JP2003022996A - Wafer treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer treatment device with which a treatment tool can be moved between a treatment position and a standby position in simple configuration. SOLUTION: A discharge nozzle of the treatment tool is fixed and linked onto a driving shaft 51 of a compound actuator 50. In the compound actuator 50 when a magnetic screw 52 is turned by a pulse motor 40, the rotation of a magnetic nut 54 inside a horizontal plane is permitted and the discharge nozzle is turned within the horizontal plane by a cam mechanism for guiding a pin 56 along with the form of a groove 59, or discharge nozzle is vertically moved by permitting the movement of the magnetic nut 54 along with a perpendicular direction while limiting the rotation of the magnetic nut 54 within the horizontal plane. By using the compound actuator 50, the discharge nozzle can perform two-axis movement only with one driving part (pulse motor 40), and can be moved between the treatment position and the standby position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a treatment tool for performing a predetermined treatment on the surface of a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disc, etc. (hereinafter referred to as "substrate"). For example, the present invention relates to a substrate processing apparatus that moves a discharge nozzle or a cleaning brush between a processing position and a retracted position.

[0002]

As is well known, products such as semiconductors and liquid crystal displays are subjected to a series of various treatments such as cleaning, resist coating, exposure, development, etching, interlayer insulating film formation, heat treatment, and dicing on the above-mentioned substrate. It is manufactured by applying. Among these various kinds of processing, there is also one in which a processing tool for performing a predetermined processing is brought close to or in contact with the substrate surface. For example, in an apparatus that removes photoresist (hereinafter, simply referred to as “resist”) attached to the edge of a substrate, an edge nozzle cleaning process is performed by bringing a discharge nozzle that discharges a cleaning liquid close to the substrate. In a spin scrubber that mechanically cleans the surface of a substrate, a cleaning brush is brought into contact with the surface of the substrate while rotating the substrate to perform processing.

FIG. 6 is a diagram showing the structure of a conventional substrate processing apparatus. This substrate processing apparatus is an apparatus that performs resist coating processing on the substrate W and also cleans and removes the resist attached to the edge portion of the substrate W. The substrate W coated with the resist is held in a horizontal posture by the spin chuck 101. The spin chuck 101 can be rotated by a motor (not shown). This allows
The substrate W held by the spin chuck 101 is rotated in a horizontal plane.

A substrate W held on the spin chuck 101
Around the circumference of the cup 11, the processing liquid (resist and cleaning liquid) scattered by rotating the substrate W is collected.
0 is placed. The cup 110 can be raised and lowered by an elevating mechanism (not shown). When the substrate W is loaded or unloaded, the cup 110 is lowered, and during the cleaning process, the cup 110 is raised and positioned around the substrate W. When the cup 110 is raised (state of FIG. 6), the upper end of the cup 110 is at the spin chuck 101.
It becomes higher than the substrate W held by the.

A cleaning liquid for cleaning the edge portion of the substrate W is discharged from the discharge nozzle 120. Discharge nozzle 12
Reference numeral 0 is connected to a cleaning liquid supply source (not shown) so that when the cleaning liquid is supplied from the cleaning liquid supply source to the discharge nozzle 120, the cleaning liquid is discharged from the tip of the discharge nozzle 120. The discharge nozzle 120 is held by the nozzle arm 121. The nozzle arm 121 and the discharge nozzle 120 can be moved up and down by an air cylinder 127 as shown by an arrow AR61. The air cylinder 127 is rotated by the pulse motor 125. When the pulse motor 125 rotates the air cylinder 127, the nozzle arm 121 and the discharge nozzle 120 rotate in a horizontal plane as indicated by an arrow AR62.

Therefore, the discharge nozzle 120 can be moved up and down along the vertical direction and swung in the horizontal plane by the air cylinder 127 and the pulse motor 125. As a result, the discharge nozzle 120 moves to the cup 11
0 and the spin chuck 101 provided outside the 0 position.
It is possible to move to and from the processing position directly above the edge of the substrate W held by the substrate. Specifically, first, the ejection nozzle 120 at the retracted position is moved up and down by the air cylinder 127 and moved to a position higher than the upper end of the cup 110. Then, the discharge nozzle 120 is swung by the pulse motor 125 and is positioned above the edge of the substrate W held by the spin chuck 101. After that, the discharge nozzle 120 is lowered by the air cylinder 127, and is moved to directly above the edge portion of the substrate W. In this state, from the discharge nozzle 120 to the substrate W
The cleaning liquid can be discharged to the edge portion of the. When the discharge nozzle 120 moves from the processing position to the retracted position, the procedure reverse to the above is executed.

