CN110534629B - Fluorescent powder glue coating method, device and system, coating control equipment and storage medium - Google Patents
Fluorescent powder glue coating method, device and system, coating control equipment and storage medium Download PDFInfo
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- CN110534629B CN110534629B CN201910666526.6A CN201910666526A CN110534629B CN 110534629 B CN110534629 B CN 110534629B CN 201910666526 A CN201910666526 A CN 201910666526A CN 110534629 B CN110534629 B CN 110534629B
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- 238000000576 coating method Methods 0.000 title claims abstract description 501
- 239000011248 coating agent Substances 0.000 title claims abstract description 477
- 239000000843 powder Substances 0.000 title claims abstract description 124
- 239000003292 glue Substances 0.000 title claims abstract description 105
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 27
- 238000005507 spraying Methods 0.000 claims description 20
- 230000006870 function Effects 0.000 claims description 17
- 238000009825 accumulation Methods 0.000 claims description 16
- 238000005457 optimization Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 14
- 230000003068 static effect Effects 0.000 claims description 14
- 238000012937 correction Methods 0.000 claims description 9
- 238000002474 experimental method Methods 0.000 claims description 9
- 239000007921 spray Substances 0.000 claims description 7
- 230000001419 dependent effect Effects 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 6
- 238000000889 atomisation Methods 0.000 description 5
- 238000004590 computer program Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009675 coating thickness measurement Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/084—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to condition of liquid or other fluent material already sprayed on the target, e.g. coating thickness, weight or pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/20—Arrangements for agitating the material to be sprayed, e.g. for stirring, mixing or homogenising
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a fluorescent powder glue coating method, a fluorescent powder glue coating device, a fluorescent powder glue coating system, a fluorescent powder glue coating control device and a storage medium, wherein the method comprises the following steps: controlling a coating execution mechanism to perform fluorescent powder glue coating on the LED wafer according to default coating control parameters of a pre-established multivariable coating thickness distribution model; controlling thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer; determining whether the current coating control parameters need to be corrected or not according to the thickness of the fluorescent powder adhesive coating; if so, correcting the current coating control parameter, controlling a coating execution mechanism to coat the LED wafer with the fluorescent powder glue according to the corrected coating control parameter, and returning to control the thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer; if not, controlling the coating executing mechanism to finish blanking. The invention has strong adaptability, can ensure the uniform coating consistency of the fluorescent powder glue of the high-power white light LED, and improves the coating quality and the coating efficiency of the high-power white light LED.
Description
Technical Field
The invention relates to a fluorescent powder glue coating method, device and system, coating control equipment and a storage medium, and belongs to the field of fluorescent powder glue coating.
Background
Compared with the traditional illumination light source, the high-power white light LED has a series of advantages of small volume, low voltage, low power consumption, high reliability, long service life, energy conservation, environmental protection and the like, and is a green illumination light source which accords with environmental protection and energy conservation.
In the process of coating an LED chip, a fluorescent powder coating technology is the most critical link, wherein various factors such as the integrity of a coating surface, the accuracy of a coating position, the coating thickness, the uniformity of fluorescent powder distribution and the like can influence the light emitting and color temperature quality of the LED. Free dispensing and atomization spraying are the most common fluorescent powder coating forms in the LED market at present, but because the coating thickness and uniformity of the fluorescent powder are difficult to control accurately, the emergent light color is inconsistent, and the emergent light is slightly blue or yellow.
Disclosure of Invention
In view of the above, the invention provides a fluorescent powder glue coating method, a fluorescent powder glue coating device, a fluorescent powder glue coating system, a fluorescent powder glue coating control device and a storage medium, wherein the fluorescent powder glue coating thickness is controlled by a pre-established multivariable coating thickness distribution model and an iterative learning control algorithm, so that the fluorescent powder glue coating method has strong adaptability, can ensure the uniform coating consistency of the high-power white light LED fluorescent powder glue coating, improves the coating quality and the coating efficiency of the high-power white light LED, and solves the technical problem of the coating process of the white light LED fluorescent powder glue.
The first purpose of the invention is to provide a fluorescent powder glue coating method.
The second purpose of the invention is to provide a fluorescent powder glue coating device.
The third purpose of the invention is to provide a fluorescent powder glue coating system.
A fourth object of the present invention is to provide a coating control apparatus.
A fifth object of the present invention is to provide a storage medium.
The first purpose of the invention can be achieved by adopting the following technical scheme:
a phosphor paste coating method, the method comprising:
after the LED wafer enters the coating area, controlling a coating execution mechanism to perform fluorescent powder glue coating on the LED wafer according to default coating control parameters of a pre-established multivariable coating thickness distribution model;
controlling thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer;
determining whether the current coating control parameters need to be corrected or not according to the thickness of the fluorescent powder adhesive coating;
if the current coating control parameter needs to be corrected, correcting the current coating control parameter, controlling a coating execution mechanism to coat the LED wafer with the fluorescent powder glue according to the corrected coating control parameter, and returning to control the thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer;
and if the current coating control parameters do not need to be corrected, controlling the coating executing mechanism to finish blanking.
