KR100895370B1 - Method of manufacturing gas discharge display panel, and support table - Google Patents

Abstract

A method of manufacturing a gas discharge display panel according to the present invention includes a disposing step of arranging a material of an electrode, a dielectric layer, a partition wall, and a phosphor layer on a substrate, and a firing step of loading the substrate on which the arrangement is made on a support table and firing the same. The support may include at least one groove extending from an area covered by the substrate to an exposed area not covered by the substrate, on an upper surface on which the substrate is loaded.

Gas Discharge Display Panel, Dielectric Layer, Phosphor Layer, Support, Bulkhead

Description

Manufacturing method of gas discharge display panel, supporter {METHOD OF MANUFACTURING GAS DISCHARGE DISPLAY PANEL, AND SUPPORT TABLE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a gas discharge display panel for use in a display device, and more particularly, to a method for supporting a glass substrate in a firing step of forming an electrode, a dielectric layer, or the like by firing on a glass substrate of a gas discharge display panel. It is about.

Background Art In recent years, in display devices used in computers, televisions, and the like, gas discharge display panels such as plasma display panels (hereinafter referred to as " PDPs ") have attracted attention as display devices that can realize large size and thin weight.

1 is a schematic diagram of a typical AC PDP.

As shown in FIG. 1, the PDP 100 is comprised from the front board 90 and the back board 91 arrange | positioned so that the main surface may mutually oppose.

The front plate 90 includes a front glass substrate 101, a display electrode 102, a dielectric layer 106, and a protective layer 107.

The front glass substrate 101 is a material on which the front plate 90 is formed, and a display electrode 102 is formed on the front glass substrate 101.                 

The display electrode 102 is composed of a transparent electrode 103, a black electrode film 104, and a bus electrode 105.

In addition, the display electrode 102 and the front glass substrate 101 are covered with the dielectric layer 106 and the protective layer 107.

The rear plate 91 is a wall surface of a gap between the rear glass substrate 111, the address electrode 112, the dielectric layer 113, the partition wall 114, and the adjacent partition wall 114 (hereinafter referred to as a partition wall groove). Formed of a phosphor layer 115 formed thereon.

As shown in FIG. 1, the front plate 90 and the back plate 91 are sealed in an overlapping state, and a discharge space 116 is formed therein.

In addition, although the edge part in the Y-axis direction of the back plate 91 is shown in FIG. 1 as being open, this is shown for convenience to demonstrate a structure easily, In fact, the outer periphery part is sealed by the sealing glass and sealed. .

In the discharge space 116, a discharge gas (sealed gas) composed of rare gas components such as He, Xe, and Ne is sealed at a pressure of 500 to 600 Torr (66.5 to 79.8 kPa).

An area where a pair of neighboring display electrodes 102 and one address electrode 112 intersect with the discharge space 116 between them becomes a cell that contributes to image display.

2 is a diagram illustrating a configuration of a plasma display display device which is one of gas discharge display devices.

The plasma display device includes a PDP 100 and a panel driver 119.                 

In this plasma display device, a voltage is applied between the X electrode and the address electrode 112 of a cell to be turned on, and then a pulse voltage is applied to a set of two adjacent display electrodes 102 after the address discharge is performed. Discharge is made.

In the PDP 100, ultraviolet rays are generated in the discharge space 116 by this sustain discharge, and the generated ultraviolet rays strike the phosphor layer 115, so that the ultraviolet rays are converted into visible light, and the image is displayed by turning on the cell. .

However, the front glass substrate 101 is fired during the formation of the black electrode film 104 and the bus electrode 105 and the formation of the dielectric layer 106.

In addition, during the formation of the address electrode 112, the dielectric layer 113, the partition wall 114, and the phosphor layer 115, the back glass substrate 111 coated with these materials is fired.

In the firing step, the front glass substrate 101 and the rear glass substrate 111 (hereinafter, collectively referred to as "glass substrate") on which firing objects such as the black electrode film 104 or the dielectric layer 113 are arranged are illustrated in FIG. As shown in Fig. 3, the substrate is loaded on a plate-shaped heat-resistant material larger than the outer size of these substrates, that is, the setter 120 and fired.

The setter 120 is conveyed by a Hearth roller 130 in a continuous firing furnace, for example, fired with a glass substrate loaded in a temperature profile in which the peak temperature is set to 590 ° C.

However, there are the following problems in this firing process.

That is, as shown in FIG. 4, at room temperature, the front glass substrate 101 or the rear glass substrate 111 located at the normal position of the setter 120 moves from the normal position during firing (hereinafter, “position shifting”). In some cases, a so-called unevenness of temperature distribution may occur, in which a firing object such as a dielectric layer on the front glass substrate 101 or the back glass substrate 111 cannot be fired at a uniform temperature.

In particular, as the outer size of the front glass substrate 101 or the rear glass substrate 111 increases, the occurrence frequency of position shift tends to increase.

Since the firing object cannot be fired at a uniform temperature, incomplete firing may result in failure to obtain regular characteristics of the firing object.

