TWI605534B - Substrate holding/rotating device, substrate processing apparatus including the same, and substrate processing method - Google Patents

Description

Substrate holding rotating device, substrate processing device therewith, and substrate processing method

The present invention relates to a substrate holding and rotating device, a substrate processing device therewith, and a substrate processing method. The substrate to be held or processed includes, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for a disk, a substrate for a disk, and a disk for a magneto-optical disk. A substrate, a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, or the like.

US2013/0152971 A1 discloses a rotary substrate holding and rotating device, comprising: a rotary table rotatable about a rotation axis along a vertical direction; a rotary drive unit that rotates the rotary table about the rotation axis; The roots (for example, four) hold pins, which are disposed on the turntable, and horizontally position the substrate from the surface of the turntable at a predetermined interval.

The plurality of retaining pins include a fixed pin that is stationary with respect to the rotary table, and a movable pin that is movable relative to the rotary table. The movable pin is rotatably disposed about a rotation axis coaxial with the central axis thereof, and has an abutting portion for abutting against a peripheral end edge of the substrate. By the rotation of the abutting portion, the abutting portion is displaced between a distant open position away from the rotation axis and a holding position close to the rotation axis. a pin drive is coupled to the rotating shaft of the abutting portion Use a magnet.

Switching of the switch of the movable pin is performed using a lifting magnet disposed below the rotating table (magnet switching method). The lifting magnet is combined with a magnet lifting unit. When the lifting magnet is positioned below the predetermined position, the lifting magnet does not oppose the pin driving magnet, and therefore the movable pin does not apply pressure to the holding position. Therefore, when the lifting magnet is in the lower position, the movable pin is held in its open position. On the other hand, when the lifting magnet is positioned at a predetermined upper position, the movable pin is held at its holding position by the magnetic attraction between the lifting magnet and the pin driving magnet.

Further, the substrate holding and rotating device is provided in a one-chip substrate processing apparatus that processes the substrate one by one, and supplies the processing liquid (cleaning liquid) from the processing liquid nozzle to the upper surface of the substrate that is rotated by the substrate holding rotating device. The treatment liquid supplied to the upper surface of the substrate flows toward the peripheral portion of the substrate by the centrifugal force generated by the rotation of the substrate. Thereby, the entire area of the upper surface of the substrate and the peripheral end surface of the substrate are subjected to liquid treatment. Further, depending on the type of the substrate treatment, there is also a case where the peripheral portion of the lower surface of the substrate is also subjected to liquid treatment.

However, in the configuration described in US 2013/0152971 A1, the support substrate is always contacted by a plurality of (for example, four) holding pins during the liquid treatment, and therefore, the plurality of portions of the holding pin of the peripheral end surface of the substrate are The contact position treatment liquid does not flow back, and a cleaning residue is generated on the peripheral portion of the substrate (the peripheral end surface of the substrate and the peripheral portion of the lower surface of the substrate). If the contact support position of the substrate is changed during the rotation of the substrate, the peripheral portion of the substrate can be cleaned without causing cleaning residues. However, in order to achieve such a change in the contact support position, it is necessary to selectively select only during the processing of the substrate. One of the plurality of holding pins of the rotary table provided in the rotation is kept open. Of course Further, in the substrate holding and rotating device of the magnet switching method described in Patent Document 1, the lifting magnet for switching the switch of the movable pin is provided non-rotatably, and therefore, it is not possible to selectively selectively only provide the rotating table provided in the rotation. One of the plurality of retaining pins keeps the pin open. In the above-described Patent Document 1, when the lifting magnet is placed at the lower position and the two movable pins are both opened in the rotation of the rotary table, the substrate is separated from the rotating table.

Accordingly, it is an object of the present invention to provide a substrate holding and rotating device for magnet switching, which can support and rotate a substrate well, and can change a contact support position of a movable pin to a substrate during rotation of the substrate.

Further, another object of the present invention is to provide a substrate processing apparatus and a substrate processing method which can treat a peripheral portion of a substrate without causing a processing residue.

The present invention provides a substrate holding and rotating device comprising: a rotary table; a rotary drive unit that rotates the rotary table about a rotation axis along a vertical direction; and a movable pin that is used to support the substrate horizontally a movable pin having a support portion movably disposed between a distant open position away from the rotation axis and a holding position close to the rotation axis, and being disposed to rotate around the rotation axis together with the rotary table; a pressing unit that presses the support portion of each movable pin to the holding position; a driving magnet that is attached to each movable pin; and an open magnet that is an open magnet that is provided in a non-rotating state, and is formed Each of the movable pins that rotates by the rotation of the rotating table can pass through the predetermined magnetic field generating region and can be passed through the driving magnet concentrated in the rotating direction of the rotating table and only corresponding to one of the plurality of movable pins. a magnetic field generating region provided in a manner, and giving a repulsion to the driving magnet of the movable pin passing through the magnetic field generating region Or attract The force acts on the support portion of the movable pin that is pressed by the pressure applying unit to the holding position to a force that is directed toward the open position against the pressing force.

According to this configuration, the rotary table is provided with a plurality of movable pins, and each of the movable pins has a support portion that is movably provided between the open position and the holding position. The support portion of each movable pin is pressed by the pressure applying unit to the holding position.

Further, the rotating device is held on the substrate, and an open magnet is provided in a non-rotating state. The open magnet system generates a repulsive force only for the driving magnet corresponding to the movable pin of the magnetic field generating region that is collectively provided in the rotating direction of the rotating table among the plurality of movable pins that rotate in association with the rotation of the rotating table, and does not pass the The driving magnet corresponding to the movable pin in the magnetic field generating region imparts a repulsive force or an attractive force. The magnetic field generating region is provided so as to be able to pass only the driving magnet corresponding to one of the plurality of movable pins.

A movable pin (a movable pin that passes through the magnetic field generating region) that imparts a repulsive force or an attractive force to the open magnet generates a force that is directed toward the open position against the pressing force at the support portion of the movable pin. Thereby, the pressing force of the movable pin to the peripheral edge portion of the substrate can be alleviated. At this time, if the force generated in the support portion of the movable pin toward the open position exceeds the repulsive force or attractive force exceeding the pressing force from the pressing unit, a gap is formed between the peripheral portion of the substrate and the support portion of the movable pin. As a result, the support portion does not support the substrate. Further, the movable pin passing through the magnetic field generating region is sequentially switched in accordance with the phase change of each of the movable pins due to the rotation of the rotary table. Thereby, the contact support position of the movable pin to the substrate can be changed in accordance with the rotation of the turntable. The contact support position of the substrate can be changed.

On the other hand, a movable pin (a movable pin that does not pass through the magnetic field generating region) that does not impart a repulsive force and an attractive force by the open magnet holds the support portion at the open position. Thereby, the peripheral edge portion of the substrate can be supported by the movable pin. Thereby, the substrate can be well supported And make it rotate.

According to the above, it is possible to provide a substrate holding and rotating device for magnet switching, which can support and rotate the substrate well, and can change the contact support position of the movable pin to the substrate during the rotation of the substrate.

According to an embodiment of the present invention, the first relative moving unit further includes the open magnet and the rotating table such that a distance between the open magnet and the driving magnet changes. mobile.

According to this configuration, the distance between the open magnet and the driving magnet can be changed by relatively moving the open magnet and the rotating table by the first relative moving means. Therefore, by moving the open magnet and the rotating table relatively, it is possible to switch between the state in which the magnetic field generating region is generated in the region through which the respective driving magnets pass and the state in which the magnetic field generating region is not generated.

Further, the first relative moving means may cause the open magnet and the rotating table to form the magnetic field generating region at a first position in a region where each driving magnet passes, and the magnetic field does not form in a region where each driving magnet passes Relative movement between the second positions of the generation regions.

According to this configuration, in a state where the relative position of the open magnet and the turntable is at the first position, the repulsive force or the attraction force can be applied to the movable pin passing through the magnetic field generating region from the open magnet, and the movable pin pair can be made in the rotation of the substrate. The contact support position of the substrate changes. On the other hand, in a state where the relative position of the open magnet and the turntable is at the second position, no magnetic field generation region is generated in the region where the respective driving magnets pass, and therefore, the movable pin cannot be brought into contact with the substrate during the rotation of the substrate. Support position changes.

Moreover, in a state in which the open magnet and the turntable are located at the first position, the support portion of the movable pin may be disposed in the open position. An intermediate position between the above holding positions.

According to this configuration, in the state where the relative position of the open magnet and the turntable is at the first position, the movable pin that passes through the magnetic field generating region is given a repulsive force or an attractive force that exceeds the pressure applied by the pressing unit. Thereby, the support portion of the movable pin is disposed at an intermediate position between the open position and the holding position.

Further, the pressing unit may include a closing magnet that applies a repulsive force or an attractive force to each of the driving magnets, and presses the supporting portion of each of the movable pins to the holding position.

According to this configuration, the support portion of each movable pin is pressed to the holding position by the closing magnet. Thereby, the configuration in which the support portions of the respective movable pins are pressed to the holding position can be easily realized.

Furthermore, the second relative movement unit may further include a third position in which the closing magnet and the rotating table provide the repulsive force or the attraction force between the closing magnet and the driving magnet. And the closed magnet moves relative to the fourth position where the repulsive force and the attractive force are not provided between the driving magnet and the driving magnet.

According to this configuration, by switching the relative positions of the closing magnet and the rotating table between the third position and the fourth position, the supporting portion of each movable pin can be pressed to the holding position and the supporting portion of each movable pin is not Switch to the state of holding the position.

Further, the open magnet may include a plurality of open magnets provided at intervals in a circumferential direction of the turntable, and the magnetic field generating region formed in a region where each of the driving magnets passes may be a rotation direction of the turntable. The area of the upper break.

According to this configuration, the magnetic field generating region can be a region that is interrupted in the rotation direction of the turntable. Therefore, the movable pin that is not adjacent to each other among the plurality of movable pins provided on the peripheral edge portion of the substrate can be simultaneously received from the open magnet. Repulsive or attractive. Thereby, the movable pins that are not adjacent to each other can be simultaneously set to an unsupported state, in other words, the remaining movable pins can be used to support the substrate, and therefore, the substrate can be supported more stably when a plurality of movable pins release the support of the substrate. And make it rotate.

The movable pin may include: a first movable pin group including at least three movable pins; and a second movable pin group disposed separately from the first movable pin group and including at least three movable pins; All of the driving magnets that are mounted correspondingly to the movable pin are provided so as to have the same magnetic pole direction in a direction orthogonal to the axis of the rotation axis, and the plurality of the open magnets are arranged as follows In other words, in a state in which each of the driving magnets corresponding to the first movable pin group is present in the magnetic field generating region, each of the driving magnets corresponding to the second movable pin group does not exist in the magnetic field generating region. In a state in which the respective driving magnets corresponding to the second movable pin group are present in the magnetic field generating region, the respective driving magnets corresponding to the first movable pin group are not present in the magnetic field generating region.

According to this configuration, when each of the first movable pin groups contacts the peripheral edge portion of the support substrate, each of the second movable pin groups does not participate in the support of the substrate. Further, when each of the second movable pin groups contacts the peripheral edge portion of the support substrate, each of the first movable pin groups does not participate in the support of the substrate. Therefore, the state in which the substrate is supported by the first movable pin group including three or more movable pins and the second one including the movable pin including three or more are accompanied by a change in the phase of each of the movable pins due to the rotation of the rotary table. The movable pin group supports a transition between states of the substrate. That is, each time the rotary table rotates one turn, the holding substrate is exchanged between the first movable pin group and the second movable pin group a plurality of times.

The first movable pin group may include the same number of the movable pins as the second movable pin group, and the first and second movable pin groups may be alternately arranged in a circumferential direction of the turntable. The plurality of movable pins included in the movable pin group are disposed at equal intervals, and the plurality of open magnets are equally spaced in the circumferential direction of the turntable in the same number as the number of the movable pins included in each of the movable pin groups Configuration.

According to this configuration, the first and second movable pin groups are alternately arranged in the circumferential direction of the turntable, and the plurality of movable pins included in each of the movable pin groups are provided at equal intervals. Therefore, three The state of the first movable pin group supporting substrate and the state in which the substrate is supported by three or more second movable pin groups are supported by the respective movable pin groups.

Further, since the plurality of open magnets are arranged at equal intervals in the circumferential direction of the turntable in the same number as the number of the movable pins included in each of the movable pin groups, the magnetic field generating region formed by the plurality of open magnets can be formed. It is assumed that the driving magnet corresponding to the movable pin included in each of the movable pin groups passes through the same shape at the same time.