Further, determining whether the current coating control parameter needs to be corrected according to the thickness of the fluorescent powder glue coating layer specifically includes:
comparing the thickness of the fluorescent powder adhesive coating with the set coating thickness to obtain a coating thickness error;
and comparing the coating thickness error with the set maximum allowable error, if the coating thickness error is greater than the set maximum allowable error, the current coating control parameter needs to be corrected, and if the coating thickness error is less than or equal to the set maximum allowable error, the current coating control parameter does not need to be corrected.
Further, the modifying the current coating control parameter specifically includes:
and calculating the correction value of the current coating control parameter by adopting an iterative learning control algorithm according to the current coating control parameter and the default coating control parameter of the multivariable coating thickness distribution model, thereby obtaining the corrected coating control parameter.
Further, the coating control parameters comprise feeding air pressure, spray head height and atomization pressure;
the establishing process of the multivariate coating thickness distribution model comprises the following steps:
selecting a Gaussian and coating accumulation model as a fluorescent powder glue static spraying model;
designing a uniform coating experiment which takes the feeding air pressure, the height of a spray head and the atomizing pressure as independent variables and takes the coating thickness as a dependent variable;
expressing parameters in the fluorescent powder adhesive static spraying model as coating control parameters, and establishing a generalized multivariable coating thickness model containing the coating control parameters;
taking the variance between the set coating thickness and the actual coating thickness as an optimization target, performing nonlinear least square fitting optimization, and solving the undetermined coefficient of the generalized multivariate coating thickness model to obtain a multivariate coating thickness model;
and predicting the coating thickness by using the multivariate coating thickness model, and correcting the multivariate coating thickness model.
The second purpose of the invention can be achieved by adopting the following technical scheme:
a phosphor paste coating apparatus, the apparatus comprising:
the coating module is used for controlling the coating execution mechanism to perform fluorescent powder glue coating on the LED wafer according to default coating control parameters of a pre-established multivariable coating thickness distribution model after the LED wafer enters a coating area;
the measuring module is used for controlling the thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer;
the determining module is used for determining whether the current coating control parameters need to be corrected or not according to the thickness of the fluorescent powder adhesive coating;
the correction module is used for correcting the current coating control parameter if the current coating control parameter needs to be corrected, controlling the coating execution mechanism to coat the LED wafer with the fluorescent powder glue according to the corrected coating control parameter, and returning to the control thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer;
and the ending module is used for controlling the coating executing mechanism to end the blanking if the current coating control parameters do not need to be corrected.
The third purpose of the invention can be achieved by adopting the following technical scheme:
a fluorescent powder glue coating system comprises a conveying mechanism, a coating executing mechanism, thickness measuring equipment and coating control equipment, wherein the conveying mechanism, the coating executing mechanism and the thickness measuring equipment are respectively connected with the coating control equipment;
the conveying mechanism is used for conveying the LED wafer to be coated at the inlet of the conveying mechanism to a coating area and conveying the coated LED wafer from the coating area to the outlet of the conveying mechanism;
the coating executing mechanism is used for circularly stirring the fluorescent powder glue and coating the fluorescent powder glue on the LED wafer according to the coating control parameters;
the thickness measuring equipment is used for measuring the thickness of the fluorescent powder glue coating of the coated LED wafer;
the coating control equipment is used for executing the fluorescent powder glue coating method.
Further, the coating actuator comprises a cartridge and a nozzle;
the charging barrel is used for loading fluorescent powder glue and circularly stirring the fluorescent powder glue;
the nozzle is connected with the coating control equipment, and a feeding port of the nozzle is communicated with a discharging port of the charging barrel and used for coating the LED wafer with the fluorescent powder glue according to the coating control parameters.
Furthermore, the thickness measuring equipment comprises a laser emitter, a charge coupled device image sensor and an image processor, wherein the charge coupled device image sensor is connected with the image processor, and the laser emitter and the image processor are respectively connected with the coating control equipment;
the laser emitter is used for respectively emitting laser to irradiate the surface of the LED wafer before and after coating;
the CCD image sensor is used for acquiring reflected light on the surface of the LED wafer so as to acquire a laser spot image on the surface of the LED wafer;
the image processor is used for processing the laser spot images before and after coating, and measuring the thickness of the fluorescent powder glue coating in the spraying area of the LED wafer according to the processed laser spot images before and after coating.
The fourth purpose of the invention can be achieved by adopting the following technical scheme:
the coating control equipment comprises a processor and a memory for storing a program executable by the processor, and when the processor executes the program stored in the memory, the fluorescent powder glue coating method is realized.