For example, in the dielectric layer 106, when the baking is incomplete, the removal of the organic compound is insufficient, and organic components such as resin remain in the dielectric layer 106, making it difficult to secure prescribed transparency and insulating properties.

In addition, when the plasticity is incomplete in the partition wall 114, the strength of the partition wall 114 itself may be insufficient, and a crack or the like may occur in the partition wall 114. Moreover, the wall surface of the partition wall 114 may be caused by the incomplete plasticity described above. The surface roughness may be uneven, so that the phosphor layer 115 having a uniform film thickness may not be formed on this wall surface in a subsequent step.

That is, in the firing process, poor quality of the gas discharge display panel occurs.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to reduce the occurrence of quality defects in the gas discharge display panel manufacturing method and the gas discharge display panel firing process, which are unlikely to cause quality defects in the firing process. There is provided a setter and a method for producing such a setter.

In order to achieve the above object, a method of manufacturing a gas discharge display panel according to the present invention comprises the steps of arranging a material of any one of an electrode, a dielectric layer, a partition and a phosphor layer on a substrate, and the substrate having the arrangement And a firing step of loading on the support and conveying the inside of the continuous firing furnace, wherein the support extends from an covered area covered by the substrate to an exposed area not covered by the substrate on an upper surface on which the substrate is loaded. Having an at least one groove formed therein, wherein the area of the non-contact area in which the substrate and the support in the covering area are not in contact with the groove by the groove is 10% or more and 70% or less of the area of the substrate when the stack is made; It is done.

Accordingly, the gas present in the groove portion can move freely over the covering area and the exposure area.

That is, when gas pressure rises in the gap between the substrate and the support, buoyancy is generated in the substrate, whereby the positional displacement of the substrate is likely to occur. Since the gas escapes through the grooves and is discharged, the pressure rise of the gap is reduced to reduce the buoyancy of the substrate.

Therefore, positional shift at the time of baking is suppressed and nonuniform distribution of heat | fever does not arise easily, and the improvement of baking quality is aimed at.

In addition, there may be a plurality of the grooves, and the grooves may be disposed in a dispersed manner.

Accordingly, since the range in which the buoyancy of the substrate is reduced is dispersed, the buoyancy is effectively reduced.

In addition, the support is made of a heat-resistant glass material, the thickness of the support is 5mm or more and 8mm or less, the groove is disposed perpendicular to the conveying direction of the firing furnace, the depth of the groove is 0.05mm or more and 2.0mm. The width of the groove is preferably 5 mm or more and 200 mm or less.

Accordingly, when the heating starts from the leading end in the conveying direction of the support and the temperature rises, since the support has grooves arranged perpendicularly to the conveying direction, the temperature and pressure gradients are increased within the individual grooves. It is hard to occur.

Therefore, no local buoyancy occurs in one groove, and the floating of the substrate is suppressed.

The support is made of a heat-resistant glass material, and the thickness of the support is 5 mm or more and 8 mm or less, the groove is disposed in parallel to the conveying direction of the firing furnace, and the depth of the groove is 0.05 mm or more and 2.0 mm. The width of the groove is preferably 5 mm or more and 200 mm or less.

Accordingly, when heating starts from the leading end in the conveying direction of the support, the gas moves to the rear end having a low pressure, so that heat is conducted in the longitudinal direction of the groove.

In other words, when the conveyance speed of the support is slow, the heat conduction in the conveying direction of the substrate and the support becomes more important than the heat conduction between the substrate and the support (upper and lower), so that at least the entire substrate is located on the surface of the support. By providing a plurality of grooves substantially parallel to the conveying direction, even when gradually heated from the front end of the support, heat is also conducted to the rear end by the gas exiting the rear end, so that the temperature gradient in the conveying direction of the substrate and the support is Generation is suppressed, and generation of nonuniform heat distribution is suppressed.

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Moreover, the support stand which concerns on this invention is a support stand for loading when baking the said board | substrate with the said arrangement | positioning in the process of baking the material arrange | positioned on the board | substrate used as the base of a gas discharge display panel, conveying the inside of a continuous baking furnace, The support has at least one groove formed from an area covered by the substrate to an exposed area not covered by the substrate when the loading is performed on an upper surface on which the substrate is loaded. In this case, the area of the non-contact area where the substrate and the support in the covering area are not in contact with each other by the groove is 10% or more and 70% or less of the area of the substrate.

When the substrate on which the arrangement is made is placed on the support base and fired, the gas present in the portion of the groove can move freely over the covering area and the exposure area.

That is, when gas pressure rises in the clearance gap between the said board | substrate and the said support stand, buoyancy generate | occur | produces in the said board | substrate, and the position shift of the said board | substrate tends to occur easily. Since the gas escapes the grooves and is discharged, the pressure rise of the grooves is reduced, and the buoyancy of the substrate is reduced.

Therefore, since the positional shift at the time of baking is suppressed and a nonuniform heat distribution etc. do not arise easily, baking quality improves.

