JPH1064880A - Substrate treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treatment device with which the lower surface of a wafer is uniformly treated, by uninterruptedly making a treating liquid reach the lower surface of the wafer. SOLUTION: A rotary board 21 contains arms 24 provided along the circumference thereof at equal angle spaces and treating liquid channel 70 formed between adjacent arms 24. Nozzles 11a, 11b, 11c, 11d, 11e, and 11f for jetting a liquid chemicals A, a liquid chemicals B and a pure water C are assigned diagonally below the rotary board 21. The nozzles are not assigned along the circumference at an equal angle, but, so that two nozzles for jetting the same kind of treating liquid are placed at an angle of 90 deg. with respect to a center axis O as a center. As a result, for example, the liquid chemicals A from the nozzle 11b reaches the lower surface of a wafer W through the channel 70 when the liquid chemicals A from the nozzle 11a is blocked with the arm 24. Conversely, when the liquid chemicals A from the nozzle 11b is blocked with the arm 24, the liquid chemicals A from the nozzle 11a reaches the lower surface of the wafer W through the channel 70.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
iquid Crystal Display) manufacturing equipment, PDP (Plasma Disp.
lay Panel) applied to manufacturing equipment or semiconductor manufacturing equipment,
The present invention relates to a substrate processing apparatus for performing processing on a substrate such as a glass substrate for LCD, a glass substrate for PDP, and a semiconductor wafer.

[0002]

2. Description of the Related Art LCDs, PDPs and ICs (Integrated
The circuit manufacturing process includes a process of forming an electronic circuit on a glass substrate, a semiconductor wafer, or the like. In the step of forming an electronic circuit on a substrate, a substrate processing apparatus for performing each of these surface treatments is used to clean the substrate surface or to form a thin film pattern on the substrate surface. This type of substrate processing apparatus is disclosed, for example, in Japanese Patent Publication No. 3-9607.

[0003] The devices disclosed in this publication include:
A rotatable rotation shaft and a spin chuck provided at the upper end of the rotation shaft for holding the substrate are provided. The spin chuck has a rotating head attached to the upper end of the rotating shaft, six spin arms protruding from the rotating head at equal angular intervals in the radial direction, and a standing upright end at the tip of the spin arm to hold the substrate. To hold the jaws.

Below the spin chuck, six nozzles for spraying the processing liquid substantially linearly toward the lower surface of the substrate are provided at substantially equal angular intervals along the circumference surrounding the spin chuck in plan view. It is arranged in. The nozzle is
Nozzles for injecting the same type of processing liquid are paired two by two. When the processing is started with the substrate being held by the holding claws, the spin chuck is rotated, and on the other hand, the processing liquid is simultaneously ejected from a predetermined pair of nozzles. As a result, the processing liquid sprayed from the nozzle passes between the spin arms and is sprayed on the lower surface of the substrate. This allows
Processing is performed on the lower surface of the substrate.

[0005]

However, in the apparatus disclosed in the above-mentioned publication, the spin arms and the nozzles are provided at equal angular intervals of six in a plan view, so that they are paired. There is a case where the processing liquid ejected from the nozzle which is in use is simultaneously blocked by the spin arm. Specifically, there are six times when the processing liquid is simultaneously blocked during one rotation of the spin arm.

As a result, depending on the type of the processing liquid, the processing performed on the substrate may be uneven, and the processing may not proceed uniformly. For example, in an etching process for shaving a thin film formed on a substrate by supplying an etching solution to the substrate, the erosion of the thin film proceeds rapidly when the etching solution is being applied, and the etching solution is blocked by the spin arm. Sometimes the erosion rate of the thin film becomes slow. Therefore, there is a problem that high-precision processing cannot be performed uniformly over the entire surface of the substrate.

It is an object of the present invention to solve the above-mentioned technical problems and to provide a substrate processing apparatus capable of supplying a processing liquid to a substrate without interruption.