The fifth purpose of the invention can be achieved by adopting the following technical scheme:
a storage medium stores a program which, when executed by a processor, implements the above-described phosphor paste coating method.
Compared with the prior art, the invention has the following beneficial effects:
aiming at the problems of uneven coating thickness and poor LED light-emitting effect in the traditional fluorescent powder glue coating process, the invention sets up a multivariable coating thickness distribution model in advance by fully considering the influence of process equipment and parameters from the coating process and introduces an iterative learning control algorithm, thereby accurately adjusting coating control parameters, ensuring the uniform coating consistency of the high-power white light LED fluorescent powder glue, improving the coating quality and the coating efficiency of the high-power white light LED, and being particularly suitable for the process with high-precision coating requirements.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a structural diagram of a phosphor paste coating system according to embodiment 1 of the present invention.
Fig. 2 is a block diagram showing the structure of a coating control apparatus according to embodiment 1 of the present invention.
FIG. 3 is a flow chart of a phosphor glue coating method according to embodiment 1 of the present invention.
Fig. 4 is a flowchart of determining whether the current coating control parameter needs to be corrected according to embodiment 1 of the present invention.
FIG. 5 is a flowchart of the process of modeling the thickness of a coating layer in the multivariate according to example 1 of the present invention.
FIG. 6 is a schematic diagram of the cumulative thickness of the phosphor glue coating in example 1 of the present invention.
Fig. 7 is a block diagram of a fluorescent powder glue coating apparatus according to embodiment 2 of the present invention.
Fig. 8 is a block diagram of a determination module according to embodiment 2 of the present invention.
FIG. 9 is a graph of the relationship of the various modules of the multivariate coating thickness model of example 2 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer and more complete, the technical solutions in the embodiments of the present invention will be described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
Example 1:
as shown in fig. 1, the present embodiment provides a phosphor paste coating system, which includes a conveying mechanism 101, a coating actuator 102, a thickness measuring device and a coating control device (not shown in the figure), wherein the conveying mechanism 101, the coating actuator 102 and the thickness measuring device are respectively connected to the coating control device.
The conveying mechanism 101 may include a base, a conveyor belt, four driving wheels, and a driving motor, wherein one end of the base is used as an inlet of the conveying mechanism 101, and the other end is used as an outlet of the conveying mechanism 101, two of the driving wheels are oppositely disposed at the inlet of the conveying mechanism 101 to form a first group of driving wheel sets and are connected to the base through a driving shaft, the other two driving wheels are oppositely disposed at the outlet of the conveying mechanism 101 to form a second group of driving wheel sets and are connected to the base through a driving shaft, the conveyor belt is respectively connected to the two driving shafts, the driving motor is connected to one driving wheel of one group of driving wheel sets (the first group of driving wheel sets or the second group of driving wheel sets), the driving motor drives the driving wheel to rotate to drive the other driving wheel of the group of driving wheel sets, so as to rotate the conveyor, the two driving wheels of the other driving wheel set also rotate to transfer the LED wafer 103 to be coated at the entrance of the transfer mechanism 101 to the coating area and to transfer the coated LED wafer 103 from the coating area to the exit of the transfer mechanism 101.
The coating executing mechanism 102 can circularly stir the fluorescent powder glue and coat the fluorescent powder glue on the LED wafer according to the coating control parameters; specifically, the coating execution mechanism 102 includes two material cylinders 1021 and two nozzles 1022, the material cylinders 1021 are used for loading fluorescent powder glue, the fluorescent powder glue can be circularly stirred by controlling the air pressure of the material cylinders 1021 to achieve defoaming of the fluorescent powder glue, the nozzles 1022 can adopt single-head or multi-head nozzles, and are connected with a coating control device, and a feeding port of the nozzles 1022 is communicated with a discharging port of the material cylinders 1021, and is used for coating the fluorescent powder glue on the LED wafer 103 according to coating control parameters; among other things, coating control parameters may include feed air pressure, showerhead height, and atomization pressure.
In order to fix the coating actuator 102 at a certain position to perform the coating operation, the phosphor paste coating system of the embodiment further includes a truss 104, the truss 104 includes a horizontal rod and two vertical rods, two ends of the horizontal rod are respectively connected to one end of the two vertical rods, the other ends of the two vertical rods are fixed to the left and right sides of one side of the base of the conveyor 101, two material barrels 1021 are arranged left and right and fixed to the horizontal rod of the truss 104, the nozzle 1022 is arranged between the two material barrels 1021, and a discharge opening of the nozzle 1022 is aligned with the coating area of the conveyor 101.
