JP2000304458A - Baking setter and method for baking - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten a baking time as short as possible and to reduce energy consumption and improve productivity by providing a penetrated opening. SOLUTION: A baking setter 110 is used for a baking treatment for baking a working raw material of a treating base plate while substantially horizontally conveying a back surface (treating base plate) for a PDP having the raw material made of a low melting point glass paste for forming a barrier. Circular shape penetrating pores 115 are uniformly provided in an overall surface of a treating base plate placing area 118 in the setter made of heat-resisting glass for placing the PDP treating base plate (a). The pores 115 are disposed at vertexes of regular triangles for disposing central positions of respective circles on the surface of the plate without gap (b).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a baking process for baking a processing material, and more particularly to a baking process for a processing material of a substrate for a plasma display.

[0002]

2. Description of the Related Art In recent years, plasma display panels (hereinafter, also referred to as PDPs) have been used in various display devices because of their small depth, light weight, clear display, and wide viewing angle compared to liquid crystal panels. It is being used.
Generally, a plasma display panel (PDP) has two
A pair of regularly arranged electrodes are provided on a pair of opposed glass substrates, and a gas mainly containing neon, xenon, or the like is sealed between the pair of electrodes. Then, a voltage is applied between these electrodes, and a discharge is generated in minute cells around the electrodes, so that each cell emits light and display is performed. In particular, in order to display information, regularly arranged cells are selectively discharged to emit light.

Here, the configuration of the PDP is shown in FIG.
An example of the type PDP will be described. FIG. 7 is a perspective view of the PDP structure, but shows a front plate (glass substrate 710) and a rear plate (glass substrate 720) apart from the actual case for easy understanding. As shown in FIG. 7, two glass substrates 710 and 720 are arranged in parallel and opposed to each other, and both are provided on a glass substrate 720 serving as a back plate in parallel with each other (cell barrier). 730)
Are held at regular intervals. On the back side of the glass substrate 710 serving as a front plate, composite electrodes composed of a transparent electrode 740 serving as a discharge sustaining electrode and a metal electrode 750 serving as a bus electrode are formed in parallel with each other.
A dielectric layer 760 is formed, and a protective layer (MgO layer) 770 is further formed thereon. In addition, on the front side of a glass substrate 720 serving as a back plate, an address electrode 780 is positioned between barriers 730 so as to be orthogonal to the composite electrode.
Are formed in parallel with each other, and a fluorescent surface 790 is provided so as to cover the wall surface of the barrier 730 and the cell bottom surface. The barrier 730 is for defining a discharge space, and each partitioned discharge space is called a cell or a unit light emitting region.
This AC type PDP is a surface discharge type, and has a structure in which an AC voltage is applied between composite electrodes on the front panel to cause discharge. In this case, since the alternating current is applied, the direction of the electric field changes according to the frequency. The fluorescent material 790 emits light by the ultraviolet light generated by the discharge, and the light transmitted through the front plate can be visually recognized by an observer. In addition, DC type PDP
In the above, the electrode is different from the AC type in that the electrode has a structure not coated with the dielectric layer, but the discharge effect is the same. 7 has a structure in which an underlayer 767 is provided on one surface of a glass substrate 720 and a dielectric layer 765 is provided thereon, but the underlayer 767 and the dielectric layer 765 are not provided.
Is not necessarily required.

An AC type plasma display (PDP) has been manufactured, for example, as shown in FIG. FIG. 6 shows an AC type PDP manufacturing process, in which a back plate and a front plate are manufactured in separate steps, respectively, and a PDP is assembled using both. First,
The manufacturing process of the back plate will be described. Note that S51 to S74 represent processing steps. First, prepare a glass substrate (S
51) An electrode wiring paste is applied on one surface of a glass substrate, dried, and processed into a predetermined shape through a plate making process, or the electrode wiring paste is formed on a glass substrate by a thick film printing method. Then, it is baked to form an electrode wiring. (S52) Next, a dielectric layer is formed on the entire surface of the formed electrode so as to cover the glass substrate surface. (S53) Next, a barrier (also called a barrier rib) is formed on the dielectric layer of the glass substrate by a printing method or a sandblast method. (S54) In the case of the printing method, a paste for forming a barrier (barrier rib) is printed in a predetermined pattern on a glass substrate by a thick film printing method,
This is dried. The thickness of the barrier is large (for example, 100 to 2).
(Thickness of 00 μm) Since this film thickness cannot be obtained by one thick film printing, printing and drying of the barrier forming paste are performed a plurality of times. After a predetermined film thickness is obtained, the paste is fired. In the case of the sand blast method, a barrier forming material is applied on a glass substrate, and a predetermined resist pattern is further formed thereon. This is fired to form a barrier. Further, a paste for a phosphor (for example, a paste for a phosphor containing indium oxide) is printed in a predetermined pattern on the substrate on which the barrier is formed by a thick film printing method, and then dried and fired (S55). Form a face plate. (S56)

