CN110534629A - Phosphor gel coating method, device, system, coating control equipment and storage medium - Google Patents
Phosphor gel coating method, device, system, coating control equipment and storage medium Download PDFInfo
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- CN110534629A CN110534629A CN201910666526.6A CN201910666526A CN110534629A CN 110534629 A CN110534629 A CN 110534629A CN 201910666526 A CN201910666526 A CN 201910666526A CN 110534629 A CN110534629 A CN 110534629A
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- 238000000576 coating method Methods 0.000 title claims abstract description 350
- 239000011248 coating agent Substances 0.000 title claims abstract description 323
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 125
- 238000003860 storage Methods 0.000 title claims abstract description 16
- 239000011247 coating layer Substances 0.000 claims abstract description 84
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000005259 measurement Methods 0.000 claims abstract description 18
- 230000007723 transport mechanism Effects 0.000 claims description 22
- 238000012937 correction Methods 0.000 claims description 11
- 238000005457 optimization Methods 0.000 claims description 10
- 230000003068 static effect Effects 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 8
- 238000009825 accumulation Methods 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- 238000002474 experimental method Methods 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 6
- 230000001419 dependent effect Effects 0.000 claims description 5
- 238000013461 design Methods 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 3
- 238000009675 coating thickness measurement Methods 0.000 claims description 3
- 230000005055 memory storage Effects 0.000 claims description 3
- 241000208340 Araliaceae Species 0.000 claims description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 claims description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 claims description 2
- 235000008434 ginseng Nutrition 0.000 claims description 2
- 238000010422 painting Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract description 10
- 239000003292 glue Substances 0.000 abstract description 4
- 230000006870 function Effects 0.000 description 9
- 238000004422 calculation algorithm Methods 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004590 computer program Methods 0.000 description 4
- 230000001186 cumulative effect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 244000309464 bull Species 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/084—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to condition of liquid or other fluent material already sprayed on the target, e.g. coating thickness, weight or pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/20—Arrangements for agitating the material to be sprayed, e.g. for stirring, mixing or homogenising
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a kind of phosphor gel coating method, device, system, coating control equipment and storage mediums, the described method includes: coating control parameter according to the default of the multivariable coating layer thickness distributed model pre-established, control coating executing agency carries out phosphor gel coating to LED wafer；Control the phosphor gel coating layer thickness of LED wafer after thickness-measuring equipment measurement coats；According to phosphor gel coating layer thickness, it is determined whether need to correct current coating control parameter；If so, being modified to current coating control parameter, according to revised coating control parameter, control coating executing agency carries out phosphor gel coating to LED wafer, and returns to the phosphor gel coating layer thickness of LED wafer after control thickness-measuring equipment measurement coating；If it is not, then controlling coating executing agency terminates blanking.The present invention has compared with strong adaptability, it is ensured that the uniformity consistency of high-power white-light LED fluorescent powder glue coating improves the coating quality and coating efficiency of large power white light LED.
Description
Technical field
The present invention relates to a kind of phosphor gel coating method, device, system, coating control equipment and storage mediums, belong to
Phosphor gel coats field.
Background technique
Large power white light LED possesses the title of " green illumination light source ", with conventional illumination sources phase as forth generation electric light source
There is low pressure small in size, low-power consumption, high reliability and long-life than, large power white light LED, the series of advantages such as energy conservation and environmental protection,
It is that one kind meets environmental protection and energy-efficient green illumination light source.
In LED chip coating procedure, fluorescent powder paint-on technique is the most key link, and wherein coated side is complete
Property, the accuracy of position is coated, the various factors such as uniformity coefficient that coating thickness and fluorescent powder are distributed all can be to the hair of LED
Light, colour temperature quality impact.Free dispensing and atomizing spraying are the most common fluorescent powder coated forms in the current market LED, but
It is to cause emergent light color inconsistent since the coating thickness and uniformity that are difficult to fluorescent powder are accurately controlled, occurs inclined
Blue light or inclined yellow light.
Summary of the invention
In view of this, the present invention provides a kind of phosphor gel coating method, device, system, coating control equipment and depositing
Storage media by the multivariable coating layer thickness distributed model pre-established, and introduces Iterative Learning Control Algorithm to fluorescent powder
Coating thickness is controlled, and is had compared with strong adaptability, it is ensured that the uniformity of high-power white-light LED fluorescent powder glue coating
Property, the coating quality and coating efficiency of large power white light LED are improved, solves the skill of the coating processes of white-light LED fluorescence arogel
Art problem.