[0007]

However, in the conventional substrate processing apparatus shown in FIG. 6, the discharge nozzle 12 is used.
Two drive units, an air cylinder 127 for raising and lowering 0 and a pulse motor 125 for turning, are required. This is because when the discharge nozzle 120 moves between the retracted position and the processing position, the operation of overcoming the cup 110 is required, and the biaxial movement is essential.

If the two drive parts of the air cylinder 127 and the pulse motor 125 are provided to move one discharge nozzle 120, the number of parts such as a position detection sensor and a solenoid valve for properly operating them increases. . If the number of parts increases, the maintainability deteriorates and the size of the substrate processing apparatus also increases. Further, the control software for driving each of the air cylinder 127 and the pulse motor 125 becomes complicated, which further increases the cost and causes the malfunction.

The present invention has been made in view of the above problems, and an object thereof is to provide a substrate processing apparatus capable of moving a processing tool between a processing position and a retracted position with a simple structure. To do.

[0010]

In order to solve the above-mentioned problems, the invention of claim 1 is a substrate processing apparatus for moving a processing tool for performing a predetermined processing on a surface of a substrate between a processing position and a retreat position. A holding means for holding the substrate in a substantially horizontal posture; a rotation driving means for rotating the rotation axis about an axis along a predetermined direction as a rotation center; and the rotation driving means and the processing tool for coupling the rotation means. The processing tool is processed by transmitting the processing tool to the processing tool while switching the rotational motion of the shaft to either a swivel motion about the axis along the predetermined direction or a linear movement motion along the predetermined direction. Drive switching means for moving between a position and the retracted position.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect of the invention, the predetermined direction is substantially vertical, and the drive switching means causes the rotary operation of the rotary shaft to be substantially in a horizontal plane. The processing tool is moved between the processing position and the retreat position by transmitting the processing tool to the processing tool while switching to either the turning operation in (1) or the ascending / descending operation along the substantially vertical direction.

According to a third aspect of the invention, in the substrate processing apparatus according to the second aspect of the invention, the drive switching means includes:
A magnetic screw fixed to the rotary shaft and having a magnet spirally arranged on a cylindrical surface whose longitudinal direction is substantially vertical, is fixedly connected to the cleaning tool, and the periphery of the magnetic screw is A magnetic nut, which is arranged so as to surround it in a non-contact manner along the circumferential direction and has a built-in magnet, and when the magnetic screw is rotated by the rotation driving means, allows rotation of the magnetic nut in a horizontal plane. A cam that causes the cleaning tool to perform the ascending / descending operation by causing the cleaning tool to perform the turning operation or by limiting the rotation of the magnetic nut in a horizontal plane to allow the magnetic nut to move in a substantially vertical direction. And a mechanism.

According to a fourth aspect of the invention, in the substrate processing apparatus according to the third aspect of the invention, a cup surrounding the periphery of the substrate held by the holding means is further provided.
The processing position is inside the cup and lower than the upper end of the cup, and the retreat position is outside the cup and higher than the upper end of the cup.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a plan view of a substrate processing apparatus according to the present invention. 2 is a front view of the substrate processing apparatus of FIG. The substrate processing apparatus 1 is an apparatus for applying a resist to the substrate W and cleaning and removing the resist adhering to the edge by ejecting a cleaning liquid to the edge. The substrate processing apparatus 1 mainly includes a spin chuck 10, a cup 20, a discharge nozzle 30, a pulse motor 40, and a composite actuator 50.

The spin chuck 10 is a so-called vacuum chuck that holds the substrate W in a horizontal posture by vacuum-sucking the back surface of the substrate W. A motor shaft 16 of an electric motor 15 is vertically provided at the central portion on the lower surface side of the spin chuck 10. The electric motor 15 is the motor shaft 16
By rotating the spin chuck 10 via
The substrate W held by it also rotates. A so-called mechanical chuck that mechanically holds the edge portion of the substrate W may be used as the spin chuck 10.

