CN108962798A - The full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED and method - Google Patents
The full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED and method Download PDFInfo
- Publication number
- CN108962798A CN108962798A CN201810879557.5A CN201810879557A CN108962798A CN 108962798 A CN108962798 A CN 108962798A CN 201810879557 A CN201810879557 A CN 201810879557A CN 108962798 A CN108962798 A CN 108962798A
- Authority
- CN
- China
- Prior art keywords
- coating
- phosphor gel
- chip
- led
- rgb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 176
- 239000011248 coating agent Substances 0.000 title claims abstract description 175
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 95
- 239000003086 colorant Substances 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims description 27
- 230000033001 locomotion Effects 0.000 claims abstract description 47
- 230000007246 mechanism Effects 0.000 claims abstract description 45
- 239000007921 spray Substances 0.000 claims abstract description 26
- 230000007723 transport mechanism Effects 0.000 claims abstract description 22
- 238000003756 stirring Methods 0.000 claims description 30
- 230000005540 biological transmission Effects 0.000 claims description 23
- 238000001514 detection method Methods 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 11
- 241000883990 Flabellum Species 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 241000196324 Embryophyta Species 0.000 claims description 3
- 238000013528 artificial neural network Methods 0.000 claims description 3
- 238000010422 painting Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 241000208340 Araliaceae Species 0.000 claims description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 claims description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 claims description 2
- 235000008434 ginseng Nutrition 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000000843 powder Substances 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 238000004891 communication Methods 0.000 description 5
- 230000001376 precipitating effect Effects 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Coating Apparatus (AREA)
- Spray Control Apparatus (AREA)
Abstract
The invention discloses a kind of full-automatic phosphor gel high-speed intelligent coating equipments of three primary colours RGB-LED, including slave computer and upper computer control system, slave computer includes rack, phosphor gel feed mechanism, transport mechanism, coat motion module, phosphor gel mechanism for measuring thick, the next machine controller, the phosphor gel mixed is pressed into the spray head in coating motion module using air pressure by phosphor gel feed mechanism, chip array is transmitted and is fixed on coating position by transport mechanism, spray head in coating motion module coats the chip at coating position, phosphor gel mechanism for measuring thick detects current chip array coating thickness, the next machine controller is connected with upper computer control system.Present device high degree of automation has the function of coating feedback control and on-line tuning control parameter the purpose, it can be achieved that phosphor gel coating thickness high-precision control, effectively improves the coating precision and coating efficiency of RGB-LED.
Description
Technical field
The present invention relates to the automatic paint-on technique fields of LED fluorescent powder glue, and in particular to a kind of three primary colours RGB-LED is full-automatic
Phosphor gel high-speed intelligent coating equipment and method.
Background technique
Light emitting diode (LED) is a kind of all solid state lighting source of novel semi-conductor.It is this compared with conventional lighting technology
New type light source have it is energy-efficient, the service life is long, it is small in size, environmentally protective, using the clear superiorities such as safe, be acknowledged as future
First choice of lighting source.The liquid crystal display of big inch has been widely used for television set and computer display screen at present, they
Backlight still use traditional cold cathode fluorescent tube (Cold Cathode Fluorescent Lamp, CCFL), it includes
The frequency of red, green, blue lamp white light.In terms of service life length, about 30,000 hours service life of cold cathode fluorescent tube
It can satisfy the daily lighting demand of people.In addition, cold cathode fluorescent tube has high, low in cost, technology maturation of luminance etc. excellent
Point, but its light source color expressive ability is insufficient, is much smaller than NTSC standard.
With the improvement of light-emitting diode luminance, LED backlight module displays go out the incomparable advantage of cold cathode fluorescent tube,
For example color reducibility is high, the service life is long, environmentally friendly etc., becomes the research hotspot in LCD backlight mould group.Wherein have
Outstanding color rendition may be implemented in the LCD display panel of RGB-LED backlight, strengthens viewing experience.With general cold yin
Pole fluorescent tube is different, and RGB-LED extends the range of visual color.It is about 80% that CCFL, which covers NTSC color gamut, and RGB-LED
NTSC color gamut can be covered and be up to 110%, realize more accurate image restoring.
RGB-LED does not improve colour gamut singly, also improves efficiency.Because RGB-LED only issues required luminous energy, i.e., red
Color, green and blue, wideband light source (such as white light LEDs and CCFL) have relatively large number of extra color, compromise colour gamut, thus
Efficiency is caused to reduce.In addition to this, each color can be operated alone in RGB-LED, it is possible to correct white point or secondary colour
Temperature, and CCFL and white light LEDs then have fixed white point.
All the advantages based on RGB-LED there is now researcher and carry out the glimmering of RGB-LED to meet market trend
The research of light arogel coating equipment and method, but since the specification of chip to be coated is varied, have to parameters such as coating thickness
High requirement, the coating equipment for still capableing of full-automation without one kind occur.
Summary of the invention
The purpose of the present invention is being directed to uncontrollable RGB-LED coating thickness, automated production low efficiency, provide
A kind of full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED and method.Coating equipment can realize traffic monitoring,
The functions such as the micro- coating of intelligence, Thickness sensitivity and feedback, on-line tuning parameter, are improved coating effect, can both be completed with independent operating
Production task can also work with production line other processes perfect pipeline is connect, improve coating production efficiency.Coating equipment packet
Slave computer and upper computer control system two parts are included, upper and lower machine forms by serial communication real-time transmission data and is directed to fluorescence
The closed-loop control subsystem of arogel flow and closed-loop control subsystem for coating thickness realize phosphor gel coating intelligence
And precision.