The first purpose of this invention is to provide a kind of phosphor gel coating method.
Second object of the present invention is to provide a kind of phosphor gel coating unit.
Third object of the present invention is to provide a kind of phosphor gel application system.
Fourth object of the present invention is to provide a kind of coating control equipment.
Of the invention the 5th is designed to provide a kind of storage medium.
The first purpose of this invention can be reached by adopting the following technical scheme that:
A kind of phosphor gel coating method, which comprises
After LED wafer enters coating zone, applied according to the default of the multivariable coating layer thickness distributed model pre-established
Control parameter is covered, control coating executing agency carries out phosphor gel coating to LED wafer；
Control the phosphor gel coating layer thickness of LED wafer after thickness-measuring equipment measurement coats；
According to phosphor gel coating layer thickness, it is determined whether need to correct current coating control parameter；
If desired the current coating control parameter of amendment is then modified current coating control parameter, according to revised
Control parameter is coated, control coating executing agency carries out phosphor gel coating to LED wafer, and returns to control thickness-measuring equipment measurement
The phosphor gel coating layer thickness of LED wafer after coating；
If not needing to correct current coating control parameter, controlling coating executing agency terminates blanking.
Further, described according to phosphor gel coating layer thickness, it is determined whether to need to correct current coating control parameter, tool
Body includes:
Phosphor gel coating layer thickness is compared with setting coating thickness, obtains coating thickness error；
Coating thickness error is compared with the limits of error of setting, if coating thickness error is greater than setting most
Big allowable error then needs to correct current coating control parameter, if coating thickness error is less than or equal to the maximum allowable of setting
Error does not need then to correct current coating control parameter.
It is further, described that current coating control parameter is modified, specifically:
Control parameter is coated according to the default of current coating control parameter and multivariable coating layer thickness distributed model, using repeatedly
The correction value that current coating control parameter is calculated for control learning algorithm, to obtain revised coating control parameter.
Further, the coating control parameter includes feed air pressure, sprinkler height and atomizing pressure；
The establishment process of the multivariable coating layer thickness distributed model includes:
Gaussian sum coating Accumulation Model is chosen as phosphor gel static state and sprays model；
Design is respectively to be fed air pressure, sprinkler height, atomizing pressure as independent variable, using coating thickness as the uniform of dependent variable
The coating experiment；
Phosphor gel static state is sprayed into the form that the parameter in model is expressed as coating control parameter, is established containing coating control
The extensive multivariable coating layer thickness model of parameter processed；
It is quasi- to carry out nonlinear least square method as optimization aim for variance to set coating thickness and practical coating thickness
Optimization is closed, the undetermined coefficient of extensive multivariable coating layer thickness model is solved, obtains multivariable coating layer thickness model；
It is modified using multivariable coating layer thickness model prediction coating thickness, and to multivariable coating layer thickness model.
Second object of the present invention can be reached by adopting the following technical scheme that:
A kind of phosphor gel coating unit, described device include:
Coat module, for being distributed according to the multivariable coating layer thickness pre-established after LED wafer enters coating zone
The default of model coats control parameter, and control coating executing agency carries out phosphor gel coating to LED wafer；
Measurement module, for controlling the phosphor gel coating layer thickness of LED wafer after thickness-measuring equipment measurement coats；
Determining module, for according to phosphor gel coating layer thickness, it is determined whether need to correct current coating control parameter；
Correction module is then modified current coating control parameter for the current coating control parameter of if desired amendment,
According to revised coating control parameter, control coating executing agency carries out phosphor gel coating to LED wafer, and returns to control
The phosphor gel coating layer thickness of LED wafer after thickness-measuring equipment measurement coating；
Ending module, if controlling coating executing agency terminates blanking for not needing to correct current coating control parameter.
Third object of the present invention can be reached by adopting the following technical scheme that:
A kind of phosphor gel application system, the system comprises transport mechanism, coating executing agency, thickness-measuring equipment and coatings
Equipment is controlled, the transport mechanism, coating executing agency and thickness-measuring equipment are connected with coating control equipment respectively；
The transport mechanism, for the LED wafer to be coated of transport mechanism inlet to be sent to coating zone, and general
The LED wafer that coating is completed is sent to the exit of transport mechanism from coating zone；
The coating executing agency is used to carry out phosphor gel circulation stirring, and according to coating control parameter, right
LED wafer carries out phosphor gel coating；
The thickness-measuring equipment, for measure coating after LED wafer phosphor gel coating layer thickness；
The coating controls equipment, requires the described in any item phosphor gel coating methods of 1-4 for perform claim.