Moreover, the said groove may be plural and may be arrange | positioned distributed in the said covering area | region.

When the substrate on which the arrangement is made is placed on the support base and fired, a range in which buoyancy generation of the substrate is reduced is dispersed, thereby effectively reducing the generation of buoyancy.

In addition, the support is made of a heat-resistant glass material, the thickness of the support is 5mm or more and 8mm or less, the groove is disposed perpendicular to the conveying direction of the firing furnace, the depth of the groove is 0.05mm or more and 2.0mm. The width of the groove is preferably 5 mm or more and 200 mm or less.

When the substrate on which the arrangement is made is placed on the support and calcining, when the heating starts from the tip of the support in the transport direction and the temperature rises, the support has a groove arranged perpendicularly to the transport direction. As a result, temperature and pressure gradients are less likely to occur inside individual grooves.

Therefore, no local buoyancy occurs in one groove, and the floating of the substrate is suppressed.

The support is made of a heat-resistant glass material, and the thickness of the support is 5 mm or more and 8 mm or less, the groove is disposed in parallel to the conveying direction of the firing furnace, and the depth of the groove is 0.05 mm or more and 2.0 mm. The width of the groove is preferably 5 mm or more and 200 mm or less.

When the substrate on which the arrangement is made is placed on the support base and fired, the gas moves to the rear end where the pressure is low when heating starts from the front end in the conveyance direction of the support, so that heat is conducted in the longitudinal direction of the groove.

In other words, when the conveyance speed of the support is slow, the heat conduction in the conveying direction of the substrate and the support becomes more important than the heat conduction between the substrate and the support (upper and lower), so that at least the entire substrate is located on the surface of the support. By providing a plurality of substantially parallel grooves in the conveying direction, even when gradually heated from the front end of the support, heat is conducted to the rear end by the gas discharged to the rear end, and the temperature gradient in the conveying direction of the substrate and the support is prevented. It is suppressed and generation | occurrence | production of heterogeneous heat distribution is suppressed.

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1 is a schematic view showing an example of a general AC type PDP.

2 is a diagram illustrating a configuration of a plasma display display device.

3 is a view showing a state of the glass substrate and the setter in the firing step.

4 illustrates the movement of a glass substrate positioned on the setter;

5 is a view showing the shape of the setter in the embodiment of the present invention.

6 shows an example of a temperature profile in a firing step.                 

7 shows the effect of the shape of the setter;

8 is a view showing a step of manufacturing a setter in an embodiment of the present invention.

9 is a view showing another modified example of the setter shape in the embodiment of the present invention.

Fig. 10 is a diagram showing another modified example of the setter shape in the embodiment of the present invention.

Fig. 11 is a diagram showing another modified example of the setter shape in the embodiment of the present invention.

12 is a view showing another modified example of the setter shape in the embodiment of the present invention.

Fig. 13 shows another modification of the setter shape in the embodiment of the present invention.

(Configuration)

In the embodiment of the present invention, the PDP is fired by using the setter 200 described later in the firing step, and the structure is the same as that of the general AC PDP 100.

Therefore, hereinafter, the PDP 100 shown in FIG. 1 will be described as a PDP in the embodiment of the present invention.

As shown in FIG. 1, the PDP 100 in the Example of this invention is comprised from the front board 90 and the back board 91 arrange | positioned so that the main surface may mutually oppose.

In Fig. 1, the z direction corresponds to the thickness direction of the PDP, and the xy plane corresponds to a plane parallel to the PDP plane.

The front plate 90 includes a front glass substrate 101, a display electrode 102, a dielectric layer 106, and a protective layer 107.

The front glass substrate 101 is a material on which the front plate 90 is formed, and a display electrode 102 is formed on the front glass substrate 101.

The display electrode 102 includes a transparent electrode 103, a black electrode film 104, and a bus electrode 105.

The transparent electrode 103 is formed by forming a plurality of conductive metal oxides such as ITO, SnO ₂ and ZnO in a columnar shape on one surface of the front glass substrate 101 with the x direction as the longitudinal direction.

The black electrode film 104 is formed by laminating a material mainly composed of ruthenium oxide on the transparent electrode 103 and laminating it on the transparent electrode 103 with a width smaller than that of the transparent electrode 103.

The bus electrode 105 is formed by stacking a conductive material containing Ag on the black electrode film 104.

The dielectric layer 106 is a layer made of a dielectric material covering the entire surface on which the display electrode 102 of the front glass substrate 101 is formed. Generally, lead-based low melting glass is used, but bismuth-based low melting glass or lead-based low You may form from a laminated body of melting point glass and bismuth type low melting point glass.

The protective layer 107 is a thin layer made of magnesium oxide (MgO) and covers the entire surface of the dielectric layer 106.

The back plate 91 is a phosphor laminated on a wall surface of a partition groove formed by a gap between the rear glass substrate 111, the address electrode 112, the dielectric layer 113, the partition wall 114, and the adjacent partition wall 114. Layer 115.

