JP4256629B2 - Method for manufacturing gas discharge display panel, support table and method for manufacturing support table - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a gas discharge display panel used for a display device or the like, and more particularly, to a method for supporting a glass substrate in a firing step in which an electrode, a dielectric layer and the like are formed on the glass substrate of the gas discharge display panel by firing.
[0002]
[Prior art]
In recent years, gas display panels such as plasma display panels (hereinafter referred to as “PDPs”) in display devices used in computers and televisions have attracted attention as display devices that are large, thin, and lightweight. Has been.
[0003]
  FIG.These are the schematics of a general alternating current type (AC type) PDP.
  As shown in this figure, the PDP 1100 is composed of a front plate 1090 and a back plate 1091 which are arranged with their main surfaces facing each other.
  The front plate 1090 includes a front glass substrate 1101, display electrodes 1102, a dielectric layer 1106, and a protective layer 1107.
[0004]
The front glass substrate 1101 is a material that becomes a base of the front plate 1090, and the display electrode 102 is formed on the front glass substrate 1101.
The display electrode 1102 includes a transparent electrode 1103, a black electrode film 1104, and a bus electrode 1105.
The display electrode 1102 and the front glass substrate 1101 are further covered with a dielectric layer 1106 and a protective layer 1107.
[0005]
  The back plate 1091 is a fluorescent light formed on a wall surface of a back glass substrate 1111, an address electrode 1112, a dielectric layer 1113, a partition wall 1114, and a gap between adjacent partition walls 1114 (hereinafter referred to as “partition wall groove”). A body layer 1115.
  The front plate 1090 and the back plate 1091 areFIG.As shown in FIG. 2, the sealing is performed in a stacked state, and a discharge space 1116 is formed inside.
[0006]
In this figure, the end of the back plate 1091 in the Y-axis direction is depicted as being open, but this is shown for convenience in explaining the structure. The outer peripheral edge is adhered and sealed with sealing glass.
The discharge space 1116 is filled with a discharge gas (filled gas) made of a rare gas component such as He, Xe, or Ne at a pressure of about 500 to 600 Torr (66.5 to 79.8 kPa).
[0007]
A region where a pair of adjacent display electrodes 1102 and one address electrode 1112 intersect with each other across the discharge space 1116 is a cell contributing to image display.
A plasma display device is configured by connecting a driving circuit to the PDP 1100.
In this plasma display device, a voltage is applied between the X electrode of the cell to be lit and the address electrode 1112 to cause an address discharge, and then a pulse voltage is applied to a pair of two adjacent display electrodes 1102. As a result, sustain discharge is performed.
[0008]
In the PDP 1100, in the discharge space 1116, ultraviolet rays are generated by the sustain discharge. When the generated ultraviolet rays hit the phosphor layer 1115, the ultraviolet rays are converted into visible light, and the cells are turned on to display an image. .
By the way, in the process of forming the black electrode film 1104 and the bus electrode 1105 and the process of forming the dielectric layer 1106, the front glass substrate 1101 is baked.
[0009]
  Further, also in the process of forming the address electrode 1112, the dielectric layer 1113, the partition wall 1114, and the phosphor layer 1115, the back glass substrate 1111 coated with these materials is baked.
  In the firing step, a front glass substrate 1101 and a back glass substrate 1111 (hereinafter, collectively referred to as “glass substrate”) on which a firing object such as the black electrode film 1104 or the dielectric layer 1113 is disposed.FIG.As shown in FIG. 4, the flat plate-shaped heat-resistant material larger than the outer size of the substrate, that is, the setter 1120 is placed and fired.
[0010]
The setter 1120 is conveyed by the hearth roller 1130 in the continuous firing furnace, and is fired in a state where the glass substrate is loaded, for example, in a temperature profile in which the peak temperature is set to 590 ° C.
[0011]
[Problems to be solved by the invention]
  However, this firing step has the following problems.
  That is,FIG.As shown in FIG. 4, the front glass substrate 1101 or the rear glass substrate 1111 placed at the regular position of the setter 1120 moves from the regular position during firing (hereinafter referred to as “positional deviation”) at room temperature. There may be a so-called uneven temperature unevenness in which a firing object such as a dielectric layer on the front glass substrate 1101 or the back glass substrate 1111 cannot be fired at a uniform temperature.
[0012]
  In particular, the front glass substrate 1101 or the back glass substrate 1111'sAs the outer size increases, the frequency of occurrence of misalignment tends to increase.
  If the firing object cannot be fired at a uniform temperature and the firing is incomplete, the proper characteristics of the firing object may not be obtained.
  For example, in the dielectric layer 1106, when firing is incomplete, the removal of the solvent is insufficient, and an organic component such as a resin remains in the dielectric layer 1106, and the specified transparency and insulation characteristics are ensured. It becomes difficult.
[0013]
Further, in the partition wall 1114, when the firing is incomplete, the partition wall 1114 itself is insufficient in strength, and the partition wall 1114 may be cracked. In addition, the partition wall 1114 is incomplete due to the incomplete firing. In some cases, the phosphor layer 1115 having a uniform film thickness cannot be formed on the wall surface in a later step.
[0014]
  That is, the quality defect of the gas discharge display panel occurs in the firing process.