The thickness measuring device of the present embodiment adopts a special laser thickness measuring instrument, which includes a laser emitter 105, a charge-coupled device image (CCD) sensor 106 and an image processor (not shown in the figure), the laser emitter 105 and the CCD image sensor 106 are disposed on the horizontal rod of the truss 104, the CCD image sensor 106 is connected to the image processor, and the laser emitter 105 and the image processor are respectively connected to the coating control device; the laser emitter 105 may emit laser light at an angle to the surface of the LED wafer 103 before and after coating; the CCD image sensor 106 can acquire reflected light on the surface of the LED wafer to acquire laser spot images of the LED wafer, the image processor processes the laser spot images before and after coating, and fluorescent powder adhesive coating thickness measurement is performed on the spraying area of the LED wafer according to the processed laser spot images before and after coating.
As shown in fig. 2, the coating control apparatus of the present embodiment is a host computer of a phosphor paste coating system, which may be a computer, and includes a processor 108, a memory, an input device 109, a display 110, and a network interface 111 connected by a system bus 107, where the processor is configured to provide computing and control capabilities, the memory includes a nonvolatile storage medium 112 and an internal memory 113, the nonvolatile storage medium 112 stores an operating system, a computer program, and a database, the internal memory 113 provides an environment for the operating system and the computer program in the nonvolatile storage medium to run, and when the processor 108 executes the computer program stored in the memory, the phosphor paste coating method is executed.
As shown in fig. 3, the phosphor glue coating method of the present embodiment includes the following steps:
s301, controlling a coating execution mechanism to perform fluorescent powder glue coating on the LED wafer according to the default coating control parameters of the pre-established multivariable coating thickness distribution model.
And after the LED wafer enters the coating area, the coating control equipment controls the coating execution mechanism to coat the fluorescent powder glue on the LED wafer according to the default coating control parameters of the pre-established multivariable coating thickness distribution model because the LED wafer is coated for the first time.
S302, controlling thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer.
As mentioned above, the thickness measuring device adopts a special laser thickness gauge, the measuring principle is that a laser triangulation method is adopted, the incident light of a laser transmitter forms an angle theta with the normal direction of the LED wafer plane through a convergent lens, the incident chief ray emitted from the laser transmitter forms an angle theta with the normal of the LED wafer plane through the convergent lens, the emergent light forms an angle phi with the normal, and the focal length of an imaging lens is L.
In this embodiment, before controlling the coating actuator to coat the LED wafer with the phosphor paste, the coating control device first emits laser light by the laser emitter, so that the incident chief ray is incident on a point a on the surface of the LED wafer, and after being imaged by the converging lens, the imaging point falls on a point C on the photosensitive surface of the image sensor of the ccd; after controlling the coating execution mechanism to coat the LED wafer with the fluorescent powder glue, the coating control equipment emits laser through the laser transmitter, so that incident principal rays are incident on a point B on the surface of the LED wafer, and after imaging is carried out through the convergent lens, an imaging point falls on a point D on a photosensitive surface of the image sensor of the charge coupled device; the coating thickness of the fluorescent powder glue is H, the distance from the point C to the point D is D, and the distance is deduced from a trigonometric relation:
s303, determining whether the current coating control parameters need to be corrected according to the thickness of the fluorescent powder glue coating.
If so, it means that the coating of the LED wafer is not completed and the next coating is required, the process proceeds to step S304, otherwise, it means that the coating of the LED wafer is completed and the process proceeds to step S305.
Further, as shown in fig. 4, the step S303 specifically includes:
s3031, comparing the thickness of the fluorescent powder glue coating with the set coating thickness to obtain a coating thickness error.
Specifically, if the thickness of the fluorescent powder glue coating is greater than the set coating thickness, subtracting the coating thickness from the thickness of the fluorescent powder glue coating to obtain a difference value, namely a coating thickness error; and if the thickness of the fluorescent powder glue coating is smaller than the set coating thickness, subtracting the thickness of the fluorescent powder glue coating from the coating thickness to obtain the coating thickness error.
S3032, comparing the coating thickness error with the set maximum allowable error, if the coating thickness error is greater than the set maximum allowable error, the current coating control parameter needs to be corrected, and if the coating thickness error is less than or equal to the set maximum allowable error, the current coating control parameter does not need to be corrected.
S304, correcting the current coating control parameter, and controlling a coating execution mechanism to perform fluorescent powder glue coating on the LED wafer according to the corrected coating control parameter.
Correcting the current coating control parameters, specifically: and calculating the correction value of the current coating control parameter by adopting an iterative learning control algorithm according to the current coating control parameter and the default coating control parameter of the multivariable coating thickness distribution model, thereby obtaining the corrected coating control parameter.
In this embodiment, the iterative learning control algorithm is used to calculate the correction values for the current coating control parameters, and a coating controller model, such as PID:
wherein u isiAs a default coating control parameter (theoretical coating control parameter), ui+1For the current coating control variable (actual coating control variable), eiAnd (4) for coating thickness errors, taking alpha, beta and gamma as coefficient matrixes, and finally calculating to obtain the corrected coating control parameters.
And after controlling the coating execution mechanism to perform fluorescent powder glue coating on the LED wafer according to the corrected coating control parameters, returning to the step S302.