Further, the coating executing agency includes barrel and nozzle；
The barrel carries out circulation stirring for loading phosphor gel, and to phosphor gel；
The nozzle is connected with coating control equipment, and the feeding inlet of nozzle is connected with the discharge port of barrel, is used for root
According to coating control parameter, phosphor gel coating is carried out to LED wafer.
Further, the thickness-measuring equipment includes laser emitter, ccd image sensor and image procossing
Device, the ccd image sensor are connected with image processor, the laser emitter and image processor difference
It is connected with coating control equipment；
The laser emitter, for emitting laser irradiation respectively afterwards to LED wafer surface before coating；
The ccd image sensor, for obtaining the reflected light on LED wafer surface, to acquire LED wafer
The representation of laser facula on surface；
Described image processor is handled for the representation of laser facula to coating front and back, according to coating front and back
Representation of laser facula is handled, phosphor gel coating thickness measurement is carried out to the spraying area of LED wafer.
Fourth object of the present invention can be reached by adopting the following technical scheme that:
A kind of coating control equipment, it is described including processor and for the memory of storage processor executable program
When processor executes the program of memory storage, above-mentioned phosphor gel coating method is realized.
5th purpose of the invention can be reached by adopting the following technical scheme that:
A kind of storage medium is stored with program, when described program is executed by processor, realizes above-mentioned phosphor gel coating
Method.
The present invention have compared with the existing technology it is following the utility model has the advantages that
The present invention uneven, LED illumination effect difference problem for coating thickness in conventional fluorescent arogel coating processes, from
Coating processes process is set out, and fully considers the influence of process equipment and parameter, pre-establishes multivariable coating layer thickness distributed model,
And Iterative Learning Control Algorithm is introduced, to accurately adjust coating control parameter, it is ensured that high-power white-light LED fluorescent powder
The uniformity consistency of glue coating, improves the coating quality and coating efficiency of large power white light LED, is particularly suitable for high-precision and coats
It is required that technique.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structure chart of the phosphor gel application system of the embodiment of the present invention 1.
Fig. 2 is the structural block diagram of the coating control equipment of the embodiment of the present invention 1.
Fig. 3 is the flow chart of the phosphor gel coating method of the embodiment of the present invention 1.
Fig. 4 is the flow chart for determining the need for correcting current coating control parameter of the embodiment of the present invention 1.
Fig. 5 is the flow chart for establishing multivariable coating layer thickness model of the embodiment of the present invention 1.
Fig. 6 is the phosphor gel coating cumulative thickness schematic diagram of the embodiment of the present invention 1.
Fig. 7 is the structural block diagram of the phosphor gel coating unit of the embodiment of the present invention 2.
Fig. 8 is the structural block diagram of the determining module of the embodiment of the present invention 2.
Fig. 9 is the relational graph of the modules for establishing multivariable coating layer thickness model of the embodiment of the present invention 2.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiments of the present invention, instead of all the embodiments, based on the embodiments of the present invention, ordinary skill people
Member's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Embodiment 1:
As shown in Figure 1, present embodiments providing a kind of phosphor gel application system, which includes transport mechanism 101, applies
Cover executing agency 102, thickness-measuring equipment and coating control equipment (not shown), transport mechanism 101, coating executing agency 102,
Thickness-measuring equipment is connected with coating control equipment respectively.
The transport mechanism 101 may include the components such as pedestal, conveyer belt, driving wheel, driving motor, with one end of pedestal
As the entrance of transport mechanism 101, outlet of the other end as transport mechanism 101, driving wheel can be set four, two of them
Driving wheel is oppositely arranged on the inlet of transport mechanism 101, constitutes first group of driving wheel group, and pass through transmission shaft and pedestal phase
Even, other two driving wheel is oppositely arranged on the exit of transport mechanism 101, constitutes second group of driving wheel group, and pass through transmission
Axis is connected with pedestal, and conveyer belt is connected with two transmission shafts respectively, driving motor and wherein one group of driving wheel group (first group of transmission
Wheel group or second group of driving wheel group) a driving wheel be connected, driving motor drive the driving wheel rotation come drive the group be driven
Another driving wheel of wheel group, so that conveyer belt is rotated, during conveyer belt rotates, two biographies of another group of driving wheel group
Driving wheel also can rotate, and the LED wafer to be coated 103 of 101 inlet of transport mechanism can be sent to coating zone, and will apply
The LED wafer 103 for covering completion is sent to the exit of transport mechanism 101 from coating zone.