The rotation speed of the rotating table and/or the circumferential length of the open magnet may be such that the magnetic field generating region formed by one of the open magnets is spaced apart from the circumferential direction of the movable pin in the circumferential direction of the rotating table. A consistent way to set.

According to this configuration, the magnetic field generating region formed by one open magnet is aligned with the circumferential direction of the movable pin in the circumferential direction of the turntable. Therefore, the state of the plurality of movable pins provided on the rotary table can be performed one by one. Switch.

Furthermore, the shielding member may further include a shielding member that interferes with a magnetic field generated by the open magnet and a magnetic field generated by the closed magnet. To shield.

According to this configuration, the interference between the magnetic field generated by the open magnet and the magnetic field generated by the closed magnet can be reliably prevented.

Moreover, the present invention provides a substrate processing apparatus including: the substrate holding rotating device; and a processing liquid supply unit that supplies a processing liquid to a main surface of the substrate held by the substrate holding rotating device.

According to this configuration, the processing liquid is supplied from the processing liquid supply unit to the main surface of the substrate. The processing liquid supplied to the main surface of the substrate flows toward the peripheral portion of the substrate by the centrifugal force generated by the rotation of the substrate. Thereby, the peripheral portion of the substrate is subjected to liquid treatment using the treatment liquid. In the present invention, the contact support position of the movable pin to the substrate can be changed during the rotation of the substrate. Therefore, the peripheral portion of the substrate can be satisfactorily processed without generating a treatment residue.

Furthermore, the first relative movement unit may include a first position in which the open magnet and the rotating table form the magnetic field generating region in a region where each of the driving magnets passes, and an area through which each driving magnet passes. The relative movement between the second positions of the magnetic field generation regions is not formed, and the control unit controls the rotation drive unit, the processing liquid supply unit, and the first relative movement unit. In this case, the control unit may further perform a rotating table rotating step of rotating the rotating table about the rotation axis, and a processing liquid supply step of supplying the processing liquid to the substrate that rotates accompanying the rotation of the rotating table; The open magnet disposing step of disposing the relative position of the open magnet and the rotating table in the first position in parallel with the rotating table rotating step and the processing liquid supplying step.

According to this configuration, the processing liquid is supplied to the main surface of the substrate in the rotated state. The processing liquid supplied to the main surface of the substrate is subjected to centrifugal force generated by the rotation of the substrate The effect flows toward the peripheral portion of the substrate. Thereby, the peripheral portion of the substrate is subjected to liquid treatment using the treatment liquid.

Further, in parallel with the rotation of the turntable and the supply of the processing liquid, the relative position of the open magnet and the turntable is placed at the first position where the magnetic field generating region is formed in the region where the respective driving magnets pass. In this case, the contact support position of the movable pin to the substrate can be changed in accordance with the change in the rotational phase of the rotary table. Therefore, the processing liquid can be supplied to the entire region of the peripheral portion of the substrate, whereby the peripheral portion of the substrate can be satisfactorily processed without causing the processing residue.

Moreover, the present invention provides a substrate processing method which is implemented in a substrate processing apparatus including a substrate holding and rotating device and a first relative moving unit, wherein the substrate holding rotating device includes a rotary table and a rotary drive unit. Rotating the rotating table about a rotation axis along a vertical direction; a movable pin, wherein the plurality of movable pins for horizontally supporting the substrate have a movably disposed open position far from the rotation axis and a support portion between the holding positions of the rotation axis, and is disposed to rotate around the rotation axis together with the rotating table; a pressing unit that presses the support portion of each movable pin to the holding position; a magnet is attached to each movable pin; and an open magnet is an open magnet that is provided in a non-rotating state, and forms a predetermined magnetic field generating region through which each of the movable pins that rotates with the rotation of the rotating table can pass. Concentrating on the rotation direction of the above-mentioned rotary table and corresponding to only one of the plurality of movable pins a magnetic field generating region that can be provided by the driving magnet, and a repulsive force or an attractive force is applied to the driving magnet of the movable pin passing through the magnetic field generating region, and the movable pin is pressed by the pressing unit to the holding position. The support portion generates a force toward the open position against the pressing force; the first relative moving unit causes the open magnetic The iron and the rotating table relatively move between a first position where the magnetic field generating region is formed in a region where each driving magnet passes, and a second position where the magnetic field generating region is not formed in a region where each driving magnet passes; the substrate The processing method includes a rotating table rotating step of rotating the rotating table about the rotation axis, a processing liquid supply step of supplying a processing liquid to a substrate that rotates in accordance with rotation of the rotating table, and an open magnet disposing step, which is the same as The rotating table rotating step and the processing liquid supplying step are performed in parallel with the relative position of the open magnet and the rotating table at the first position.

According to this method, the processing liquid is supplied to the main surface of the substrate in a rotating state. The processing liquid supplied to the main surface of the substrate flows toward the peripheral portion of the substrate by the centrifugal force generated by the rotation of the substrate. Thereby, the peripheral portion of the substrate is subjected to liquid treatment using the treatment liquid.

Further, in parallel with the rotation of the turntable and the supply of the processing liquid, the relative position of the open magnet and the turntable is placed at the first position where the magnetic field generating region is formed in the region where the respective driving magnets pass. In this case, the contact support position of the movable pin to the substrate can be changed in accordance with the change in the rotational phase of the rotary table. Therefore, the processing liquid can be supplied to the entire region of the peripheral portion of the substrate, whereby the peripheral portion of the substrate can be satisfactorily processed without causing the processing residue.

The above and other objects, features and advantages of the invention will be apparent from

1‧‧‧Substrate processing unit

2‧‧‧Processing unit

3‧‧‧Control device

4‧‧‧Processing chamber

5‧‧‧Rotary chuck

6‧‧‧Drug nozzle

7‧‧‧Drug supply unit

8‧‧‧Water supply unit

10‧‧‧ cleaning brush

10a‧‧‧cleaning surface

11‧‧‧ cleaning brush drive unit

12‧‧‧Protective gas supply unit

14‧‧‧Pharmaceutical piping

15‧‧‧Drug valve

17‧‧‧Rotary drive unit

21‧‧‧Nozzle arm

22‧‧‧Nozzle mobile unit

41‧‧‧ water nozzle

42‧‧‧Water piping

43‧‧‧Water valve

45‧‧‧Protection valve

47‧‧‧Swing arm

48‧‧‧arm drive unit

103‧‧‧Rotary drive unit

107‧‧‧Rotary table

108‧‧‧Rotary axis

109‧‧‧Seat

110‧‧‧Distributable

110a‧‧‧able sales

110b‧‧‧able sales

110c‧‧‧able sales

110d‧‧‧Distributable

110e‧‧‧able sales

110f‧‧‧able sales

111‧‧‧1st movable group

112‧‧‧2nd movable group

115‧‧‧protection disk

115a‧‧

116‧‧‧Incision

117‧‧‧Guide axis

118‧‧‧Linear bearings

119‧‧‧Guide unit

120‧‧‧Flange

125‧‧‧Closed permanent magnet

126‧‧‧Inside lifting unit

127‧‧‧Open permanent magnet

128‧‧‧Outer lifting unit

129‧‧‧Magnetic field generating area

130‧‧‧Shielding members

131‧‧‧Shield

141‧‧‧Magnetic floating unit

142‧‧‧Magnetic drive unit

151‧‧‧lower shaft

152‧‧‧Upper shaft

153‧‧‧ Cone

154‧‧‧ bearing

155‧‧‧Support shaft

156‧‧‧Drive permanent magnets

157‧‧‧ Magnet holding member

160‧‧‧Protection disk side permanent magnet

161‧‧‧ Magnet holding member

162‧‧‧through holes

170‧‧‧Inert gas supply pipe

172‧‧‧Inert gas supply road

173‧‧‧Inert gas valve

174‧‧‧Inert gas flow adjustment valve

175‧‧‧ bearing unit

176‧‧‧ recess

177‧‧‧ spacers

178‧‧‧ bearing

179‧‧‧Magnetic fluid bearings

181‧‧‧Flange

182‧‧‧flow path

183‧‧‧Sloping surface

184‧‧‧ Cover

184a‧‧‧Flange

185‧‧‧ recess

186‧‧‧Rectifying components

187‧‧‧ feet

188‧‧‧ bottom

189‧‧‧ sloped surface

190‧‧‧ Throttling Department

191‧‧‧ Cover

192‧‧‧ring plate

193‧‧‧Cylinder

194‧‧‧ incision

A1‧‧‧Rotation axis

A2‧‧‧ Swing axis

A3‧‧‧Rotation axis

B‧‧‧Center axis

C‧‧‧ Carrier

CR‧‧‧Center Robot

Dr‧‧‧Rotation direction

H1‧‧‧Hands

H2‧‧‧Hands

IR‧‧ ‧ indexing robot

LP‧‧‧Loader

S1~S14‧‧‧Steps

TU‧‧‧Flip unit

W‧‧‧Substrate

Wa‧‧‧ surface

Wb‧‧‧ back

Fig. 1 is a schematic plan view for explaining the layout of the inside of a substrate processing apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view for explaining a configuration example of a processing unit provided in the substrate processing apparatus.

Fig. 3 is a plan view for explaining a more specific configuration of a rotary chuck provided in the substrate processing apparatus.

Figure 4 is a bottom plan view showing the configuration of Figure 3.

Fig. 5 is a cross-sectional view taken from the cut surface line V-V of Fig. 3.

Fig. 6 is an enlarged cross-sectional view showing a part of the configuration of Fig. 5 in an enlarged manner.

Fig. 7 is an enlarged cross-sectional view showing the configuration of the vicinity of the movable pin of the rotary chuck.

Fig. 8A is a schematic view showing a state of each movable pin in a state where both the inner lifting permanent magnet and the outer lifting magnet are in the lower position.

Fig. 8B is a schematic view showing a state of each of the movable pins in a state where the inner lifting permanent magnet is in the upper position and the outer lifting magnet is in the lower position.

Fig. 8C is a schematic view showing the state of each of the movable pins in a state where the inner lifting permanent magnet and the outer lifting magnet are both in the upper position.

9A to 9F are views showing a state transition of each of the movable pins during a period in which the rotary table rotates once.

Fig. 10 is a block diagram for explaining an electrical configuration of a main part of the substrate processing apparatus.

Fig. 11 is a flowchart for explaining an example of processing liquid processing performed by the above substrate processing apparatus.

12A to 12G are diagrams for explaining a processing example of the above-described treatment liquid treatment.

13A and 13B are views showing a state in which the treatment liquid flows back at each time when the movable pin is at the holding position and when the movable pin is at the intermediate position.

Fig. 13C is a cross-sectional view showing the flow of the treatment liquid and the inert gas in the peripheral portion of the substrate.

Fig. 1 is a schematic plan view for explaining the layout of the inside of the substrate processing apparatus 1 according to an embodiment of the present invention.

The substrate processing apparatus 1 is a one-chip apparatus in which a disk-shaped substrate W including a semiconductor wafer (semiconductor substrate) is processed one by one by a processing liquid or a processing gas. The substrate processing apparatus 1 includes a loading cassette LP that holds a plurality of carriers C, an inverting unit TU that inverts the posture of the substrate W, and a plurality of processing units 2 that process the substrate W. The loading cassette LP and the processing unit 2 are arranged at intervals in the horizontal direction. The inverting unit TU is disposed on a transport path of the substrate W that is transported between the loading cassette LP and the processing unit 2.

As shown in FIG. 1 , the substrate processing apparatus 1 further includes: an indexing robot IR disposed between the loading cassette LP and the reversing unit TU; and a central robot CR disposed between the reversing unit TU and the processing unit 2; And a control device 3 that controls the operation of the device provided in the substrate processing device 1 or the switching of the valve. The indexing robot IR transports the plurality of substrates W one by one to the reversing unit TU from the carrier C held in the loading cassette LP, and transports the plurality of substrates W one by one from the reversing unit TU to the carrier C held on the loading cassette LP. . Similarly, the center robot CR self-reversing unit TU transports the plurality of substrates W to the processing unit 2 one by one, and transports the plurality of substrates W from the processing unit 2 to the reversing unit TU piece by piece. The center robot CR further transports the substrate W between the plurality of processing units 2.

The indexing robot IR has a hand H1 that supports the substrate W horizontally. The indexing robot IR moves the hand H1 horizontally. Furthermore, the indexing robot IR makes the hand H1 moves up and down and rotates the hand H1 about the vertical axis. Similarly, the center robot CR has a hand H2 that horizontally supports the substrate W. The center robot CR moves the hand H2 horizontally. Further, the center robot CR raises and lowers the hand H2 and rotates the hand H2 about the vertical axis.