The cup 20 is arranged around the substrate W,
The processing liquid scattered from the rotating substrate W is received and collected. The cup 20 can be raised and lowered by an elevation mechanism (not shown). When the cup 20 is being lowered by the lifting mechanism, the upper end of the cup 20 is located below the spin chuck 10. In this state, the transfer robot (not shown) can load the substrate W into and out of the spin chuck 10. Further, when the cup 20 is rising, the cup 20 surrounds the periphery of the substrate W held by the spin chuck 10, and the upper end of the cup 20 is located above the substrate W. When the edge cleaning process for the substrate W is performed, the process is performed with the cup 20 raised.

The discharge nozzle 30 is communicatively connected to a cleaning liquid supply source (not shown). When the cleaning liquid is supplied from the cleaning liquid supply source to the discharge nozzle 30, the cleaning liquid is discharged downward from the discharge port formed at the lower end of the discharge nozzle 30.

The discharge nozzle 30 is fixed to the tip of an L-shaped nozzle arm 31 so that its discharge port faces downward. The base end of the nozzle arm 31 is fixed to the drive shaft 51 of the compound actuator 50. Since the nozzle arm 31 is formed in an L shape, even if the discharge nozzle 30 is positioned lower than the upper end of the cup 20, the cup 20 and the nozzle arm 31 are prevented from contacting each other.

The composite actuator 50 connects the pulse motor 40 and the discharge nozzle 30 to each other,
Driving force is transmitted to the discharge nozzle 30. FIG. 3 is a diagram showing a configuration of the composite actuator 50. A magnetic screw 52 is fixed to a motor shaft 41 of the pulse motor 40. The pulse motor 40 rotates the motor shaft 41 with the axis Q along the vertical direction as the center of rotation. When the pulse motor 40 rotates the motor shaft 41, the magnetic screw 52 also rotates with the axis Q along the vertical direction as the center of rotation.

The magnetic screw 52 is constructed by arranging a pair of magnets 52a and 52b in a spiral shape on the surface of a cylinder whose longitudinal direction is the vertical direction. Here, the magnet 52a is the N pole,
The magnet 52b is the S pole. In FIG. 3, the pitch between each magnet pair is drawn wide for easy understanding, but it may be set narrower. Also, the magnet 52
The a may be an S pole and the magnet 52b may be an N pole.

The magnetic nut 54 is a cylindrical magnetic screw 5.
It is an annular member arranged so as to surround the periphery of 2 in a non-contact manner along the circumferential direction. The inner diameter of the magnetic nut 54 is larger than the outer diameter of the magnetic screw 52. Magnetic nut 5
4 has a pair of magnets 54a and 54b built therein. Here, the magnet 54a is an S pole and the magnet 54b is an N pole. The distance between the magnet 54a and the magnet 54b is equal to that of the magnetic screw 52.
Is equal to the distance between the magnet 52a and the magnet 52b. The magnets 54a and 54b may be ring-shaped magnets, or may be a plurality of magnet pieces arranged in an annular shape. When the magnet 52a has the S pole and the magnet 52b has the N pole, the magnet 54a is correspondingly set to the N pole.
The pole and the magnet 54b are S poles.

The magnetic nut 54 is fixed to the inner cylinder 55. The inner cylinder 55 is a hollow cylinder whose longitudinal direction is the vertical direction, and its inner diameter is larger than the outer diameter of the magnetic screw 52. Therefore, with respect to the hollow portion of the inner cylinder 55, the magnetic screw 52
Can be freely inserted and removed.

A drive shaft 51 is fixed to the upper end of the inner cylinder 55. The drive shaft 51 is a cylindrical member, and its upper end is fixed to the base end of the nozzle arm 31. Therefore, the discharge nozzle 30 is fixedly connected to the magnetic nut 54, but is not directly connected to the pulse motor 40.

An outer cylinder 58 is arranged outside the inner cylinder 55. The outer cylinder 58 is also a hollow cylinder, and its inner diameter is larger than the outer diameter of the inner cylinder 55. Therefore, the inner cylinder 55 can be inserted inside the outer cylinder 58. The outer cylinder 58 is fixedly provided in the substrate processing apparatus 1, and the outer cylinder 58 itself does not move relative to the pulse motor 40.