  Accordingly, the present invention has been made in view of the above-described problems, and a method for manufacturing a gas discharge display panel in which quality defects are unlikely to occur in the firing process, and the occurrence of quality defects in the firing process of the gas discharge display panel are reduced. Setter that canー andThe purpose is to provide.
[0015]
[Means for Solving the Problems]
  In order to achieve the above object, a method for manufacturing a gas discharge display panel according to the present invention includes:
A placement step of placing any of the electrode, dielectric layer, barrier rib and phosphor layer material on the substrate; and loading the substrate on which the placement has been made on a support baseWhile transporting through a continuous firing furnaceA firing step for firing,
The support base extends from a covered region covered with the substrate to an exposed region not covered with the substrate on the upper surface on which the substrate is stacked.pluralHas a grooveWhen the stacking is performed, the area of the non-contact area where the substrate and the support in the covering area are not in contact with each other by the groove is 10% or more and 70% or less of the area of the substrate. is thereIt is characterized by that.
[0016]
  Further, the support base according to the present invention includes a step of firing the material disposed on the substrate serving as a base of the gas discharge display panel, and the step of placing the substrate on which the placement has been made.Firing while transporting through a continuous firing furnaceA support base for sometimes stacking, wherein the support base is exposed on the upper surface on which the substrate is stacked, when the stacking is performed, and is not covered by the substrate from a covering region covered by the substrate Has at least one groove across the regionWhen the stacking is performed, the area of the non-contact area where the substrate and the support in the covering area are not in contact with each other by the groove is 10% or more and 70% or less of the area of the substrate. is thereIt is characterized by that.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described in detail with reference to the drawings.
(Embodiment)
<Configuration>
FIG. 1 is a schematic diagram of a PDP 100 according to an embodiment of the present invention.
[0019]
This PDP 100 is an AC type PDP, and is composed of a front plate 90 and a back plate 91 arranged with their main surfaces facing each other, and is not structurally different from a conventional PDP.
In the figure, the z direction corresponds to the thickness direction of the PDP, and the xy plane corresponds to a plane parallel to the PDP surface.
[0020]
The front plate 90 includes a front glass substrate 101, display electrodes 102, a dielectric layer 106, and a protective layer 107.
The front glass substrate 101 is a material that becomes a base of the front plate 90, and the display electrode 102 is formed on the front glass substrate 101.
The display electrode 102 includes a transparent electrode 103, a black electrode film 104, and a bus electrode 105.
[0021]
The transparent electrode 103 is formed on one side of the front glass substrate 101 with ITO and SnO with the x direction as the longitudinal direction.₂A plurality of conductive metal oxides such as ZnO are formed in a row.
The black electrode film 104 is formed by laminating a material containing ruthenium oxide as a main component on the transparent electrode 103, with a width narrower than that of the transparent electrode 103 and being laminated on the transparent electrode 103.
[0022]
The bus electrode 105 is obtained by stacking a conductive material containing Ag on the black electrode film 104.
The dielectric layer 106 is a layer made of a dielectric material that covers the entire surface of the front glass substrate 101 on which the display electrodes 102 are formed. Generally, lead-based low-melting glass is used, but bismuth-based low-melting glass is used. You may form with melting | fusing point glass or the laminated body of lead type low melting glass and bismuth type low melting glass.
[0023]
The protective layer 107 is a thin layer made of magnesium oxide (MgO) and covers the entire surface of the dielectric layer 106.
The back plate 91 includes a back glass substrate 111, an address electrode 112, a dielectric layer 113, a partition wall 114, and a phosphor layer 115 stacked on a wall surface of a partition groove formed by a gap between adjacent partition walls 114. Become.
[0024]
The back glass substrate 111 is a material that becomes a base of the back plate 91, and the address electrodes 112 are formed on the back glass substrate 111.
The address electrode 112 is a metal electrode (for example, a silver electrode or a Cr—Cu—Cr electrode), and a conductive material containing Ag is arranged in a row on one side of the rear glass substrate 111 with the y direction as a longitudinal direction. A plurality are formed.
[0025]
The dielectric layer 113 is a layer made of a dielectric material so as to cover the entire surface of the rear glass substrate 111 on the side on which the address electrodes 112 are formed, and is generally made of lead-based low-melting glass. However, it may be formed of a bismuth-based low-melting glass or a laminate of lead-based low-melting glass and bismuth-based low-melting glass.
A partition 114 is formed on the dielectric layer 113 in accordance with the interval between the adjacent address electrodes 112.
[0026]
A phosphor layer 115 corresponding to one of RGB is formed on the wall surface of the partition groove formed by the gap between the adjacent partition walls 114.
More specifically, the phosphor layer 115 includes three types that emit light having different wavelengths of red, green, and blue by the discharged ultraviolet rays, and red, green, and blue fluorescent lights are formed on the inner wall of the partition wall groove. It is applied repeatedly in the order of the body.
[0027]
As shown in FIG. 1, the front plate 90 and the back plate 91 are sealed in a stacked state, and a discharge space 116 is formed therein.
In the discharge space 116, a discharge gas (filled gas) made of a rare gas component such as He, Xe, or Ne is sealed at a pressure of about 500 to 600 Torr (66.5 to 79.8 kPa).