In the carrier C, the substrate W is housed in a state in which the surface Wa of the substrate W as the device formation surface faces upward (upward posture). The control device 3 transports the substrate W from the carrier C to the reversing unit TU with the surface Wa (see FIG. 2 and the like) facing upward by the indexing robot IR. Then, the control device 3 inverts the substrate W by the inverting unit TU. Thereby, the back surface Wb (refer FIG. 2, etc.) of the board|substrate W is upward. Thereafter, the control device 3 transports the substrate W from the reversing unit TU to the processing unit 2 with the back surface Wb facing upward by the center robot CR. Then, the control device 3 processes the back surface Wb of the substrate W by the processing unit 2.

After the back surface Wb of the substrate W is processed, the control device 3 transports the substrate W from the processing unit 2 to the reversing unit TU with the back surface Wb facing upward by the center robot CR. Then, the control device 3 inverts the substrate W by the inverting unit TU. Thereby, the surface Wa of the substrate W faces upward. Thereafter, the control device 3 transports the substrate W from the reversing unit TU to the carrier C with the surface Wa facing upward by the indexing robot IR. Thereby, the processed substrate W is accommodated in the carrier C. The control device 3 processes the plurality of substrates W piece by piece by repeatedly performing the series of operations by the indexing robot IR or the like.

FIG. 2 is a schematic cross-sectional view for explaining a configuration example of the processing unit 2 provided in the substrate processing apparatus 1. FIG. 3 is a plan view for explaining a more specific configuration of the rotary chuck 5 provided in the substrate processing apparatus 1. Figure 4 is a bottom plan view showing the configuration of Figure 3. Fig. 5 is a cross-sectional view taken from the cut surface line V-V of Fig. 3. Figure 6 is an enlarged view An enlarged cross-sectional view of one of the components of 5. Fig. 7 is a cross-sectional view showing an enlarged configuration of the vicinity of the movable pin 110 of the rotary chuck 5.

As shown in FIG. 2, the processing unit 2 comprises a box-shaped processing chamber 4 having an internal space, and a rotary chuck (substrate holding rotating device) 5 for holding a substrate W in a horizontal posture in the processing chamber 4. And rotating the substrate W around the vertical axis of rotation A1 passing through the center of the substrate W; a chemical supply unit (processing liquid supply unit) 7 for feeding the upper surface of the substrate W held by the rotary chuck 5 (one main surface) Wb) An ozone-containing hydrofluoric acid solution (hereinafter referred to as FOM) as an example of a chemical solution (treatment liquid); and a water supply unit (treatment liquid supply unit) 8 for rotating The upper surface of the substrate W held by the chuck 5 is supplied with water as a eluent (treatment liquid); the cleaning brush 10 is for scrubbing cleaning of the upper surface in contact with the upper surface of the substrate W; the cleaning brush driving unit 11 a cleaning gas supply unit 12 for supplying an inert gas as a shielding gas to a lower surface (surface (the other main surface) Wa) of the substrate W held by the rotary chuck 5; A cylindrical processing cup (not shown) surrounds the rotating chuck 5.

As shown in Fig. 2, the processing chamber 4 includes a box-shaped partition wall (not shown), and an FFU (fan ‧ filter ‧ unit, not shown) as a blowing unit, which faces the partition wall from the upper portion of the partition wall The inside (corresponding to the inside of the processing chamber 4) delivers clean air; and an exhaust device (not shown) that discharges the gas in the processing chamber 4 from below the partition wall. A downflow (downflow) is formed in the processing chamber 4 by the FFU and the exhaust device.

As shown in FIG. 2, the rotary chuck 5 is provided with a rotary table 107 rotatable about a rotation axis A1 along the vertical direction. A rotating shaft 108 is coupled to the lower surface of the rotation center of the rotary table 107 via a boss 109. The rotating shaft 108 is a hollow shaft extending in the vertical direction and configured to be rotated by the driving force from the rotary driving unit 103. The axis A1 rotates. The rotary drive unit 103 may be, for example, an electric motor in which the rotary shaft 108 is a drive shaft.

As shown in FIG. 2, the rotary chuck 5 further includes a plurality of (six in the present embodiment) movable pins 110 which are provided at substantially equal intervals in the circumferential direction around the peripheral portion of the upper surface of the rotary table 107. Each of the movable pins 110 is configured to maintain the height of the substrate above the rotating table 107 having a substantially horizontal upper surface at a fixed interval, and to keep the substrate W horizontal. That is, all of the holding pins provided in the rotary chuck 5 are the movable pins 110.

The rotary table 107 is formed in a disk shape along a horizontal plane, and is coupled to a boss 109 coupled to the rotating shaft 108.

As shown in FIG. 3, each of the movable pins 110 is disposed at equal intervals in the circumferential direction on the peripheral portion of the upper surface of the rotary table 107. Each of the movable pins 110 has a specification common to each other. The six movable pins 110 are set to one group in units of three movable pins 110 that are not adjacent to each other. In FIG. 3, the group of the movable pin 110a, the movable pin 110c, and the movable pin 110e and the movable pin 110b, the movable pin 110d, and the movable pin 110f are set to be different from each other.

In other words, the six movable pins 110 include three movable pins 110a, 110c, 110e (110) included in the first movable pin group 111 (FIG. 9A, etc.), and three movable pins 110b included in the second movable pin group 112. 110d and 110f (110), the movable pin 110 included in the first movable pin group 111 and the movable pin 110 included in the second movable pin group 112 (FIG. 9A and the like) are alternately arranged in the circumferential direction of the rotary table 107. . When focusing on the first movable pin group 111, the three movable pins 110 are arranged at equal intervals (120° intervals). Further, when attention is paid to the second movable pin group 112, the three movable pins 110 are arranged at equal intervals (120° intervals).

Each movable pin 110 includes: a lower shaft portion 151 coupled to the rotary table 107; and an upper shaft portion (support portion) 152 integrally formed at an upper end of the lower shaft portion 151; and the lower shaft portion 151 and the upper shaft portion 152 are each formed in a cylindrical shape. The upper shaft portion 152 is eccentrically disposed from the center axis of the lower shaft portion 151. A surface connecting the upper end of the lower shaft portion 151 and the lower end of the upper shaft portion 152 is formed as a tapered surface 153 which is lowered from the upper shaft portion 152 toward the circumferential surface of the lower shaft portion 151.

As shown in FIG. 7, the movable pin 110 is coupled to the rotary table 107 such that the lower shaft portion 151 is rotatable about a rotation axis A3 coaxial with the central axis thereof. More specifically, a support shaft 155 that is supported by the turntable 107 via a bearing 154 is provided at a lower end portion of the lower shaft portion 151. A magnet holding member 157 holding a driving permanent magnet (driving magnet) 156 is coupled to the lower end of the support shaft 155. The driving permanent magnet 156 is disposed, for example, such that the magnetic pole direction is directed in a direction orthogonal to the rotation axis A3 of the movable pin 110. Each of the driving permanent magnets 156 is provided in a direction orthogonal to the rotation axis A3 (in the state in which the external force is not applied to the movable pin 110 corresponding to the driving permanent magnet 156) The directions in which the axes of the axes are orthogonal to each other are the same in the direction of the magnetic poles.

The driving permanent magnet 156 is disposed in such a manner that when the attraction magnetic force from the closed permanent magnet (closed magnet) 125 (the magnetic force exceeding the elastic pressing force of the elastic pressing member) is received, the upper shaft portion 152 faces the rotation axis. The position of A1 is moved.

As shown in FIG. 2, a plurality of open permanent magnets (open magnets) 127 are disposed below the turntable 107 along the circumferential direction of the turntable 107. Specifically, three arc-shaped shapes centering on the rotation axis A1 (the same number as the number of the movable pins 110 included in each of the movable pin groups 111 and 112) are formed, and the permanent magnets 127 are attached to each other at a height position common to each other. Further, they are arranged at intervals in the circumferential direction of the turntable 107. 3 The open permanent magnets 127 have the same specifications as each other, and are disposed at equal intervals in the circumferential direction on a circumference coaxial with the rotation axis A1. Each of the open permanent magnets 127 is disposed along a plane (horizontal plane) orthogonal to the rotation axis A1. More specifically, the open permanent magnet 127 is disposed at substantially the same position as the driving permanent magnet 156 with respect to the rotation axis A1 or slightly outside the radial direction of the driving permanent magnet 156 (FIG. 3 and FIG. 4). Medium, indicating the situation of roughly the same position). The circumferential length (angle) of each of the open permanent magnets 127 is about 30°. The reason why the circumferential length (angle) of each of the open permanent magnets 127 is about 30° is set in such a manner that when the substrate W is rotated at a liquid processing speed (for example, about 500 rpm), it is formed as follows. The length of the magnetic field generating region 129 (see FIG. 9A and the like) in the annular region that is rotated by the rotation of the rotary table 107 is approximately 60° in the circumferential direction (the arrangement interval of the movable pin 110 in the circumferential direction). Consistent.

In the present embodiment, the magnetic pole directions of the respective open permanent magnets 127 are along the vertical direction. The upper surface of each of the open permanent magnets 127 has a ring-shaped magnetic pole opposite to the magnetic pole of the upper surface of the closed permanent magnet 125. When the upper surface of the closed permanent magnet 125 is, for example, an S pole, the upper surface of each of the open permanent magnets 127 also has S poles of the same polarity.

The open permanent magnet 127 is coupled to an outer lift unit (first relative movement unit) 128 that uniformly raises and lowers the plurality of open permanent magnets 127. The outer lift unit 128 is configured to include, for example, a cylinder that is expandable and contractable in the vertical direction, and is supported by the cylinder. Further, the outer lift unit 128 may be configured using an electric motor. Further, the outer lift unit 128 can also raise and lower the open permanent magnets 127 individually.

The open permanent magnet 127 is disposed at a position where the magnetic pole approaches the driving permanent magnet 156 in the vertical direction (first position, see FIG. 12C) and is permanently opened. In a state where the magnet 127 and the driving permanent magnet 156 face each other, a magnetic force acts between the open permanent magnet 127 and the driving permanent magnet 156.

As shown in FIG. 2, a closed permanent magnet (closed magnet) 125 is disposed below the turntable 107. An inner lifting unit (second relative moving unit) 126 that moves the closing permanent magnet 125 up and down is coupled to the closed permanent magnet 125. The inner lift unit 126 is configured to include, for example, a cylinder that is expandable and contractable in the vertical direction, and is supported by the cylinder. Further, the inner lift unit 126 may be configured using a drive motor.

The closed permanent magnet 125 is formed in an annular shape coaxial with the rotation axis A1, and is disposed along a plane (horizontal plane) orthogonal to the rotation axis A1. More specifically, the closed permanent magnet 125 is disposed closer to the rotation axis A1 than to the protective disk side permanent magnet 160 and closer to the drive permanent magnet 156. That is, the annular closed permanent magnet 125 is located between the protective disk side permanent magnet 160 and the driving permanent magnet 156 in plan view. Further, the closed permanent magnet 125 is disposed at a position lower than the protective disk side permanent magnet 160. In the present embodiment, the direction of the magnetic pole of the closed permanent magnet 125 is along the horizontal direction, that is, the direction of the radius of rotation of the turntable 107. In the case where the protective disk side permanent magnet 160 has the S pole on the lower surface, the closed permanent magnet 125 has the same magnetic pole, that is, the S pole, in a ring shape in the inner side in the radial direction.

The closed permanent magnet 125 is disposed in a state in which the annular magnetic pole is opposed to the driving permanent magnet 156 in the horizontal direction (the third position, see FIGS. 8B and 12B), and acts on the closed permanent magnet. The magnetic force between the 125 and the driving permanent magnet 156 causes the movable pin 110 to be driven toward the holding position and held in its holding position.

A shielding member 130 is disposed below the rotating table 107, and the shielding structure is The member 130 shields the magnetic field generated by the open permanent magnet 127 from the magnetic field generated by the enclosed permanent magnet 125. The shield member 130 includes three shield plates 131 (the same number as the number of open permanent magnets 127) arranged in a circular arc shape arranged at intervals in the circumferential direction of the turntable 107. Each of the shield plates 131 is formed in an arc shape centering on the rotation axis A1. The three shielding plates 131 have the same specifications as each other, and are disposed at equal intervals in the circumferential direction on a circumference coaxial with the rotation axis A1. Each of the shield plates 131 is disposed inside the closed permanent magnet 125. The three shield plates 131 are provided in one-to-one correspondence with the three open permanent magnets 127. One of the group shield plates 131 and the open permanent magnets 127 are disposed in the same angular direction as viewed from the rotation axis A1. Further, one of the group shield plates 131 and the open permanent magnets 127 corresponding to each other are identical to each other. Each of the shield plates 131 may be attached to the closed permanent magnet 125 so as to be integrally lifted and lowered with the closed permanent magnet 125, or may be attached to another support member that cannot be relatively rotated with respect to the rotary table 107 and that cannot be lifted and lowered. The upper and lower widths of the shield plates 131 are set to a size that completely shields the magnetic field generated by the open permanent magnet 127 from the magnetic field generated by the closed permanent magnet 125.