The coating executing agency 102 can carry out circulation stirring to phosphor gel, and according to coating control parameter, right
LED wafer carries out phosphor gel coating；Specifically, coating executing agency 102 includes barrel 1021 and nozzle 1022, barrel 1021
There are two, for loading phosphor gel, circulation stirring can be carried out to phosphor gel by controlling the air pressure of barrel 1021, with reality
The de-bubble of existing phosphor gel, nozzle 1022 can use single head or bull nozzle, be connected with coating control equipment, and nozzle
1022 feeding inlet is connected with the discharge port of barrel 1021, for carrying out to LED wafer 103 glimmering according to coating control parameter
The coating of light arogel；Wherein, coating control parameter may include feed air pressure, sprinkler height and atomizing pressure.
It is fixed on some position execution coating operation in order to make to coat executing agency 102, the phosphor gel of the present embodiment applies
The system of covering further includes truss 104, it includes a horizon bar and two vertical bars to truss 104, and the both ends of horizon bar are respectively with two
One end of root vertical bar connects, and the other end of two vertical bars is fixed on the right and left of the pedestal side of transport mechanism 101, and two
A 1021 left and right settings of barrel, and be fixed on the horizon bar of truss 104, nozzle 1022 is arranged between two barrels 1021,
And the coating zone of the feed opening alignment transport mechanism 101 of nozzle 1022.
The thickness-measuring equipment of the present embodiment uses special laser thickness gauge comprising laser emitter 105, charge-coupled device
Part image (charge-coupled device, abbreviation CCD) sensor 106 and image processor (not shown), laser hair
Emitter 105 and ccd image sensor 106 are arranged on the horizon bar of truss 104, and ccd image
Sensor 106 is connected with image processor, and laser emitter 105 and image processor are connected with coating control equipment respectively；Swash
Optical transmitting set 105 can before coating after emit laser irradiation at a certain angle to 103 surface of LED wafer；Charge-coupled device
The reflected light on the available LED wafer surface of imaging sensor 106, to acquire the representation of laser facula of LED wafer, image procossing
Device handles the representation of laser facula of coating front and back, according to the processed representation of laser facula of coating front and back, to LED wafer
Spraying area carry out phosphor gel coating thickness measurement.
As shown in Fig. 2, the coating control equipment of the present embodiment is the host computer of phosphor gel application system, it can be meter
Calculation machine comprising processor 108, memory, input unit 109, display 110 and the network connected by system bus 107
Interface 111, which calculates for offer and control ability, the memory include non-volatile memory medium 112 and memory
Reservoir 113, the non-volatile memory medium 112 are stored with operating system, computer program and database, the built-in storage 113
Environment is provided for the operation of operating system and computer program in non-volatile memory medium, processor 108 executes memory
When the computer program of storage, phosphor gel coating method is executed.
As shown in figure 3, the phosphor gel coating method of the present embodiment the following steps are included:
S301, control parameter, control coating are coated according to the default of the multivariable coating layer thickness distributed model pre-established
Executing agency carries out phosphor gel coating to LED wafer.
It opens barrel and circulation stirring is carried out to phosphor gel, LED wafer to be coated is placed on to the inlet of transport mechanism,
And then it is sent to coating zone, and after LED wafer enters coating zone, since LED wafer is to coat for the first time, coating control equipment
Control parameter is coated according to the default of the multivariable coating layer thickness distributed model pre-established, control coating executing agency is to LED
Wafer carries out phosphor gel coating.
The phosphor gel coating layer thickness of LED wafer after S302, control thickness-measuring equipment measurement coating.
As previously described, thickness-measuring equipment uses special laser thickness gauge, and measuring principle is using laser triangulation
The normal direction of method, the concentrated lens of the incident ray of laser emitter and LED wafer plane is into θ angle, from laser emitter
The incident chief ray of sending is into θ angle by convergent lens and LED wafer plane normal, and emergent ray and normal are at the angle φ, imaging
The focal length of lens is L.
In the present embodiment, coating control equipment carries out phosphor gel coating to LED wafer in control coating executing agency
Before, laser transmitter projects laser is first passed through, so that on incident chief ray incident to the A point on LED wafer surface, concentrated lens
After imaging, imaging point is fallen on the photosurface C point of ccd image sensor；Coating control equipment is held in control coating
After row mechanism carries out phosphor gel coating to LED wafer, then by laser transmitter projects laser, so that incident chief ray incident
Onto the B point on LED wafer surface, after concentrated lens imaging, imaging point falls in the photosensitive of ccd image sensor
On face D point；The coating thickness of phosphor gel is H, and the distance of C point to D point is d, can be obtained by triangle relation derivation:
S303, according to phosphor gel coating layer thickness, it is determined whether need to correct current coating control parameter.