[0028]
A region where a pair of adjacent display electrodes 102 and one address electrode 112 cross each other with the discharge space 116 interposed therebetween is a cell contributing to image display.
As shown in FIG. 2, the PDP 100 and the panel driving device 119 constitute a plasma display display device 220. In the plasma display display device, a voltage is applied between the X electrode and the address electrode 112 of the cell to be lit. After address discharge is performed, a sustain discharge is performed by applying a pulse voltage to a pair of two adjacent display electrodes 102.
[0029]
By this sustain discharge, ultraviolet rays (wavelength of about 147 nm) are generated. When the generated ultraviolet rays hit the phosphor layer 115, the ultraviolet rays are converted into visible light, and the cells are turned on to display an image.
<Manufacturing method of PDP>
As described above, the PDP 100 is formed by stacking and sealing the front plate 90 and the back plate 91 and filling the discharge gas.
[0030]
Hereinafter, a method for manufacturing the front plate 90 will be described.
In the method of manufacturing a gas discharge display panel according to the present invention, a known technique such as vapor deposition or sputtering is used, and a thickness of about 1400 angstroms is formed on the surface of the front glass substrate 101 made of soda glass having a thickness of about 2.8 mm. ITO (Indium Tin Oxide) or SnO₂The transparent electrode 103 is formed by generating a plurality of parallel conductive material such as.
[0031]
Further, using a known technique such as a screen printing method or a photolithography method, a precursor of the black electrode film 104 containing ruthenium oxide as a main component (hereinafter referred to as “black electrode”) across the transparent electrode 103 and the front glass substrate 101. Film precursor 104a ") and a precursor of bus electrode 105 made of Ag (hereinafter referred to as" bus electrode precursor 105a ").
[0032]
The above is the same as the manufacturing method of the conventional gas discharge display panel.
The front glass substrate 101 on which the black electrode film precursor 104a and the bus electrode precursor 105a are formed is loaded on the setter 200, and, for example, is fired with a profile whose peak temperature is set to 590 ° C. The body 104a and the bus electrode precursor 105a are sintered to form the black electrode film 104 and the bus electrode 105.
[0033]
The black electrode film 104 and the bus electrode 105 constitute the display electrode 102 together with the already formed transparent electrode 103.
The precursor of the dielectric layer 106 (hereinafter referred to as “dielectric layer precursor 106a”) is formed on the surface of the front glass substrate 101 on which the black electrode film 104 and the bus electrode 105 are formed by a known technique such as a printing method. The front glass substrate 101 is loaded on the setter 200 and fired.
[0034]
Thereby, the dielectric layer precursor 106a is sintered and the dielectric layer 106 is formed.
Further, the protective layer 107 is formed thereon by a known technique such as sputtering.
As described above, the manufacturing method of the gas discharge display panel according to the present invention uses the setter 200 having grooves formed on the surface instead of the conventional setter 120 having a flat surface at the time of firing described above. In the point which bakes the back glass substrate 111, it differs from the past.
[0035]
Similar to the firing in the production of the front plate 90, the setter 200 described above can be used in the firing in the production of the back plate 91.
Hereinafter, a method for manufacturing the back plate 91 will be described.
In the method for manufacturing a gas discharge display panel according to the present invention, a conductor material mainly composed of Ag is formed on the surface of a rear glass substrate 111 made of soda glass having a thickness of about 2.6 mm by a screen printing method at regular intervals. The back glass substrate 111 on which the precursor of the address electrode 112 (hereinafter referred to as “address electrode precursor 112a”) having a thickness of about 5 to 10 μm is formed on the setter 200 by being applied in a stripe shape. Is fired.
[0036]
Thereby, the address electrode precursor 112a is sintered and the address electrode 112 is formed.
In order to make a PDP to be manufactured a 40-inch class high-definition television, the interval between two adjacent address electrodes 112 is set to about 0.2 mm or less.
[0037]
Subsequently, the entire surface of the rear glass substrate 111 on which the address electrodes 112 are formed is coated with a lead-based glass paste, and this rear glass substrate 111 is placed on the setter 200 and fired, and the thickness is about 20 to 30 μm. The dielectric layer 113 is formed.
Furthermore, by using a coating method by die coating, a paste-like partition wall material containing lead-based glass as a main component and adding alumina powder as an aggregate is applied and formed on the dielectric layer 113, and the purpose is to use a sand blast method. A partition 114 precursor (hereinafter referred to as a “partition precursor 114a”) is formed by scraping only the region excluding the region of the shape, and the partition precursor 114a is baked to form a partition having a height of about 100 to 150 μm. 114 is formed.
[0038]
At this time, the rear glass substrate 111 on which the partition wall precursor 114a is formed is loaded on the setter 200 and baked.
The interval between the partition walls 114 is about 0.36 mm, for example.
Subsequently, any of red (R), phosphor, green (G) phosphor, and blue (B) phosphor on the wall surface of the partition wall 114 and the surface of the dielectric layer 113 exposed between the adjacent partition walls 114. A phosphor ink containing is applied.
[0039]
Thereafter, the phosphor ink is dried and then baked to form the phosphor layers 115 of the respective colors.
Also at this time, the rear glass substrate 111 coated with the phosphor ink is loaded on the setter 200 and baked.