The back glass substrate 111 is a material on which the back plate 91 is formed, and an address electrode 112 is formed on the back glass substrate 111.

The address electrode 112 is a metal electrode (for example, a silver electrode or a Cr-Cu-Cr electrode), and a conductive material containing Ag is opened on one surface of the rear glass substrate 111 with the y direction as the longitudinal direction. It is formed in plurality in shape.

The dielectric layer 113 is a layer made of a dielectric material formed to cover the entire surface of the rear glass substrate 111 on the side where the address electrode 112 is formed. In general, although the lead-based low melting glass is used, the bismuth-based low melting point is used. You may form with a laminated body of glass or lead type low melting glass, and bismuth type low melting glass.

In addition, on the dielectric layer 113, partition walls 114 are formed at intervals between adjacent address electrodes 112.

The phosphor layer 115 corresponding to any one of RGB (Red, Green, Blue) is formed on the wall surface of the partition groove formed by the gap between the adjacent partition walls 114.

More specifically, the phosphor layer 115 has three types that emit light of different wavelengths of red, green, and blue by the discharged ultraviolet rays. The phosphor layer 115 has a red, green, and blue phosphor order on the inner wall of the partition groove. It is repeatedly applied.

As shown in FIG. 1, the front plate 90 and the back plate 91 are sealed in an overlapping state, and a discharge space 116 is formed therein.

In the discharge space 116, the discharge gas (sealing gas) which consists of rare gas components, such as He, Xe, Ne, is sealed by the pressure of about 500-600 Torr (66.5-79.8 kPa).

An area where a pair of neighboring display electrodes 102 and one address electrode 112 intersect with the discharge space 116 between them becomes a cell that contributes to image display.

As shown in Fig. 2, the plasma display display device 220 is constituted by the PDP 100 and the panel driver 119. In the plasma display device, the X electrode and the address electrode ( After a voltage is applied between 112 to perform address discharge, a sustain voltage is generated by applying a pulse voltage to a set of two adjacent display electrodes 102.

Ultraviolet rays (about 147 nm in wavelength) are generated by this sustain discharge, and the generated ultraviolet rays collide with the phosphor layer 115, so that the ultraviolet rays are converted into visible light, and the cells are lit to display an image.

(Production method of PDP)

As described above, the PDP 100 is produced by overlapping and sealing the front plate 90 and the back plate 91 and filling the discharge gas.

Hereinafter, the manufacturing method of the front plate 90 is demonstrated.

In the manufacturing method of the gas discharge display panel of the present invention, ITO (Indium) having a thickness of about 1400 kPa on the surface of the front glass substrate 101 made of soda glass having a thickness of about 2.8 mm, using known techniques such as vapor deposition or sputtering. The transparent electrode 103 is formed by generating a plurality of rows of conductor materials such as tin oxide or SnO ₂ in parallel.

In addition, using a known technique such as screen printing or photolithography, the precursor of the black electrode film 104 containing ruthenium oxide as a main component over the transparent electrode 103 and the front glass substrate 101 (hereinafter, " A precursor of the bus electrode 105 made of Ag and a black electrode film precursor 104a (hereinafter referred to as "bus electrode precursor 105a") is formed.

The above is the same as the manufacturing method of the conventional gas discharge display panel.

The front electrode glass substrate 101 on which the black electrode film precursor 104a and the bus electrode precursor 105a are formed is mounted on the setter 200 and, for example, the black electrode is baked by a profile having a peak temperature set to 590 ° C. The film precursor 104a and the bus electrode precursor 105a are sintered to form the black electrode film 104 and the bus electrode 105.

The black electrode film 104 and the bus electrode 105 together with the transparent electrode 103 already formed form the display electrode 102.

Then, the precursor of the dielectric layer 106 (hereinafter referred to as "dielectric layer precursor 106a") by a known technique such as a printing method on the surface of the front glass substrate 101 on which the black electrode film 104 and the bus electrode 105 are formed. Is formed), and the front glass substrate 101 is loaded on the setter 200 to be fired.

As a result, the dielectric layer precursor 106a is sintered, and the dielectric layer 106 is formed.

The protective layer 107 is formed thereon by a known technique such as sputtering.

As described above, the method of manufacturing the gas discharge display panel according to the present invention is not the conventional setter 120 having a flat surface at the time of firing, but the front glass substrate (using the setter 200 having grooves formed on the surface). 101) and the glass substrate 111 is different from the conventional one in that it is fired.

Similarly to the firing in the manufacture of the front plate 90, the setter 200 described above can be used also in the firing in the production of the back plate 91.

Hereinafter, the manufacturing method of the back plate 91 is demonstrated.

In the method for manufacturing a gas discharge display panel according to the present invention, a conductive material mainly composed of Ag is formed at regular intervals on the surface of the back glass substrate 111 made of soda glass having a thickness of about 2.6 mm by screen printing. By applying the stripe shape, the back glass substrate 111 on which the precursor of the address electrode 112 (hereinafter referred to as the “address electrode precursor 112a”) having a thickness of about 5 to 10 μm is formed is mounted on the setter 200. Firing is carried out.