[0008]

According to a first aspect of the present invention, there is provided a rotatable rotatable device having an upper surface and a lower surface, and a penetrating portion penetrating the upper surface and the lower surface. A substrate holding portion for holding a substrate on the upper surface side of the rotating member, and a lower surface of the substrate provided below the substrate holding portion and holding the same type of processing liquid on the substrate holding portion. And a plurality of nozzles for simultaneously supplying the processing liquid supplied from the plurality of nozzles, and a positional relationship between the through portion and a path of each processing liquid supplied from the plurality of nozzles is at least one of the plurality of nozzles. The substrate processing apparatus is characterized in that the processing liquid supplied from the substrate is defined so as to pass through a penetrating part formed in the substrate holding part and reach the lower surface of the substrate.

According to the present invention, the processing liquid supplied from at least one of the plurality of nozzles passes through the penetrating portion formed in the rotating member and reaches the lower surface of the substrate. I have. Specifically, for example, when a plurality of penetrating portions are formed along a circumference centered on the rotation center and a pair of nozzles are arranged along a circumference centered on the rotation center, The angle formed between the center and an arbitrary pair of penetrating portions is set to be different from the angle formed between the center of rotation and a pair of nozzles for supplying the same type of processing liquid to the lower surface of the substrate. More specifically, the angle between the rotation center and a pair of nozzles that supply the same type of processing liquid to the lower surface of the substrate is an angle formed by the rotation center and the path of the processing liquid of each nozzle in plan view. is there.

As described above, since the processing liquid supplied from at least one of the plurality of nozzles reaches the lower surface of the substrate, the processing liquid is supplied to the lower surface of the substrate without interruption. Is done.

[0011]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a simplified cross-sectional view showing a configuration of a substrate processing apparatus to which an embodiment of the present invention is applied. In this substrate processing apparatus, a processing liquid is supplied to a lower surface of a semiconductor wafer (hereinafter, simply referred to as “wafer”) W held by a holding mechanism 1 while the wafer W is rotated at a high speed in a cup 2. This is for subjecting W to a treatment with a chemical solution or a washing treatment with pure water.

The holding mechanism 1 is connected to a cylindrical rotary structure 3 provided so that the center axis O passes through the center of the held wafer W. The rotating structure 3 includes a cylindrical rotating shaft 4 and a chuck shaft 5 provided inside the rotating shaft 4. The rotating shaft 4 includes bearings 9a and 9b disposed on inner wall surfaces of upper and lower ends of a fixed cylindrical body 8 fixed via a mounting member 7 to a base 6 serving as a base of the apparatus.
And is rotated in a predetermined rotation direction by the driving force of the motor M. The chuck shaft 5 is a rotating shaft 4
A small diameter portion 5a extending from near the upper end of the base to below the base 6,
Large diameter portion 5b integrally formed above small diameter portion 5a
And a step surface formed between the small diameter portion 5a and the large diameter portion 5b is supported by the upper end surface of the rotating shaft 4.

In this embodiment, the holding mechanism 1, the rotary structure 3, and the chuck driving mechanism 30 correspond to a substrate holding unit. The cup 2 is supported by a support plate 10 that is fixedly arranged, and has an outer appearance formed by a cylindrical outer edge 2a that is inclined so as to decrease in diameter downward, and has an open upper surface. An undulating portion 2b is formed in the center of the bottom of the cup 2, and is raised. A circular hole is formed in the center of the undulating portion 2b, and the rotating structure 3 is inserted into the hole, and the holding mechanism 1 connected to the upper end thereof is accommodated in the cup 2. A drain port 2d to which a drain pipe 2c is connected is formed at the bottom of the cup 2, so that the processing liquid injected from the nozzle 11 and scattered in the cup 2 can be discharged to the outside.