As a phosphor material constituting the phosphor layer 115, here,
Red phosphor: (Y_XGd_1-X) BO_Three: Eu
Green phosphor: Zn₂SiO_Four: Mn
Blue phosphor: BaMgAl_TenO₁₇: Eu³⁺
Shall be used.
[0040]
As each phosphor material, for example, a powder having an average particle diameter of about 3 μm is used.
For applying the phosphor ink, for example, the phosphor ink is ejected from an ultrafine nozzle.
After applying the phosphor ink, the phosphor layer 115 is formed by baking the profile at a maximum temperature of about 520 ° C. for 2 hours.
After the front plate 90 and the back plate 91 are created as described above, the front plate 90 and the back plate 91 are bonded and sealed using a known PDP manufacturing technique, and the impure gas inside is exhausted. The PDP 100 is completed by filling the discharge gas.
[0041]
The method for manufacturing a gas discharge display panel according to the present invention relates to a firing process in manufacturing the front plate 90 and the back plate 91, and a detailed description of the manufacturing method after the bonding of the front plate 90 and the back plate 91 is omitted. To do.
<Specifications of setter>
Here, the above-described setter 200 used in the firing process will be described in detail.
[0042]
FIG. 3 is a schematic diagram of the setter 200 in the embodiment of the present invention.
When the setter 200 fires a firing object such as the dielectric layer precursor 106a on the front glass substrate 101 and the back glass substrate 111, the setter 200 supports the glass substrate, conveys it into a continuous firing furnace, and fires it. It is a support base.
For example, as shown in FIG. 4, the setter 200 is repeatedly used in a profile in which the peak temperature is set to 590 ° C., and has high heat fatigue resistance. For example, Neoceram N-0 Or it consists of transparent heat-resistant glass materials, such as N-11 (Nippon Electric Glass brand name).
[0043]
The plate thickness of the setter 200 is about 5 to 8 mm, although it varies depending on the size of the glass substrate to be loaded.
The outer size of the setter 200 varies depending on the size of the glass substrate to be loaded, but is at least larger than the outer size of the glass substrate both vertically and horizontally.
Further, as shown in FIG. 3, the setter 200 has a plurality of grooves, that is, a groove 250 and a groove 251 that are arranged perpendicular to the transport direction.
[0044]
The groove shapes of the groove 250 and the groove 251 are the same, for example, the groove width (W) is 70 mm, the groove depth is 2 mm, and the distance (d) between the grooves. Is 400 mm.
When the glass substrate is stacked on the setter 200, the groove 250 and the groove 251 are formed from the area where the front glass substrate 101 is stacked to the outside of the area.
[0045]
Therefore, as shown in FIG. 3, the groove 250 is divided into a groove part 250a covered with a glass substrate, a groove part 250b and a groove part 250c not covered with the glass substrate, and the groove 251 is a groove part 251a covered with the glass substrate. And a groove 251b and a groove 251c that are not covered with the glass substrate.
Here, the reason for using the setter 200 made of the heat-resistant glass material having the above-described groove in the firing step will be described.
<Effect of surface shape of setter 200>
When viewed microscopically, the surface of the setter is not in a mirror state, but warps or undulates, and a minute gap exists between the glass substrate and the setter 120.
[0046]
  The cause of the so-called misalignment that the front glass substrate 101 or the back glass substrate 111 placed at the regular position of the setter 120 moves from the regular position during firing at room temperature is that the temperature rises in the firing process. As the convection occurs in the gas existing in the gap, the pressure inside the gap increases, and between the front glass substrate 101 and the setter 120,FIG.This is considered to be due to the formation of a gas layer as shown in FIG. 5 and the glass substrate floating on the order of several tens to several hundreds of μm.
[0047]
This gas convection is thought to occur due to a difference in temperature between the glass substrate and the setter due to differences in physical properties such as heat capacity and thermal conductivity between the glass substrate and the setter. Furthermore, it is considered that the degree of convection of the gas increases.
Since the setter 200 according to the embodiment of the present invention has the groove 250 and the groove 251 as described above, gas is generated between the front glass substrate 101 and the setter 120 as shown in FIG. However, since this gas is transmitted through the groove portion 250a and the groove portion 251a and is discharged from the groove portion 250b, the groove portion 250c, the groove portion 251b, and the groove portion 250c, the buoyancy to reduce the buoyancy and to raise the glass substrate hardly occurs. Misalignment hardly occurs.
[0048]
In addition, since the setter 200 in the embodiment of the present invention has a groove arranged perpendicular to the transport direction, heating starts from the tip of the setter 200 in the transport direction and the temperature rises. In each groove, temperature and pressure gradients are unlikely to occur, so local buoyancy does not occur in one groove, and the glass substrate does not easily float.
[0049]
Furthermore, since the setter conveyance direction usually coincides with the longitudinal direction of the glass substrate, the groove 250 and the groove 251 are arranged in a direction substantially perpendicular to the longitudinal direction of the glass substrate, and are covered with the glass substrate. The area of the groove 250a and the groove 251a can be made smaller than any other direction.
Thereby, the volume of the gas existing in the gap between the groove 250a and the groove 251a is also reduced, and the relaxation time of the pressure increase due to the release of gas is also reduced, so the conveying speed of the setter 200 is fast and the setter 200 suddenly This is advantageous when overheated.