A pin 56 is provided on the outer peripheral surface of the inner cylinder 55, and a groove 59 is formed in the outer cylinder 58. The width of the groove 59 is larger than the diameter of the pin 56, and the pin 56 has the groove 5
The front end of the outer cylinder 58 projects through the outer cylinder 58. FIG. 4 is a diagram showing a state in which the pin 56 penetrates the groove 59. The cylindrical magnetic screw 52, the inner cylinder 55, the outer cylinder 58, the drive shaft 51, and the annular magnetic nut 54 are all provided coaxially, and the central axes thereof are the rotation centers of the motor shaft 41. Match Q. Therefore, if the pin 56 does not exist, the inner cylinder 55 can be freely rotated and moved up and down in the inner hollow portion of the outer cylinder 58. In this embodiment, since the pin 56 is engaged with the groove 59, the inner cylinder 55 is relatively opposed to the outer cylinder 58 only in the range in which the pin 56 can move along the shape of the groove 59 as shown in FIG. It can be rotated and moved up and down. In other words, by engaging the pin 56 with the groove 59, the inner cylinder 5
The relative movement of No. 5 with respect to the outer cylinder 58 is restricted within the range of the shape of the groove 59. The details of the operation of the composite actuator 50 will be described later.

In this embodiment, the discharge nozzle 30 serves as a processing tool, the spin chuck 10 serves as a holding means, the pulse motor 40 serves as a rotation driving means, and the composite actuator 50.
Corresponds to the drive switching means, and the combination of the pin 56 and the groove 59 corresponds to the cam mechanism. In addition to the above, the substrate processing apparatus 1 of the present embodiment is provided with a coating nozzle or the like for coating the substrate W with a resist.

Next, the operation of the substrate processing apparatus 1 having the above structure will be described. The substrate processing apparatus 1 of the present embodiment is an apparatus for applying a resist to the substrate W and cleaning / removing the resist adhering to the edge portion of the substrate W. The basic processing content is after applying the resist to the substrate W. , Its substrate W
The cleaning liquid is ejected from the ejection nozzle 30 to the edge portion of the substrate W while being held and rotated by the spin chuck 10.

As a concrete processing procedure, first, the cup 20 descends and the transfer robot carries in the substrate W and holds it on the spin chuck 10. Next, after the cup 20 moves up, the discharge nozzle 30 moves from the retracted position to the processing position. Here, the "withdrawal position" is a position outside the cup 20 and higher than the upper end of the cup 20, and is a position shown by a chain double-dashed line in FIG. The “evacuation position” is a position where the ejection nozzle 30 retreats so as not to interfere with the transfer robot or the like when the cleaning liquid is not ejected. Discharge nozzle 30
Is in the retracted position, the droplet removal from the ejection port of the ejection nozzle 30 is executed.

On the other hand, the "processing position" is the position inside the cup 20 and lower than the upper end of the cup 20, and is the position shown by the solid line in FIG. The “processing position” is immediately above the edge of the substrate W held by the spin chuck 10. During the cleaning process, the discharge nozzle 30 is located at the processing position and discharges the cleaning liquid.

After the discharge nozzle 30 moves to the processing position,
The substrate W held on the spin chuck 10 is moved to the electric motor 1
While rotating 5, the resist is discharged from a coating nozzle (not shown) to apply the resist to the surface of the substrate W by a centrifugal force (so-called spin coating). Then, the cleaning liquid is started to be discharged from the discharge nozzle 30, and the edge portion of the substrate W is cleaned. When the edge cleaning is completed, the rotation of the substrate W is stopped and the ejection nozzle 30 moves from the processing position to the retracted position. After that, the cup 20 descends, the transfer robot carries out the substrate W, and the series of processes is completed. In the above, the discharge nozzle 30 may be moved from the retracted position to the processing position after the resist coating process is completed.

Here, a mode in which the discharge nozzle 30 moves from the processing position to the retracted position will be described in more detail with reference to FIGS. 3 to 5. Note that FIG. 5 shows the discharge nozzle 30.
It is a figure which shows the moving path of.

First, when the discharge nozzle 30 is in the processing position (solid line position in FIG. 5), the pin 56 is in the position shown by the solid line in FIG. In this state, the pulse motor 40 moves in the direction indicated by the arrow AR3 in FIG.
When 1 is rotated, the magnetic screw 52 also rotates in the direction indicated by an arrow AR3 with the axis Q along the vertical direction as the center of rotation. When the magnetic screw 52 rotates, an attractive force resulting from the magnetic force acting between the magnets 52a and 52b and the magnets 54a and 54b causes a rotational driving force in the horizontal plane to act on the magnetic nut 54.

