JP2003039395A - 懸架微細構造を形成する方法 - Google Patents

懸架微細構造を形成する方法

Info

Publication number
JP2003039395A
JP2003039395A JP2002120034A JP2002120034A JP2003039395A JP 2003039395 A JP2003039395 A JP 2003039395A JP 2002120034 A JP2002120034 A JP 2002120034A JP 2002120034 A JP2002120034 A JP 2002120034A JP 2003039395 A JP2003039395 A JP 2003039395A
Authority
JP
Japan
Prior art keywords
platform
substrate
dielectric layer
base substrate
suspension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002120034A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003039395A5 (https=
Inventor
David Horsley
デイビッド・ホースレイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2003039395A publication Critical patent/JP2003039395A/ja
Publication of JP2003039395A5 publication Critical patent/JP2003039395A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00142—Bridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/05—Temporary protection of devices or parts of the devices during manufacturing
    • B81C2201/056—Releasing structures at the end of the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Weting (AREA)
  • Pressure Sensors (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
JP2002120034A 2001-04-27 2002-04-23 懸架微細構造を形成する方法 Pending JP2003039395A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/844,356 US6465355B1 (en) 2001-04-27 2001-04-27 Method of fabricating suspended microstructures
US09/844356 2001-04-27

Publications (2)

Publication Number Publication Date
JP2003039395A true JP2003039395A (ja) 2003-02-13
JP2003039395A5 JP2003039395A5 (https=) 2005-04-07

Family

ID=25292493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002120034A Pending JP2003039395A (ja) 2001-04-27 2002-04-23 懸架微細構造を形成する方法

Country Status (5)

Country Link
US (1) US6465355B1 (https=)
EP (1) EP1253108B1 (https=)
JP (1) JP2003039395A (https=)
CN (1) CN1384042A (https=)
DE (1) DE60203431T2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010104064A1 (ja) * 2009-03-13 2010-09-16 アルプス電気株式会社 Ｍｅｍｓセンサ

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