As described above with reference to Fig. 7, the movable pin 110 has the upper shaft portion 152 at a position eccentric from the rotation axis A3. That is, the central axis B of the upper shaft portion 152 is shifted from the rotation axis A3. Therefore, by the rotation of the lower shaft portion 151, the upper shaft portion 152 is closer to the rotation axis at a position farther away from the rotation axis A1 (the center axis B) (refer to FIG. 8A below) and (the center axis B). The position of A1 is shifted (see Fig. 8B below). The upper shaft portion 152 of the movable pin 110 is pressed toward the open position by the elastic pressing force of an elastic pressing member (not shown) such as a spring. Therefore, when the driving permanent magnet 156 is not subjected to the attraction magnetic force from the closed permanent magnet 125, the movable pin 110 is located at an open position away from the rotation axis A1.

As shown in FIG. 2, the rotary chuck 5 further includes a protective disk 115 disposed between the upper surface of the rotary table 107 and the substrate holding height based on the movable pin 110. The protection disk 115 is coupled to be movable up and down with respect to the rotary table 107, and is positionable below the upper surface of the rotary table 107 and above the lower position and on the lower surface of the substrate W held by the movable pin 110. Moves close to the close position by a small interval. The protective disk 115 has a disk-shaped member having a diameter slightly larger than the size of the substrate W, and a slit 116 for avoiding the movable pin 110 is formed at a position corresponding to the movable pin 110.

The rotating shaft 108 is a hollow shaft, and an inert gas supply pipe 170 is inserted therein. An inert gas supply path 172 for introducing an inert gas as an example of a shielding gas from an inert gas supply source is incorporated at a lower end of the inert gas supply pipe 170. As the inert gas introduced along the inert gas supply path 172, a clean dry air (Clean Dry Air, CDA) (clean air of low humidity) or an inert gas such as nitrogen gas can be exemplified. An inert gas valve 173 and an inert gas flow rate adjustment valve 174 are interposed in the middle of the inert gas supply path 172. The inert gas valve 173 switches the inert gas supply path 172. The inert gas is supplied to the inert gas supply pipe 170 by opening the inert gas valve 173. The inert gas system is supplied to a space between the protective disk 115 and the lower surface of the substrate W by the following constitution. In this manner, the inert gas supply pipe 170, the inert gas supply path 172, the inert gas valve 173, and the like constitute the above-described shielding gas supply unit 12.

The protective disk 115 is a substantially disk-shaped member having the same size as the substrate W. A slit 116 is formed in a peripheral portion of the protective disk 115 at a position corresponding to the movable pin 110 so as to rim the movable pin 110 at a fixed interval from the outer peripheral surface of the movable pin 110. A circular opening corresponding to the boss 109 is formed in a central portion of the protective disk 115.

As shown in FIGS. 3 and 5, a guide shaft 117 extending in the vertical direction parallel to the rotation axis A1 is coupled to the lower surface of the protection disk 115 at a position farther from the rotation axis A1 than the boss 109. In the present embodiment, the guide shafts 117 are disposed at three locations that are equally spaced apart in the circumferential direction of the protection disk 115. More specifically, when viewed from the rotation axis A1, three guide shafts 117 are disposed at angular positions corresponding to every other movable pin 110. The guide shaft 117 is coupled to the linear bearing 118 provided at a corresponding portion of the rotary table 107, and is movable in a direction perpendicular to the rotation axis A1 while being guided by the linear bearing 118. Therefore, the guide shaft 117 and the linear bearing 118 constitute a guide unit 119 that guides the protection disk 115 in the up-and-down direction parallel to the rotation axis A1.

The guide shaft 117 penetrates the linear bearing 118 and has a flange 120 that protrudes outward at a lower end thereof. By the flange 120 abutting against the lower end of the linear bearing 118, the upward movement of the guide shaft 117, that is, the upward movement of the protection disk 115 is restricted. That is, the flange 120 is a restricting member that restricts the upward movement of the protection disk 115.

A magnet holding the protective disk side permanent magnet 160 is fixed to the lower surface of the protection disk 115 at a position farther from the rotation axis A1 than the guide shaft 117 and closer to the inner side than the rotation axis A1. The member 161 is held. In the present embodiment, the disk-side permanent magnet 160 is held by the magnet holding member 161 with the magnetic pole direction oriented in the vertical direction. For example, the protective disk side permanent magnet 160 may be fixed to the magnet holding member 161 so as to have an S pole on the lower side and an N pole on the upper side. In the present embodiment, the magnet holding members 161 are provided at six intervals at equal intervals in the circumferential direction. More specifically, each of the magnet holding members 161 is disposed at an angular position corresponding to the intermediate movable pin 110 (the middle in the present embodiment) when viewed from the rotation axis A1. Furthermore, it is composed of 6 magnets when viewed from the rotation axis A1. Three guide shafts 117 are disposed in each of the six angular regions of the iron holding member 161 (in the present embodiment, the angular position is the center position of the angular region).

As shown in FIG. 4, a through hole 162 is formed in the rotating table 107 at six locations corresponding to the six magnet holding members 161. Each of the through holes 162 is formed such that the corresponding magnet holding members 161 can be inserted in the vertical direction parallel to the rotation axis A1. When the protection disk 115 is in the lower position, the magnet holding member 161 is inserted through the through hole 162 and protrudes to be lower than the lower surface of the rotary table 107, and the protection disk side permanent magnet 160 is located closer to the lower surface of the rotary table 107. Below.

When the closed permanent magnet 125 is at the upper position (see FIG. 12B), a repulsive magnetic force acts between the closed permanent magnet 125 and the protective disk side permanent magnet 160, and the disk side permanent magnet 160 is protected from an upward external force. Thereby, the protective disk 115 is held at a processing position close to the lower surface of the substrate W from the magnet holding member 161 holding the protective disk side permanent magnet 160 by the upward force.

The closed permanent magnet 125 is disposed at a position downward (downward from the upper position (see FIG. 12B) (the fourth position, see FIG. 12B, etc.), and the repulsion between the closed permanent magnet 125 and the protective disk side permanent magnet 160 is disposed. The magnetic force is small, and therefore, the protective disk 115 is held close to the upper surface of the rotary table 107 by its own weight. Further, since the closed permanent magnet 125 does not oppose the driving permanent magnet 156, the movable pin 110 does not act on the movable pin 110 to apply a force to the holding position.

Therefore, when the closed permanent magnet 125 is in the lower position, the protective disk 115 is located near the upper surface of the rotary table 107, and the movable pin 110 is held in its open position. In this state, the center robot CR that carries and unloads the substrate W with respect to the spin chuck 5 can bring the hand H2 into the protective disk 115 and the substrate W. The space between the surfaces.

The protective disk side permanent magnet 160, the closed permanent magnet 125, and the inner lifting unit 126 constitute a magnetic force that lifts the protective disk 115 upward from the surface of the rotating table 107 by the repulsive force between the permanent magnets 125, 160 and leads to the processing position. The floating unit 141. Further, the driving permanent magnet 156, the closing permanent magnet 125, and the inner lifting unit 126 constitute a magnetic driving unit 142 that holds the movable pin 110 in its holding position by the magnetic force between the permanent magnets 125 and 156.

That is, the magnetic floating unit 141 and the magnetic driving unit 142 share the closed permanent magnet 125 and the inner lifting unit 126. Moreover, when the closed permanent magnet 125 is in the upper position, the disk 115 is held in the close position by the magnetic repulsion between the permanent magnet 125 and the protective disk side permanent magnet 160, and the permanent magnet 125 and the permanent drive are closed. The magnetic attraction between the magnets 156 maintains the movable pin 110 in its holding position.

As shown enlarged in Fig. 6, the boss 109 coupled to the upper end of the rotating shaft 108 holds a bearing unit 175 for supporting the upper end portion of the inert gas supply pipe 170. The bearing unit 175 includes a spacer 177 that is fitted and fixed to a recess 176 formed in the boss 109, a bearing 178 disposed between the spacer 177 and the inert gas supply tube 170, and a magnetic fluid bearing 179 that is the same It is disposed between the spacer 177 and the inert gas supply pipe 170 and above the bearing 178.

As shown in FIG. 5, the boss 109 integrally has a flange 181 that protrudes outward along the horizontal plane, and a rotary table 107 is coupled to the flange 181. Further, the spacer 177 is fixed to the flange 181 so as to sandwich the inner peripheral edge portion of the turntable 107, and the cover portion 184 is coupled to the spacer 177. The cover portion 184 is formed in a substantially disk shape and has an opening at the center for exposing the upper end of the inert gas supply pipe 170. The mouth is formed with a recess 185 having a bottom surface as the opening. The recess 185 has a horizontal bottom surface and an inverted conical surface inclined surface 183 rising upward from the peripheral edge of the bottom surface toward the outer side. A rectifying member 186 is coupled to the bottom surface of the recess 185. The rectifying member 186 has a plurality of (for example, four) leg portions 187 that are discretely arranged at intervals in the circumferential direction about the rotation axis A1, and are disposed by the foot portions 187 spaced apart from the bottom surface of the recesses 185. Bottom 188. An inclined surface 189 including an inverted conical surface extending obliquely upward from the peripheral portion of the bottom surface 188 toward the outer side is formed.

As shown in FIGS. 5 and 6, a flange 184a is formed on the outer peripheral edge of the upper surface of the cover portion 184 toward the outer side. The flange 184a is aligned with the step portion 115a formed on the inner circumference of the protection disk 115. That is, when the protection disk 115 is located close to the lower surface of the substrate W, the flange 184a is in contact with the step portion 115a, and the upper surface of the cover portion 184 is in the same plane as the upper surface of the protection disk 115 to form a flat inertness. Gas flow path.

With this configuration, the inert gas system flowing out from the upper end of the inert gas supply pipe 170 flows into the space in the recess 185 of the cover portion 184 which is defined by the bottom surface 188 of the rectifying member 186. The inert gas is further blown in a radial direction away from the rotation axis A1 via the inclined flow surface 183 of the recess 185 and the radial flow path 182 defined by the inclined surface 189 of the flow regulating member 186. The inert gas system forms a gas stream of an inert gas in a space between the protective disk 115 and a lower surface of the substrate W held by the movable pin 110, and is blown out from the space toward the outer side in the direction of the radius of rotation of the substrate W.

As shown in FIG. 5, the peripheral portion of the upper surface of the protective disk 115 and the peripheral end of the protective disk 115 are protected by an annular cover portion 191. The cover portion 191 includes an annular plate portion 192 that protrudes in the horizontal direction from the peripheral edge portion of the upper surface toward the radially outer side, and a cylindrical portion 193 that hangs from the circumferential end of the annular plate portion 192. The outer circumference of the annular plate portion 192 is located It is closer to the outside than the peripheral end of the rotary table 107. The annular plate portion 192 and the cylindrical portion 193 are integrally formed using, for example, a resin material having chemical resistance. A slit 194 for avoiding the movable pin 110 is formed at a position corresponding to the movable pin 110 at the inner circumference of the annular plate portion 192. The slit 194 is formed by edging the movable pin 110 at a fixed interval from the outer peripheral surface of the movable pin 110. The annular plate portion 192 and the cylindrical portion 193 are integrally formed using, for example, a resin material having chemical resistance.

The annular plate portion 192 of the cover portion 191 is provided with a throttle portion 190 that restricts a flow path of the inert gas at a peripheral portion of the substrate W held by the movable pin 110 on the upper surface (see FIG. 13C). By the throttle unit 190, the flow rate of the inert gas flow which is blown outward from the space between the cover portion 191 and the lower surface of the substrate W becomes high, and therefore, the treatment liquid on the upper surface of the substrate W can be surely prevented or suppressed. (The liquid medicine or the eluent) enters to the inner side of the peripheral portion of the lower surface of the substrate W.

As shown in FIG. 2, the chemical solution supply unit 7 includes a chemical liquid nozzle 6 that discharges FOM (medicine solution) toward the upper surface of the substrate W, a nozzle arm 21 to which a chemical liquid nozzle 6 is attached, and a nozzle movement. The unit 22 moves the liquid chemical nozzle 6 by moving the nozzle arm 21.