Next, a process for manufacturing the front plate will be described. First, a glass substrate is prepared (S61), and a deposition layer of, for example, ITO (Indium Tin Oxide) is patterned on the glass substrate. (S62) The patterning is performed by a normal photolithography process (lithography technology). Next, three layers of Cr-Cu-Cr (chromium, copper, chromium) are formed by vapor deposition or sputtering, and a photolithography process (lithography technology) is performed similarly.
To form an electrode wiring for discharge together with the patterned ITO film. (S63) Next, a transparent dielectric layer is formed by solid printing of paste-like low melting point glass (S64), and a front plate is obtained. (S65)

Next, a PDP is manufactured using the back plate and the front plate thus obtained as follows. First, the front plate and the back plate are aligned, and in that state, lead glass for sealing is applied to the edges of both substrates, and then sealing is performed. (S71) Next, after the inside of the gap surrounded by both substrates (the back plate and the front plate) and the seal portion is exhausted through the exhaust pipe, the discharge gas is sealed in the above-mentioned gap through the exhaust pipe. . (S72) Thereafter, the exhaust pipe is burned off (chip off), and a driver IC is mounted (S73), whereby a PDP (plasma display panel) is obtained. (S74) As described above, the back plate and the front plate used for the production of the PDP are subjected to various processes to form an electrode wiring portion, a barrier portion, a phosphor portion, a dielectric layer portion, and the like. In addition, it becomes a PDP.

In the production of such a PDP, formation of an electrode wiring portion, formation of a barrier, and the like have recently been performed by sandblasting in terms of productivity, quality, and the like. In this sandblasting process, a processing material composed of a low-melting glass paste for forming an electrode wiring portion and a barrier is applied onto a glass substrate, respectively, and a predetermined resist pattern is formed thereon. Processing the barrier forming material into a shape corresponding to the spray resist pattern,
This is fired to form an electrode wiring portion and a barrier, respectively. The firing treatment referred to here means that after a processing material made of a low-melting glass paste is formed on a glass substrate, the processing material is kept at a keeping temperature for firing, for a predetermined time, and then gradually cooled to a strain point of the glass substrate. In addition, the glass substrate is further cooled to room temperature, and also controls expansion and contraction of the glass substrate itself in each processing. The peak temperature of the baking treatment is usually a temperature for sintering the working material, and is maintained at this peak temperature for a predetermined time, and is also referred to as a keep temperature. Further, the strain point of the glass substrate is a temperature at which there is no possibility of generating any new permanent strain due to the rapid cooling, no matter how rapid cooling is performed from this temperature. Also,
Usually, the conductive paste for forming the electrode wiring is made of fine metal particles (for example, Ag), a low-melting glass frit, a resin, and a solvent. The paste for forming the dielectric layer is made of a low-melting glass frit, a resin, and a solvent. If necessary, fillers, pigments and the like are added. Further, the paste for forming the barrier is made of a low melting point glass frit, a filler (alumina, zirconia, etc.), a pigment, a resin, and a solvent. These pastes are generally referred to as low-melting glass or low-melting glass paste because they contain, as a main component, a low-melting glass frit for flowing and fixing in a firing process.

[0008] Such a baking treatment is performed in order to raise the temperature of the PDP so as to bend (thermally deform) in the production of the PDP and to perform baking. Therefore, as a method of transporting the processing substrate,
Normally, as shown in FIG. 5A, a method is adopted in which a processing substrate 520 is placed on a heat-resistant glass substrate called a setter 510 and transported in a firing furnace 540 by a roller type conveyor. FIG. 5B is a view from the C0 side of FIG. 5A, and in FIG. 5, reference numeral 530 is a transport roller. Conventionally, as shown in FIG. 5B, the setter 510 is solid and has no opening. As the setter 510, Neoceram N-0 (a crystallized glass substrate manufactured by Nippon Electric Glass) having a thickness of about 5 mm is generally used, but ceramics or the like can be used in other cases. However, in the case of this method, since the setter 510 is thicker than the processing substrate 520 (typically about 2-3 mm thick) and has a large heat capacity, it takes time to obtain a predetermined firing temperature (the above-mentioned keep temperature). This has been sought, as it takes too much time for cooling. That is, in the formation of the back plate of the PDP, since the firing process is performed a plurality of times, if the heat capacity of the setter is large, the loss of heat energy and the decrease in productivity due to this become large, and this measure is required. I was

[0009]

Under these circumstances, in recent years, PDPs have been required to be large, high quality, and mass-produced. Was sought. The present invention responds to this problem. Specifically, it is intended to provide a method capable of shortening the baking time as much as possible, and contributing to energy saving and productivity improvement in manufacturing a back plate and a front plate for a PDP. It is.