As a result, the address electrode precursor 112a is sintered and the address electrode 112 is formed.

In order to produce a 40-inch high-definition television, the distance between two neighboring address electrodes 112 is set to about 0.2 mm or less.

Subsequently, a paste of lead-based glass is applied over the entire surface of the rear glass substrate 111 on which the address electrode 112 is formed, and the rear glass substrate 111 is placed on the setter 200 to be fired. The dielectric layer 113 having a thickness of about 20 to 30 mu m is formed.

In addition, by using a coating film method by die coating, a paste-like partition material containing lead-based glass as a main component and alumina powder added as an aggregate is formed on the dielectric layer 113 to form a sandblaster. A precursor of the partition wall 114 (hereinafter referred to as "bulb precursor 114a") is formed by removing only an area except a region having a desired shape using the test method, and by firing the partition precursor 114a, the height is approximately 100. The partition wall 114 of -150 micrometers is formed.

In this case, the back glass substrate 111 on which the barrier precursor 114a is formed is loaded on the setter 200 to perform the baking.

In addition, the space | interval of the partition 114 is about 0.36 mm, for example.

Subsequently, any one of red (R) phosphor, green (G) phosphor, and blue (B) phosphor is placed on the surface of the dielectric layer 113 exposed between the wall surface of the partition wall 114 and the adjacent partition wall 114. Phosphor containing ink is applied.

Thereafter, baking is performed after the phosphor ink is dried, and phosphor layers 115 of respective colors are formed.

At this time, the back glass substrate 111 coated with the phosphor ink is loaded on the setter 200, and the baking is performed.

In addition, as the phosphor material constituting the phosphor layer 115, here,

Red phosphor: (Y _X Gd _1-X ) BO ₃ : Eu

Green phosphor: Zn ₂ SiO ₄ : Mn

Blue phosphor: BaMgAl ₁₀ O ₁₇ : Eu ³⁺

Shall be used.

As each phosphor material, for example, a powder having an average particle diameter of about 3 mu m is used.

For application of the phosphor ink, for example, the phosphor ink is discharged from a very thin nozzle.

After applying the phosphor ink, the phosphor layer 115 is formed by baking the profile at a maximum temperature of about 520 ° C. for 2 hours.

After the front plate 90 and the back plate 91 are manufactured as described above, the front plate 90 and the back plate 91 are joined and sealed by using a known PDP manufacturing technique, and the impurity gas therein is Exhaust and discharge gas is filled to complete the PDP 100.

The manufacturing method of the gas discharge display panel of this invention relates to the baking process at the time of manufacture of the front plate 90 and the back plate 91, Comprising: The manufacturing method after joining the front plate 90 and the back plate 91. Detailed description will be omitted.

(Specification of the setter)

Here, the above-described setter 200 used in the firing step will be described in detail.

5 is a schematic diagram of a setter 200 in an embodiment of the present invention.

The setter 200 is a support for supporting the glass substrate and conveying it in a continuous firing furnace when firing an object to be fired, such as the dielectric layer precursor 106a, on the front glass substrate 101 and the rear glass substrate 111.

This setter 200 is used repeatedly in a profile in which the peak temperature is set to 590 ° C in the firing step, for example, as shown in FIG. 6, and has high heat fatigue resistance, for example, Neoceram N−. It consists of transparent heat-resistant glass materials, such as 0 or N-11 (brand name of Nippon Electric Glass).

The thickness of the setter 200 depends on the size of the glass substrate to be loaded, but is about 5 to 8 mm.

The outer size of the setter 200 varies depending on the size of the glass substrate to be loaded, but at least the size of the glass substrate exceeds the outer dimensions of all.

In addition, as shown in FIG. 5, the setter 200 has a plurality of grooves, that is, grooves 250 and grooves 251 arranged perpendicularly to the conveying direction.

The groove shapes of the grooves 250 and 251 are the same, for example, the width W of the groove is 70 mm, the depth of the groove is 2 mm, and the distance d between the groove and the groove is 400 mm.

The grooves 250 and 251 are formed from the area on which the front glass substrate 101 is loaded to extend beyond the area when the glass substrate is loaded on the setter 200.

Therefore, the groove 250 is covered with a glass substrate as shown in FIG.
The groove portion 250a is divided into a groove portion 250b not covered by the glass substrate and a groove portion 250c, and the groove 251 is a groove portion 251a covered by the glass substrate and a groove portion 251b and the groove portion 251c not covered by the glass substrate. Are distinguished.

Here, the reason for using the setter 200 which consists of a heat resistant glass material which has the groove mentioned above in a baking process is demonstrated.

(Effect of surface shape of setter 200)

The surface of the setter is not a mirror surface state, but bent or waved (undulation), and there is a minute gap between the glass substrate and the setter 120.