The chemical liquid nozzle 6 is, for example, a DC nozzle that discharges the FOM in a continuous flow state, and is attached to the nozzle arm 21 in a vertical posture in which the FOM is discharged in a direction perpendicular to the upper surface of the substrate W, for example. The nozzle arm 21 extends in the horizontal direction and is provided to be rotatable around a circumference of the rotary chuck 5 around a predetermined pivot axis (not shown) extending in the vertical direction.

The chemical solution supply unit 7 includes a chemical liquid pipe 14 that guides the FOM to the chemical liquid nozzle 6 and a chemical liquid valve 15 that switches the chemical liquid pipe 14. When the chemical liquid valve 15 is opened, the FOM from the FOM supply source is supplied from the chemical liquid pipe 14 to the chemical liquid nozzle 6. Thereby, the FOM is discharged from the chemical liquid nozzle 6.

The nozzle moving unit 22 horizontally moves the chemical liquid nozzle 6 along the locus of the central portion of the upper surface of the substrate W in a plan view by rotating the nozzle arm 21 about the swing axis. The nozzle moving unit 22 sets the processing position of the chemical liquid nozzle 6 on the upper surface of the substrate W by the FOM discharged from the chemical liquid nozzle 6, and the starting position of the chemical liquid nozzle 6 around the rotary chuck 5 in a plan view. Move between horizontally. Further, the nozzle moving unit 22 causes the chemical liquid nozzle 6 to immerse the FOM discharged from the chemical liquid nozzle 6 at the center of the upper surface of the upper surface of the substrate W and the FOM discharged from the chemical liquid nozzle 6 to be liquid on the substrate W. The peripheral position of the peripheral portion of the surface moves horizontally. The central position and the peripheral position are processing positions.

Further, the chemical liquid nozzle 6 may be a fixed nozzle in which the discharge port is fixedly disposed at a predetermined position (for example, a central portion) of the upper surface of the substrate W.

As shown in FIG. 2, the water supply unit 8 includes a water nozzle 41. The water nozzle 41 is, for example, a DC nozzle that discharges liquid in a state of continuous flow, and the discharge port is fixedly disposed above the spin chuck 5 toward the central portion of the upper surface of the substrate W. A water pipe 42 for supplying water from the water supply source is connected to the water nozzle 41. A water valve 43 for switching the supply/supply stop of the water from the water nozzle 41 is interposed in the middle of the water pipe 42. When the water valve 43 is opened, the water supplied from the water pipe 42 to the continuous flow of the water nozzle 41 is discharged from the discharge port set at the lower end of the water nozzle 41. Moreover, when the water valve 43 is closed, the supply of water from the water pipe 42 to the water nozzle 41 is stopped. The water is, for example, deionized water (DIW). It may be any of carbonated water, electrolytic ionized water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 ppm to 100 ppm), and is not limited to DIW.

Further, the water nozzle 41 need not be fixedly disposed with respect to the rotary chuck 5, and for example, a so-called scanning nozzle may be employed, and the scanning nozzle is mounted to be rotatable An arm that swings above the collet 5 in a horizontal plane scans the position of the water on the upper surface of the substrate W by the swing of the arm.

The cleaning brush 10 is a sponge-like scouring member containing, for example, polyvinyl alcohol (PVA), and is formed in a cylindrical shape. The cleaning brush 10 is a cleaning surface 10a having a flat shape on its lower surface. The cleaning surface 10a functions as a contact surface that comes into contact with the upper surface of the substrate W.

The cleaning brush drive unit 11 includes a swing arm 47 that holds the cleaning brush 10 at the front end portion, and an arm drive unit 48 that drives the swing arm 47. The arm drive unit 48 is configured to swing the swing arm 47 about the swing axis A2 extending in the vertical direction or to move the swing arm 47 up and down. According to this configuration, the cleaning brush 10 can be horizontally moved between the position above the substrate W and the starting position set to the side of the rotary chuck 5 when the substrate W is held by the rotary chuck 5 and rotated.

Further, the cleaning surface 10a of the cleaning brush 10 may be pressed against the upper surface (back surface Wb) of the substrate W, and the pressing position of the cleaning brush 10 may be between the central portion of the substrate W and the peripheral portion of the substrate W along the substrate W. Move in the radial direction (scan).

At the time of the scrubbing cleaning, water (for example, pure water (deionized water)) is supplied from the water nozzle 41, and foreign matter on the back surface Wb of the substrate W is easily eliminated, and the foreign matter wiped off by the cleaning brush 10 can be removed. Discharged toward the outside of the substrate W.

8A to 8C are schematic views showing the state of each of the movable pins 110. The state in which the closed permanent magnet 125 and the open permanent magnet 127 are both in the lower position is shown in Fig. 8A. Fig. 8B shows a state in which the closed permanent magnet 125 is in the upper position and the open permanent magnet 127 is in the lower position (second position). In Fig. 8C, the closed permanent magnet 125 and the open permanent magnet 127 are both in the upper position.

As described above, in each of the movable pins 110, the elastic pressing member (not shown) The movable pin 110 is pressed to the holding position. Therefore, in a state where no external force is applied to the movable pin 110, the movable pin 110 is pressed toward the open position by the elastic pressing force from the elastic pressing member (not shown). In the state in which the movable pin 110 is in the open position, the driving permanent magnet 156 is disposed such that the N pole faces the inside of the radial direction of the turntable 107 and the S pole faces the radially outer side of the turntable 107.

When the closed permanent magnet 125 and the open permanent magnet 127 are both in the lower position as shown in FIG. 8A, the magnetic force from the closed permanent magnet 125 and the open permanent magnet 127 does not act on the driving permanent magnet 156. Therefore, no external force is applied to the movable pin 110 and the movable pin 110 is in the open position.

The closed permanent magnet 125 is raised and placed in the upper position from the state shown in Fig. 8A. When the upper surface of the permanent magnet 125 is closed to approach the driving permanent magnet 156, a suction magnetic force is generated to the driving permanent magnet 156, and an attraction force is generated between the driving permanent magnet 156 and the closing permanent magnet 125. When the closed permanent magnet 125 is placed at the upper position, the magnitude of the suction magnetic force acting on the driving permanent magnet 156 exceeds the elastic pressing force of the elastic pressing member, whereby the upper shaft portion 152 is away from the rotation axis A1 (refer to the figure). 2) The open position moves toward the holding position near the rotation axis A1. Thereby, the movable pin 110 is pressed toward the holding position. In this state, as shown in FIG. 8B, the driving permanent magnet 156 is disposed such that the S pole faces the inside of the radial direction of the turntable 107 and the N pole faces the radially outer side of the turntable 107.

The open permanent magnet 127 is raised and placed in the upper position from the state shown in Fig. 8B. That is, as shown in FIG. 8C, each of the closed permanent magnet 125 and the open permanent magnet 127 is disposed at the upper position. When the upper surface of the open permanent magnet 127 approaches the driving permanent magnet 156, a suction magnetic force is generated to the driving permanent magnet 156, and an attraction force is generated between the driving permanent magnet 156 and the open permanent magnet 127. In other words The movable pin 110, which is pressed by the closed permanent magnet 125 to the holding position, generates a force that is directed toward the open position against such a pressing force. In the present embodiment, in the state in which each of the closed permanent magnet 125 and the open permanent magnet 127 is disposed at the upper position, the magnitude of the attractive magnetic force acting on the permanent magnet 156 for driving from the open permanent magnet 127 (with the elastic pressing force) The resultant force of the elastic pressing force of the member slightly exceeds the magnitude of the attractive magnetic force of the self-closing permanent magnet 125 acting on the driving permanent magnet 156. Therefore, in a state where the open permanent magnet 127 is placed at the upper position, the movable pin 110 is rotated a small amount toward the open position, and as a result, as shown in FIG. 8C, the upper shaft portion 152 is set between the open position and the held position. Move in the middle position. When the movable pin 110 is at the intermediate position, the center axis B of the upper shaft portion 152 is located, for example, in a direction away from the rotation axis A1 by a range of a few tenths of a mm, compared to when the movable pin 110 is in the holding position.

9A to 9F are views showing a plurality of movable pins 110 provided on the rotary table 107. When the open permanent magnet 127 is placed in the upper position (the state shown in FIG. 8C) and the rotating table 107 is rotated, the driving permanent magnet 156 that rotates with the rotation of the rotating table 107 passes through the annular region, and is interrupted. Three magnetic field generating regions 129 (the same number as the number of open permanent magnets 127) extending in the circumferential direction of the turntable 107 are disposed (in the circumferential direction at intervals). Each of the magnetic field generating regions 129 is a region where a magnetic field formed by the magnetic force of the open permanent magnet 127 is present. In the rotated state of the rotary table 107, the circumferential length (angle) of each of the magnetic field generating regions 129 is longer than the circumferential length (angle) of the corresponding open permanent magnet 127. The circumferential length (angle) of each of the magnetic field generating regions 129 (see FIG. 9A and the like) is set to about 60°.

The driving permanent magnet 156 that rotates in accordance with the rotation of the rotary table 107 passes through the annular region, and has a circumferential circumference of 60° at equal angular intervals. A region 129 is generated for three magnetic fields of length (angle). In this case, the three driving permanent magnets 156 corresponding to the three movable pins 110 included in the first movable pin group 111 simultaneously pass through the magnetic field generating region 129 or the three movable pins included in the second movable pin group 112. The three driving permanent magnets 156 corresponding to 110 simultaneously pass through the magnetic field generating region 129. In other words, in the state in which the three driving permanent magnets 156 corresponding to the three movable pins 110 included in the first movable pin group 111 pass through the magnetic field generating region 129, the three movable pins included in the second movable pin group 112 are included. The three driving permanent magnets 156 corresponding to 110 do not pass through the magnetic field generating region 129. In addition, in the state in which the three driving permanent magnets 156 corresponding to the three movable pins 110 included in the second movable pin group 112 pass through the magnetic field generating region 129, the three movable pins included in the first movable pin group 111 are included. The three driving permanent magnets 156 corresponding to 110 do not pass through the magnetic field generating region 129.

In the state where the open permanent magnet 127 is placed at the upper position, the three movable pins 110 corresponding to the three driving permanent magnets 156 that simultaneously pass through the magnetic field generating region 129 among the six movable pins 110 are disposed from the holding position to the intermediate position. Further, the three driving permanent magnets 156 passing through the magnetic field generating region 129 and the three movable pins included in the first movable pin group 111 are accompanied by a change in the phase of each of the movable pins 110 due to the rotation of the rotating table 107. The driving permanent magnet corresponding to 110 is switched between the driving permanent magnet corresponding to the three movable pins 110 included in the second movable pin group 112. In other words, the three movable pins 110 disposed at the intermediate position and the three movable pins 110 included in the first movable pin group 111 are movable along with the second movable pin 110 due to the rotation of the rotary table 107. The three movable pins 110 included in the pin group 112 are switched.

In the state shown in FIG. 9A, the three movable pins 110a, 110c, 110e and the three open permanent magnets 127 included in the first movable pin group 111 are on the rotary table 107. Since they are aligned in the circumferential direction, the three driving permanent magnets 156 (see FIG. 8C and the like) corresponding to the three movable pins 110a, 110c, and 110e included in the first movable pin group 111 are respectively present in the magnetic field generating region 129. . Therefore, the attraction magnetic force from the open permanent magnet 127 is generated in the three movable pins 110a, 110c, and 110e included in the first movable pin group 111, and the three movable pins 110a, 110c, and 110e included in the first movable pin group 111 are included. Configured in the middle position (open). On the other hand, the three driving permanent magnets 156 (see FIG. 8C and the like) corresponding to the three movable pins 110b, 110d, and 110f included in the second movable pin group 112 are not present in the magnetic field generating region 129. Therefore, the three movable pins 110b, 110d, and 110f included in the second movable pin group 112 are disposed at the holding position (closed). The state in which the rotational phase of the rotary table 107 is advanced from the state shown in Fig. 9A in the rotational direction Dr is shown in Fig. 9B.

In the state shown in FIG. 9B, the three movable pins 110a, 110c, and 110e and the three open permanent magnets 127 included in the first movable pin group 111 are shifted in the circumferential direction of the turntable 107, but the first movable pin group The three movable pins 110a, 110c, 110e included in 111 are still present in the magnetic field generating region 129. Therefore, the three movable pins 110a, 110c, and 110e included in the first movable pin group 111 are still disposed at the intermediate position (open). On the other hand, the three movable pins 110b, 110d, and 110f included in the second movable pin group 112 are still disposed in the magnetic field generating region 129 because the corresponding three driving permanent magnets 156 (see FIG. 8C and the like) are not present. Keep the position (closed). The state in which the rotational phase of the rotary table 107 is further advanced from the state shown in Fig. 9B in the rotational direction Dr is shown in Fig. 9C.

