on the entire surface,
Photomask exposure, development, and baking are performed, and the pitch 220
1920 stripe-shaped electrodes having a thickness of μm were formed.

Next, a dielectric paste was applied by a screen printing method on the glass substrate on which the electrodes were formed. The dielectric paste was prepared by kneading a mixture having the following composition with a three-roller kneader.

Glass powder having an average particle diameter of 3.0 μm (bismuth-containing barium borosilicate glass, glass transition temperature 480 ° C., heat softening temperature 520 ° C.) 60 parts by weight Titanium oxide 15 parts by weight Binder (ethyl cellulose) 10 parts by weight Terpineol 15 parts by weight After applying the dielectric paste, the paste is dried at 100 ° C. for 30 minutes, and then baked at a baking temperature of 54 using a roller hearth baking furnace.
Baking was performed at 0 ° C. for a keeping time of 15 minutes.

Next, partition walls were formed using a photosensitive glass paste. A photosensitive glass paste is applied by a die coating method to a thickness of 150 μm (thickness after drying) on a glass substrate on which electrodes and a dielectric are formed, and dried, exposed,
Development was performed to form a partition pattern.

The photosensitive glass paste was prepared by kneading a mixture having the following composition with a three-roller kneader.

Glass powder (average particle diameter 3.5 μm, lithium borosilicate glass: glass transition temperature 480 ° C., heat softening temperature 530 ° C.) 60 parts by weight Binder (methacrylic acid-methyl methacrylate copolymer) 10 parts by weight Photosensitive 10 parts by weight of monomer (trimethylolpropane triacrylate) 3 parts by weight of photopolymerization initiator (Irgacure 651 manufactured by Ciba-Geigy) 17 parts by weight of γ-butyrolactone After application of the photosensitive glass paste, drying was performed, and the pitch was 220 μm.
m, a photomask designed in the form of a stripe having an opening of 20 μm is placed, irradiated with light at an exposure amount of 1000 mJ / cm ² , and then developed with a 0.3% aqueous solution of sodium carbonate.
A partition pattern having a pitch of 220 μm, a line width of 350 μm, and a height of 150 μm was formed.

After the partition pattern is formed, a baking temperature of 560 ° C. and a keeping time of 15 hours are set using a baking furnace of a roller hearth type.
Baking for minutes.

The embedding amount of the partition in the dielectric layer was 2 μm.

Thereafter, a phosphor layer was formed using a phosphor paste containing phosphors corresponding to red, green, and blue, sealed together with the front substrate, and sealed with gas. A good plasma display could be manufactured without defects due to the above.

Example 2 In Example 1, after applying the dielectric paste, drying was performed, a partition pattern was formed by a large number of screen printings without going through a firing step, and a roller hearth type firing furnace was used.
The firing was performed at a firing temperature of 560 ° C. for a keeping time of 15 minutes. The embedding amount of the partition in the dielectric layer was 3 μm.

Thereafter, a phosphor layer was formed using a phosphor paste containing phosphors corresponding to red, green, and blue, sealed together with the front substrate, and sealed with gas. A good plasma display could be manufactured without defects due to the above.

Comparative Example 1 In Example 1, a bismuth-containing borosilicate glass having an average particle diameter of 3.0 μm (glass transition temperature: 520 ° C., thermal softening temperature: 540 ° C.) was used as the glass powder for the dielectric paste. After screen printing of the dielectric layer in the same process as in Example 1, baking was performed at a baking temperature of 560 ° C. for 15 minutes, and then a partition pattern was formed. afterwards,
Using a roller hearth type firing furnace, the firing temperature is 560 ° C.
Was performed for 15 minutes. The embedding amount of the partition in the dielectric layer was 0.2 μm.

Thereafter, a phosphor layer was formed using a phosphor paste containing phosphors corresponding to red, green, and blue, sealed together with the front substrate, and sealed with gas. Defects occurred in the partition walls of the portion, and normal discharge and display could not be obtained.

[0044]

The substrate for a plasma display of the present invention is a substrate for a plasma display in which a dielectric layer is formed on a glass substrate and a partition is formed on the dielectric layer. 10 to 10 μm embedded. For this reason, the adhesive strength between the dielectric layer and the partition is high, and when manufacturing the plasma display, even if atmospheric pressure is applied to the plasma display substrate at the time of gas filling, the partition does not break, so that the plasma display has a high yield. And can be manufactured with high productivity.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a plasma display substrate of the present invention.

[Explanation of symbols]

 1: Glass substrate 2: Electrode 3: Dielectric layer 4: Partition wall A: Buried amount

Claims (6)

[Claims] 1. A plasma display substrate having a dielectric layer formed on a glass substrate and a partition formed thereon, wherein a part of the partition is buried in the dielectric layer by 1 to 10 μm. Substrate for a plasma display. 2. A thermal softening temperature Tr of a material forming a partition wall.
(° C.) and the thermal softening temperature Td of the material forming the dielectric layer
The plasma display substrate according to claim 1, wherein the following relationship is established between (° C). 5 ≦ Tr−Td ≦ 50 3. A plasma display substrate for forming a dielectric layer and a partition on a glass substrate using a dielectric paste mainly comprising a glass powder and an organic binder and a partition paste mainly comprising a glass powder and an organic binder. A manufacturing method, characterized in that the following relationship is established between the thermal softening temperature Tr (° C.) of the glass powder in the paste for partition walls and the thermal softening temperature Td (° C.) of the glass powder in the dielectric paste. Of manufacturing a plasma display substrate. 5 ≦ Tr−Td ≦ 50 4. A dielectric paste is applied and baked on a glass substrate to form a dielectric layer, and then a partition pattern is formed and fired by using a partition paste to form a partition, thereby forming a dielectric layer. The firing temperature at the time of forming is 5 to 40 ° C. lower than the firing temperature at the time of forming the partition walls.
3. The method for manufacturing a substrate for a plasma display according to item 1. 5. A dielectric paste is applied on a glass substrate, a partition pattern is formed by using a partition paste, and the dielectric paste application layer and the partition pattern are simultaneously fired. 4. The method of manufacturing a plasma display substrate according to 3. 6. The method according to claim 5, wherein the firing temperature of the dielectric paste application layer and the partition pattern is 450 to 600 ° C.