If so, illustrating that LED wafer coating does not complete, needs to carry out coating next time, S304 is entered step, if it is not, saying
Bright LED wafer coating is completed, and S305 is entered step.
Further, step S303 is as shown in figure 4, specifically include:
S3031, phosphor gel coating layer thickness is compared with setting coating thickness, obtains coating thickness error.
Specifically, if phosphor gel coating layer thickness is greater than setting coating thickness, phosphor gel coating layer thickness is subtracted into coating
Thickness, obtained difference are coating thickness error；If phosphor gel coating layer thickness is less than setting coating thickness, by coating thickness
Phosphor gel coating layer thickness is subtracted, what is obtained is coating thickness error.
S3032, coating thickness error is compared with the limits of error of setting, is set if coating thickness error is greater than
The fixed limits of error then need to correct current coating control parameter, if coating thickness error is less than or equal to setting most
Big allowable error does not need then to correct current coating control parameter.
S304, current coating control parameter is modified, according to revised coating control parameter, control coating is executed
Mechanism carries out phosphor gel coating to LED wafer.
Current coating control parameter is modified, specifically: thickness is applied according to current coating control parameter and multivariable
The default for spending distributed model coats control parameter, and the amendment of current coating control parameter is calculated using Iterative Learning Control Algorithm
Value, to obtain revised coating control parameter.
In the present embodiment, the correction value of current coating control parameter, selection are calculated using Iterative Learning Control Algorithm
A kind of coating controller model, such as PID type:
Wherein, uiFor default coating controling parameter (theory coating controling parameter), ui+1It is (real currently to coat controling parameter
Border coats controling parameter), eiFor coating thickness error, α, beta, gamma is coefficient matrix, and revised coating control is finally calculated
Parameter processed.
According to revised coating control parameter, control coating executing agency carries out phosphor gel coating to LED wafer
Later, return step S302.
S305, control coating executing agency terminate blanking.
As shown in figure 5, the multivariable coating layer thickness distributed model establishment process of the present embodiment the following steps are included:
S501, gaussian sum coating Accumulation Model is chosen as phosphor gel static state spraying model.
Fig. 6 is phosphor gel coating cumulative thickness schematic diagram, and atomized fluorescence powder coating stream is with radial from nozzle
It sprays, sprays the spatial distribution approximation circular cone of coating.Assuming that s point is r to the distance projected along injection direction, coating radius is R,
If choosing the extensive gaussian sum coating Accumulation Model of applicability, coating cumulative function can be expressed as follows:
In formula, ω1,ω2,ω3,r1,r2,r3,σ1,σ2,σ3For the parameter of gaussian sum coating Accumulation Model.
S502, design are respectively to be fed air pressure, sprinkler height, atomizing pressure as independent variable, using coating thickness as dependent variable
Uniform the coating experiment.
S503, phosphor gel static state is sprayed into the form that the parameter in model is expressed as coating control parameter, foundation contains
Coat the extensive multivariable coating layer thickness model of control parameter.
S504, the variance to set coating thickness and practical coating thickness carry out non-linear minimum two as optimization aim
Multiplication fitting optimization, solves the undetermined coefficient of extensive multivariable coating layer thickness model, obtains multivariable coating layer thickness model.
Specifically, the i.e. selected nonlinear function of Non-linear least-square curve fitting, such as:
Y (x)=c1+c2*e^ (- 3*x)+c3*cos (- 2*x) * exp (- 4*x)+c4*x^2
Lsqcurvefit () is nonlinear least square fitting function in matlab, is substantially to solve for optimizing and ask
Topic uses format are as follows:
X=lsqcurvefit (fun, x0, xdata, ydata)
Wherein, fun is the nonlinear function to be fitted, and x0 is initial parameter, and xdata, ydata are the data of match point,
The nonlinear least square fitting function finally returns that coefficient matrix；The inputoutput data of experiment is imported, it is suitable to fit
Parameter make error sum of squares minimum, finally obtain multivariable coating layer thickness model.
S505, it is repaired using multivariable coating layer thickness model prediction coating thickness, and to multivariable coating layer thickness model
Just.
Specifically, using multivariable coating layer thickness model prediction coating thickness, prediction coating thickness and practical coating is thick
Degree compares, to be modified to multivariable coating layer thickness model.