[0050]
By preventing the occurrence of the above-described displacement, the firing object placed on the glass substrate can be fired at a more uniform temperature, and the firing quality can be improved.
<Effect of material of setter 200>
By the way, since the setter 200 has a groove that cannot directly contact the glass substrate on the surface on which the glass substrate is stacked, the setter 200 contacts the setter on the glass substrate rather than the setter 120 that does not have any groove. Since the area of the part which is not, ie, the area of the range of the groove part 250a and the groove part 251a, becomes large, the heat conduction performance between the setter 200 and the glass substrate is lowered.
[0051]
Usually, the temperature difference between the setter and the glass substrate is desirably small, and it is necessary to ensure a certain degree of heat conduction performance.Therefore, when forming a groove in a setter made of a material having a low emissivity such as metal, There is a limit to increasing the groove width and groove depth.
On the other hand, since the setter 200 in the embodiment of the present invention is a transparent heat-resistant glass material, not only the heat conduction but also the radiant heat can greatly contribute to the heat conduction. It is considered that the width and the depth of the groove can be increased, and the degree of freedom of design of the setter in the embodiment of the present invention is further increased.
[0052]
Furthermore, although the materials of the glass substrate and the setter are not the same, they are similar in physical properties such as specific heat, thermal tension coefficient, and thermal conductivity because they are made of the same glass material.
For this reason, it is considered that a temperature difference between the glass substrate and the setter is unlikely to occur and contributes to suppression of the occurrence of the convection.
<Specific specifications of groove>
In the setter 200, which is a heat-resistant glass material, from experience, even if the groove depth is increased to about 2.00 mm when the groove width is between 5 mm and 200 mm, there is no problem of uneven heating during firing. .
[0053]
On the other hand, regarding the lower limit of the groove depth, whether the gas can escape to such an extent that buoyancy sufficient to cause the above-described displacement occurs does not matter, but warpage or undulation of the glass substrate surface. It is considered that the value of the groove is affected, and from experience, it is not effective as a gas communication path unless the depth of the groove is at least 0.05 mm or more.
Further, when the proportion of the groove in the range where the glass substrate is placed, that is, the proportion of the area of the groove portion 250a and the groove portion 251a is small, the contact area between the glass substrate and the setter 200 becomes large, and the convection of the gas present in the contact portion As a result, buoyancy to the extent that the glass substrate is levitated may be generated.
[0054]
On the contrary, if the above-mentioned ratio is too large, the contact area may be small and may not be supported firmly.
In order to prevent these disadvantages from occurring, the ratio of the groove to the range is desirably 10% or more and 70% or less.
Needless to say, the contact portion is a range obtained by removing the range of the groove portion 250a and the groove portion 251a from the range where the glass substrate (here, the front glass substrate 101) is placed in the top view in FIG. Means.
[0055]
Moreover, it is desirable to form the groove formation position in the setter 200 over the entire range where the glass substrate is stacked.
That is, it is desirable to disperse the buoyancy reduction range due to gas convection so that large buoyancy is not locally generated.
From such a viewpoint, the groove 250 and the groove 251 are arranged so as to be substantially symmetrical with respect to the center point of the setter 200.
<Manufacturing method of setter>
Hereinafter, an example of a method for manufacturing the setter 200 used in the firing process in the creation of the front plate 90 and the back plate 91 will be described.
[0056]
FIG. 6 is a diagram illustrating a manufacturing process of the setter 200.
FIG. 6A shows the first step (photosensitive resist film forming step). In this step, for example, the plate has a length of 1280 mm, a width of 800 mm, and a thickness of 5 mm, and is neoceram N-0 or N- 11 (trade name of Nippon Electric Glass Co., Ltd.) on a transparent heat resistant glass 201, the roll temperature is 80 ° C. and the linear pressure is 4 kg / cm.²A photosensitive resist film (hereinafter referred to as DFR) 210 having a thickness of 50 μm is laminated under the condition that the substrate feed rate is 1 m / min.
[0057]
FIG. 6B shows the second step (exposure and development step). In this step, a negative pattern patterned in such a shape is provided in order to provide two parallel grooves with a width of 400 mm and a width of 70 mm. 15 mW / cm using a mold type photomask²The exposure part 211 and the non-exposure part 212 are formed by irradiating ultraviolet light (UV light) with the output ultra-high pressure mercury lamp.
[0058]
The exposure amount at this time is, for example, 700 mJ.
Further, for example, development is performed with a developing solution of 1% aqueous sodium carbonate solution, followed by washing with water, whereby the non-exposed portion 212 is removed.
As a result, as shown in FIG. 6C, stripe-like grooves are formed in the DFR 210.
[0059]
FIG. 6D shows a third step (blasting step). In this step, after the groove is formed, sand blasting is performed from the side where the DFR 210 is formed.
More specifically, the abrasive 230 such as a glass bead material is sprayed from the blast nozzle 229 onto the heat-resistant glass 201 under the conditions of an Air flow rate of 1500 NL / min and an abrasive supply amount of 1500 g / min. The glass 201 is blasted to form grooves.