The purpose of the present invention is realized by the following technical solution: the full-automatic phosphor gel high speed intelligence of three primary colours RGB-LED
Energy coating equipment, including slave computer and upper computer control system, slave computer include rack, phosphor gel feed mechanism, conveyer
Structure, coating motion module, phosphor gel mechanism for measuring thick, the next machine controller, phosphor gel feed mechanism will be mixed using air pressure
Chip array is transmitted and is fixed on coating position by the spray head in good phosphor gel indentation coating motion module, transport mechanism,
Spray head in coating motion module coats the chip at coating position, and phosphor gel mechanism for measuring thick detects current chip battle array
Column coating thickness, the next machine controller are connected with upper computer control system.Coating equipment high degree of automation of the present invention, can
It realizes the purpose to phosphor gel coating thickness high-precision control, effectively improves the coating precision and coating effect of RGB-LED
Rate.
Preferably, the phosphor gel feed mechanism includes air pressure regulator, charging air-pressure duct, stirring motor, stirring
Flabellum, transmission pipeline, flow sensor and 3 barrels are respectively provided with the phosphor gel of red, green, blue three primary colours in 3 barrels,
Air pressure regulator setting is driven on charging air-pressure duct by a driver, and charging air-pressure duct one end is connect with air pump, another
End is protruded into barrel, and stirring motor driving stirring flabellum rotates in barrel, and transmission pipeline divides the phosphor gel in 3 barrels
It is not transported to the arrival end of spray head in coating motion module, flow sensor detects in the unit time into glimmering in transmission pipeline
Light arogel flow, connect with the next machine controller.
Further, an air outlet valve is equipped at the top of each barrel.The air outlet valve is for being discharged in stainless steel barrel
Remaining air pressure, avoid because in barrel air pressure it is excessively high cause open barrel when explosion danger occurs.
Further, the stirring flabellum is in cylinder shape.Phosphor gel is stirred evenly, fluorescent powder precipitating is reduced.
Preferably, the transport mechanism is located above rack, including fixed guide rail, flapper, feed belt, belt drive
Dynamic motor, displacement sensor, main block, pushing-up device, side clamp device, fixed guide rail are fixedly mounted on plant bottom case, activity
Baffle is perpendicular to guide rail is fixed, and the spacing between flapper is adjustable, and the communicated belt of chip to be coated is transmitted to preset painting
Position is covered, feed belt is driven by belt driving motor, and whether displacement sensor detection chip reaches specified coating position；Main gear
Block and the side that coating position is arranged in, lifting are located at the lower section of coating position by a solenoid valve control, pushing-up device, rise
Drop is controlled by the next machine controller, and when coating, pushing-up device is risen so that chip to be coated is met or exceeded at the top of flapper,
Side clamp device is located on flapper, and chip is fixed on coating position along the direction perpendicular to flapper.
Further, the transport mechanism includes entrance block, and the input of chip direction of transfer is arranged in entrance block
End.The effect of entrance block has two o'clock: first is that avoiding influencing the normal painting of the chip array come on coating work position
It covers, second is that the chip array of holding fix can be made way within a short period of time after previous piece of chip array coating is completed to send out
It is sent to coating work position, reduces chip array conversion time, improves production efficiency.
Preferably, the coating motion module is located at transport mechanism top, including XYZ movement mechanism, spray head driving motor,
Several first limit sensors and several set ejecting devices, ejecting device are fixed on XYZ movement mechanism to realize three-dimensional move
Dynamic, XYZ movement mechanism is driven by spray head driving motor, and the first limit sensors are arranged in XYZ movement mechanism boundary position；Every set
Ejecting device is equipped with 3 nozzles, and 60 ° of angles, 3 nozzles pass through transmission pipeline respectively and connect with 3 barrels 3 nozzles each other, spray
Mouth is connected to the rotation that various angles are realized on R kinematic axis by circular rotating piece.
Preferably, the phosphor gel mechanism for measuring thick includes laser detector, parallel slide bar, X-direction kinematic axis, second
Limit sensors and laser detection driving motor, laser detector are connected with the next machine controller, and lower end is fixed in parallel
On slide bar, parallel slide bar is fixed on X-direction kinematic axis, and laser detection driving motor drives under the control of the next machine controller to swash
Optical detection device is moved to position to be detected along parallel slide bar, and the both ends of parallel slide bar are arranged in the second limit sensors.Second
Limit sensors are used to limit the motion range of laser detector.
A kind of control method based on the full-automatic phosphor gel high-speed intelligent coating equipment of above-mentioned three primary colours RGB-LED, packet
Include step:
The phosphor gel mixed is pressed into spray head using air pressure, chip array is transmitted and is fixed on coating position, spray
Head coats the chip at coating position, current chip array coating thickness is detected in coating procedure, by itself and setting
Expectation thickness value judges whether to need coating according to deviation compared to deviation is obtained.
Specifically, the following steps are included:
(1) coating equipment initializes；
(2) phosphor gel mixed is poured into the barrel of phosphor gel feed mechanism, opens phosphor gel feeder
Stirring motor stirring in structure；
(3) control parameter needed for control process is set in upper computer control system；
(4) after reaching preset mixing time, stirring motor works on, and transport mechanism is by chip array to be coated
It transmits and is fixed on coating position；
(5) coat motion module on spray head according to preset deposition path parameter to coating position at chip into
Row coating operation；
(6) judge whether to need to carry out phosphor gel thickness measuring step, if it is not required, then executing step (8), otherwise execute
Step (7)；
(7) the laser detector scanning in phosphor gel mechanism for measuring thick obtains the coating of each application point of current chip array
Thickness feeds back to upper computer control system, and upper computer control system calculates Chip array surface phosphor gel actual (real) thickness value,
And deviation is obtained compared with the expectation thickness value of setting, if the deviation is less than the limits of error of setting, terminate to spray
Operation is applied, (8) are entered step；If deviation is greater than the limits of error, upper computer control system on- line setting goes out practical
Number needed for coating repeats step (5) according to required coating number；
(8) chip array that transport mechanism completes coating is from coating location transmission to discharge port or next process, so
Next piece of chip array to be coated enters coating position afterwards.