When the magnetic nut 54 rotates about the axis Q, the inner cylinder 55, the pin 56, and the like, which are fixedly provided thereto,
The drive shaft 51, the nozzle arm 31, and the discharge nozzle 30 all rotate in the horizontal plane with the axis Q as the center of rotation. At this time, as shown in FIG. 4, if the shape of the groove 59 allows the pin 56 to rotate in the horizontal plane, that is, the pin 5
If the direction of travel in the horizontal plane of 6 is open,
The rotational movement of the magnetic nut 54 is not hindered. Therefore, when the pulse motor 40 rotates the magnetic screw 52, the magnetic nut 54 also rotates about the axis Q, and as a result, the discharge nozzle 30 fixedly connected to the magnetic nut 54 also has an axis along the vertical direction. A turning operation is performed in a horizontal plane with Q as the center of rotation. As a result, the discharge nozzle 30 moves from the solid line position (processing position) in FIG. 5 to the position P1. At the same time, the pin 56 also moves from the solid line position in FIG. 4 to the position C1 along the groove 59.

When the pin 56 reaches the position C1, the groove 59
This limits the rotation of the pin 56 in the horizontal plane. Therefore, the rotation of the magnetic nut 54 cannot be continued, and the turning operation of the discharge nozzle 30 is stopped. In this state,
Even if the pulse motor 40 further rotates the motor shaft 41 in the direction indicated by the arrow AR3 in FIG. 3, the magnetic screw 52 is not in contact with the magnetic nut 54, so that the rotation operation is mechanically limited. However, the magnetic screw 52 continues to rotate in the direction indicated by the arrow AR3 with the axis Q along the vertical direction as the center of rotation. At this time, the rotation of the magnetic nut 54 in the horizontal plane is limited, and only the magnetic screw 52 rotates relative to the magnetic nut 54.
Helical magnet 52 disposed on the cylindrical surface of magnetic screw 52
The a and 52b also rotate relative to the magnetic nut 54. As a result, the magnets 52a, 52b and the magnet 54
An ascending driving force acts on the magnetic nut 54 by the attractive force caused by the magnetic force acting between the a and 54b.

When the magnetic nut 54 rises, the inner cylinder 55 fixed to it, the pin 56, and the drive shaft 5 are fixed.
1, the nozzle arm 31 and the discharge nozzle 30 all perform the raising operation. Here, as shown in FIG. 4, when the shape of the groove 59 allows the upward movement of the pin 56 in the vertical direction, that is, when the upper portion of the pin 56 is open, the magnetic nut 54 is provided. It is possible to move upward along the vertical direction. Therefore, when the pulse motor 40 rotates the magnetic screw 52 when the pin 56 is at the position C1,
The magnetic nut 54 rises vertically and, as a result,
The discharge nozzle 30 fixedly connected to the magnetic nut 54 also moves upward in the vertical direction. As a result, the discharge nozzle 30 moves upward from the position P1 in FIG. 5 to the position P2. At the same time, the pin 56 also moves from the position C1 in FIG.
Move along 9 and reach position C2.

When the pin 56 reaches the position C2, the groove 59
This limits the upward movement of the pin 56 in the vertical direction. Therefore, it is not possible to continue raising the magnetic nut 54, and the raising operation of the discharge nozzle 30 is also stopped. However, when the pin 56 is at the position C2, the shape of the groove 59 allows the rotation of the pin 56 in the horizontal plane in the same manner as described above (as when the pin 56 is at the solid line position in FIG. 4). That is, that is, when the pin 56 is open in the horizontal direction. Therefore, similarly to the above, when the pulse motor 40 rotates the magnetic screw 52, the magnetic nut 54
Also rotates about the axis Q as the center of rotation, and as a result, the discharge nozzle 30 fixedly connected to the magnetic nut 54 also performs a swiveling operation in the horizontal plane about the axis Q as the center of rotation along the vertical direction. As a result, the discharge nozzle 30 moves from the position P2 in FIG. 5 to the position P3. At the same time, the pin 56 is also shown in FIG.
It moves from the position C2 along the groove 59 to reach the position C3.