It should be noted that although describing above-mentioned method operation in the accompanying drawings with particular order, this do not require that or
Person implies must execute these operations in this particular order, or has to carry out operation shown in whole and be just able to achieve expectation
Result.On the contrary, the step of describing can change and execute sequence.Additionally or alternatively, it is convenient to omit certain steps, it will be multiple
Step is merged into a step and is executed, and/or a step is decomposed into execution of multiple steps.
Embodiment 2:
As shown in fig. 7, present embodiments providing a kind of phosphor gel coating unit, which is applied to coating control and sets
It is standby, including coat module 701, measurement module 702, determining module 703, the first correction module 704 and ending module 705, it is each
The concrete function of module is as follows:
The coat module 701, for after LED wafer enters coating zone, according to the multivariable coating pre-established
The default of thickness distribution model coats control parameter, and control coating executing agency carries out phosphor gel coating to LED wafer.
The measurement module 702, for controlling the phosphor gel coating layer thickness of LED wafer after thickness-measuring equipment measurement coats.
The determining module 703, for according to phosphor gel coating layer thickness, it is determined whether need to correct current coating control
Parameter.
First correction module 704, for the current coating control parameter of if desired amendment, then to current coating control ginseng
Number is modified, and according to revised coating control parameter, control coating executing agency carries out phosphor gel painting to LED wafer
It covers, and returns to the phosphor gel coating layer thickness of LED wafer after control thickness-measuring equipment measurement coating.
The ending module 705, if controlling coating executing agency knot for not needing to correct current coating control parameter
Beam blanking.
Further, the determining module 703 is as shown in figure 8, specifically include:
First comparing unit 7031 is applied for phosphor gel coating layer thickness to be compared with setting coating thickness
Cover thickness error.
Second comparing unit 7032, for coating thickness error to be compared with the limits of error of setting, if applying
The limits of error that thickness error is greater than setting are covered, then need to correct current coating control parameter, if coating thickness error is small
In or equal to setting the limits of error, then do not need to correct current coating control parameter.
Further, in the correction module 704, current coating control parameter is modified, specifically:
Control parameter is coated according to the default of current coating control parameter and multivariable coating layer thickness distributed model, using repeatedly
The correction value that current coating control parameter is calculated for control learning algorithm, to obtain revised coating control parameter.
Further, as shown in figure 9, the foundation of multivariable coating layer thickness distributed model is real especially by following module
It is existing:
Module 901 is chosen, sprays model for choosing gaussian sum coating Accumulation Model as phosphor gel static state.
Module 902 is designed, for designing respectively to be fed air pressure, sprinkler height, atomizing pressure as independent variable, to coat thickness
Degree is the uniform the coating experiment of dependent variable.
Module 903 is established, the parameter for spraying phosphor gel static state in model is expressed as the shape of coating control parameter
Formula establishes the extensive multivariable coating layer thickness model containing coating control parameter.
Optimization module 904 carries out non-for the variance to set coating thickness and practical coating thickness as optimization aim
Linear least squares fit optimization, solves the undetermined coefficient of extensive multivariable coating layer thickness model, obtains multivariable and applies thickness
Spend model.
Second correction module 905, for using multivariable coating layer thickness model prediction coating thickness, and to multivariable coating
Thickness model is modified.
The specific implementation of modules may refer to above-described embodiment 1 in the present embodiment, and this is no longer going to repeat them.It needs
Illustrate, device provided in this embodiment only the example of the division of the above functional modules, in practical applications,
It can according to need and be completed by different functional modules above-mentioned function distribution, i.e., internal structure is divided into different functions
Module, to complete all or part of the functions described above.
It is appreciated that term " first ", " second " used in the device of the present embodiment etc. can be used for describing various lists
Member, but these units should not be limited by these terms.These terms are only used to distinguish first module and another module.Citing
For, without departing from the scope of the invention, first judgment module can be known as to the second judgment module, and similar
Second judgment module, can be known as first judgment module by ground, and first judgment module and the second judgment module both judge mould
Block, but it is not same judgment module.