Specifically, control parameter includes two major classes in the step (3), it is equipment adjusting parameter and coating movement respectively
Parameter, equipment adjusting parameter include being arranged between ejecting device spacing and flapper according to the length and width of actual chips array
Away from, according to chip chamber each in array away from angle setting injector spacing and rotation angle；Coating kinematic parameter includes expectation thickness
Value, stirring duration, charging atmospheric pressure value, coating location parameter, deposition path parameter equivalence control coating motion process.
Preferably, the flow sensor detection in step (5), when carrying out coating operation, in phosphor gel feed mechanism
Enter the phosphor gel flow in transmission pipeline in unit time, flow signal is transmitted to the next machine controller, slave computer control
Device processed, which is used, adjusts air pressure regulator based on BP neural network pid control algorithm, enters transmission pipeline in the unit time to control
Phosphor gel flow it is constant.Stablize to control nozzle application amount, avoids because of charging air pressure de-stabilising effect coating effect, really
Declaration form layer phosphor gel coating thickness is identical, provides feasible basis for postorder host computer on-line tuning coating parameters.
It preferably, include that N covers ejecting device, every set ejecting device primary coating in the coating equipment coating motion module
One RGB-LED, N cover the synchronous coating of ejecting device, after the completion of single RGB-LED coating, the next machine controller control XY movement
Ejecting device is moved to next RGB-LED and coats position by axis, while being coated number variate-value and being added N；Upper computer control system
Current coating number variate-value is compared with the chip number that chip array is equipped with, if two-value is equal, coats completion,
Enter step (6)；If differing, repeat step (5).
Compared with the prior art, the invention has the following advantages and beneficial effects:
(1) the full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED array proposed by the invention, with
RGB-LED chip array allows different dimensions chip arrays to coat as coating object, and the customized planning of user is allowed to apply
Path is covered, diversified production requirement is met；It realizes to phosphor gel coating thickness closed-loop control, improves phosphor gel and coat intelligence
It can property and precision；
(2) high degree of automation changes the universal production operation of current industry.The micro- spraying process of whole system collection
With intelligent control in one, wafer or the micro- coating of chip module automatic loading/unloading, intelligence, Thickness sensitivity and feedback, online are realized
The function of setting parameter improves coating effect, and wherein Thickness sensitivity module has the detection of a wide range of LED coating thickness and coats anti-
Control function is presented, realizes the high-precision control to phosphor gel thickness.The equipment both can complete production task with independent operating,
It can work with production line other processes perfect pipeline is connect, improve coating production efficiency.
(3) phosphor gel mixed is pressed into spray head using external world's charging air pressure by phosphor gel feed mechanism of the present invention,
Accurate control to phosphor gel flow in transmission pipeline is realized by flow closed-loop control subsystem in the mechanism, avoid because into
Expect that air pressure de-stabilising effect coats effect.
(4) transport mechanism of the present invention is driven using belt for transmitting chip array and fixation and is sent to chip array
Position is coated, will be pushed into fix at the top of flapper and with side clamp device on chip array using pushing-up device.Work as chip array
After the completion of coating operation, side clamp device unclamps, and chip array is displaced downwardly on belt by pushing-up device is transmitted to discharge port or next
Procedure.
(5) present invention coating motion module can be equipped with 3 nozzles, use respectively equipped with more set ejecting devices, every set cartridge nozzle
To coat red, green, blue three primary colors fluorescent powder glue.Spacing is adjustable between two covering devices, improves coating efficiency.Coating motion module can be real
The now a variety of deposition paths of customized planning and storing path parameter, meet the coating demand of different dimensions chip arrays.
(6) phosphor gel mechanism for measuring thick of the present invention is used for detection chip array coating thickness effect, by Thickness sensitivity result
It is applied in closed loop thickness control subsystem, provides data for on-line tuning control parameter, improve the intelligence and essence of coating
Degree.
Detailed description of the invention
Fig. 1 is phosphor gel feed mechanism schematic diagram in the present embodiment.
Fig. 2 is transport mechanism aerial view in the present embodiment.
Fig. 3 is the flow chart of the present embodiment control method.
Specific embodiment
The above content has made sufficient explanation to the present invention, in order to have more to technical characteristic and effect of the invention
It is clearly understood from, the detailed description of the present invention will be compared with the attached drawing and described in detail now.
The full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED array of the present invention includes slave computer
And upper computer control system.Lower computer hardware structure includes rack, phosphor gel feed mechanism, transport mechanism, coating movement mould
Block, phosphor gel mechanism for measuring thick, the next machine controller.The next machine controller is located at frame lower, the next machine controller with it is upper
Machine control system realizes real-time communication by serial mode, is issued to each motor for program is controlled by control card, bears
Duty controls each mechanism and system worked well.Phosphor gel feed mechanism is located on the left of rack, will be mixed using external world's charging air pressure
The phosphor gel got togather is pressed into spray head, is realized by flow closed-loop control subsystem to phosphor gel stream in transmission pipeline in mechanism
The accurate control of amount.Upper rack includes transport mechanism, coating motion module, phosphor gel mechanism for measuring thick.