On the inner wall of the outer edge 2a of the cup 2, six nozzles 11 (only two are shown in FIG. 1) for supplying a processing liquid to the lower surface of the wafer W are arranged. I have. The nozzle 11 is connected to a processing liquid supply tank (not shown), and the processing liquid is sprayed obliquely from below onto the lower surface of the wafer W held by the holding mechanism 1. The nozzles 11 are paired with each other by two nozzles 11 that eject the same type of processing liquid. For example, a nozzle pair for injecting the chemical solution A, a nozzle pair for injecting the chemical solution B, and a nozzle pair for injecting pure water are separated, and the processing liquid is simultaneously injected from each nozzle pair. .

The holding mechanism 1 has a rotary head 20 mounted on the upper end of the rotary shaft 4. Rotating head 20
An inner peripheral cylindrical portion 20a and an intermediate cylindrical portion 20b are formed integrally with the lower surface of the inner cylindrical portion so as to sandwich the protective cylindrical portion 8a attached to the upper end surface of the fixed cylindrical body 8 therebetween. 20a
, So that its inner peripheral surface is in close contact with the outer peripheral surface of the rotating shaft 4,
It is attached to the rotating shaft 4. On the lower surface of the rotary head 20, an outer peripheral cylindrical portion 20c is provided along the undulating portion 2b of the cup 2.

A rotary plate 21 is attached to the upper surface of the rotary head 20 with bolts 22. The rotating plate 21 includes an arm mounting portion 23 provided around the central axis O, and six (only two in FIG. 1) spin arms 24 integrally formed with the arm mounting portion 23. including. The spin arm 24 extends radially from the arm mounting portion 23 in the radial direction.

The tip of the spin arm 24 has a wafer W
Is provided with a holding claw 25 for holding the holding member. The six holding claws 25 include three fixed claws 25a and three movable claws 25b, and the fixed claws 25a and the movable claws 25b are alternately arranged. The fixed claw 25a is fixed to the tip of the spin arm 24 with a bolt (not shown). The movable claw 25b is attached to a tip end of the spin arm 24 so as to be rotatable around a vertical axis, and a swing arm 26 is integrally formed at a lower end thereof.

A pawl operation link 27 is provided at the tip of the swing arm 26.
Is connected, and the other end of the claw operation link 27 is rotatably connected to a claw operation member 28 attached to the upper end of the chuck shaft 5. The pawl operation link 27 swings in conjunction with the rotation of the chuck shaft 5. With this swing, the movable claw 25b rotates around a vertical axis,
The movable claw 25b is displaced between the chuck state and the chuck release state.

Near the lower end of the rotating shaft 4, a chuck shaft 5 is provided.
Is provided with a chuck drive mechanism 30 for rotating the rotary shaft 4 relatively to the rotary shaft 4. Chuck drive mechanism 30
Is a flange 30 attached to the outer peripheral surface of the rotating shaft 4.
a, base pin 30 projecting downward from flange 30a
b, a cylinder pin 30 projecting vertically from the chuck shaft 5
c, a coil spring 30d interposed between the base pin 30b and the cylinder pin 30c, and an air cylinder 30
e. The chuck shaft 5 is urged by a coil spring 30d in a direction in which the movable claw 25b is in a chuck state.

The air cylinder 30e is disposed on the lower surface of the base 6 such that the rod 30g faces the cylinder pin 30c while the rotating shaft 4 is stopped at a loading / unloading position described later. When pressurized air is supplied from an air supply source (not shown) to the air cylinder 30e so as to make the rod 30g protrude, the rod 3 protruding from the air cylinder 30e
0g pushes the cylinder pin 30c against the spring force of the coil spring 30d. As a result, the chuck shaft 5 is
Rotate relative to. Accordingly, the chuck shaft 5
The pawl operation link 27 provided on the upper end side of the oscillating member swings to rotate the movable pawl 25b from the chucked state to the chuck released state.

When the rod 30g of the air cylinder 30e is retracted, the chuck shaft 5 returns to the original position by the spring force of the coil spring 30d. As a result, the claw operation link 27 operates in the direction opposite to the direction in which it is displaced to the chuck release state, and the movable claw 25b returns to the original chuck state. In addition,
Reference numeral 30f is a stop pin. The stop pin 30f is
When the wafer W is not held by the holding mechanism 1 and the cylinder pin 30c is not pushed by the air cylinder 30e, the wafer W comes into contact with the base pin 30b, thereby displacing the chuck shaft 5. Is regulated.