In the state shown in FIG. 9C, the three movable pins 110a, 110c, and 110e included in the first movable pin group 111 are separated from the magnetic field generating region 129, respectively. Therefore, the three movable pins 110a, 110c, and 110e included in the first movable pin group 111 are disposed. Keep the position (closed). Instead of this, the three movable pins 110b, 110d, and 110f included in the second movable pin group 112 enter the magnetic field generating region 129. Therefore, the three movable pins 110b, 110d, and 110f included in the second movable pin group 112 are included. Configured in the middle position (open). The state in which the rotational phase of the rotary table 107 is further advanced from the state shown in Fig. 9C in the rotational direction Dr is shown in Fig. 9D.

In the state shown in FIG. 9D, the three movable pins 110b, 110d, and 110f included in the second movable pin group 112 and the three open permanent magnets 127 are aligned in the circumferential direction of the turntable 107. Therefore, the three movable pins 110a, 110c, and 110e included in the first movable pin group 111 are disposed at the intermediate position (open). On the other hand, the three movable pins 110a, 110c, and 110e included in the first movable pin group 111 are still disposed in the magnetic field generating region 129 because the corresponding three driving permanent magnets 156 (see FIG. 8C and the like) are not present. Keep the position (closed). The state in which the rotational phase of the rotary table 107 is further advanced from the state shown in Fig. 9D in the rotational direction Dr is shown in Fig. 9E.

In the state shown in FIG. 9E, the three movable pins 110b, 110d, and 110f included in the second movable pin group 112 are separated from the magnetic field generating region 129, respectively. Therefore, the three movable pins 110b, 110d, and 110f included in the second movable pin group 112 are disposed at the holding position (closed). Instead of this, the three movable pins 110a, 110c, and 110e included in the first movable pin group 111 enter the magnetic field generating region 129. Therefore, the three movable pins 110a, 110c, and 110e included in the first movable pin group 111 are included. Configured in the middle position (open). The state in which the rotational phase of the rotary table 107 is further advanced from the state shown in Fig. 9E in the rotational direction Dr is shown in Fig. 9F.

In the state shown in FIG. 9F, the three movable pins 110a, 110c, and 110e included in the first movable pin group 111 are separated from the magnetic field generating region 129, respectively. Therefore, the three movable pins 110a, 110c, and 110e included in the first movable pin group 111 are disposed. Keep the position (closed). Instead of this, the three movable pins 110b, 110d, and 110f included in the second movable pin group 112 enter the magnetic field generating region 129. Therefore, the three movable pins 110b, 110d, and 110f included in the second movable pin group 112 are included. Configured in the middle position (open). The state in which the rotational phase of the rotary table 107 is further advanced from the state shown in Fig. 9C in the rotational direction Dr is shown in Fig. 9D.

FIG. 10 is a block diagram for explaining an electrical configuration of a main part of the substrate processing apparatus 1.

The control device 3 controls the operations of the rotary drive unit 103, the nozzle moving unit 22, the arm drive unit 48, the inner lift unit 126, the outer lift unit 128, and the like in accordance with a predetermined program. Further, the control device 3 controls switching operations and the like of the chemical liquid valve 15, the water valve 43, the inert gas valve 173, the inert gas flow rate adjusting valve 174, and the like.

FIG. 11 is a flowchart for explaining an example of cleaning processing as the processing liquid processing performed by the processing unit 2. 12A to 12G are diagrams for explaining a processing example of the above processing. Figs. 13A and 13B are views showing a state in which the treatment liquid flows back at each time when the movable pin 110 is at the holding position and when the movable pin 110 is at the intermediate position. Fig. 13C is a cross-sectional view showing the flow of the treatment liquid and the inert gas in the peripheral portion of the substrate W.

Description will be made with reference to FIGS. 1 , 2 to 7 and 11 . Further, reference is made to Figs. 12A to 12G and Figs. 13A to 13C as appropriate.

The processing unit 2 is, for example, a substrate (hereinafter sometimes referred to as "uncleaned substrate") W processed by a pretreatment device such as an annealing device or a film forming device. An example of the substrate W is a circular crucible substrate. The processing unit 2 is, for example, the back surface of the substrate W opposite to the surface Wa (the other main surface, the device forming surface) Wb (one main surface, the device is not formed) is cleaned.

The carrier C containing the uncleaned substrate W is transferred from the pretreatment apparatus to the substrate processing apparatus 1 and placed on the loading cassette LP. In the carrier C, the substrate W is housed in a state in which the surface Wa of the substrate W faces upward. The control device 3 transports the substrate W from the carrier C to the reversing unit TU with the surface Wa facing upward by the indexing robot IR. Then, the control device 3 inverts the conveyed substrate W by the inverting unit TU (S1: substrate inversion). Thereby, the back surface Wb of the substrate W is made upward. Then, the control device 3 takes out the substrate W from the reversing unit TU by the hand H2 of the center robot CR, and carries the substrate W into the processing unit 2 with the back surface Wb facing upward (step S2).

The chemical liquid nozzle 6 is retracted to a starting position set to the side of the rotary chuck 5 before being carried into the substrate W. Further, the cleaning brush 10 is also retracted to the starting position set to the side of the rotary chuck 5. Further, since both the closed permanent magnet 125 and the open permanent magnet 127 are disposed at the lower position, the driving permanent magnets 156 are not subjected to the attracting magnetic force from the closed permanent magnet 125 and the attracting magnetic force from the open permanent magnet 127, respectively. Except for the elastic pressing force from the elastic pressing member (not shown), no external force is applied to each of the movable pins 110. Therefore, as shown in Fig. 8A, each of the movable pins 110 is located at the open position.

Further, since the closed permanent magnet 125 is disposed at the lower position, the closed permanent magnet 125 largely moves away from the turntable 107 downward, so that the repulsive magnetic force acting between the closed permanent magnet 125 and the protective disk side permanent magnet 160 is small. Therefore, the protection disk 115 is located near the upper surface of the rotary table 107. Thereby, a sufficient space for the hand H2 of the center robot CR to enter is ensured between the substrate holding height based on the movable pin 110 and the upper surface of the protective disk 115.

The hand H2 of the center robot CR is higher than the movable pin 110 The substrate W is conveyed to the upper side of the rotary chuck 5 while the substrate W is held at the upper end. Thereafter, the hand H2 of the center robot CR is lowered toward the upper surface of the rotary table 107 as shown in Fig. 12A. Then, the control device 3 controls the inner lift unit 126 to raise the closed permanent magnet 125 (inside lift magnet) to the upper position (step S3, open magnet arrangement step). Thereby, as shown in FIG. 8B, each of the movable pins 110 is driven from the open position toward the holding position and held in its holding position. Thereby, the substrate W is held by the six movable pins 110. The substrate W is held by the rotary chuck 5 with its surface Wa facing downward and its back surface Wb facing upward.

Thereafter, the hand H2 of the center robot CR passes between the movable pins 110 and retreats toward the side of the rotary chuck 5.

Further, during the process in which the closed permanent magnet 125 is raised upward, the closed permanent magnet 125 approaches the disk side permanent magnet 160 from the lower direction, and the distance between the permanent magnets 125 and 160 is reduced. The repulsive magnetic force between them becomes larger. By the repulsive magnetic force, the protective disk 115 is caused to float from the upper surface of the rotary table 107 toward the substrate W. Then, until the closed permanent magnet 125 reaches the upper position, as shown in FIG. 12B, the protective disk 115 reaches an approaching position close to the surface Wa (lower surface) of the substrate W with a slight interval, and is formed on the guide shaft 117. The lower end flange 120 abuts against the linear bearing 118. Thereby, the protective disk 115 is held at the above-mentioned close position. In this state, the control device 3 opens the inert gas valve 173, and as shown in Fig. 12B, the supply of the inert gas is started (S4: the supply of the inert gas is started). The supplied inert gas system is discharged from the upper end of the inert gas supply pipe 170, and is moved toward the narrow space between the protective disk 115 located at the approximate position and the surface Wa (lower surface) of the substrate W by the action of the rectifying member 186 or the like. Radially blown around the rotation axis A1.

Thereafter, the control device 3 controls the rotation driving unit 103 to start the rotation of the rotary table 107 (rotation table rotation step), whereby the substrate W is rotated about the rotation axis A1 as shown in Fig. 12C (step S5). The rotation speed of the substrate W is raised to a predetermined liquid processing speed (in the range of 300 to 1500 rpm, for example, 500 rpm), and is maintained at the liquid processing speed.

After the rotation speed of the substrate W reaches the liquid processing speed, the control device 3 performs a FOM supply step of supplying the FOM to the back surface Wb of the substrate W (processing liquid supply step, step S6). In the FOM supply step (S6), the control device 3 moves the chemical liquid nozzle 6 from the home position to the center position by controlling the nozzle moving unit 22. Thereby, the chemical liquid nozzle 6 is disposed above the central portion of the substrate W. After the chemical liquid nozzle 6 is disposed above the substrate W, the control device 3 opens the chemical liquid valve 15, whereby the FOM is discharged from the discharge port of the chemical liquid nozzle 6 and is immersed in the central portion of the back surface Wb of the substrate W. The FOM supplied to the central portion of the back surface Wb of the substrate W is radially expanded toward the peripheral edge portion of the back surface Wb of the substrate W by the centrifugal force generated by the rotation of the substrate W. Therefore, the FOM can extend over the entire area of the back surface Wb of the substrate W.

In the FOM supply step (S6), a ruthenium oxide film is formed on the back surface Wb of the substrate W as a tantalum substrate by the oxidation of ozone contained in the FOM. Further, by the etching action of the hydrofluoric acid oxide film contained in the FOM, scratches (notches, recesses, and the like) formed on the back surface Wb of the substrate W are removed, and foreign matter is also removed from the back surface Wb of the substrate W ( Particles, impurities, exfoliates of the back surface Wb of the substrate W, and the like).

In the FOM supply step (S6), the inert gas system discharged from the upper end of the inert gas supply pipe 170 is directed toward the protective disk 115 located at the approximate position and the surface Wa (lower surface) of the substrate W by the action of the rectifying member 186 or the like. The narrow space between them is radially blown around the rotation axis A1. The inert gas is as shown in Figure 13C. Further, it is accelerated by a flow hole formed between the throttle portion 190 formed in the annular plate portion 192 of the cover portion 191 disposed on the peripheral edge portion of the protective disk 115 and the peripheral edge portion of the substrate W, and is formed on the substrate W. The side forms a high velocity blown air stream. In the present embodiment, by using the supply of the inert gas to the surface Wa (lower surface) of the substrate W of the protective disk 115, the treatment liquid is not completely prevented from flowing back toward the surface Wa (lower surface) of the substrate W, but only The treatment liquid flows back to the peripheral region of the surface Wa (lower surface) of the substrate W (small range of about 1.0 mm from the circumferential end of the substrate W), and the peripheral region of the surface Wa (lower surface) is cleaned. Further, by forming a high-speed blown air stream, the amount of return is accurately controlled. The flow amount depends on the supply flow rate of the treatment liquid on the upper surface of the substrate W, the supply flow rate of the inert gas to the lower surface of the substrate W, the rotation speed of the substrate W, and the like.

Further, in the FOM supply step (S6), the control device 3 controls the outer lift unit 128 to raise the open permanent magnet 127 from the position up to the upper position and to the upper position. The control device 3 arranges the open permanent magnet 127 at the upper position at substantially the same timing as the discharge from the FOM of the chemical liquid nozzle 6. In the state where the open permanent magnet 127 is placed at the upper position, the three movable pins 110 corresponding to the three driving permanent magnets 156 that simultaneously pass through the magnetic field generating region 129 among the six movable pins 110 are disposed from the holding position to the intermediate position. Further, as the phase of each of the movable pins 110 due to the rotation of the rotary table 107 changes, as shown in FIGS. 12C and 12D, the three movable pins 110 disposed at the intermediate position are included in the first movable pin group 111. The root movable pin 110 is switched between the three movable pins 110 included in the second movable pin group 112. As a result, as shown in FIGS. 9A to 9C, the substrate W is supported by the three movable pins 110 included in the first movable pin group 111 (see FIG. 9A and the like) and the third movable pin group 112 is included. The state in which the root movable pin 110 supports the substrate W (refer to FIG. 9C, etc.) Change between. In other words, the contact support position of the movable pin 110 of the peripheral edge portion of the substrate W can be changed in accordance with the change in the rotational phase of the rotary table 107.