The so-called positional shift, which causes the front glass substrate 101 or the rear glass substrate 111 located at the normal position of the setter 120 to move from the normal position during firing at room temperature, is caused by the fact that the temperature in the firing process As it rises, convection occurs in the gas present in the above-mentioned gap, and the pressure inside the above-mentioned gap rises, and the gas layer as shown in FIG. 4 between the front glass substrate 101 and the setter 120 rises. Is formed, and it is thought that the glass substrate floats on the order of tens to hundreds of micrometers.

The convection of this gas is thought to be caused by the temperature difference between the glass substrate and the setter due to the difference in physical properties such as heat capacity and thermal conductivity between the glass substrate and the setter. Is thought to grow even larger.

In the setter 200 according to the exemplary embodiment of the present invention, since the grooves 250 and the grooves 251 are formed as described above, as shown in FIG. 7, even if gas is generated between the front glass substrate 101 and the setter 120. Since the gas is discharged along the groove portion 250a and the groove portion 251a into the groove portion 250b, the groove portion 250c, the groove portion 251b and the groove portion 250c, the buoyancy is reduced and it is difficult to generate the buoyancy enough to float the glass substrate. The above positional shift is unlikely to occur.

In addition, since the setter 200 in the embodiment of the present invention has a groove disposed perpendicularly to the conveying direction, when the heating starts from the distal end of the setter 200 in the conveying direction and the temperature rises, the setter 200 is individually Since the temperature and pressure gradients are less likely to occur in the grooves of the grooves, local buoyancy does not occur in one groove, and the glass substrate is less likely to float.

In addition, since the conveying direction of the setter generally coincides with the longitudinal direction of the glass substrate, the groove 250 and the groove 251 are arranged in a direction substantially orthogonal to the longitudinal direction of the glass substrate, so that the groove portion 250a covered by the glass substrate and The area of the groove portion 251a can be made smaller than in any other direction.

As a result, the volume of the gas present in the gap between the groove portion 250a and the groove portion 251a is also reduced, and the relaxation time of the pressure rise due to the release of the gas is also shortened. This is advantageous when the 200 is suddenly overheated.

By preventing the occurrence of the misalignment described above, the firing object disposed on the glass substrate can be baked at a more uniform temperature, and the firing quality can be improved.

(Effect of Material of Setter 200)

However, since the setter 200 has a groove on the surface on which the glass substrate is loaded, the area where the setter 200 does not contact the setter on the glass substrate may be smaller than the setter 120 having no groove at all. That is, since the area of the groove portion 250a and the groove portion 251a becomes large, the thermal conductivity performance between the setter 200 and the glass substrate decreases.

In general, the smaller the temperature difference between the setter and the glass substrate is, the more it is necessary to secure the thermal conductivity to a certain extent. Therefore, when the groove is formed in a setter made of a material having a low emissivity such as metal, the width of the groove and the There is a limit to increasing the depth.

On the other hand, since the setter 200 in the embodiment of the present invention is made of a transparent heat-resistant glass material, the width of the groove and the depth of the groove are larger than those of the metallic setter in that the setter 200 can contribute significantly to thermal conduction as well as heat conduction. It is considered that this can be done, and it is considered that the degree of freedom in designing the setter in the embodiment of the present invention is increased.

In addition, the materials of the glass substrate and the setter are not the same, but are made of the same glass material, and thus the physical properties such as specific heat, coefficient of thermal expansion, and thermal conductivity are similar.

For this reason, it is hard to produce the temperature difference between a glass substrate and a setter, and it is considered that it contributes to suppressing generation | occurrence | production of the said convection.

(Specific specifications of the groove)

In the setter 200, which is a heat-resistant glass material, in the experience, even if the groove depth from 5mm to 200mm deep groove depth to about 2.00mm does not cause a problem that the heat is unevenly distributed during firing.

On the other hand, with regard to the lower limit of the depth of the grooves, whether or not the gas can escape to such an extent that the buoyancy such that the above-described positional shift occurs does not occur is a problem, but it is also affected by the warpage or wave shape value of the surface of the glass substrate. It is considered that, in experience, it is not effective as a gas passage unless the groove depth is at least 0.05 mm or more.

In addition, when the ratio of the groove in the range where the glass substrate is located, that is, the area ratio of the groove portion 250a and the groove portion 251a is small, the contact area between the glass substrate and the setter 200 becomes large, and the In some cases, convection creates a buoyancy enough to float a glass substrate.

On the contrary, when the above-mentioned ratio is too large, the contact area may be small and not reliably supported.                 

In order to prevent such a defect from occurring, the ratio of the groove in the above range is preferably 10% or more and 70% or less.

Needless to say, the contact means a range excluding the range of the groove portion 250a and the groove portion 251a from the range in which the glass substrate (in this case, the front glass substrate 101) in the top view of FIG. 5 is located. .

In addition, the position where the groove is formed in the setter 200 is preferably formed over the entire range in which the glass substrate is loaded.