As shown in Figure 1, the phosphor gel feed mechanism includes stainless steel barrel 1, stirring flabellum 2, stirring motor 3, resists
Corrode flow sensor, air pressure regulator 4, driver 5, charging air-pressure duct 6 and round transmission pipeline 7.Stainless steel barrel 1 is used
In the phosphor gel fluid that mixes of splendid attire, 3 stainless steel barrels are respectively provided with the phosphor gel of red, green, blue three primary colours, and 3
Round transmission pipeline 7 is separately connected in coating motion module at the fluid inlet of respective nozzle；Air-pressure duct 6 is fed for external
Pressure-air, driving phosphor gel enter round transmission pipeline 7, and the next machine controller passes through the aperture of control pressure regulating valve 4
The practical charging air pressure size of control, round transmission pipeline 7 are used for transmission phosphor gel, it connect 1 discharge port of stainless steel barrel and
Showerhead Fluid entrance stirs flabellum 2 and stirring motor 3 for stirring phosphor gel, reduces fluorescent powder precipitating；Air outlet valve is located at material
Cylinder top, the remaining air pressure for being discharged in stainless steel barrel, generation when avoiding causing to open barrel because air pressure is excessively high in barrel
Explosion；Anticorrosive flow sensor is mounted on round transmission pipeline 7.Flow sensor, air pressure regulator and slave computer control
Device processed constitutes flow closed loop subsystem, when the next machine controller controls unit using the pid control algorithm based on BP neural network
The interior phosphor gel flow for entering round transmission pipeline is constant, stablizes to control nozzle application amount.Stirring motor driving is stirred
Flabellum work is mixed, stirring flabellum is in cylinder shape, stirs evenly phosphor gel, reduces fluorescent powder precipitating.
As shown in Fig. 2, the transport mechanism is located above rack, for transmitting chip array and fixation, including active catch
Plate 8, fixed guide rail 9, feed belt 10, belt driving motor, displacement sensor, main block 11, entrance block 12, pushing-up device
13, side clamp device.Fixed guide rail 8 is fixedly mounted on plant bottom case, and flapper 8 is perpendicular to fixed guide rail 9, its spacing width
The chip array width (unit is millimeter) that can be inputted according to user adjusts, to adapt to the chip array of different dimensions；It is main
Block 11 is risen by the movement of solenoid valve, and chip array is made to stop at coating work position；Pushing-up device 13 be located at guide rail it
Between, but slightly below guide level.When main block 11 rises, the next machine controller control pushing-up device 13 above pushes away chip array
To 8 top of flapper；Side clamp device is located on flapper 8, it can be along the direction perpendicular to guide rail by chip array
It is fixed on coating work position；The chip array for having entered equipment is stopped at coating operation holding fix by entrance block 12,
Its position can be adjusted according to actual needs, but the distance between entrance block 12 and main block 11 are necessarily less than chip array
Length.When belt driving motor driving feed belt 10 works, whether displacement sensor detection chip array reaches coating
Operating position.If so, main block 11 rises, entrance block 12 is risen, and pushing-up device 13 will be pushed into fixed guide rail on chip array
Top, side clamp device are fixed.After the completion of operation to be coated, side clamp device unclamps, and pushing-up device 13 moves down chip array
To feed belt 10, main block 11 and entrance block 12 decline.
In the present embodiment, the coating motion module is located at transport mechanism top, including ejecting device, XYZ movement mechanism,
Spray head driving motor, several first limit sensors.The present embodiment includes 2 sets of ejecting devices.Every set ejecting device is equipped with 3
Nozzle, 1 circular rotating piece, 3 nozzles of original state, 60 ° of angles each other.All nozzles are connected to R movement by circular rotating piece
, it can be achieved that the rotation of various angles on axis.User can change the spacing between each nozzle by replacing circular rotating piece.Two sets of sprays
The chip array parameter adjust automatically that the spacing of head device can be inputted according to user, the motor pattern of two sets of ejecting devices are identical.
Before executing coating operation, user need to be manually entered or call chip array relevant parameter, including length, width, each chip chamber away from
With angle value etc..The next machine controller adjusts equipment working state according to parameter value.When coating operation starts, every set cartridge nozzle
Set one RGB-LED of primary coating, the synchronous coating of two sets of ejecting devices.After the completion of single RGB-LED coating, the next machine controller
It controls XY kinematic axis and ejecting device is moved to next position RGB-LED.Nozzle movement track and motion mode are by slave computer
The customized a variety of deposition paths of planning, Yong Huke can be achieved in controller control, controller (such as solid high GTS movement sequence controller)
To be arranged or select corresponding deposition path and coating method according to chip array.
In the present embodiment, the phosphor gel mechanism for measuring thick include laser detector, parallel slide bar, X-direction kinematic axis,
Second limit sensors and laser detection driving motor.Laser detector is located at that rack is latter half of, transport mechanism top, sliding
Bar is located at rack two sides.When host computer issues detection operational order, coats and move to its Z axis origin, slave computer in motion module
Controller controls laser detection driving motor and is moved to location to be checked above chip array with the laser detector on moving slide-bar
It sets.Second limit sensors play a part of to limit laser detector motion range.The phosphor gel mechanism for measuring thick is using sharp
Three kinds of color fluorescence arogel coating effects are individually detected respectively when light detection method detects one-color fluorescence arogel, i.e. thickness measuring.
Each application point thickness value that scanning obtains is fed back to upper computer control system by laser detector, upper computer control system according to
The deviation of actual (real) thickness value and expectation thickness value carries out on-line tuning control parameter, and acts in coating motion process, reaches
The purpose that phosphor gel thickness is accurately controlled.
In the present embodiment, upper computer control system provides intelligence micro- coating control, is responsible for obtaining and handles coating parameters, under
It sends out operational order and controls each mechanism of slave computer.User sets various coating parameters, including core by host computer human-computer interaction interface
Chip arrays relevant parameter, expectation coating thickness value, the limits of error, coating kinematic parameter etc.；Host computer by customer parameter, apply
The storage of the data such as order parameter and operation log is covered with local data base, is avoided loss of data, is reduced operating cost；Host computer
According to the practical coating thickness value and actual deviation on-line tuning control parameter of slave computer feedback, realize to the accurate of coating thickness
Control；Data communication is realized by serial communication mode between upper and lower machine.