A motor M for rotating the rotating shaft 4 is attached to the base 6. The motor M is, for example, an alternating current (AC) servo motor, and its rotation is controlled by the control unit 3.
5 is controlled. The motor M is
The pulley 36 is attached with the fixed drive shaft 37 facing upward. A pulley 38 is fixed to the rotary shaft 4 at a position corresponding to the pulley 36 of the drive shaft 37, and an endless belt 39 is looped between the pulleys 36, 38.

When the motor M is driven by the control unit 35, the driving force is transmitted to the drive shaft 37, and further transmitted to the rotary shaft 4 via a pulley 36, a belt 39 and a pulley 38.
Is transmitted to As a result, the rotary head 20 fixed to the upper end of the rotary shaft 4 rotates at high speed. The rotating head 20
Arm 24, movable claw 25b, claw operation link 2
7, and the chuck shaft 5 connected via the claw operating member 28 also rotates at high speed. That is, the entire holding mechanism 1 for holding the wafer W rotates together with the rotating shaft 4. At this time, the fixed cylinder 8 and the cup 2 do not rotate,
It is stationary.

A position detecting mechanism 40 for detecting the rotational position of the rotating shaft 4 is provided in relation to the lower end portion of the rotating shaft 4. The position detecting mechanism 40 is mounted on the outer peripheral surface of the rotary shaft 4 and has a rotary disk 40a having a notch at a predetermined position, and a transmissive type in which the rotary disk 40a is interposed between a light emitting element and a light receiving element. Of the photoelectric sensor 40b. The photoelectric sensor 40b outputs an ON signal if the notch formed in the rotating disk 40a is located between the light emitting element and the light receiving element of the photoelectric sensor 40b, and otherwise outputs an OFF signal. The ON / OFF signal is provided to the control unit 35.

The control section 35 controls the rotation of the motor M based on the on / off signal given from the photoelectric sensor 40b. For example, when receiving the wafer W carried by the arm of the transfer robot, the control unit 35 monitors the rotational position of the rotary shaft 4 based on the on / off signal, and controls the rotary shaft 4 to rotate at a predetermined rotational position (hereinafter, referred to as the rotational position). When it is determined that the position has reached the “load-in / load-out position”, the rotation of the motor M is stopped. Thereby, the rotary shaft 4 and the holding mechanism 1 can be roughly positioned near the carry-in / out position. The rotating shaft 4 and the holding mechanism 1 which are roughly positioned
Is accurately positioned at the loading / unloading position by the positioning mechanism 50.

The loading / unloading position is determined by the transfer robot arm transferring the wafer W to the holding mechanism 1 or the holding mechanism 1.
This is a position for preventing the holding claws 25 from interfering with the arm when taking out from the arm. Therefore, when the holding mechanism 1 is stopped at the loading / unloading position, loading / unloading of the wafer W can be performed smoothly. Base 6
Is attached to the rod 45a of the lift cylinder 45, and when the lift cylinder 45 extends / contracts,
It moves vertically between the home position shown by the solid line and the wafer receiving position shown by the two-dot chain line along the guides 46a and 46b. When the base 6 moves up / down, the rotary structure 3, the motor M, and the fixed cylinder 8 attached to the base 6 also move up / down, and furthermore, a clamp provided at the upper end of the rotary structure 3. The mechanism 1 also moves up / down.