And S305, controlling the coating executing mechanism to finish blanking.
As shown in fig. 5, the multivariate coating thickness distribution modeling process of the present embodiment includes the following steps:
s501, selecting a Gaussian and coating accumulation model as a fluorescent powder glue static spraying model.
FIG. 6 is a schematic view of the cumulative thickness of a phosphor gel coating, with a stream of atomized phosphor coating ejected radially from a nozzle with a spatial distribution approximating a cone. Assuming that the distance from the point s to the projection along the jetting direction is R and the coating radius is R, if gaussian and coating accumulation models with wide applicability are selected, the coating accumulation function can be expressed as follows:
in the formula, ω1,ω2,ω3,r1,r2,r3,σ1,σ2,σ3Gaussian and parameters of the coating build-up model.
S502, designing a uniform coating experiment by taking the feeding air pressure, the height of the spray head and the atomizing pressure as independent variables and the coating thickness as a dependent variable.
S503, expressing the parameters in the fluorescent powder adhesive static spraying model as the form of coating control parameters, and establishing a generalized multivariable coating thickness model containing the coating control parameters.
S504, with the variance between the set coating thickness and the actual coating thickness as an optimization target, carrying out nonlinear least square fitting optimization, and solving the undetermined coefficient of the generalized multivariate coating thickness model to obtain the multivariate coating thickness model.
Specifically, a non-linear least squares fit, i.e., a non-linear function is selected, such as:
y(x)＝c1+c2*e^(-3*x)+c3*cos(-2*x)*exp(-4*x)+c4*x^2
lsqcurvefit () is a nonlinear least squares fitting function in matlab, which essentially solves the optimization problem using the format:
x＝lsqcurvefit(fun,x0,xdata,ydata)
where fun is the nonlinear function to be fitted, x0 is the initial parameter, xdata, ydata are the data of the fitting point, and the nonlinear least squares fitting function finally returns the coefficient matrix; and importing the input and output data of the experiment, fitting appropriate parameters to minimize the sum of squares of errors, and finally obtaining a multivariable coating thickness model.
And S505, predicting the coating thickness by using the multivariate coating thickness model, and correcting the multivariate coating thickness model.
Specifically, the coating thickness is predicted using a multivariate coating thickness model, and the predicted coating thickness is compared with the actual coating thickness to correct the multivariate coating thickness model.
It should be noted that although the method operations described above are depicted in the drawings in a particular order, this does not require or imply that these operations must be performed in this particular order, or that all of the illustrated operations must be performed, to achieve desirable results. Rather, the depicted steps may change the order of execution. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions.
Example 2:
as shown in fig. 7, the present embodiment provides a phosphor paste coating apparatus, which is applied to a coating control device, and includes a coating module 701, a measuring module 702, a determining module 703, a first correcting module 704, and an ending module 705, where the specific functions of the modules are as follows:
the coating module 701 is configured to control the coating execution mechanism to perform phosphor glue coating on the LED wafer according to default coating control parameters of a pre-established multivariate coating thickness distribution model after the LED wafer enters a coating region.
The measuring module 702 is configured to control the thickness measuring equipment to measure the thickness of the phosphor glue coating of the coated LED wafer.
The determining module 703 is configured to determine whether the current coating control parameter needs to be corrected according to the thickness of the phosphor glue coating.
The first correcting module 704 is configured to correct the current coating control parameter if the current coating control parameter needs to be corrected, control the coating executing mechanism to perform fluorescent powder glue coating on the LED wafer according to the corrected coating control parameter, and return to control the thickness measuring device to measure the thickness of the fluorescent powder glue coating of the coated LED wafer.
The ending module 705 is configured to control the coating executing mechanism to end the blanking if the current coating control parameter does not need to be corrected.
Further, as shown in fig. 8, the determining module 703 specifically includes:
a first comparing unit 7031, configured to compare the thickness of the phosphor paste coating with a set coating thickness, so as to obtain a coating thickness error.
A second comparing unit 7032, configured to compare the coating thickness error with the set maximum allowable error, where if the coating thickness error is greater than the set maximum allowable error, the current coating control parameter needs to be corrected, and if the coating thickness error is less than or equal to the set maximum allowable error, the current coating control parameter does not need to be corrected.
Further, in the modification module 704, modifying the current coating control parameter specifically includes:
and calculating the correction value of the current coating control parameter by adopting an iterative learning control algorithm according to the current coating control parameter and the default coating control parameter of the multivariable coating thickness distribution model, thereby obtaining the corrected coating control parameter.
Further, as shown in fig. 9, the establishment of the multivariate coating thickness distribution model is specifically realized by the following modules:
and the selecting module 901 is used for selecting Gaussian and coating accumulation models as the fluorescent powder glue static spraying model.
A design module 902 for designing a uniform coating experiment with feed air pressure, showerhead height, and atomization pressure as independent variables, and coating thickness as a dependent variable, respectively.