As shown in figure 3, the control of the full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED array
Method, specifically includes the following steps:
(1) starting the full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED array, equipment automatically resets,
Each kinematic axis restores to origin；
(2) phosphor gel mixed is poured into stainless steel barrel, stirring motor is opened in host computer and is sufficiently stirred
Fluorescent powder and AB glue, and certain mixing time, which is arranged, keeps its stirring abundant, reduces fluorescent powder precipitating；
(3) user's setup parameter, the parameter being related to are broadly divided into two major classes, equipment adjusting parameter and coating movement ginseng
Number.Equipment adjusting parameter includes user according to the length and width of actual chips array setting ejecting device spacing and flapper
Spacing away from injector spacing is arranged with angle and rotates angle according to chip chamber each in array, it is therefore an objective to determine that initial application works
State；Coating kinematic parameter includes that user inputs expectation thickness value, stirring duration, charging atmospheric pressure value, coating location parameter, coating
Path parameter equivalence control coating motion process.User can be by two ways setup parameter, and mode is first is that be manually entered, mode
Second is that calling the relevant parameter in history coating record by human-computer interaction interface；
(4) start to count mixing time after step (3) is provided with, the next machine controller controls respective drive motor tune
Whole flapper spacing and ejecting device spacing and injector spacing and angle, into initial application working condition.It is to be mixed fall
At the end of timing, stirring motor works on, and feed belt starts running.Whether displacement sensor detection chip array, which reaches, refers to
Surely position is coated.If so, feed belt stops, the main block of solenoid-driven and entrance block rise, and pushing-up device is by chip battle array
It is pushed on column at the top of flapper, side clamp device fixes chip array；If it is not, feed belt works on, main block and
Entrance block keeps origin position；
(5) after the completion of step (4), ejecting device is moved to by the motor of the next machine controller control coating motion module
The starting of chip array coats position, carries out coating operation according to deposition path parameter set by user.Every set ejecting device one
One RGB-LED of secondary coating, the synchronous coating of two sets of ejecting devices.After the completion of single RGB-LED coating, the next machine controller control
Ejecting device is moved to next position RGB-LED by XY kinematic axis, while being coated number variate-value and being added two.Host computer judgement is worked as
Preceding coating number variate-value is compared with the chip number that chip array is equipped with, if two-value is equal, enters step (6)；
If differing, repeat step (5)；
(6) it after the completion of step (5), coats and moves to its Z axis origin in motion module.Slave computer is upward by serial communication
Position machine sends coating and completes signal, and host computer judges whether to terminate monolithic coating operation or enters thickness measuring link.If at the beginning of the group
Beginning parameter is manually entered by user to be got, then host computer issues detection instruction to slave computer, and laser detector is moved along its X
Axis is moved to detection position, and scanning obtains the thickness of each application point, and feeds back to host computer.Host computer calculates chip array table
Face phosphor gel actual (real) thickness value, and deviation is obtained compared with the expectation thickness value of setting.If the deviation is less than setting
The limits of error then terminate spraying operation, enter step (7)；If deviation is greater than the limits of error, host computer is whole online
Number needed for devise a stratagem calculates practical coating, and be stored in database, step (5) are repeated according to required coating number.If the group control
Parameter processed calls directly history coating record by user and gets, and host computer issues END instruction, enters step (7)；
(7) after the completion of step (6), side clamp device unclamps, and chip array is displaced downwardly to biography by main block decline, pushing-up device
It send on belt, is transmitted to discharge port or next process, entrance block decline, into the coating operation of next piece of chip array.
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention,
It should be equivalent substitute mode, be included within the scope of the present invention.
Claims (10)
1. the full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED, which is characterized in that including slave computer and upper
Machine control system, slave computer include rack, phosphor gel feed mechanism, transport mechanism, coating motion module, phosphor gel thickness measuring
The phosphor gel mixed is pressed into coating motion module using air pressure by mechanism, the next machine controller, phosphor gel feed mechanism
In spray head, transport mechanism chip array is transmitted and be fixed on coating position, coat motion module on spray head to coating position
The chip at the place of setting is coated, phosphor gel mechanism for measuring thick detect current chip array coating thickness, the next machine controller with it is upper
Position machine control system is connected.
2. the full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED according to claim 1, feature exist
In the phosphor gel feed mechanism includes air pressure regulator, charging air-pressure duct, stirring motor, stirring flabellum, transfer tube
Road, flow sensor and 3 barrels, the phosphor gel of red, green, blue three primary colours is respectively provided in 3 barrels, and air pressure regulator is set
It sets on charging air-pressure duct, is driven by a driver, charging air-pressure duct one end is connect with air pump, and the other end protrudes into barrel
Interior, stirring motor driving stirring flabellum rotates in barrel, and the phosphor gel in 3 barrels is respectively delivered to apply by transmission pipeline
The arrival end of spray head in motion module is covered, flow sensor detects the phosphor gel stream entered in transmission pipeline in the unit time
Amount, connect with the next machine controller.
3. the full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED according to claim 2, feature exist
In equipped with an air outlet valve at the top of each barrel；The stirring flabellum is in cylinder shape.