Embodiment 3:
A kind of storage medium is present embodiments provided, which is computer readable storage medium, is stored with meter
Calculation machine program when described program is executed by processor, when processor executes the computer program of memory storage, realizes above-mentioned reality
The phosphor gel coating method of example 1 is applied, as follows:
After LED wafer enters coating zone, applied according to the default of the multivariable coating layer thickness distributed model pre-established
Control parameter is covered, control coating executing agency carries out phosphor gel coating to LED wafer；
Control the phosphor gel coating layer thickness of LED wafer after thickness-measuring equipment measurement coats；
According to phosphor gel coating layer thickness, it is determined whether need to correct current coating control parameter；
If desired the current coating control parameter of amendment is then modified current coating control parameter, according to revised
Control parameter is coated, control coating executing agency carries out phosphor gel coating to LED wafer, and returns to control thickness-measuring equipment measurement
The phosphor gel coating layer thickness of LED wafer after coating；
If not needing to correct current coating control parameter, controlling coating executing agency terminates blanking.
Further, described according to phosphor gel coating layer thickness, it is determined whether to need to correct current coating control parameter, tool
Body includes:
Phosphor gel coating layer thickness is compared with setting coating thickness, obtains coating thickness error；
Coating thickness error is compared with the limits of error of setting, if coating thickness error is greater than setting most
Big allowable error then needs to correct current coating control parameter, if coating thickness error is less than or equal to the maximum allowable of setting
Error does not need then to correct current coating control parameter.
It is further, described that current coating control parameter is modified, specifically:
Control parameter is coated according to the default of current coating control parameter and multivariable coating layer thickness distributed model, using repeatedly
The correction value that current coating control parameter is calculated for control learning algorithm, to obtain revised coating control parameter.
Further, the coating control parameter includes feed air pressure, sprinkler height and atomizing pressure；
The establishment process of the multivariable coating layer thickness distributed model includes:
Gaussian sum coating Accumulation Model is chosen as phosphor gel static state and sprays model；
Design is respectively to be fed air pressure, sprinkler height, atomizing pressure as independent variable, using coating thickness as the uniform of dependent variable
The coating experiment；
Phosphor gel static state is sprayed into the form that the parameter in model is expressed as coating control parameter, is established containing coating control
The extensive multivariable coating layer thickness model of parameter processed；
It is quasi- to carry out nonlinear least square method as optimization aim for variance to set coating thickness and practical coating thickness
Optimization is closed, the undetermined coefficient of extensive multivariable coating layer thickness model is solved, obtains multivariable coating layer thickness model；
It is modified using multivariable coating layer thickness model prediction coating thickness, and to multivariable coating layer thickness model.
Storage medium in the present embodiment can be disk, CD, computer storage, read-only memory (ROM, Read-
Only Memory), random access memory (RAM, Random Access Memory), USB flash disk, the media such as mobile hard disk.
In conclusion the present invention is uneven for coating thickness in conventional fluorescent arogel coating processes, LED illumination effect is poor
The problem of, it from coating processes process, fully considers the influence of process equipment and parameter, pre-establishes multivariable coating layer thickness
Distributed model, and Iterative Learning Control Algorithm is introduced, to accurately adjust coating control parameter, it is ensured that high power white light
The uniformity consistency of LED fluorescent powder glue coating, improves the coating quality and coating efficiency of large power white light LED, is particularly suitable for
The technique that high-precision coating requires.
The above, only the invention patent preferred embodiment, but the scope of protection of the patent of the present invention is not limited to
This, anyone skilled in the art is in the range disclosed in the invention patent, according to the present invention the skill of patent
Art scheme and its inventive concept are subject to equivalent substitution or change, belong to the scope of protection of the patent of the present invention.
Claims (10)
1. a kind of phosphor gel coating method, which is characterized in that the described method includes:
After LED wafer enters coating zone, control is coated according to the default of the multivariable coating layer thickness distributed model pre-established
Parameter processed, control coating executing agency carry out phosphor gel coating to LED wafer；
Control the phosphor gel coating layer thickness of LED wafer after thickness-measuring equipment measurement coats；
According to phosphor gel coating layer thickness, it is determined whether need to correct current coating control parameter；
If desired the current coating control parameter of amendment is then modified current coating control parameter, according to revised coating
Control parameter, control coating executing agency carry out phosphor gel coating to LED wafer, and return to control thickness-measuring equipment measurement coating
The phosphor gel coating layer thickness of LED wafer afterwards；
If not needing to correct current coating control parameter, controlling coating executing agency terminates blanking.
2. phosphor gel coating method according to claim 1, which is characterized in that described to apply thickness according to phosphor gel
Degree, it is determined whether need to correct current coating control parameter, specifically include:
Phosphor gel coating layer thickness is compared with setting coating thickness, obtains coating thickness error；
Coating thickness error is compared with the limits of error of setting, if the maximum that coating thickness error is greater than setting permits
Perhaps error then needs to correct current coating control parameter, if coating thickness error is less than or equal to the limits of error of setting,
It does not need then to correct current coating control parameter.