[0010]

A baking processing setter according to the present invention mounts a processing substrate used in a baking process for baking a processing material of a processing substrate while transporting a processing substrate for a plasma display. For sintering processing for providing a through-hole. In the above, the penetrating opening is characterized in that it is provided uniformly over at least the entire surface of the processing substrate mounting region, and the penetrating opening is circular. is there. In the above, the center position of each circle of the circular opening is located at each vertex of an equilateral triangle that can be arranged on the surface of the processing substrate without any gap. The ratio occupied by the penetrating circular opening is 10% in the processing substrate mounting area.
６０60%.

The sintering method according to the present invention is characterized in that a material for processing a substrate to be processed is baked using the sintering setter according to the present invention.

[0012]

The firing setter according to the present invention has a structure as described above, whereby the baking time can be reduced as much as possible in the production of the back plate and the front plate for the PDP, and the energy can be saved and the productivity can be improved. It is possible to provide. That is, by providing an opening penetrating the setter, the heat capacity of the setter is reduced, and as a result, heating and cooling of the processing substrate are facilitated. Specifically, it is a baking process setter for mounting a processing substrate, which is used in a baking process for baking a processing material of a processing substrate while transporting a processing substrate for a plasma display. By providing the portion, further, the opening that penetrates,
This is achieved by being provided uniformly over at least the entire surface of the processing substrate mounting area. And since the penetrating opening has a circular shape, the strength of the setter regardless of the direction of the opening can be easily secured,
In particular, the opening is circular, and the center position of each circle of the opening is
Each of them is located at each vertex of an equilateral triangle that can be arranged on the surface of the processing substrate without any gap, so that uniform strength can be obtained over the entire processing substrate mounting area of the setter. In this case, it is preferable that the ratio of the opening of the entire penetrating opening to the processing substrate mounting area is 60% or less in terms of quality and strength, and at least 10% in terms of energy saving and productivity improvement.
It is preferable that it is above.

The sintering method of the present invention having such a structure enables energy saving and improvement in productivity in manufacturing a back plate and a front plate for a PDP.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A sintering setter according to the present invention will be described by way of an embodiment. FIG. 1A is a plan view of an example of an embodiment of a baking treatment setter according to the present invention, and FIG. 1B is an enlarged view of a portion A0 in FIG.
FIG. 2 is a view for explaining the mounting of the processing substrate on the setter and the separation of the processing substrate from the setter when the setter shown in FIG. 1 is used, and FIG. 3 is a view showing B1-B2 of FIG. 4 (a) and 4 (b) are cross-sectional views of FIG.
It is a top view of the example of another setter for baking processing, respectively. 1 to 3, 110 is a setter, 111 is a glass part, 115 and 115A are openings, 118 is a processing substrate mounting area, 120 is a processing substrate, 150 is a transport roller, 16
Reference numeral 0 denotes a processing substrate lifting pin, 170 denotes a robot hand, and 175 denotes a suction unit.

The baking setter 110 of the embodiment shown in FIG.
Is applied to a baking process for baking the processing material of the processing substrate while transporting the back plate (processing substrate) for the PDP provided with the processing material made of the low melting point glass paste for forming the barrier substantially horizontally. A baking setter made of heat-resistant glass for mounting a back plate (processing substrate) for PDP to be used. A circular through-hole 115 is provided uniformly over the entire processing substrate mounting area 118. ing. As shown in FIG. 1A, the processing substrate mounting area 1
18, a circular penetrating opening 115 is provided uniformly over the entire surface. Each circular opening 1 in FIG.
15 indicates the center position of each circle as shown in FIG.
Each is located at each vertex of an equilateral triangle that can be arranged on the surface of the processing substrate without gaps. This allows
The circular openings 115 are uniformly arranged over the entire surface of the processing substrate mounting area 118, and the distance between the circles is increased, so that the setter strength is uniformly increased in each direction. In the case where such an opening is provided, the ratio of the opening occupied by the entire penetrating opening is preferably 60% or less in the processing substrate mounting area in terms of quality and strength, energy saving and productivity improvement. Therefore, the content is preferably at least 10% or more.