[0060]
The blasting time is adjusted so that the depth of the concave portion of the heat resistant glass is about 2 mm.
FIG. 6E is a fourth step (photosensitive resist film peeling step). In this step, the heat-resistant glass 201 is immersed in a peeling solution, for example, a 5% aqueous sodium hydroxide solution. The DFR 210 is peeled off.
[0061]
Thereby, the setter 200 which has a predetermined groove | channel, ie, the groove | channel 250, and the groove | channel 251 is obtained.
As described above, according to the present embodiment, in the firing process of the gas discharge display panel, the glass substrate is moved on the setter by placing the glass substrate on the setter 200 according to the embodiment of the present invention and firing. , Misalignment can be prevented.
[0062]
The groove width (W) of the setter 200 in the embodiment of the present invention is 70 mm. However, the groove width of the setter is not limited to this groove width as long as the area of the setter groove can be secured to such an extent that the glass substrate does not float. The groove width may be.
Moreover, although the groove depth of the setter 200 in the embodiment of the present invention is 2 mm and the interval (d) between the grooves is 400 mm, it is not limited to this value. The firing object may be changed within a range that does not cause firing failure.
[0063]
Further, although the material of the setter 200 in the embodiment of the present invention is a heat-resistant glass material, it may be made of a material mainly composed of a metal, a material mainly composed of a metal oxide, or a ceramic.
In that case, it is necessary to review the groove shape of the setter so that the prescribed firing quality can be ensured and no positional deviation occurs.
[0064]
Further, the setter 200 in the present embodiment has a shape in which two grooves are arranged in parallel on a flat plate, but the number of grooves is not limited to two, and may be more than that.
Further, the setter 200 in the present embodiment has a plurality of grooves arranged perpendicular to the transport direction. However, the present invention is not limited to this, and, for example, a plurality of sets disposed substantially parallel to the transport direction. A groove may be provided.
[0065]
In this case, when heating is started from the front end portion of the setter 200 in the transport direction, the gas moves to the rear end portion having a low pressure, and thus heat is conducted in the longitudinal direction of the groove.
Originally, the formation of grooves on the setter works in a direction that impedes heat conduction between the glass substrate and the setter, but when the setter transport speed is slow, heat conduction between the glass substrate and the setter (between the upper and lower sides). Since the heat conduction in the transport direction in the glass substrate and the setter is also more important than that, the tip of the setter is provided with a plurality of grooves substantially parallel to the transport direction over the entire range where the glass substrate is placed on the setter surface. Even if it is gradually heated from the heat, the gas that escapes to the rear end also conducts heat to the rear end, suppressing the generation of temperature gradient in the transport direction of the glass substrate and setter, resulting in more uniform heating Can be difficult.
[0066]
In addition, the setter 200 in the present embodiment has a shape in which two grooves are arranged in parallel on a flat plate. However, the present invention is not limited to this groove shape, and the gas existing between the setter and the glass substrate is discharged to the outside. For example, as shown in FIG. 7, a setter 300 having a cross groove 350 may be used.
In that case, when a glass substrate is stacked on the setter 300, the groove 350 includes a groove 350a covered with the glass substrate, and a groove 350b, a groove 350c, a groove 350d, and a groove 350e that are not covered with the glass substrate.
[0068]
Furthermore, as shown in FIG. 9, a setter 500 having a lattice-like groove 550 may be used.
In that case, when a glass substrate is loaded on the setter 500, the groove 550 includes a groove portion 550a covered with the glass substrate, and a groove portion 550b, a groove portion 550c, a groove portion 550d, and a groove portion 550e that are not covered with the glass substrate.
[0071]
MaIn the present embodiment, the groove of the setter 200 of the present invention is created by the sand blasting method, but is not limited to this method. For example, the glass surface is melted using a hydrofluoric acid aqueous solution. It may be created by a chemical etching method, or may be created by laminating a material on the glass surface by a thermal spraying method or the like and providing a convex portion by laminating it in a region excluding the region where the groove is to be disposed.
[0072]
【The invention's effect】
As is clear from the above description, the method for manufacturing a gas discharge display panel according to the present invention includes an arrangement step of arranging any one of an electrode, a dielectric layer, a partition wall, and a phosphor layer on a substrate, and the arrangement includes: A firing step of stacking and firing the substrate that has been made on a support base, and the support base is an exposed area that is not covered with the substrate from a cover area that is covered with the substrate on an upper surface on which the substrate is stacked It has at least 1 groove | channel straddling.
[0073]
Thereby, the gas which exists in the part of the said groove | channel can move freely across the said covering area | region and the said exposure area | region.
That is, when a gas pressure rises in the gap between the substrate and the support base, buoyancy is generated in the substrate, and thus the substrate is likely to be misaligned. Since the gas in the vicinity of the groove is discharged through the groove, the pressure increase in the gap is reduced, and the generation of buoyancy of the substrate is reduced.
[0074]
Therefore, the positional deviation at the time of baking is suppressed and uneven soaking is less likely to occur, so that the baking quality can be improved.
Moreover, there may be a plurality of the grooves, and the grooves may be distributed in the covering region.
Thereby, since the range in which the generation of buoyancy of the substrate is reduced is dispersed, the generation of buoyancy is efficiently reduced.