3. phosphor gel coating method according to claim 1, which is characterized in that it is described to current coating control parameter into
Row amendment, specifically:
Control parameter is coated according to the default of current coating control parameter and multivariable coating layer thickness distributed model, using iteration
The correction value that control algolithm calculates current coating control parameter is practised, to obtain revised coating control parameter.
4. phosphor gel coating method according to claim 1-3, which is characterized in that the coating control parameter
Including feed air pressure, sprinkler height and atomizing pressure；
The establishment process of the multivariable coating layer thickness distributed model includes:
Gaussian sum coating Accumulation Model is chosen as phosphor gel static state and sprays model；
Design is respectively to be fed air pressure, sprinkler height, atomizing pressure as independent variable, using coating thickness as the uniform coating of dependent variable
Experiment；
Phosphor gel static state is sprayed into the form that the parameter in model is expressed as coating control parameter, is established containing coating control ginseng
Several extensive multivariable coating layer thickness models；
It is excellent to carry out Non-linear least-square curve fitting as optimization aim for variance to set coating thickness and practical coating thickness
Change, solves the undetermined coefficient of extensive multivariable coating layer thickness model, obtain multivariable coating layer thickness model；
It is modified using multivariable coating layer thickness model prediction coating thickness, and to multivariable coating layer thickness model.
5. a kind of phosphor gel coating unit, which is characterized in that described device includes:
Coat module, for after LED wafer enters coating zone, according to the multivariable coating layer thickness distributed model pre-established
Default coat control parameter, control coating executing agency to LED wafer carry out phosphor gel coating；
Measurement module, for controlling the phosphor gel coating layer thickness of LED wafer after thickness-measuring equipment measurement coats；
Determining module, for according to phosphor gel coating layer thickness, it is determined whether need to correct current coating control parameter；
Correction module is then modified current coating control parameter for the current coating control parameter of if desired amendment, according to
Revised coating control parameter, control coating executing agency carries out phosphor gel coating to LED wafer, and returns to control thickness measuring
The phosphor gel coating layer thickness of LED wafer after device measuring coating；
Ending module, if controlling coating executing agency terminates blanking for not needing to correct current coating control parameter.
6. a kind of phosphor gel application system, which is characterized in that the system comprises transport mechanisms, coating executing agency, thickness measuring
Equipment and coating control equipment, the transport mechanism, coating executing agency and thickness-measuring equipment are connected with coating control equipment respectively；
The transport mechanism, for the LED wafer to be coated of transport mechanism inlet to be sent to coating zone, and will coating
The LED wafer of completion is sent to the exit of transport mechanism from coating zone；
The coating executing agency is used to carry out phosphor gel circulation stirring, and according to coating control parameter, to LED crystalline substance
Circle carries out phosphor gel coating；
The thickness-measuring equipment, for measure coating after LED wafer phosphor gel coating layer thickness；
The coating controls equipment, requires the described in any item phosphor gel coating methods of 1-4 for perform claim.
7. phosphor gel application system according to claim 6, which is characterized in that the coating executing agency includes barrel
And nozzle；
The barrel carries out circulation stirring for loading phosphor gel, and to phosphor gel；
The nozzle is connected with coating control equipment, and the feeding inlet of nozzle is connected with the discharge port of barrel, for according to painting
Control parameter is covered, phosphor gel coating is carried out to LED wafer.
8. according to the described in any item phosphor gel application systems of claim 6-7, which is characterized in that the thickness-measuring equipment includes
Laser emitter, ccd image sensor and image processor, the ccd image sensor and figure
Picture processor is connected, and the laser emitter and image processor are connected with coating control equipment respectively；
The laser emitter, for emitting laser irradiation respectively afterwards to LED wafer surface before coating；
The ccd image sensor, for obtaining the reflected light on LED wafer surface, to acquire LED wafer surface
Representation of laser facula；
Described image processor is handled for the representation of laser facula to coating front and back, according to the processed of coating front and back
Representation of laser facula carries out phosphor gel coating thickness measurement to the spraying area of LED wafer.
9. a kind of coating controls equipment, including processor and for the memory of storage processor executable program, feature
It is, when the processor executes the program of memory storage, realizes the described in any item phosphor gel coatings of claim 1-4
Method.
10. a kind of storage medium, is stored with program, which is characterized in that when described program is executed by processor, realize claim
The described in any item phosphor gel coating methods of 1-4.
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