And the establishing module 903 is used for representing the parameters in the fluorescent powder adhesive static spraying model into a coating control parameter form and establishing a generalized multivariable coating thickness model containing the coating control parameters.
And an optimization module 904, configured to perform nonlinear least squares fitting optimization with the variance between the set coating thickness and the actual coating thickness as an optimization target, and solve the undetermined coefficient of the generalized multivariate coating thickness model to obtain the multivariate coating thickness model.
And a second correction module 905 for predicting the coating thickness using the multivariate coating thickness model and correcting the multivariate coating thickness model.
For specific implementation of each module in this embodiment, reference may be made to embodiment 1, which is not described herein again. It should be noted that, the apparatus provided in this embodiment is only illustrated by dividing the functional modules, and in practical applications, the functions may be distributed by different functional modules according to needs, that is, the internal structure is divided into different functional modules to complete all or part of the functions described above.
It is to be understood that the terms "first", "second", and the like, as used in the apparatus of the present embodiment, may be used to describe various units, but the units are not limited by these terms. These terms are only used to distinguish one module from another. For example, the first determining module may be referred to as a second determining module, and similarly, the second determining module may be referred to as a first determining module, and the first determining module and the second determining module are both determining modules, but not the same determining module, without departing from the scope of the present invention.
Example 3:
the present embodiment provides a storage medium, which is a computer-readable storage medium, and stores a computer program, and when the program is executed by a processor and the processor executes the computer program stored in the memory, the method for coating phosphor paste of embodiment 1 is implemented as follows:
after the LED wafer enters the coating area, controlling a coating execution mechanism to perform fluorescent powder glue coating on the LED wafer according to default coating control parameters of a pre-established multivariable coating thickness distribution model;
controlling thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer;
determining whether the current coating control parameters need to be corrected or not according to the thickness of the fluorescent powder adhesive coating;
if the current coating control parameter needs to be corrected, correcting the current coating control parameter, controlling a coating execution mechanism to coat the LED wafer with the fluorescent powder glue according to the corrected coating control parameter, and returning to control the thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer;
and if the current coating control parameters do not need to be corrected, controlling the coating executing mechanism to finish blanking.
Further, determining whether the current coating control parameter needs to be corrected according to the thickness of the fluorescent powder glue coating layer specifically includes:
comparing the thickness of the fluorescent powder adhesive coating with the set coating thickness to obtain a coating thickness error;
and comparing the coating thickness error with the set maximum allowable error, if the coating thickness error is greater than the set maximum allowable error, the current coating control parameter needs to be corrected, and if the coating thickness error is less than or equal to the set maximum allowable error, the current coating control parameter does not need to be corrected.
Further, the modifying the current coating control parameter specifically includes:
and calculating the correction value of the current coating control parameter by adopting an iterative learning control algorithm according to the current coating control parameter and the default coating control parameter of the multivariable coating thickness distribution model, thereby obtaining the corrected coating control parameter.
Further, the coating control parameters comprise feeding air pressure, spray head height and atomization pressure;
the establishing process of the multivariate coating thickness distribution model comprises the following steps:
selecting a Gaussian and coating accumulation model as a fluorescent powder glue static spraying model;
designing a uniform coating experiment which takes the feeding air pressure, the height of a spray head and the atomizing pressure as independent variables and takes the coating thickness as a dependent variable;
expressing parameters in the fluorescent powder adhesive static spraying model as coating control parameters, and establishing a generalized multivariable coating thickness model containing the coating control parameters;
taking the variance between the set coating thickness and the actual coating thickness as an optimization target, performing nonlinear least square fitting optimization, and solving the undetermined coefficient of the generalized multivariate coating thickness model to obtain a multivariate coating thickness model;
and predicting the coating thickness by using the multivariate coating thickness model, and correcting the multivariate coating thickness model.
The storage medium in this embodiment may be a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM), a Random Access Memory (RAM), a usb disk, a removable hard disk, or other media.
In summary, the invention aims at the problems of uneven coating thickness and poor LED light emitting effect in the traditional fluorescent powder glue coating process, fully considers the influence of process equipment and parameters from the coating process, establishes a multivariable coating thickness distribution model in advance, and introduces an iterative learning control algorithm, thereby accurately adjusting coating control parameters, ensuring the uniformity of the high-power white light LED fluorescent powder glue coating, improving the coating quality and the coating efficiency of the high-power white light LED, and being particularly suitable for the process with high-precision coating requirements.
The above description is only for the preferred embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution and the inventive concept of the present invention within the scope of the present invention.