That is, it is preferable to disperse the range of reduction of buoyancy due to convection of gas so as not to generate a large buoyancy locally.

In this regard, the grooves 250 and 251 are disposed so as to be substantially symmetrical with respect to the center point of the setter 200, respectively.

(Manufacturing method of setter)

Hereinafter, an example of the manufacturing method of the setter 200 used at the baking process in manufacture of the front plate 90 and the back plate 91 is demonstrated.

8 is a diagram illustrating a manufacturing process of the setter 200.

FIG. 8A is a first step (photosensitive resist film forming step), and in this step, for example, a plate shape having a length of 1280 mm, a width of 800 mm, and a thickness of 5 mm, neoserum N-0 or N-11 (Nihon Denki) A photosensitive resist having a thickness of 50 μm on a transparent heat resistant glass 201 such as a glass product) under a condition of a roll temperature of 80 ° C., a linear pressure of 4 kg / cm 2, and a substrate transfer speed of 1 m / min. A film 210 (hereinafter referred to as DFR) 210 is laminated.                 

FIG. 8B is a second step (exposure and development step), in which a negative photo pattern is patterned in such a shape so as to provide two parallel grooves having a width of 70 mm at intervals of 400 mm. Ultraviolet light (UV light) is irradiated with an ultra-high pressure mercury lamp of 15 mW / cm 2 output using a mask, so that the exposed portion 211 and the non-exposed portion 212 are formed.

The exposure amount at this time makes exposure amount 70OmJ, for example.

For example, after image development is performed by the developing solution of 1% sodium carbonate aqueous solution, the non-exposure part 212 is removed by washing with water.

As a result, as shown in FIG. 8C, a stripe groove is formed in the DFR 210.

FIG. 8D is a third step (blast processing step), in which sandblasting is performed on the side where the DFR 210 is formed after groove formation.

More specifically, the abrasive 230 such as a glass bead material is injected from the blast nozzle 229 onto the heat resistant glass 201 under conditions of an air flow rate of 1500 NL / min and an abrasive supply amount of 1500 g / min. The heat resistant glass 201 is blasted to form grooves.

In addition, the blast processing time is adjusted so that the depth of the recessed part of the heat resistant glass 201 may be set to about 2 mm.

FIG. 8E is a fourth step (peeling process of the photosensitive resist film), in which the DFR 210 is formed by depositing the heat resistant glass 201 in a 5% sodium hydroxide aqueous solution as a stripping solution. Peel off.

Accordingly, the setter 200 having a predetermined groove, that is, the groove 250 and the groove 251 can be obtained.

As described above, according to the present embodiment, in the firing step of the gas discharge display panel, the glass substrate is moved on the setter by firing while the glass substrate is placed on the setter 200 in the embodiment of the present invention. That is, position shift can be prevented.

In addition, although the width W of the groove of the setter 200 in the embodiment of the present invention is 70 mm, it is not limited to the width of the groove as long as the area of the groove of the setter can be secured so as not to float the glass substrate. The width of the grooves of different values may be used.

In addition, although the depth of the groove of the setter 200 in the embodiment of the present invention is 2 mm and the distance d between the groove and the groove is 400 mm, it is not limited to this value, and the firing object on the glass substrate is You may change within the range which does not cause a baking defect.

In addition, although the material of the setter 200 in the Example of this invention was made into the heat resistant glass material, you may consist of the material which has a metal as a main component, the material which has a metal oxide as a main component, or a ceramic.

In such a case, it is necessary to reconstruct the groove shape of the setter so that the prescribed firing quality can be ensured and no displacement occurs.

The setter 200 in this embodiment has a shape in which two grooves are arranged in parallel on the flat plate. However, the number of the grooves may not be limited to two, and the number may be more.

In addition, although the setter 200 in this embodiment has a plurality of grooves arranged perpendicularly to the conveying direction, the setter 200 is not limited to this, and has a plurality of grooves arranged substantially parallel to the conveying direction, for example. You may also

In that case, when heating starts from the front end of the setter 200 in the conveying direction, the gas moves to the rear end with low pressure, so that heat is conducted in the longitudinal direction of the groove.

Originally, the grooves formed on the setter act in the direction of inhibiting heat conduction between the glass substrate and the setter. However, when the conveying speed of the setter is slow, the grooves on the glass substrate and the setter are larger than those of the glass substrate and the setter (upper and lower). The heat conduction in the conveying direction of the gas is also important, so that a plurality of grooves substantially parallel to the conveying direction are provided over the entire range where at least the glass substrate on the setter surface is located, so that even when gradually heated from the front end of the setter to the rear end portion, Heat can also be conducted to the rear end by the gas that escapes, thereby suppressing the occurrence of a temperature gradient in the conveyance direction of the glass substrate and the setter, thereby preventing the problem of uneven distribution of heat.

In addition, the setter 200 in this embodiment has a shape in which two grooves are arranged in parallel on the flat plate, but is not limited to this groove shape, and the gas existing between the setter and the glass substrate can be discharged to the outside. As long as the groove | channel is present, as shown in FIG. 9, the setter 300 with the groove | channel 350 of a cross may be sufficient.