[0075]
In addition, a continuous firing furnace may be used for the firing, and the plurality of grooves may be disposed substantially perpendicular to the transport direction of the firing furnace.
Thereby, when heating starts from the front end in the transport direction of the support base and the temperature rises, the support base has grooves arranged perpendicular to the transport direction. Inside, temperature and pressure gradients are unlikely to occur.
[0076]
Therefore, local buoyancy does not occur in one groove, and the floating of the substrate is suppressed.
In addition, a continuous firing furnace may be used for the firing, and the plurality of grooves may be arranged substantially parallel to the transport direction of the firing furnace.
Accordingly, when heating is started from the front end portion in the transport direction of the support base, the gas moves to the rear end portion having a low pressure, and thus heat is conducted in the longitudinal direction of the groove.
[0077]
That is, when the transport speed of the support table is slow, the heat conduction in the transport direction in the substrate and the support table is more important than the heat conduction between the substrate and the support table (between the upper and lower sides). By providing a plurality of grooves substantially parallel to the transport direction over the entire area where the substrate is placed, even if the substrate is gradually heated from the front end of the support base, the heat is backed by the gas that escapes to the rear end. Conducted also to the end portion, the generation of the temperature gradient in the transport direction of the substrate and the support is suppressed, and the occurrence of soaking unevenness is suppressed.
[0079]
Further, when the stacking is performed, the area of the non-contact area where the substrate and the support base are not in contact with each other in the covering area may be 10% to 70% of the area of the substrate. Good.
Thereby, it is easy to hold the substrate firmly while suppressing the floating of the substrate.
The support may be made of a material mainly composed of glass.
[0080]
Thereby, since the heat conduction between the said board | substrate and the said support stand by a radiation is accelerated | stimulated for glass material, the influence on the fall of the heat conductive performance by the said groove | channel is reduced.
The depth of the groove may be 0.05 mm or more and 2.0 mm or less, and the width of the groove may be 5 mm or more and 200 mm or less.
Thereby, the fall of the heat conductive performance between the said board | substrate and the said support stand is suppressed.
[0081]
  That is, the heat conduction performance between the substrate and the support can be ensured to such an extent that poor firing quality is not caused..
[0083]
MaIn addition, the support base according to the present invention is a support base for stacking the substrate that has been arranged at the time of firing in the step of firing the material disposed on the base substrate of the gas discharge display panel. And the support base has at least one groove extending from a covering region covered by the substrate to an exposed region not covered by the substrate when the loading is performed on the upper surface on which the substrate is stacked. It is characterized by.
[0084]
If firing is performed by placing the substrate on which the arrangement has been made on the support base, the gas present in the groove portion can thereby freely move across the covered region and the exposed region.
That is, when a gas pressure rises in the gap between the substrate and the support base, buoyancy is generated in the substrate, and thus the substrate is likely to be misaligned. Since the gas in the vicinity of the groove is discharged through the groove, the pressure increase in the gap is reduced, and the generation of buoyancy of the substrate is reduced.
[0085]
Therefore, the positional deviation at the time of baking is suppressed and uneven soaking is less likely to occur, so that the baking quality can be improved.
Moreover, there may be a plurality of the grooves, and the grooves may be distributed in the covering region.
If the substrate having the arrangement is placed on the support base and firing is performed, the range in which the generation of buoyancy of the substrate is reduced is dispersed, so that the generation of buoyancy is efficiently reduced. The
[0086]
In addition, a continuous firing furnace may be used for the firing, and the plurality of grooves may be disposed substantially perpendicular to the transport direction of the firing furnace.
If baking is performed by placing the substrate on which the arrangement is made on the support base, when the heating starts from the front end in the transport direction of the support base and the temperature rises, the support base transports. Since the grooves are arranged perpendicular to the direction, temperature and pressure gradients are unlikely to occur inside the individual grooves.
[0087]
Therefore, local buoyancy does not occur in one groove, and the floating of the substrate is suppressed.
In addition, a continuous firing furnace may be used for the firing, and the plurality of grooves may be arranged substantially parallel to the transport direction of the firing furnace.
If the substrate having the above arrangement is placed on the support base and firing is performed, thereby, when heating is started from the front end portion in the transport direction of the support base, the gas flows to the rear end portion having a low pressure. Since it moves, heat is conducted in the longitudinal direction of the groove.
[0088]
That is, when the transport speed of the support table is slow, the heat conduction in the transport direction in the substrate and the support table is more important than the heat conduction between the substrate and the support table (between the upper and lower sides). By providing a plurality of grooves substantially parallel to the transport direction over the entire area where the substrate is placed, even if the substrate is gradually heated from the front end of the support base, the heat is backed by the gas that escapes to the rear end. Conducted also to the end portion, the generation of the temperature gradient in the transport direction of the substrate and the support is suppressed, and the occurrence of soaking unevenness is suppressed.
[0090]
Further, when the stacking is performed, the area of the non-contact area where the substrate and the support base are not in contact with each other in the covering area may be 10% to 70% of the area of the substrate. Good.
If firing is carried out by placing the substrate on which the substrate has been placed on the support base, this makes it easy to hold the substrate firmly while suppressing the floating of the substrate.
[0091]
The support may be made of a material mainly composed of glass.