The positioning mechanism 50 is for accurately positioning the roughly positioned holding mechanism 1 at the loading / unloading position, and includes a pin holder 5 attached to the outer periphery of the rotating shaft 4.
0a, a cylindrical positioning pin 5 attached to the pin holder 50a and extending in a direction perpendicular to the longitudinal direction of the rotating shaft 4.
0b, and a positioning member 50c. As shown in FIG. 2, the positioning member 50 c has a substantially rectangular parallelepiped shape fixed to the fixing member 60, and a substantially V-shaped groove 62 is formed in a substantially central portion of the lower surface 61 in the longitudinal direction of the rotating shaft 4. It is formed along a direction P2 perpendicular to P1. The positioning member 50c is such that the positioning pins 50b can be engaged with the grooves 62 when the base 6 is raised to the wafer receiving position, and in this state, the holding mechanism 1 is accurately positioned at the loading / unloading position. It is arranged in a position.

When the holding mechanism 1 is roughly positioned, the positioning pin 50b is located almost directly below the groove 62 of the positioning member 50c as shown by the solid line in FIG. When the base 6 is raised from this state, the rotating shaft 4 is raised, and accordingly, the pin holder 50a and the positioning pin 50 are moved.
b also rises. When the base 6 reaches the wafer receiving position,
The positioning pin 50b is engaged with the groove 62 as shown by a two-dot chain line in FIG. In this way, accurate positioning of the holding mechanism 1 is achieved.

The processing of the wafer W by the substrate processing apparatus will be briefly described as follows. That is, before the wafer W to be processed is transferred by the arm of the transfer robot (not shown), the rotating shaft 4 is rotated and stopped near the loading / unloading position based on the detection result of the position detection mechanism 40. Can be Thereby, the clamping mechanism 1
Are roughly positioned, and the positioning pin 50b is moved to a position immediately below the groove 62 formed in the positioning member 50c.

Thereafter, the rod 30 of the air cylinder 30e is
g of the coil spring 30.
It is pushed against the spring force of d. As a result, the chuck shaft 5
Rotates relative to the rotation shaft 4, and the claw operation link 27 moves in conjunction with the rotation. As a result, the holding claws 25 enter the chuck release state. Next, the elevating cylinder 45 is extended. As a result, the base 6 at the home position is raised, and accordingly, the rotating shaft 4 and the holding mechanism 1 are moved.
And so on. The extension operation of the lifting cylinder 45 is stopped when the holding mechanism 1 is raised to the wafer receiving position. Here, the wafer W is moved by the arm of the transfer robot.
Is conveyed and transferred to the holding mechanism 1.

On the other hand, when the holding mechanism 1 is raised to the wafer receiving position, the positioning pins 50b attached to the rotary shaft 4 are also raised, and the grooves 62 of the positioning member 50c are moved.
Engages. That is, as a result of the holding mechanism 1 being raised to the wafer receiving position, the holding mechanism 1 is accurately positioned at the loading / unloading position. Therefore, when the wafer W is transferred, the arms of the transfer robot and the holding claws 25 do not interfere with each other.

Thereafter, the rod 30 of the air cylinder 30e is
g is retracted, and the cylinder pin 30c is
It returns to the original position by the spring force of 0d. As a result, the holding claws 25 return to the chuck state. As a result, the wafer W is chucked by the holding claws 25. Then, lift cylinder 4
5 is contracted, and the base 6 is lowered. As a result, the holding claws 25 are also lowered, and the wafer W is accommodated in the cup 2. At this time, the positioning member 5 of the positioning pin 50b is used.
The engagement state with 0c is also released, and the positioning pin 50b is lowered to the position shown by the solid line in FIG.

Thereafter, the motor M is driven, and the rotating shaft 4 is rotated at high speed. The processing liquid is supplied to the nozzle 11 from the processing liquid supply unit, and the processing liquid is jetted obliquely upward from the nozzle 11. As a result, the processing liquid is supplied to the lower surface of the wafer W. In this way, the processing on the lower surface of the wafer W is performed. When the processing on the wafer W ends, the driving of the motor M and the supply of the processing liquid are stopped.
After the processing is completed, the holding mechanism 1 is roughly positioned by rotating the rotary shaft 4 and the elevating cylinder 45 is extended to operate the holding mechanism 1.
To the wafer receiving position. At this time, the holding mechanism 1 is accurately positioned at the loading / unloading position by the positioning mechanism 50.

The rod 30 of the air cylinder 30e is
g, so that the holding mechanism 1 is released from the chuck state.
Further, the arm of the transfer robot is inserted into the lower surface side of the wafer W. In this case, since the holding mechanism 1 is accurately positioned at the loading / unloading position, the arm and the holding claw 2 at the time of insertion are set.
5 does not interfere. As described above, according to the present embodiment, the positioning of the clamping mechanism 1 can be performed accurately only by raising the apparatus by the positioning mechanism 50.
The processing time can be shortened as a whole as compared with the case where a two-stage operation of raising the apparatus after positioning is required. As a result, the processing speed can be increased, and the processing efficiency can be significantly improved.

Further, since a positioning cylinder is not required, the configuration of the entire apparatus can be simplified and the cost of the apparatus can be reduced. FIG. 3 is a plan view showing the configuration inside the cup 2. Six spin arms 2 included in clamping mechanism 1
4 extends radially in the radial direction as described above, and a notched processing liquid passage 70 corresponding to a penetrating portion is formed between the adjacent spin arms 24. On the other hand, the nozzle 11 is provided on the inner wall of the cup 2 obliquely below the spin arm 24 so that the processing liquid is supplied to the lower surface of the wafer W through the processing liquid passage 70 formed between the adjacent spin arms 24. It is arranged in.

As described above, the nozzles 11 are paired with each other by two nozzles 11 that spray the same type of processing liquid.
Two nozzles 11a and 11b for injecting a chemical A, a chemical B
Nozzles 11c and 11d for injecting water and pure water C
Are sprayed into two nozzles 11e and 11f. The routes 71a and 71b of the chemical solution A ejected from the nozzles 11a and 11b are different routes. Similarly, the path 71 of the chemical solution B ejected from the nozzles 11c and 11d
The paths 71e and 71f of the pure water C injected from the nozzles c and 71d and the nozzles 11e and 11f are also different paths. That is, the processing liquid ejected from the paired nozzles is supplied to different positions on the lower surface of the wafer W. The paths 71a to 71f are all directed to the central axis O in plan view.

The spin arms 24 are formed at equal angular intervals in the radial direction in plan view. That is, the central axis O
The angle (hereinafter, referred to as “inter-arm angle”) from which the front end of the adjacent spin arm 24 is viewed is 60 degrees, as shown in FIG. On the other hand, the nozzles 11 are not arranged at equal angular intervals along the circumference surrounding the central axis O in plan view, and as shown in FIG. The nozzles are arranged along the circumference surrounding the central axis O such that the angle (hereinafter referred to as “nozzle angle”) at which the two nozzles are formed is not 60 × n (n is a natural number) degrees. .

Specifically, as shown in FIG. 4B, the nozzles 11a and 11b form a half line 72a extending from the central axis O to the nozzle 11a and a half line 72b extending from the central axis O to the nozzle 11b. They are arranged so that the angle is 90 degrees. The other nozzles 11c and 11d and the nozzles 11e,
Similarly, 11f is also disposed at 90 degrees apart.

For example, when the process using the chemical solution A is performed, the chemical solution A ejected from the nozzles 11a and 11b for ejecting the chemical solution A may be blocked by any of the spin arms 24 that are rotating. On the other hand, the nozzles 11a and 11b
Since the angle between the nozzles is set to 90 degrees instead of 60 × n degrees and the angle between the arms is set to 60 degrees, the chemical solution A injected from the two nozzles 11a and 11b
Are not interrupted by the spin arm 24 at the same time.

More specifically, as shown in FIG. 5A, when the chemical solution A ejected from the nozzle 11a is blocked by the spin arm 24, the chemical solution A ejected from the nozzle 11b is not blocked. Conversely, as shown in FIG.
When the chemical A ejected from the nozzle b is blocked by the spin arm 24, the chemical A ejected from the nozzle 11a is not interrupted.

The same applies to the case where the processing with the chemical B is performed and the case where the processing with the pure water C is performed. That is, the nozzles 11c and 11 that inject the chemical solution B
d and the nozzles 11e and 11f for injecting pure water C
This is because, similarly to the nozzles 11a and 11b for injecting the chemical A, the nozzles are arranged so that the angle between the nozzles is 90 degrees.

As described above, since the nozzles 11 are arranged in a pattern different from the formation pattern of the spin arm 24, the processing liquid jetted from one of the two nozzles jetting the same type of processing liquid is always used. It reaches the lower surface of the wafer W. Therefore, the processing can proceed uniformly. Therefore, high-precision processing can be realized, so that the quality of the wafer W can be improved.

FIG. 6 is a diagram for explaining the formation pattern of the spin arm 24 and the arrangement pattern of the nozzles 11 in the substrate processing apparatus according to the second embodiment of the present invention. In the first embodiment, the angle between the arms is made equal and the angle between the nozzles is not made equal, so that the spin arm 24
In contrast to the first embodiment, the formation pattern of the nozzles and the arrangement pattern of the nozzles 11 are different from each other. In addition, the formation pattern of the spin arms 24 and the arrangement pattern of the nozzles 11 are made different by setting the angle between the six spin arms 24 to an angle different from 60 degrees. More specifically, as the angle between the arms, for example, θ ₁ = θ ₃ = θ ₄ = θ ₆ = 70 degrees,
The spin arm 24 is disposed so that θ ₂ = θ ₅ = 40 degrees.

In this configuration, the angle between the nozzles 11a and 11b and the nozzles 11c and 11d is 120 degrees, and the angle between the nozzles 11e and 11f is 60 degrees.
Degree. On the other hand, the spin arm 24
When one spin arm 24 is used as a reference, the angle between the spin arm 24 and any other spin arm 24 is not set to 60 × n degrees. Therefore, the processing liquid jetted from one of the two nozzles that jet the same type of processing liquid always reaches the lower surface of the wafer W. Therefore, since the processing proceeds uniformly, highly accurate processing can be realized.

FIG. 7 is a view for explaining a formation pattern of the spin arm 24 and an arrangement pattern of the nozzles 11 in the substrate processing apparatus according to the third embodiment of the present invention. In the first embodiment, the formation pattern of the spin arm 24 and the arrangement pattern of the nozzles 11 are made different by making the angle between arms equal and displacing the angle between nozzles from the same angle. In the third embodiment,
Each pattern is made different by making the number of spin arms 24 different from the number of nozzles. More specifically, as shown in FIG. 6B, five spin arms 24 are provided for six nozzles 11 arranged at equal angular intervals, and the spin arms 24 are arranged at angular intervals different from 60 degrees. It is formed so that it becomes. That is, the angle between the arms is set to 72 degrees.

In this configuration, as in the second embodiment, the nozzles 11a and 11b, the nozzles 11c and 11d
And the angles between the nozzles of the nozzles 11e and 11f are 120 degrees, 120 degrees and 60 degrees, respectively. On the other hand, when one spin arm 24 is used as a reference, Is formed so that the angle between it and another arbitrary spin arm 24 does not become 60 × n degrees, the processing liquid ejected from one of the two nozzles that eject the same type of processing liquid is It always reaches the lower surface of the wafer W. Therefore, since the processing proceeds uniformly, highly accurate processing can be realized.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. For example, in the above-described embodiment, a case is described in which the same type of processing liquid is ejected from two nozzles.
For example, the same type of processing liquid may be ejected from three or more nozzles. For example, in the case where the same type of processing liquid is ejected from three nozzles, any one of the three nozzles may be used if the angle between the nozzles of at least two nozzles is different from an integral multiple of the angle between the arms. The processing liquid ejected from the nozzle always reaches the lower surface of the wafer W.
Therefore, since the processing proceeds uniformly, highly accurate processing can be realized.

In the above embodiment, the rotary plate 21 has an arm mounting portion 23 and an arm mounting portion 23.
Has six spin arms 24 integrally formed with
A configuration in which a notched processing liquid passage 70 is formed between the adjacent spin arms 24 is employed. Instead of the rotating plate 21 having such a configuration, for example, a disk-shaped rotation as shown in FIG. A plate 80 may be employed. In the rotating plate 80,
Circular processing liquid passages 81 for allowing the processing liquid to pass therethrough are formed at equal angular intervals along a circumference around the central axis O.

In the rotating plate 80 having this configuration, if the nozzles 11 are arranged at equal angular intervals and the processing liquid passages 81 are formed at equal angular intervals, the two nozzles 11 in a pair are formed as in the conventional case. From the processing liquid passage 81 is simultaneously blocked on the lower surface of the rotating plate 80 between the adjacent processing liquid passages 81. Therefore, even when the rotating plate 80 having this configuration is adopted, the angle between the pair of two nozzles 11 can be set to 90 degrees or the processing liquid passage 8 can be formed as in the above-described embodiments.
The angle between 1 is 40 degrees or 70 degrees instead of 60 degrees,
If the number of the processing liquid passages 81 is reduced, for example, the processing liquid ejected from the two nozzles 11 that form a pair
It will not be interrupted at the same time.

Further, in the above embodiment of the present invention,
The case where the present invention is applied to a substrate processing apparatus for performing a process on a wafer W used for manufacturing C is described. However, the present invention applies a process to a glass substrate for LCD or a glass substrate for PDP, for example. Needless to say, the present invention can be applied to a substrate processing apparatus for performing coating. In addition, various design changes can be made within the scope described in the claims.

[0051]

As described above, according to the present invention, the processing liquid supplied from any one of the processing liquids simultaneously supplied from a plurality of nozzles always reaches the lower surface of the substrate. The processing liquid is supplied to the lower surface without interruption. Therefore, the processing to be performed on the substrate can be performed uniformly, so that highly accurate processing can be realized.

[Brief description of the drawings]

FIG. 1 is a simplified longitudinal sectional view showing a configuration of a substrate processing apparatus to which a first embodiment of the present invention is applied.

FIG. 2 is a schematic diagram for explaining a configuration of a positioning mechanism.

FIG. 3 is a plan view showing a configuration inside a cup.

FIG. 4 is a diagram for explaining a formation pattern of a spin arm and an arrangement pattern of nozzles.

FIG. 5 is a diagram for explaining that a chemical solution A ejected from two nozzles is not simultaneously blocked by a spin arm.

FIG. 6 is a diagram for explaining a formation pattern of a spin arm and an arrangement pattern of nozzles in a substrate processing apparatus to which a second embodiment of the present invention is applied.

FIG. 7 is a diagram for explaining a formation pattern of a spin arm and a nozzle arrangement pattern in a substrate processing apparatus to which a third embodiment of the present invention is applied.

FIG. 8 is a plan view showing another configuration example of the rotating plate.

[Explanation of symbols]

 Reference Signs List 1 clamping mechanism 3 rotating structure 4 rotating shaft 5 chuck shaft 11, 11a to 11f nozzle 21, 80 rotating plate 23 arm mounting portion 24 spin arm 25 clamping claw 26 swing arm 27 claw operating link 28 claw operating member 30 chuck driving mechanism 70, 81 Processing liquid passage

Claims (1)

[Claims] A rotating member having an upper surface and a lower surface rotatably provided with a penetrating portion penetrating the upper surface and the lower surface, and for holding a substrate on the upper surface side of the rotating member. A substrate holding unit, including a plurality of nozzles provided below the substrate holding unit and configured to simultaneously supply the same type of processing liquid toward the lower surface of the substrate held by the substrate holding unit; The positional relationship between the processing liquids supplied from the plurality of nozzles and the path of the processing liquid supplied from at least one of the plurality of nozzles is determined on the lower surface of the substrate held by the substrate holding unit. A substrate processing apparatus, wherein the substrate processing apparatus is defined so as to reach through the through portion.