4. the full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED according to claim 1, feature exist
In the transport mechanism is located above rack, including fixed guide rail, flapper, feed belt, belt driving motor, displacement
Sensor, main block, pushing-up device, side clamp device, fixed guide rail are fixedly mounted on plant bottom case, and flapper is perpendicular to solid
Determine guide rail, the spacing between flapper is adjustable, and the communicated belt of chip to be coated is transmitted to preset coating position, transmits skin
Band is driven by belt driving motor, and whether displacement sensor detection chip reaches specified coating position；Main block and setting are applying
The side of position is covered, lifting is located at the lower section of coating position by a solenoid valve control, pushing-up device, goes up and down by slave computer control
Device control processed, when coating, pushing-up device is risen so that chip to be coated is met or exceeded at the top of flapper, and side clamp device is located at
On flapper, chip is fixed on coating position along the direction perpendicular to flapper.
5. the full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED according to claim 4, feature exist
In the transport mechanism includes entrance block, and the input terminal of chip direction of transfer is arranged in entrance block.
6. the full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED according to claim 1, feature exist
In the coating motion module is located at transport mechanism top, including XYZ movement mechanism, spray head driving motor, several first limits
Level sensor and several set ejecting devices, ejecting device are fixed on XYZ movement mechanism, XYZ fitness machine three-dimensional mobile to realize
Structure is driven by spray head driving motor, and the first limit sensors are arranged in XYZ movement mechanism boundary position；Every set ejecting device is equipped with
3 nozzles, 60 ° of angles, 3 nozzles pass through transmission pipeline respectively and connect with 3 barrels 3 nozzles each other, and nozzle passes through round rotation
Rotor is connected to the rotation that various angles are realized on R kinematic axis.
7. the full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED according to claim 1, feature exist
In, the phosphor gel mechanism for measuring thick include laser detector, parallel slide bar, X-direction kinematic axis, the second limit sensors with
And laser detection driving motor, laser detector are connected with the next machine controller, lower end is fixed on parallel slide bar, parallel sliding
Bar is fixed on X-direction kinematic axis, and laser detection driving motor drives laser detector edge under the control of the next machine controller
Parallel slide bar is moved to position to be detected, and the both ends of parallel slide bar are arranged in the second limit sensors.
8. one kind is covered based on the full-automatic phosphor gel high-speed intelligent painting of any one of the claim 1-7 three primary colours RGB-LED
Standby control method, which is characterized in that comprising steps of
The phosphor gel mixed is pressed into spray head using air pressure, chip array is transmitted and is fixed on coating position, spray head pair
Chip at coating position is coated, and current chip array coating thickness is detected in coating procedure, by the expectation of itself and setting
Thickness value judges whether to need coating according to deviation compared to deviation is obtained.
9. control method according to claim 8, which comprises the following steps:
(1) coating equipment initializes；
(2) phosphor gel mixed is poured into the barrel of phosphor gel feed mechanism, is opened in phosphor gel feed mechanism
Stirring motor stirring；
(3) control parameter needed for control process is set in upper computer control system；
(4) after reaching preset mixing time, stirring motor works on, and transport mechanism transmits chip array to be coated
And it is fixed on coating position；
(5) spray head coated in motion module applies the chip at coating position according to preset deposition path parameter
Cover operation；
(6) judge whether to need to carry out phosphor gel thickness measuring step, if it is not required, then step (8) are executed, it is no to then follow the steps
(7)；
(7) the laser detector scanning in phosphor gel mechanism for measuring thick obtains the coating thickness of each application point of current chip array
Degree, feeds back to upper computer control system, and upper computer control system calculates Chip array surface phosphor gel actual (real) thickness value, and
Deviation is obtained compared with the expectation thickness value of setting, if the deviation is less than the limits of error of setting, terminates to spray
Operation enters step (8)；If deviation is greater than the limits of error, upper computer control system on- line setting goes out practical apply
Required number is covered, step (5) are repeated according to required coating number；
(8) chip array that transport mechanism completes coating is from coating location transmission to discharge port or next process, then under
One piece of chip array to be coated enters coating position.
10. control method according to claim 9, which is characterized in that in the step (3), control parameter includes two big
Class, is equipment adjusting parameter and coating kinematic parameter respectively, equipment adjusting parameter include according to the length of actual chips array and
Ejecting device spacing and flapper spacing is arranged in width, according to chip chamber each in array away from injector spacing and rotation is arranged with angle
Gyration；Coating kinematic parameter includes expectation thickness value, stirring duration, charging atmospheric pressure value, coating location parameter, deposition path ginseng
Number；