If the substrate having the arrangement is placed on the support base and baked, heat conduction between the substrate and the support base due to radiation is promoted, thereby reducing the heat conduction performance due to the groove. Impact is reduced.
Further, the depth of the groove may be 0.05 mm or more and 2.0 mm or less, and the width of the groove may be 5 mm or more and 200 mm or less.
[0092]
  If firing is performed by placing the substrate on which the arrangement has been made on the support base, a decrease in heat conduction performance between the substrate and the support base is thereby suppressed.
  That is, the heat conduction performance between the substrate and the support can be ensured to such an extent that poor firing quality is not caused..
[0097]
Further, in the groove forming step, the groove may be generated by melting the upper surface portion by a chemical etching method.
Thereby, when the area of the non-contact region is ensured to be small, the groove is easily generated by the chemical etching method.
In the groove forming step, the groove may be formed by laminating a material on the upper surface portion in a region outside the region where the groove is to be disposed and providing a convex portion by a spraying method.
[Brief description of the drawings]
FIG. 1 is a schematic diagram of a PDP 100 in an embodiment of the present invention.
FIG. 2 is a diagram showing a configuration of a plasma display display device.
FIG. 3 is a schematic view of a setter in the embodiment of the present invention.
FIG. 4 is a diagram showing an example of a temperature profile in a firing process.
FIG. 5 is a diagram illustrating an effect of a setter shape.
FIG. 6 is a diagram showing a setter manufacturing process in the embodiment of the present invention.
FIG. 7 is a diagram showing another variation of the setter shape in the embodiment of the present invention.
FIG. 8 is a diagram showing another variation of the setter shape in the embodiment of the present invention.
FIG. 9It is the schematic of a general alternating current type (AC type) PDP.
FIG. 10It is a figure which shows the state of the glass substrate and setter in a baking process.
FIG. 11It is a figure explaining the movement of the glass substrate set | placed on the setter.
[Explanation of symbols]
      90 Front plate
      91 Back plate
    100 PDP
    101 Front glass substrate
    102 Display electrode
    103 Transparent electrode
    104 Black electrode film
    104a Black electrode film precursor
    105 bus electrode
    105a Bus electrode precursor
    106 Dielectric layer
    106a Dielectric layer precursor
    107 protective layer
    111 Rear glass substrate
    112 Address electrode
    112a Address electrode precursor
    113 Dielectric layer
    114 Bulkhead
    114a Bulkhead precursor
    115 phosphor layer
    116 Discharge space
    119 Panel drive device
    120 setter
    130 Hearth Roller
    200, 300, 400, 500, 600, 700 setter
    201 heat resistant glass
    210 DFR
    220 Plasma display device
    229 Blast nozzle
    230 Abrasive
    250, 251, 350, 450, 550, 650 groove
    250a, 250b, 250c groove
    251a, 251b, 251c groove
    350a, 350b, 350c, 350d, 350e GroovePart
  550a, 550b, 550c, 550d, 550e groovePart

Claims (6)

An arrangement step of disposing any material of electrodes, dielectric layers, barrier ribs and phosphor layers on a substrate;
A firing step of firing the substrate placed on a support stand and carrying it in a continuous firing furnace, with the arrangement being made,
The support base has a plurality of grooves extending from a covering region covered by the substrate to an exposed region not covered by the substrate on the upper surface on which the substrate is stacked,
Each of the grooves extends in a direction parallel to the transport direction of the support base and is formed so as not to intersect with the other grooves.
A gas in which the area of the non-contact area where the substrate and the support base in the covering area are not in contact with each other when the stacking is performed is 10% or more and 70% or less of the area of the substrate. Manufacturing method of discharge display panel. The support base is made of a material mainly composed of glass,
The thickness of the support base is 5 mm or more and 8 mm or less ,
2. The method of manufacturing a gas discharge display panel according to claim 1, wherein a depth of the groove is 0.05 mm or more and 2.0 mm or less, and a width of the groove is 5 mm or more and 200 mm or less.   2. The method for manufacturing a gas discharge display panel according to claim 1, wherein there are a plurality of the grooves, and the grooves are distributed in the covering region. In a step of firing a material disposed on a substrate serving as a base of a gas discharge display panel, a support base for loading the disposed substrate when being fired while being conveyed in a continuous firing furnace. ,
The support base has a plurality of grooves extending from a covering region covered by the substrate to an exposed region not covered by the substrate when the loading is performed on the upper surface on which the substrate is stacked;
Each of the grooves extends in a direction parallel to the conveying direction of the support base and is formed so as not to intersect with other grooves.
A gas in which the area of the non-contact area where the substrate and the support base in the covering area are not in contact with each other when the stacking is performed is 10% or more and 70% or less of the area of the substrate. A support for a substrate for a discharge display panel. The support base is made of a material mainly composed of glass,
The thickness of the support base is 5 mm or more and 8 mm or less ,
The depth of the said groove | channel is 0.05 mm or more and 2.0 mm or less, and the width | variety of the said groove | channel is 5 mm or more and 200 mm or less, The support stand of the board | substrate for gas discharge display panels of Claim 4 . The support for a substrate for a gas discharge display panel according to claim 4 , wherein the grooves are distributed and arranged in the covering region.

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