The flow back of the FOM on the ideal support position (6 in the circumferential direction) of the movable pin 110 on the substrate W was investigated. When the movable pin 110 is in the holding position, the FOM supplied to the upper surface of the substrate W interferes with the shaft portion 152 on the circumferential end surface of the contact substrate W as shown in FIG. 13A. Therefore, in a state where the movable pin 110 is at the holding position at the ideal supporting position (6 in the circumferential direction), the FOM supplied to the upper surface of the substrate W cannot be returned to the lower surface of the substrate W via the peripheral end surface of the substrate W. The peripheral area.

On the other hand, in a state where the movable pin 110 is at the intermediate position, as shown in FIG. 13B, a predetermined gap (small gap) is formed with the circumferential end surface of the substrate W. With regard to this gap, the gap can be adjusted to a desired size by finely adjusting the position of the position above the open permanent magnet 127 (that is, the distance between the open permanent magnet 127 and the driving permanent magnet 156). The FOM supplied to the upper surface of the substrate W can flow back to the peripheral region of the lower surface of the substrate W via the peripheral end surface of the substrate W via the gap. For example, the gap is a fraction of a few mm (small gap). In this case, the FOM can be caused to flow back to the peripheral end surface of the substrate W and the peripheral region of the lower surface of the substrate W via the minute gap by the capillary force of the FOM.

The FOM supply step (S6) ends when a predetermined period has elapsed since the start of the discharge of the FOM. Specifically, the control device 3 closes the chemical liquid valve 15 and stops the discharge of the FOM from the chemical liquid nozzle 6. Further, the control device 3 moves the chemical liquid nozzle 6 from the center position to the home position. Thereby, the chemical liquid nozzle 6 is retracted from above the substrate W.

After the completion of the FOM supply step (S6), the water as the eluent is supplied to the back surface Wb of the substrate W (S7: elution step, treatment liquid supply step).

Specifically, as shown in FIG. 12E, the control device 3 opens the water valve 43 and discharges water from the water nozzle 41 toward the center portion of the back surface Wb of the substrate W. The water discharged from the water nozzle 41 is immersed in the central portion of the back surface Wb of the substrate W covered by the FOM. The water in the central portion of the back surface Wb of the substrate W is affected by the centrifugal force generated by the rotation of the substrate W, and flows toward the peripheral portion of the substrate W on the back surface Wb of the substrate W, and faces the entire area of the back surface Wb of the substrate W. Expansion. Therefore, the FOM on the substrate W is washed away to the outside by the water and discharged to the periphery of the substrate W. Thereby, the FOM attached to the back surface Wb of the substrate W is replaced with water.

Further, in the elution step (S7), the open permanent magnet 127 is held at the upper position. In the state where the open permanent magnet 127 is placed at the upper position, the three movable pins 110 corresponding to the three driving permanent magnets 156 that simultaneously pass through the magnetic field generating region 129 among the six movable pins 110 are disposed from the holding position to the intermediate position. Further, as the phase of each of the movable pins 110 due to the rotation of the rotary table 107 changes, as shown in FIGS. 12E and 12F, the three movable pins 110 disposed at the intermediate position are included in the first movable pin group 111. The root movable pin 110 is switched between the three movable pins 110 included in the second movable pin group 112. As a result, as shown in FIGS. 9A to 9C, the substrate W is supported by the three movable pins 110 included in the first movable pin group 111 (see FIG. 9A and the like) and the third movable pin group 112 is included. The root movable pin 110 supports the transition between the state of the substrate W (refer to FIG. 9C and the like). That is, the support position of the movable pin 110 to the substrate W can be changed in accordance with the change in the rotational phase of the rotary table 107.

The flow back of the FOM on the support position (6 in the circumferential direction) of the movable pin 110 on the substrate W was investigated. When the movable pin 110 is in the holding position, the FOM supplied to the upper surface of the substrate W interferes with the shaft portion 152 on the circumferential end surface of the contact substrate W as shown in FIG. 13A. Therefore, it is impossible to supply to the substrate W. The FOM of the upper surface flows back to the peripheral region of the lower surface of the substrate W via the peripheral end surface of the substrate W.

On the other hand, in a state where the movable pin 110 is at the intermediate position, as shown in FIG. 13B, a predetermined gap (small gap) is formed with the circumferential end surface of the substrate W. With regard to this gap, the gap can be adjusted to a desired size by finely adjusting the position of the position above the open permanent magnet 127 (that is, the distance between the open permanent magnet 127 and the driving permanent magnet 156). Water supplied to the upper surface of the substrate W can be returned to the peripheral region of the lower surface of the substrate W via the peripheral end surface of the substrate W via the gap. For example, the gap is a fraction of a few mm (small gap). In this case, the FOM can be caused to flow back to the peripheral end surface of the substrate W and the peripheral region of the lower surface of the substrate W via the minute gap by the capillary force of the FOM. Thereby, the FOM attached to the peripheral end surface of the substrate W or the peripheral region of the lower surface of the substrate W can be washed away.

When a predetermined period of time has elapsed since the start of the discharge of water, the control device 3 controls the arm drive unit 48, and as shown in FIG. 12F, performs scrub cleaning with the back surface Wb of the substrate W of the cleaning brush 10 (S8: brush cleaning step, Treatment liquid supply step). Thereby, the back surface Wb of the substrate W is subjected to scrub cleaning by the cleaning brush 10 while supplying water. Specifically, the control device 3 controls the arm driving unit 48 to swing the swing arm 47 about the swing axis A2, thereby disposing the cleaning brush 10 from the initial position to the upper side of the substrate W, and lowering the cleaning brush 10, and cleaning the brush The cleaning surface 10a of 10 is pressed against the back surface Wb of the substrate W. Then, as shown in FIG. 12G, the control device 3 controls the arm driving unit 48 to move (scan) the pressing position of the cleaning brush 10 between the central portion of the substrate W and the peripheral portion of the substrate W. Thereby, the entire area of the back surface Wb of the substrate W is scanned by the pressing position of the cleaning brush 10, and the entire area of the back surface Wb of the substrate W is scrubbed by the cleaning brush 10. In the brush cleaning step (S8), the foreign matter peeled off in the FOM supply step (S6) It is scraped by scrubbing with the cleaning brush 10. Moreover, the foreign matter scraped off by the cleaning brush 10 is washed away by the water. Thereby, the peeled foreign matter can be removed from the back surface Wb of the substrate W.

After the cleaning brush 10 has been moved for a predetermined number of times (for example, four times), the control device 3 controls the arm driving unit 48 to return the cleaning brush 10 from above the rotating chuck 5 to the home position. Thereby, the brush cleaning step (S8) ends. Further, the control device 3 maintains the water valve 43 in an open state. Thereby, the water as the eluent is supplied to the back surface Wb of the substrate W, and the foreign matter scraped off by the cleaning brush 10 is discharged to the outside of the substrate W (S9: final rinsing step, processing liquid supply step).

When a predetermined period of time has elapsed since the start of the supply of water, the control device 3 closes the water valve 43 and stops the discharge of water from the water nozzle 41. Further, the control device 3 closes the inert gas valve 173 and stops the discharge of the inert gas from the inert gas supply pipe 170. Further, the control device 3 controls the outer lift unit 128 to lower the open permanent magnet 127 to the lower position. After that, the substrate W is sandwiched by the six movable pins 110, whereby the substrate W is firmly held.

Then, a spin drying step of drying the substrate W is performed (step S10). Specifically, the control device 3 controls the rotary drive unit 17, whereby the substrate W is accelerated to a dry rotation speed (for example, several thousand rpm) which is larger than the rotation speed from the FOM supply step (S6) to the final rinse step (S9). ), the substrate W is rotated at a dry rotation speed. Thereby, a large centrifugal force is applied to the liquid on the substrate W, and the liquid adhering to the substrate W is rubbed around the substrate W. In this way, the liquid is removed from the substrate W, and the substrate W is dried.

Then, when a predetermined period of time has elapsed after the high-speed rotation of the substrate W is started, the control device 3 controls the rotation driving unit 17 to stop the rotation of the substrate W by the rotary chuck 5 (step S11).

Then, the control device 3 controls the inner lift unit 126, whereby the closed permanent magnet 125 is lowered toward the lower position (step S12). Thereby, the distance between the closed permanent magnet 125 and the protective disk side permanent magnet 160 is enlarged, and the magnetic repulsion between them is gradually reduced. Along with this, the protective disk 115 is lowered toward the upper surface of the rotary table 107. Thereby, a space in which only the hand H2 of the center robot CR can enter is secured between the upper surface of the protective disk 115 and the surface Wa (lower surface) of the substrate W. On the other hand, since the closed permanent magnet 125 does not oppose the driving permanent magnet 156, the force is released when the movable pin 110 is pressed toward the holding position, and the movable pin 110 receives the elastic pressing force from the elastic pressing member (not shown). And configured towards an open location. Thereby, the holding of the substrate W is released.

Then, the substrate W is carried out from the processing chamber 4 (step S13). Specifically, the control device 3 controls the center robot CR in a state where all the nozzles or the like are retracted from above the rotary chuck 5, and the hand H2 is brought into the surface Wa (lower surface) of the protective disk 115 and the substrate W. The space between the spaces. Then, the hand H2 picks up the substrate W held by the movable pin 110, and then retreats toward the side of the rotary chuck 5. Thereby, the cleaned substrate W is carried out from the processing chamber 4.

The control device 3 transports the cleaned substrate W to the reversing unit TU by the hand H2 of the center robot CR. Then, the control device 3 inverts the conveyed substrate W by the reversing unit TU (step S14). Thereby, the surface Wa of the substrate W faces upward. Thereafter, the control device 3 takes out the substrate W from the reversing unit TU by the hand H1 of the indexing robot IR, and accommodates the cleaned substrate W to the carrier C with its surface Wa facing upward. The carrier C containing the cleaned substrate W is transported from the substrate processing apparatus 1 to a post-processing apparatus such as an exposure apparatus.

According to the above, according to the embodiment, the rotation with the rotary table 107 In turn, the supply of the processing liquid (S6 to S9 in Fig. 11) is placed in parallel with the open permanent magnet 127. In a state in which the open permanent magnet 127 is placed at the upper position, the phase of each of the movable pins 110 due to the rotation of the rotary table 107 changes, and the substrate is supported by the three movable pins 110 included in the first movable pin group 111. The state of W (see FIG. 9A and the like) is changed between the state in which the substrate W is supported by the three movable pins 110 included in the second movable pin group 112 (see FIG. 9C and the like). That is, the contact support position on the substrate W by the movable pin 110 can be changed in accordance with the change in the rotational phase of the rotary table 107. Therefore, the processing liquid (FOM, water) can be supplied to the entire region of the peripheral portion of the substrate W, whereby the peripheral portion of the substrate W can be satisfactorily treated without using the processing liquid to generate the processing residue.

Although an embodiment of the present invention has been described above, the present invention can be embodied in other forms.

For example, in the direction orthogonal to the rotation axis A3, the closing permanent magnets 125 are disposed inside and the open permanent magnets 127 are disposed outside, but the arrangement positions may be reversed.

Further, although the magnetic pole direction of the open permanent magnet 127 has been described as being along the vertical direction, the magnetic pole direction of the open permanent magnet 127 may be orthogonal to the rotation axis A3 of the movable pin 110.

Further, it is a function of a magnet for generating a magnetic attraction force with the permanent magnet 156 for driving, and a magnet for generating a repulsive magnetic force between the permanent magnet 160 for protecting the disk, but it is also possible to be closed. The permanent magnets 125 are separately provided with a magnet for generating a repulsive magnetic force with the protective disk side permanent magnet 160, and the closed permanent magnet 125 is guaranteed to function as a magnet for attracting a magnetic force with the driving permanent magnet 156. .

In this case, the direction of the magnetic pole of the closed permanent magnet 125 may be a direction orthogonal to the rotation axis A3 of the movable pin 110, and may not be the up-and-down direction.

Further, in the above-described embodiment, the driving permanent magnets 156 corresponding to the three movable pins 110 (that is, the three driving permanent magnets 156) simultaneously pass through the magnetic field generating region 129, but may be all six driving The driving permanent magnet 156 (that is, one or two driving permanent magnets 156) corresponding to one or two movable pins 110 in the permanent magnet 156 simultaneously passes through the magnetic field generating region 129. In this case, the support substrate W is not exchanged between the first and second movable pin groups 111 and 112 including the three movable pins 110, and one of the six movable pins 110 or the two movable pins 110 are simultaneously disposed. In the middle position, this action is sequentially performed for the six movable pins 110.