When the pin 56 reaches the position C3, the groove 59
This limits the rotation of the pin 56 in the horizontal plane. Therefore, the rotation of the magnetic nut 54 cannot be continued, and the turning operation of the discharge nozzle 30 is stopped. However, when the pin 56 is at the position C3, the same as the above (the pin 56
(As in the position C1 in FIG. 4), the shape of the groove 59 allows the upward movement of the pin 56 in the vertical direction, that is, the upper side of the pin 56 is open. Therefore, in the same manner as described above, the pulse motor 40 operates with the magnetic screw 52.
Is rotated, the magnetic nut 54 rises along the vertical direction, and as a result, the discharge nozzle 30 fixedly connected to the magnetic nut 54 also rises along the vertical direction. As a result, the discharge nozzle 30 moves upward from the position P3 in FIG. 5 to the alternate long and two short dashes position (the retracted position). At the same time,
The pin 56 also moves from the position C3 in FIG. 4 along the groove 59,
Reach position C4.

When the pin 56 reaches the position C4,
The groove 59 limits both the rotation and the lifting movement of the pin 56 in the horizontal plane. Therefore, even if the pulse motor 40 continues to rotate the magnetic screw 52, the magnetic nut 54 does not move and is stopped at the retracted position of the discharge nozzle 30. However, normally, the drive of the pulse motor 40 is stopped when the pin 56 reaches the position C4.

The above is a description of the case where the discharge nozzle 30 moves from the processing position to the retracted position. However, when the discharge nozzle 30 moves from the retracted position to the processing position,
The operation is completely opposite to the above. That is, the pulse motor 4
When 0 rotates the motor shaft 41 in the direction opposite to the direction indicated by the arrow AR3 in FIG. 3, the magnetic screw 52 also reverses the direction indicated by the arrow AR3 with the axis Q along the vertical direction as the center of rotation. Rotate. When the shape of the groove 59 allows the descending operation of the pin 56 in the vertical direction, that is, the pin 56.
When the lower part of the nozzle is opened, the magnetic nut 54 descends along the vertical direction when the magnetic screw 52 rotates, and as a result, the discharge nozzle 30 fixedly connected to the magnetic nut 54 also follows the vertical direction. Perform descending motion. On the other hand, the groove 59
When the shape allows the rotation of the pin 56 in the horizontal plane, that is, when the direction of travel of the pin 56 in the horizontal plane is open, when the magnetic screw 52 rotates, the magnetic nut 54 also rotates the shaft Q.
As a result, the discharge nozzle 30 fixedly connected to the magnetic nut 54 also performs a swiveling operation in the horizontal plane with the axis Q along the vertical direction as the center of rotation. In this way, the discharge nozzle 30 moves in the opposite direction on the same path as shown in FIG. 5, and moves from the retracted position to the processing position.

As described above, the compound actuator 50 of the present embodiment uses the cam mechanism that guides the pin 56 along the shape of the groove 59, and when the pulse motor 40 rotates the magnetic screw 52, the magnetic nut 54. To allow the discharge nozzle 30 to perform a swivel motion in the horizontal plane, or to restrict the rotation of the magnetic nut 54 in the horizontal plane to allow the magnetic nut 54 to move in the vertical direction. The discharge nozzle 30 is caused to move up and down. That is, the composite actuator 50 causes the magnetic nut 54 to rotate the motor shaft 41 of the pulse motor 40.
The discharge nozzle 30 is moved between the processing position and the retracted position by transmitting to the discharge nozzle 30 by switching to either the swiveling operation in the horizontal plane or the elevating operation in the vertical direction.

As clearly shown in FIG. 5, the discharge nozzle 30.
The movement between the processing position and the retracted position is a biaxial movement. In the present embodiment, the compound actuator 50 is used to switch the rotation operation of the motor shaft 41 of the pulse motor 40 to either the turning operation of the magnetic nut 54 in the horizontal plane or the up-and-down operation along the vertical direction, and the discharge nozzle 30.
Since the two-axis movement of the discharge nozzle 30 is realized by transmitting the above, the single drive unit (pulse motor 40) is sufficient, unlike the conventional case that two drive systems are required. Therefore, the position detection sensor, the solenoid valve, and the like are sufficient in the number of parts for properly operating the pulse motor 40, and the cost can be reduced as compared with the conventional case. In addition, as the number of parts decreases, the size of the substrate processing apparatus 1 also decreases accordingly, leading to a reduction in footprint (plane space occupied by the apparatus).

Further, in the present embodiment, the pulse motor 40
Since it suffices to create control software enough to cause the rotating operation of the control software, simpler control software than the conventional one will suffice and the cost can be reduced, and malfunction of the control software can be reduced.