Claims (8)
1. A fluorescent powder glue coating method is characterized by comprising the following steps:
after the LED wafer enters the coating area, controlling a coating execution mechanism to perform fluorescent powder glue coating on the LED wafer according to default coating control parameters of a pre-established multivariable coating thickness distribution model;
controlling thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer;
determining whether the current coating control parameters need to be corrected or not according to the thickness of the fluorescent powder adhesive coating;
if the current coating control parameter needs to be corrected, correcting the current coating control parameter, controlling a coating execution mechanism to coat the LED wafer with the fluorescent powder glue according to the corrected coating control parameter, and returning to control the thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer;
if the current coating control parameters do not need to be corrected, controlling the coating executing mechanism to finish blanking;
the method for determining whether the current coating control parameter needs to be corrected according to the thickness of the fluorescent powder adhesive coating specifically comprises the following steps:
comparing the thickness of the fluorescent powder adhesive coating with the set coating thickness to obtain a coating thickness error;
comparing the coating thickness error with a set maximum allowable error, if the coating thickness error is greater than the set maximum allowable error, needing to correct the current coating control parameter, and if the coating thickness error is less than or equal to the set maximum allowable error, needing not to correct the current coating control parameter;
the coating control parameters comprise feeding air pressure, nozzle height and atomizing pressure; the establishing process of the multivariate coating thickness distribution model comprises the following steps:
selecting a Gaussian and coating accumulation model as a fluorescent powder glue static spraying model;
designing a uniform coating experiment which takes the feeding air pressure, the height of a spray head and the atomizing pressure as independent variables and takes the coating thickness as a dependent variable;
expressing parameters in the fluorescent powder adhesive static spraying model as coating control parameters, and establishing a generalized multivariable coating thickness model containing the coating control parameters;
taking the variance between the set coating thickness and the actual coating thickness as an optimization target, performing nonlinear least square fitting optimization, and solving the undetermined coefficient of the generalized multivariate coating thickness model to obtain a multivariate coating thickness model;
predicting the coating thickness by adopting a multivariable coating thickness model, and correcting the multivariable coating thickness model;
selecting a Gauss and coating accumulation model as a fluorescent powder glue static spraying model, specifically: the atomized fluorescent powder coating flow is radially sprayed out of the nozzle, the spatial distribution of the sprayed coating is approximate to a cone, the distance from an s point to a projection along the spraying direction is assumed to be R, the coating radius is assumed to be R, and if a Gaussian and coating accumulation model with wide applicability is selected, the coating accumulation function is expressed as follows:
in the formula, ω1,ω2,ω3,r1,r2,r3,σ1,σ2,σ3Parameters of a gaussian and coating accumulation model;
fitting a selected nonlinear function using a nonlinear least squares method, as follows:
y(x)＝c1+c2*e^(-3*x)+c3*cos(-2*x)*exp(-4*x)+c4*x^2
lsqcurvefit () is a nonlinear least squares fit function in matlab using the format:
x＝lsqcurvefit(fun,x0,xdata,ydata)
where fun is the nonlinear function to be fitted, x0 is the initial parameter, xdata, ydata are the data of the fitting point, and the nonlinear least squares fitting function finally returns the coefficient matrix; and importing the input and output data of the experiment, fitting appropriate parameters to minimize the sum of squares of errors, and finally obtaining a multivariable coating thickness model.
2. The phosphor paste coating method according to claim 1, wherein the current coating control parameter is corrected, specifically:
and calculating the correction value of the current coating control parameter by adopting an iterative learning control algorithm according to the current coating control parameter and the default coating control parameter of the multivariable coating thickness distribution model, thereby obtaining the corrected coating control parameter.
3. A phosphor paste coating apparatus, comprising:
the coating module is used for controlling the coating execution mechanism to perform fluorescent powder glue coating on the LED wafer according to default coating control parameters of a pre-established multivariable coating thickness distribution model after the LED wafer enters a coating area;
the measuring module is used for controlling the thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer;
the determining module is used for determining whether the current coating control parameters need to be corrected or not according to the thickness of the fluorescent powder adhesive coating;
the correction module is used for correcting the current coating control parameter if the current coating control parameter needs to be corrected, controlling the coating execution mechanism to coat the LED wafer with the fluorescent powder glue according to the corrected coating control parameter, and returning to the control thickness measuring equipment to measure the thickness of the fluorescent powder glue coating of the coated LED wafer;
the finishing module is used for controlling the coating executing mechanism to finish blanking if the current coating control parameters do not need to be corrected;
the method for determining whether the current coating control parameter needs to be corrected according to the thickness of the fluorescent powder adhesive coating specifically comprises the following steps:
comparing the thickness of the fluorescent powder adhesive coating with the set coating thickness to obtain a coating thickness error;