In the case of the setter shown in FIG. 1, the processing substrate can be mounted on the setter and the processing substrate can be separated from the setter as shown in FIG. 2, and the processability is excellent. This will be briefly described with reference to FIG. As described above, FIG. 3 is a diagram showing a cross section taken along line B1-B2 in FIG. As shown in FIG.
The processing substrate 120 on the processing substrate 10 is
It is held and lifted while being supported by 60. The processing substrate lifting pin 160 can be moved up and down within a predetermined range, and the processing substrate lifting pin 160 of the setter 110 has a proper positional relationship with the processing substrate. Since the processing substrate is disposed so as to pass through the opening 115A provided in the setter 120, the processing substrate can be moved up and down with the movement of the processing substrate lifting pins 160 by placing the processing substrate at a predetermined position. it can. From the state of FIG. 2A, the processing substrate lifting pins 160 move downward, and the processing substrate 120 is mounted on the setter 110, as shown in FIG. 2B. Also, as shown in FIG.
2A, the processing substrate 120 mounted on the substrate 0 is separated from the setter by moving the processing substrate lifting pins 160 upward.

Next, from the state of FIG.
As shown in FIG.
0, the processing substrate 120 is inserted between the processing substrates 120, the processing substrate lifting pins 160 are lowered, and the processing substrate 120 is held by the suction unit 175 of the robot hand 170, and the processing substrate lifting pins 160 are further lowered. 2D, the processing substrate 120 is held only by the robot hand 170 as shown in FIG. 2D, and can be moved to a predetermined position by the movement of the robot hand 170. Thus, the processing substrate 1 from the setter 110
A separation of 20 is performed. In the state of FIG. 2D, when the processing substrate 120 is at a predetermined position on the setter 110, the processing substrate lifting pins 160 are raised upward, and the processing substrate is held only by the processing substrate lifting pins 160. In this state, the processing substrate lifting pins 160 are lifted upward, and the processing substrate lifting pins 160 are moved downward in a state where the robot hand 170 is removed from this position (the state shown in FIG. 2A). Then, as shown in FIG. 2B, the processing substrate 120 is mounted on the setter 110. Thus, from the robot hand 170, the setter 1
The processing substrate 120 can be mounted on the substrate 10. By providing the opening 115A in the setter in this way, the processability can be improved.

The example of the setter shown in FIG. 1 is as described above, but is not necessarily limited thereto. In some cases, the opening 115 shown in FIGS. 4A and 4B is used.
May be provided.

The baking setter 110 of the example shown in FIG.
Was used to actually perform the baking treatment. Table 1 below shows the relationship between each shape of the setter (processing example to comparative example), heating time, and cooling time. However, FIG.
L0 shown in (b) is 50 mm, the diameter of the circle is changed, and the area occupied by the entire opening is changed. The opening area ratio (%) is the opening of the entire opening relative to the processing substrate mounting region 118. Indicates the ratio of the area occupied by.

[Table 1] From this, it is determined that the ratio of the penetrating opening is required to be 10% or more in the processing substrate mounting area.

[0020]

As described above, the present invention has made it possible to provide a baking treatment method capable of efficiently performing a baking treatment of a processing material in PDP production. As a result, the PDP can respond to the increase in size, quality, and mass production of PDPs.

[Brief description of the drawings]

FIG. 1 (a) is a plan view of an example of an embodiment of a baking treatment setter according to the present invention, and FIG. 1 (b) is FIG. 1 (a).
FIG. 3 is an enlarged view of an A0 part of FIG.

FIG. 2 is a view for explaining mounting of a processing substrate on the setter and separation of the processing substrate from the setter when the setter shown in FIG. 1 is used.

FIG. 3 is a diagram showing a cross section taken along B1-B2 in FIG.

FIGS. 4 (a) and 4 (b) are plan views of examples of other baking treatment setters, respectively.

FIG. 5 is a view for explaining a conventional firing process.

FIG. 6 is a process chart for explaining a PDP manufacturing process.

FIG. 7 is a diagram illustrating a PDP substrate.

[Explanation of symbols]

 110 setter 111 glass section 115, 115A opening 118 processing substrate mounting area 120 processing substrate 150 transport roller 160 processing substrate lifting pin 170 robot hand 175 suction section

Claims (6)

[Claims] 1. A baking processing setter for mounting a processing substrate, which is used in a baking processing for baking a processing material of the processing substrate while transporting the processing substrate for a plasma display, wherein the through-hole is provided. A baking process setter, characterized by having a section. 2. The method according to claim 1, wherein the penetrating opening is
A baking processing setter characterized by being provided uniformly over at least the entire surface of a processing substrate mounting area. 3. The baking setter according to claim 2, wherein the penetrating opening has a circular shape. 4. The method according to claim 3, wherein the center position of each circle of the opening is located at each vertex of an equilateral triangle which can be arranged on the surface of the processing substrate without any gap. Baking setter. 5. The method according to claim 4, wherein the ratio of the penetrating opening is 10% to 60% in the processing substrate mounting area.
% For baking treatment. 6. A baking treatment method, comprising baking a processing substrate material using the baking processing setter according to claim 1.