Further, even if the drive section performs an abnormal operation due to a malfunction of the control software, a hardware safety mechanism (for example, a movable range restricting member of the nozzle arm 31) is conventionally required. However, in the present embodiment, the discharge nozzle 30 is formed by the groove 59 and the pin 56.
The movement range of is limited. That is, the composite actuator 50, which is the drive switching means, also serves as a safety mechanism by hardware. Therefore, since a special hardware safety mechanism is not required, the cost can be further reduced.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above examples.
For example, in the above embodiment, the composite actuator 50 switches the rotation operation of the motor shaft 41 of the pulse motor 40 to either the turning operation of the magnetic nut 54 in the horizontal plane or the up-and-down operation along the vertical direction, and the discharge nozzle. However, the present invention is not limited to this, and the pulse motor 40 rotates the motor shaft 41 around a shaft along a predetermined direction as a rotation center, and the motor shaft 4
The discharge nozzle 30 is processed by transmitting the rotation operation of No. 1 to the discharge nozzle 30 while switching the rotation operation thereof to either a swivel operation about a shaft along the predetermined direction or a linear movement operation along the predetermined direction. Any form may be used as long as it is moved between the position and the retracted position.

Further, in the above-described embodiment, in the substrate processing apparatus 1 which discharges the cleaning liquid to the edge of the substrate W to clean and remove the resist adhering to the edge, the discharge nozzle 30 is provided at the processing position and the retracted position. Although the description has been given by taking as an example the mode of moving the apparatus between the above, the technique according to the present invention can be applied to other substrate processing apparatuses. For example, in a spin developer (rotary development processing apparatus) that performs development processing on a substrate after exposure, movement of a nozzle (processing tool) that discharges pure water between a processing position and a retracted position is also a technique according to the present invention. Can be applied. Further, for example, even in a spin scrubber in which a cleaning brush (processing tool) is brought into contact with the surface of the substrate while rotating the substrate, the movement of the cleaning brush between the processing position and the retracted position is The technology according to the present invention can be applied. In other words, the technique according to the present invention can be applied to any substrate processing apparatus that moves a processing tool that performs a predetermined process on the surface of a substrate between a processing position and a retracted position, and in particular, the processing tool is a cup. When it is necessary to move in two axes because it has to overcome the above, it is significant to apply the technique according to the present invention.

Further, the rotation driving means is not limited to the pulse motor 40, and another driving method, for example, an air driving method may be adopted. However, as in the present embodiment, when removing the resist adhering to the edge portion of the substrate W, positional accuracy of the processing position of the discharge nozzle 30 is required, so that a pulse motor is adopted as the rotation driving means. preferable. On the other hand, when the positional accuracy of the processing position of the nozzle is not required as in the above spin developer, an air driven rotation driving means may be adopted. When the positional accuracy of the processing position of the ejection nozzle 30 is particularly strictly required, only when the ejection nozzle 30 exists near the processing position (for example, the ejection nozzle 30).
Is present between the solid line position and the position P1 in FIG. 5), a clutch mechanism for mechanically connecting the magnetic screw 52 and the magnetic nut 54 may be further provided.

[0048]

As described above, according to the first aspect of the present invention, the rotation drive means for rotating the rotary shaft about the shaft along the predetermined direction as the center of rotation, and the rotary operation of the rotary shaft, The processing tool is moved between the processing position and the retracted position by transmitting to the processing tool while switching to either a swivel motion about an axis along the predetermined direction as a rotation center or a linear movement motion along the predetermined direction. Drive switching means,
In order to be provided with 2 of processing tools by one rotation drive means
Axial movement is possible, and the processing tool can be moved between the processing position and the retracted position with a simple configuration.

According to the second aspect of the present invention, the rotary operation of the rotary shaft is transmitted to the processing tool while being switched to either a swiveling operation in a substantially horizontal plane or an ascending / descending operation in a substantially vertical direction. Since the processing tool is moved between the processing position and the retracted position, it is possible to move the processing tool in two axes by one rotation drive means, and move the processing tool between the processing position and the retracted position with a simple configuration. Can be made.

According to the third aspect of the present invention, the drive switching means is fixed to the rotary shaft, and the magnetic screw has magnets arranged spirally on a cylindrical surface whose longitudinal direction is substantially vertical, and cleaning. It is fixedly connected to the tool and arranged so as to surround the magnetic screw along its circumferential direction in a non-contact manner,
When the magnetic nut with built-in magnet and the magnetic screw is rotated by the rotation driving means, the cleaning tool is allowed to rotate in the horizontal plane, or the cleaning tool is rotated, or the magnetic nut is rotated in the horizontal plane. The cleaning tool is provided with a cam mechanism that moves up and down by restricting the movement of the magnetic nut in a substantially vertical direction. Therefore, the two-axis movement of the processing tool can be easily performed by one rotation driving means. It will be possible.

According to the invention of claim 4, the processing position is inside the cup and lower than the upper end of the cup, and the retreat position is outside the cup and higher than the upper end of the cup. By causing the processing tool to perform biaxial movement by the driving means, the processing tool can easily move over the cup and move between the processing position and the retracted position.

[Brief description of drawings]

FIG. 1 is a plan view of a substrate processing apparatus according to the present invention.

FIG. 2 is a front view of the substrate processing apparatus of FIG.

3 is a diagram showing a configuration of a composite actuator of the substrate processing apparatus of FIG.

FIG. 4 is a view showing a state in which a pin of an inner cylinder penetrates a groove of an outer cylinder.

FIG. 5 is a diagram showing a movement path of a discharge nozzle.

FIG. 6 is a diagram showing a configuration of a conventional substrate processing apparatus.

[Explanation of symbols]

1 Substrate processing equipment 10 Spin chuck 20 cups 30 discharge nozzles 40 pulse motor 41 motor shaft 50 compound actuator 52 magnetic screw 52a, 52b, 54a, 54b Magnet 54 magnetic nut 56 pin 59 groove W board

─────────────────────────────────────────────────── ─── Continued Front Page (51) Int.Cl. ⁷ Identification Code FI Theme Coat (Reference) F16H 25/24 F16H 25/24 B H01L 21/027 H01L 21/30 577 (72) Inventor Akihiko Morita Kyoto City 4 Horikawa-dori Teranouchi, Kamigyo-ku, 1-chome, Tenjin Kitamachi 1-chome, Dainippon Screen Mfg. Co., Ltd. F-term (Reference) 3J062 AA28 AB23 AB32 AC07 AC09 CB18 CD16 CD22 5F046 MA10

Claims (4)

[Claims] 1. A substrate processing apparatus for moving a processing tool for performing a predetermined processing on a surface of a substrate between a processing position and a retracted position, the holding means holding the substrate in a substantially horizontal posture, and a predetermined direction. A rotation driving means for rotating the rotation axis with the axis along the rotation center as a rotation center, the rotation driving means and the processing tool are connected, and the rotation operation of the rotation axis is performed by rotating the rotation axis around the axis along the predetermined direction. Drive switching means for moving the processing tool between the processing position and the retreat position by transmitting to the processing tool while switching to either the turning operation or the linear movement operation along the predetermined direction. A substrate processing apparatus comprising: 2. The substrate processing apparatus according to claim 1, wherein the predetermined direction is a substantially vertical direction, and the drive switching unit causes the rotational movement of the rotary shaft to be a swiveling movement in a substantially horizontal plane or a substantially vertical direction. The substrate processing apparatus, wherein the processing tool is moved between the processing position and the retracted position by transmitting the processing tool to the processing tool while switching to one of the raising and lowering operations according to the above. 3. The substrate processing apparatus according to claim 2, wherein the drive switching unit is fixed to the rotation shaft, and magnets are spirally arranged on a cylindrical surface whose longitudinal direction is substantially vertical. A screw, a magnetic nut fixedly connected to the cleaning tool, arranged so as to surround the magnetic screw in a non-contact manner along the circumferential direction thereof, and a magnetic nut containing a magnet, and the rotation driving means. When the magnetic screw rotates, the cleaning tool is allowed to rotate in a horizontal plane to cause the cleaning tool to perform the swiveling operation, or the rotation of the magnetic nut in the horizontal plane is limited to allow the magnetic nut to rotate. A substrate processing apparatus, comprising: a cam mechanism that allows the cleaning tool to move up and down by allowing the cleaning tool to move in a substantially vertical direction. 4. The substrate processing apparatus according to claim 3, further comprising a cup that surrounds the periphery of the substrate held by the holding means, wherein the processing position is inside the cup and lower than the upper end of the cup. The substrate processing apparatus, wherein the retracted position is outside the cup and higher than an upper end of the cup.