comparing the coating thickness error with a set maximum allowable error, if the coating thickness error is greater than the set maximum allowable error, needing to correct the current coating control parameter, and if the coating thickness error is less than or equal to the set maximum allowable error, needing not to correct the current coating control parameter;
the coating control parameters comprise feeding air pressure, nozzle height and atomizing pressure; the establishing process of the multivariate coating thickness distribution model comprises the following steps:
selecting a Gaussian and coating accumulation model as a fluorescent powder glue static spraying model;
designing a uniform coating experiment which takes the feeding air pressure, the height of a spray head and the atomizing pressure as independent variables and takes the coating thickness as a dependent variable;
expressing parameters in the fluorescent powder adhesive static spraying model as coating control parameters, and establishing a generalized multivariable coating thickness model containing the coating control parameters;
taking the variance between the set coating thickness and the actual coating thickness as an optimization target, performing nonlinear least square fitting optimization, and solving the undetermined coefficient of the generalized multivariate coating thickness model to obtain a multivariate coating thickness model;
predicting the coating thickness by adopting a multivariable coating thickness model, and correcting the multivariable coating thickness model;
selecting a Gauss and coating accumulation model as a fluorescent powder glue static spraying model, specifically: the atomized fluorescent powder coating flow is radially sprayed out of the nozzle, the spatial distribution of the sprayed coating is approximate to a cone, the distance from an s point to a projection along the spraying direction is assumed to be R, the coating radius is assumed to be R, and if a Gaussian and coating accumulation model with wide applicability is selected, the coating accumulation function is expressed as follows:
in the formula, ω1,ω2,ω3,r1,r2,r3,σ1,σ2,σ3Parameters of a gaussian and coating accumulation model;
fitting a selected nonlinear function using a nonlinear least squares method, as follows:
y(x)＝c1+c2*e^(-3*x)+c3*cos(-2*x)*exp(-4*x)+c4*x^2
lsqcurvefit () is a nonlinear least squares fit function in matlab using the format:
x＝lsqcurvefit(fun,x0,xdata,ydata)
where fun is the nonlinear function to be fitted, x0 is the initial parameter, xdata, ydata are the data of the fitting point, and the nonlinear least squares fitting function finally returns the coefficient matrix; and importing the input and output data of the experiment, fitting appropriate parameters to minimize the sum of squares of errors, and finally obtaining a multivariable coating thickness model.
4. A fluorescent powder glue coating system is characterized by comprising a conveying mechanism, a coating executing mechanism, thickness measuring equipment and coating control equipment, wherein the conveying mechanism, the coating executing mechanism and the thickness measuring equipment are respectively connected with the coating control equipment;
the conveying mechanism is used for conveying the LED wafer to be coated at the inlet of the conveying mechanism to a coating area and conveying the coated LED wafer from the coating area to the outlet of the conveying mechanism;
the coating executing mechanism is used for circularly stirring the fluorescent powder glue and coating the fluorescent powder glue on the LED wafer according to the coating control parameters;
the thickness measuring equipment is used for measuring the thickness of the fluorescent powder glue coating of the coated LED wafer;
the coating control apparatus for performing the phosphor paste coating method according to any one of claims 1 to 2.
5. The phosphor paste coating system of claim 4, wherein said coating actuator comprises a cartridge and a nozzle;
the charging barrel is used for loading fluorescent powder glue and circularly stirring the fluorescent powder glue;
the nozzle is connected with the coating control equipment, and a feeding port of the nozzle is communicated with a discharging port of the charging barrel and used for coating the LED wafer with the fluorescent powder glue according to the coating control parameters.
6. The phosphor paste coating system according to any one of claims 4 to 5, wherein the thickness measuring device comprises a laser emitter, a CCD image sensor and an image processor, the CCD image sensor is connected with the image processor, and the laser emitter and the image processor are respectively connected with the coating control device;
the laser emitter is used for respectively emitting laser to irradiate the surface of the LED wafer before and after coating;
the CCD image sensor is used for acquiring reflected light on the surface of the LED wafer so as to acquire a laser spot image on the surface of the LED wafer;
the image processor is used for processing the laser spot images before and after coating, and measuring the thickness of the fluorescent powder glue coating in the spraying area of the LED wafer according to the processed laser spot images before and after coating.
7. A coating control apparatus comprising a processor and a memory for storing a program executable by the processor, wherein the processor implements the phosphor paste coating method of any one of claims 1-2 when executing the program stored in the memory.
8. A storage medium storing a program, wherein the program, when executed by a processor, implements the phosphor paste coating method according to any one of claims 1 to 2.
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| CN111420819B (en) * | 2020-03-31 | 2021-12-24 | 联想(北京)有限公司 | Spraying operation control method and device |
| CN111530712A (en) * | 2020-06-08 | 2020-08-14 | 成都晔凡科技有限公司 | Adhesive application system, method of manufacturing a laminated assembly and laminated assembly |
| CN112916346A (en) * | 2021-01-20 | 2021-06-08 | 广州大学 | Fluorescent powder coating method, system and medium based on information fusion prediction control |
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| CN103128041B (en) * | 2013-02-07 | 2014-09-10 | 华南理工大学 | Full automatic fluorescent powder coating process and device |
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