In that case, when the glass substrate is loaded on the setter 300, the groove 350 includes the groove portion 350a covered by the glass substrate, the groove portion 350b not covered by the glass substrate, and the groove portion 350c. And a groove portion 350d and a groove portion 350e.

In addition, as described above, as another modification of the setter, as shown in FIG. 10, the setter 400 having the groove 450 disposed on the diagonal of the setter may be used.                 

In this case, when the glass substrate is loaded on the setter 400, the groove 450 includes a groove portion 450a covered by the glass substrate, a groove portion 450b not covered by the glass substrate, and a groove portion 450c. And a groove portion 450d and a groove portion 450e.

As shown in FIG. 11, the setter 500 having a lattice groove 550 may be used.

In this case, when the glass substrate is loaded on the setter 500, the groove 550 includes the groove portion 550a covered by the glass substrate, the groove portion 550b not covered by the glass substrate, and the groove portion 550c. And a groove portion 550d and a groove portion 550e.

As another modification of the setter, as shown in FIG. 12, the setter 600 having one groove 650 may be used.

In this case, when the glass substrate is loaded on the setter 600, the groove 650 includes a groove portion 650a covered by the glass substrate, a groove portion 650b not covered by the glass substrate, and a groove portion 650c. Has

In addition, the setter 200 according to the present embodiment is provided with a groove on a plane (hereinafter referred to as a "loading surface") on which the glass substrate of the setter 200 is mounted. Instead, as shown in FIG. 13, the setter 700 may have a plurality of through holes 750 penetrating from the mounting surface in the range where the glass substrate is located to the rear surface thereof.

In this case, even if a part of the lower surface is closed by a hearth roller 130 or the like, it is essential that the gas is discharged to such an extent that the glass substrate will not be injured by the through holes existing in other parts.

In the present embodiment, the groove of the setter 200 of the present invention is produced by the sandblasting method, but the groove is not limited to this method. For example, the glass surface is dissolved using an aqueous hydrofluoric acid solution. It may be produced by a chemical etching method, or may be prepared by laminating a material in a region excluding a region where a groove should be arranged on the glass surface by providing a convex portion by a thermal spraying method or the like.

The present invention is applicable to the manufacture of gas discharge display panels such as plasma display panels used in televisions and computer monitors.

Claims (24)

Placing the material of any one of an electrode, a dielectric layer, a partition and a phosphor layer on a substrate; And a firing step of loading the substrate on which the arrangement is made on a support table and firing while conveying the inside of the continuous firing furnace, The support has at least one groove formed over an exposed area not covered by the substrate from a covered area covered by the substrate on an upper surface on which the substrate is loaded, and when the loading is made, And an area of the non-contact area in which the substrate and the support are not in contact with the groove is 10% or more and 70% or less of the area of the substrate. The method of claim 1, And a plurality of the grooves, and are arranged in a dispersing area in the covering area. The method of claim 1, The support is made of a heat-resistant glass material, The thickness of the said support stand is 5 mm or more and 8 mm or less, The groove is disposed perpendicular to the conveying direction of the firing furnace, The depth of the groove is 0.05mm or more and 2.0mm or less, and the width of the groove is 5mm or more and 200mm or less. The method of claim 1, The support is made of a heat-resistant glass material, The thickness of the said support stand is 5 mm or more and 8 mm or less, The groove is arranged in parallel with the conveying direction of the firing furnace, The depth of the groove is 0.05mm or more and 2.0mm or less, and the width of the groove is 5mm or more and 200mm or less. delete delete delete delete delete In the step of firing the material disposed on the substrate serving as the base of the gas discharge display panel, the substrate on which the arrangement has been carried out is supported as a support for loading when firing while transporting the inside of the continuous firing furnace. The support has at least one groove formed from an area covered by the substrate to an exposed area not covered by the substrate when the loading is performed on an upper surface on which the substrate is loaded. And wherein the area of the non-contact area in which the substrate and the support in the covering area are not in contact with each other by the groove is 10% or more and 70% or less of the area of the substrate. The method of claim 10, A plurality of the grooves, the support of the gas discharge panel substrate, characterized in that arranged in the covering area. The method of claim 10, The support is made of a heat-resistant glass material, The thickness of the said support stand is 5 mm or more and 8 mm or less, The groove is disposed perpendicular to the conveying direction of the firing furnace, The depth of the groove is 0.05 mm or more and 2.0 mm or less, and the width of the groove is 5 mm or more and 200 mm or less. The method of claim 10, The support is made of a heat-resistant glass material, The thickness of the said support stand is 5 mm or more and 8 mm or less, The groove is arranged in parallel with the conveying direction of the firing furnace, The depth of the groove is 0.05 mm or more and 2.0 mm or less, and the width of the groove is 5 mm or more and 200 mm or less. delete delete delete delete delete delete delete delete delete delete delete

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