In step (5), when carrying out coating operation, in flow sensor in the phosphor gel feed mechanism detection unit time into
Enter the phosphor gel flow in transmission pipeline, flow signal is transmitted to the next machine controller, the next machine controller is used and is based on
BP neural network pid control algorithm adjusts air pressure regulator, to control the phosphor gel stream for entering transmission pipeline in the unit time
It measures constant；
It include that N covers ejecting device, every one RGB- of set ejecting device primary coating in the coating equipment coating motion module
LED, N cover the synchronous coating of ejecting device, and after the completion of single RGB-LED coating, the next machine controller controls XY kinematic axis for spray head
Device is moved to next RGB-LED coating position, while coating number variate-value and adding N；Upper computer control system will be applied currently
It covers number variate-value and is compared with the chip number that chip array is equipped with, if two-value is equal, coats completion, enter step
(6)；If differing, repeat step (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810879557.5A CN108962798B (en) | 2018-08-03 | 2018-08-03 | High-speed intelligent coating equipment and method for three-primary-color RGB-LED full-automatic fluorescent powder glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810879557.5A CN108962798B (en) | 2018-08-03 | 2018-08-03 | High-speed intelligent coating equipment and method for three-primary-color RGB-LED full-automatic fluorescent powder glue |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108962798A true CN108962798A (en) | 2018-12-07 |
| CN108962798B CN108962798B (en) | 2024-07-05 |
Family
ID=64467571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810879557.5A Active CN108962798B (en) | 2018-08-03 | 2018-08-03 | High-speed intelligent coating equipment and method for three-primary-color RGB-LED full-automatic fluorescent powder glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108962798B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110508463A (en) * | 2019-07-03 | 2019-11-29 | 江苏大学 | A kind of coating method being precisely controlled coated shape thickness |
| CN110534629A (en) * | 2019-07-23 | 2019-12-03 | 华南理工大学 | Phosphor gel coating method, device, system, coating control equipment and storage medium |
| CN111045458A (en) * | 2019-12-25 | 2020-04-21 | 华南理工大学 | Novel non-Newtonian fluid micro-coating system and control method |
| CN111258315A (en) * | 2020-01-20 | 2020-06-09 | 华南理工大学 | Method for improving working efficiency and path optimization of LED coating machine |
| CN112215445A (en) * | 2020-12-09 | 2021-01-12 | 季华实验室 | Multi-nozzle spray scheduling method and device for preparing luminous layer, storage medium and terminal |
Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1053387A (en) * | 1990-01-19 | 1991-07-31 | 标准模具有限公司 | Injection molding manifold and nozzle with laterally clamped flanges |
| SU1763835A1 (en) * | 1989-12-13 | 1992-09-23 | Среднеазиатский Филиал Всесоюзного Научно-Исследовательского Института Использования Газа В Народном Хозяйстве И Подземного Хранения Нефти, Нефтепродуктов И Сжиженных Газов | Multinozzle burner device of rotating furnace |
| JPH1064880A (en) * | 1996-08-23 | 1998-03-06 | Dainippon Screen Mfg Co Ltd | Substrate treatment device |
| JPH11239748A (en) * | 1998-02-25 | 1999-09-07 | Toray Ind Inc | Method and device for applying coating liquid on uneven substrate, method and apparatus for producing plasma display |
| US20040115567A1 (en) * | 2002-12-16 | 2004-06-17 | Mandal Robert P. | Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms |
| JP2010045233A (en) * | 2008-08-14 | 2010-02-25 | Disco Abrasive Syst Ltd | Resin coating device |
| CN202667085U (en) * | 2012-06-19 | 2013-01-16 | 福建福贞金属包装有限公司 | Full-automatic external supplementary gluing system for tanks |
| CN103081142A (en) * | 2010-08-17 | 2013-05-01 | 柯尼卡美能达先进多层薄膜株式会社 | Method of manufacturing light-emitting device |
| CN103128041A (en) * | 2013-02-07 | 2013-06-05 | 华南理工大学 | Full automatic fluorescent powder coating process and device |
| CN203256474U (en) * | 2013-05-21 | 2013-10-30 | 宁夏西部皮草有限公司 | Multi-color dyeing kettle for Tan sheep fur |
| CN104226568A (en) * | 2014-08-07 | 2014-12-24 | 华南理工大学 | LED (Light emitting diode) fluorescent powder coating method and system based on 3D printing principle |
| CN104960340A (en) * | 2015-06-30 | 2015-10-07 | 北京威控睿博科技有限公司 | Multi-spray-head interference-free printing method and spray head structure of 3D printer |
| CN105728220A (en) * | 2016-04-30 | 2016-07-06 | 华南理工大学 | Atomizing device for high-viscosity fluorescent powder and control method of atomizing device |
| CN106493045A (en) * | 2016-12-26 | 2017-03-15 | 上海斐讯数据通信技术有限公司 | A kind of automatic IC coating equipments and painting method |
| CN106548962A (en) * | 2016-10-26 | 2017-03-29 | 郑建灵 | A kind of electronic devices and components automatic double surface gluer |
| CN106853680A (en) * | 2017-01-20 | 2017-06-16 | 深圳市贝优通新能源技术开发有限公司 | A kind of rotary 3D printing head |
| CN206685365U (en) * | 2017-04-26 | 2017-11-28 | 深圳市时创意电子有限公司 | A kind of integrated circuit BGA support plates of a variety of wafer space layouts of compatibility |
| CN108136674A (en) * | 2016-06-17 | 2018-06-08 | 源秩科技（上海）有限公司 | Multiinjector 3D printing nozzle and Method of printing and 3D printing system |
| CN108248041A (en) * | 2018-03-20 | 2018-07-06 | 河北工业大学 | A kind of adjustable 3D printer nozzle of nozzle diameter |
| CN209766366U (en) * | 2018-08-03 | 2019-12-10 | 华南理工大学 | Three-primary-color RGB-LED full-automatic fluorescent powder glue high-speed intelligent coating equipment |
-
2018
- 2018-08-03 CN CN201810879557.5A patent/CN108962798B/en active Active
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1763835A1 (en) * | 1989-12-13 | 1992-09-23 | Среднеазиатский Филиал Всесоюзного Научно-Исследовательского Института Использования Газа В Народном Хозяйстве И Подземного Хранения Нефти, Нефтепродуктов И Сжиженных Газов | Multinozzle burner device of rotating furnace |