Further, although the movable permanent magnet 127 is disposed at the upper position and the movable pin 110 is disposed from the holding position to the intermediate position, the movable pin 110 may be disposed in a state where the open permanent magnet 127 is disposed at the upper position. Still configured in the hold position. However, in this case, the pressing force generated by the movable pin 110 (upper shaft portion 152) against the peripheral edge of the substrate W can be alleviated by the attraction magnetic force generated between the open permanent magnet 127 and the driving permanent magnet 156. That is, the movable pin 110 is not displaced by disposing the open permanent magnet 127 at the upper position, but the pressing force (switching force) of the movable pin 110 can be adjusted. In this case, the pressing force (switching force) of the movable pin 110 can be finely adjusted by adjusting the position above the open permanent magnet 127. That is, not only the adjustment of the gap but also the adjustment of the subtle pressing force (clamping force) can be performed.

In addition, the driving permanent magnet 156 is driven by the attraction magnetic force generated between the open permanent magnet 127 and the driving permanent magnet 156 and the attraction magnetic force generated between the closing permanent magnet 125 and the driving permanent magnet 156. Although it is described, it can also be generated by opening the permanent magnet 127 and the driving permanent magnet 156. The repulsive magnetic force and/or the repulsive magnetic force generated between the open permanent magnet 127 and the driving permanent magnet 156 drives the driving permanent magnet 156.

Further, the closing permanent magnet 125 is provided as a pressing unit that presses the driving permanent magnet 156 to the holding position, but an elastic pressing unit such as a spring that presses the driving permanent magnet 156 to the holding position may be provided instead of the closing permanent. Magnet 125.

Moreover, the number of the movable pins 110 is six, but it may be six or more. In this case, as long as the number of the movable pins 110 is even or plural, the number of the movable pins 110 included in the first movable pin group 111 and the movable pin 110 included in the second movable pin group 112 can be used. The number is set to be the same as each other, which is ideal from the viewpoint of layout. For example, when the number of the movable pins 110 is eight, the number of movable pins included in each of the movable pin groups 111 and 112 is four. In this case, the number of open permanent magnets 127 is also The number is the same as the number of the movable pins 110. For example, the surface to be processed is the back surface (device non-formation surface) Wb of the substrate W. However, the surface (device formation surface) Wa of the substrate W may be a processing target surface. In this case, the flip unit TU can also be revoked.

Further, the series of treatment liquid treatments is not limited to the removal of foreign matter, and the removal of impurities by metal and the removal of impurities buried in the membrane may be used. Further, the series of treatment liquid treatments may be an etching treatment and not a cleaning treatment.

In the above embodiment, FOM is used as the chemical liquid, but the chemical liquid supplied to the substrate W includes, for example, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, ammonia water, hydrogen peroxide water, or organic acid (for example, citric acid, oxalic acid). Or a liquid of at least one of an organic alkali metal (for example, TMAH: tetramethylammonium hydroxide), an organic solvent (for example, IPA: isopropyl alcohol, etc.), and a surfactant and an anticorrosive agent.

As the chemical solution supplied to the substrate W, it is more preferable to use diluted hydrofluoric acid (DHF), buffered hydrofluoric acid (BHF), and SC1 (including NH ₄ OH and H ₂ O _{2 )} . Liquid), FPM (liquid containing HF and H ₂ O ₂ ), and the like. In other words, instead of the FOM supply step (S6, T6), a chemical liquid supply step of supplying a chemical liquid containing one of the chemical liquids to the processing target surface of the substrate W can be performed as the medicine used in the chemical liquid supply step. For the liquid, DHF, BHF, SC1, FPM, etc. can be used. When such a liquid is used as the chemical liquid, the surface to be processed of the substrate W is not necessarily naked, and the surface to be processed of the substrate W may also include an oxide film (for example, a hafnium oxide film) and/or a nitride film (for example, nitrogen).矽 film).

Further, in the above description, the open permanent magnet 127 is disposed at the upper position in the entire period of the chemical liquid step (S7 to S9), but it may be used only in the chemical liquid step (S7 to S9). The permanent magnet 127 is placed in the upper position during a part of the period.

Further, in the above description, the open permanent magnet 127 is disposed at the upper position in the entire period of the rinsing step (S7 to S9), but may be used only in the rinsing step (S7 to S9). The permanent magnet 127 is placed in the upper position during a part of the period.

Further, the brush cleaning step (S8) may be abolished from the treatment liquid. In this case, the necessity of the final rinsing step (S9) is not performed, and therefore, the rinsing step (S9) can also be abolished.

Further, although the surface to be processed is described as the upper surface of the substrate W, the lower surface of the substrate W may be a processing target surface. In this case, the processing liquid is supplied to the lower surface of the substrate W, but the processing liquid is not used by allowing the substrate supporting position of the peripheral portion of the substrate W to flow back from the lower surface of the substrate W to the upper surface of the substrate W. The peripheral portion of the substrate W is treated satisfactorily with the treatment residue.

In addition, the case where the substrate processing apparatus 1 is a device for processing a disk-shaped semiconductor substrate has been described. However, the substrate processing apparatus 1 may be a device that processes a polygonal substrate such as a glass substrate for a liquid crystal display device.

The embodiments of the present invention have been described in detail, but these are merely specific examples for making the technical content of the present invention clear, and the present invention is not limited to the specific examples, and the scope of the present invention is only The scope of the patent application is limited.

This application corresponds to Japanese Patent Application No. 2015-192154 filed on September 29, 2015 to the Japanese Patent Office, and Japanese Patent Application No. 2016-30155 filed on February 19, 2016, to the Japanese Patent Office. All disclosures of these applications are incorporated herein by reference.

107‧‧‧Rotary table

110a‧‧‧able sales

110b‧‧‧able sales

110c‧‧‧able sales

110d‧‧‧Distributable

110e‧‧‧able sales

110f‧‧‧able sales

111‧‧‧1st movable group

112‧‧‧2nd movable group

127‧‧‧Open permanent magnet

129‧‧‧Magnetic field generating area

Dr‧‧‧Rotation direction

W‧‧‧Substrate

Claims (14)

A substrate holding rotation device comprising: a rotary table; a rotary drive unit that rotates the rotary table about a rotation axis along a vertical direction; and a movable pin that is used to support a plurality of movable pins horizontally of the substrate, a support portion movably disposed between a distant open position away from the rotation axis and a holding position adjacent to the rotation axis, and disposed to rotate around the rotation axis together with the rotating table; a pressure applying unit, The pressing portion of each movable pin is pressed to the holding position; the driving magnet is mounted corresponding to each movable pin; and the open magnet is an open magnet provided in a non-rotating state to form a rotating table. Each of the movable and rotatable movable pins can pass through the predetermined magnetic field generating region and is disposed in such a manner as to be concentrated in the rotating direction of the rotating table and can be passed through only the driving magnet corresponding to one of the plurality of movable pins. a magnetic field generating region that imparts a repulsive force or attraction to the driving magnet of the movable pin that passes through the magnetic field generating region Pressed by the pressing means in the holding position to the supporting portion of the movable pin can be generated against the urging force of the above-mentioned force toward the open position. The substrate holding rotating device according to claim 1, further comprising: a first relative moving unit that changes the distance between the open magnet and the driving magnet to rotate the opening magnet and the rotating The station moves relatively. The substrate holding rotating device according to claim 2, wherein the first relative moving unit causes the open magnet and the rotating table to form a first position of the magnetic field generating region in a region where each driving magnet passes, and each driving unit Area through which a magnet passes The relative movement between the second positions of the magnetic field generating regions is not formed. The substrate holding rotating device according to claim 3, wherein the support portion of the movable pin is disposed at an intermediate position between the open position and the holding position in a state where the open magnet and the rotating table are located at the first position . The substrate holding rotating device according to claim 1 or 2, wherein the pressing unit includes a closing magnet that applies a repulsive force or an attractive force to each of the driving magnets, and presses the support portion of each of the movable pins To the above holding position. The substrate holding rotating device of claim 5, further comprising: a second relative moving unit that applies the repulsive force between the closing magnet and the rotating table between the closing magnet and the driving magnet The third position of the attraction force and the closing magnet move relative to each other between the driving magnet and the fourth position where the repulsive force and the suction force are not provided. The substrate holding rotating device according to claim 1, wherein the open magnet includes a plurality of open magnets disposed at intervals in a circumferential direction of the turntable, and the magnetic field generating region formed in a region through which each of the driving magnets passes is The region of the above-mentioned rotating table that is interrupted in the direction of rotation. The substrate holding rotating device of claim 7, wherein the movable pin includes: a first movable pin group including at least three movable pins; and a second movable pin group separately provided from the first movable pin group, and And including at least three movable pins; and the driving magnets that are mounted corresponding to all of the movable pins are provided so as to have the same magnetic pole directions in a direction orthogonal to an axis along the rotation axis, and the plural The above-mentioned open magnets are arranged in the following manner, that is, in the first In a state in which each of the driving magnets corresponding to the movable pin group exists in the magnetic field generating region, each of the driving magnets corresponding to the second movable pin group does not exist in the magnetic field generating region, and the second movable pin In a state where each of the driving magnets corresponding to the group exists in the magnetic field generating region, each of the driving magnets corresponding to the first movable pin group does not exist in the magnetic field generating region. The substrate holding rotating device according to claim 8, wherein the first movable pin group includes the same number of the movable pins as the second movable pin group, and the first and second movable pin groups are attached to a circumference of the rotary table. Alternatingly, the plurality of movable pins included in each of the movable pin groups are arranged at equal intervals, and the plurality of open magnets are equal to the number of the movable pins included in each of the movable pin groups. The rotation stages are arranged at equal intervals in the circumferential direction. The substrate holding and rotating device according to any one of claims 7 to 9, wherein a rotation speed of the rotary table and/or a circumferential length of the open magnet is the magnetic field generation region formed by one of the open magnets It is set so that the arrangement|interval of the circumferential direction of the said movable pin may correspond in the circumferential direction of the said turntable. The substrate holding rotating device of claim 1 or 2, further comprising a shielding member that shields the magnetic field generated by the open magnet from the magnetic field generated by the closed magnet. A substrate processing apparatus comprising: the substrate holding rotating device of claim 1 or 2; and a processing liquid supply unit that supplies a processing liquid to a main surface of the substrate held by the substrate holding rotating device. The substrate processing apparatus of claim 12, further comprising: The first relative moving unit is configured such that the open magnet and the rotating table form the first position of the magnetic field generating region in a region where each driving magnet passes, and the magnetic field generating region does not form in a region where each driving magnet passes. a relative movement between the second positions; and a control unit that controls the rotation drive unit, the processing liquid supply unit, and the first relative movement unit; and the control unit performs a rotation table rotation step of winding the rotation table The rotation axis is rotated; the processing liquid supply step is to supply a processing liquid to the substrate that rotates in accordance with the rotation of the rotating table; and the open magnet disposing step is performed in parallel with the rotating table rotating step and the processing liquid supplying step The relative position of the open magnet and the rotating table is disposed at the first position. A substrate processing method for performing a substrate processing method performed in a substrate processing apparatus including a substrate holding rotating device and a first relative moving unit, wherein the substrate holding rotating device includes: a rotating table; and a rotary driving unit that winds the rotating table Rotating along a rotation axis in a vertical direction; a movable pin, which is a plurality of movable pins for horizontally supporting the substrate, having a movably disposed open position far from the rotation axis and close to the rotation axis a support portion between the positions is held, and is disposed to rotate around the rotation axis together with the rotating table; a pressing unit that presses the support portion of each movable pin to the holding position; and a driving magnet corresponding thereto And an open magnet that is an open magnet that is provided in a non-rotating state, and that forms a predetermined magnetic field generating region through which each of the movable pins that rotates with the rotation of the rotating table can pass, and is concentrated on the rotating table. Direction of rotation and only for multiple roots One of the movable pins, the magnetic field generating region through which the driving magnet can be provided, applies a repulsive force or an attractive force to the driving magnet of the movable pin passing through the magnetic field generating region, and is pressed by the pressing unit. The support portion of the movable pin to the holding position generates a force that is directed toward the open position against the pressing force, and the first relative moving unit causes the open magnet and the rotating table to form the above-described region in which each of the driving magnets passes a first position of the magnetic field generating region and a second position that does not form the magnetic field generating region in a region where each of the driving magnets passes; the substrate processing method includes a rotating table rotating step of rotating the rotating table Rotational axis rotation; a processing liquid supply step of supplying a processing liquid to a substrate that rotates in accordance with rotation of the rotating table; and an open magnet disposing step that opens in parallel with the rotating table rotating step and the processing liquid supply step The relative position of the magnet and the rotating table is disposed at the first position.