| CN1053387A (en) * | 1990-01-19 | 1991-07-31 | 标准模具有限公司 | Injection molding manifold and nozzle with laterally clamped flanges |
| JPH1064880A (en) * | 1996-08-23 | 1998-03-06 | Dainippon Screen Mfg Co Ltd | Substrate treatment device |
| JPH11239748A (en) * | 1998-02-25 | 1999-09-07 | Toray Ind Inc | Method and device for applying coating liquid on uneven substrate, method and apparatus for producing plasma display |
| US20040115567A1 (en) * | 2002-12-16 | 2004-06-17 | Mandal Robert P. | Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms |
| JP2010045233A (en) * | 2008-08-14 | 2010-02-25 | Disco Abrasive Syst Ltd | Resin coating device |
| CN103081142A (en) * | 2010-08-17 | 2013-05-01 | 柯尼卡美能达先进多层薄膜株式会社 | Method of manufacturing light-emitting device |
| CN202667085U (en) * | 2012-06-19 | 2013-01-16 | 福建福贞金属包装有限公司 | Full-automatic external supplementary gluing system for tanks |
| CN103128041A (en) * | 2013-02-07 | 2013-06-05 | 华南理工大学 | Full automatic fluorescent powder coating process and device |
| CN203256474U (en) * | 2013-05-21 | 2013-10-30 | 宁夏西部皮草有限公司 | Multi-color dyeing kettle for Tan sheep fur |
| CN104226568A (en) * | 2014-08-07 | 2014-12-24 | 华南理工大学 | LED (Light emitting diode) fluorescent powder coating method and system based on 3D printing principle |
| CN104960340A (en) * | 2015-06-30 | 2015-10-07 | 北京威控睿博科技有限公司 | Multi-spray-head interference-free printing method and spray head structure of 3D printer |
| CN105728220A (en) * | 2016-04-30 | 2016-07-06 | 华南理工大学 | Atomizing device for high-viscosity fluorescent powder and control method of atomizing device |
| CN108136674A (en) * | 2016-06-17 | 2018-06-08 | 源秩科技（上海）有限公司 | Multiinjector 3D printing nozzle and Method of printing and 3D printing system |
| CN106548962A (en) * | 2016-10-26 | 2017-03-29 | 郑建灵 | A kind of electronic devices and components automatic double surface gluer |
| CN106493045A (en) * | 2016-12-26 | 2017-03-15 | 上海斐讯数据通信技术有限公司 | A kind of automatic IC coating equipments and painting method |
| CN106853680A (en) * | 2017-01-20 | 2017-06-16 | 深圳市贝优通新能源技术开发有限公司 | A kind of rotary 3D printing head |
| CN206685365U (en) * | 2017-04-26 | 2017-11-28 | 深圳市时创意电子有限公司 | A kind of integrated circuit BGA support plates of a variety of wafer space layouts of compatibility |
| CN108248041A (en) * | 2018-03-20 | 2018-07-06 | 河北工业大学 | A kind of adjustable 3D printer nozzle of nozzle diameter |
| CN209766366U (en) * | 2018-08-03 | 2019-12-10 | 华南理工大学 | Three-primary-color RGB-LED full-automatic fluorescent powder glue high-speed intelligent coating equipment |
Non-Patent Citations (1)
| Title |
|---|
| 陈羽白等: "喷灌量与喷灌形状的精确控制方法及技术", 农业机械学报, vol. 35, no. 2, 31 March 2004 (2004-03-31), pages 84 - 87 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110508463A (en) * | 2019-07-03 | 2019-11-29 | 江苏大学 | A kind of coating method being precisely controlled coated shape thickness |
| CN110534629A (en) * | 2019-07-23 | 2019-12-03 | 华南理工大学 | Phosphor gel coating method, device, system, coating control equipment and storage medium |
| CN111045458A (en) * | 2019-12-25 | 2020-04-21 | 华南理工大学 | Novel non-Newtonian fluid micro-coating system and control method |
| CN111258315A (en) * | 2020-01-20 | 2020-06-09 | 华南理工大学 | Method for improving working efficiency and path optimization of LED coating machine |
| CN112215445A (en) * | 2020-12-09 | 2021-01-12 | 季华实验室 | Multi-nozzle spray scheduling method and device for preparing luminous layer, storage medium and terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108962798B (en) | 2024-07-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108962798A (en) | The full-automatic phosphor gel high-speed intelligent coating equipment of three primary colours RGB-LED and method | |
| CN103955093B (en) | Optical plate based on quantum dot | |
| CN103817052B (en) | Full-automatic LED fluorescent material coating equipment and control method thereof | |
| CN108970865A (en) | A kind of Multifunction fluorescent arogel automatic coating machine and control method | |
| US20110203522A1 (en) | Method and system for dynamic in-situ phosphor mixing and jetting | |
| CN1532872A (en) | Fluorescent ink coating device and method for plasma display panel and plasma display panel | |
| CN106932951A (en) | LED lamp source and its manufacture method, backlight module | |
| CN209766366U (en) | Three-primary-color RGB-LED full-automatic fluorescent powder glue high-speed intelligent coating equipment | |
| CN109078814A (en) | A kind of coupling of slab guide class device automatic dispensing device and method | |
| CN105960158A (en) | Bilateral feeding LED placement machine | |
| CN102198438B (en) | Porous synchronous noncontact dispensing head | |
| CN209020670U (en) | The automatic coating equipment of multi-product | |
| JP2004223439A (en) | Coating device and coating application method and method for manufacturing member for display | |
| CN207831141U (en) | A kind of plant illumination system | |
| CN110221630A (en) | A kind of building glass filming parameter adaptive control system | |
| CN202962744U (en) | Quick changeover coating system | |
| CN106252487B (en) | The full-automatic ink jet printer of LED support | |
| CN210475870U (en) | Marking device and laser marking machine | |
| CN108502527B (en) | Full-automatic powder preparation machine and method | |
| CN107838674B (en) | Intelligent automatic assembly equipment for spray valve accessories | |
| CN213967414U (en) | SCARA robot gluing device | |
| CN101561593B (en) | Method for liquid crystal display panel continuously and uniformly dripping off liquid crystal and device thereof | |
| CN114148097A (en) | Ink-jet printing equipment | |
| CN210475871U (en) | Laser marking device | |
| CN107470091B (en) | LED COB (chip on board) dam dispensing all-in-one machine and implementation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |