JP2003008082A - 発光ダイオード及びその形成方法 - Google Patents

発光ダイオード及びその形成方法

Info

Publication number
JP2003008082A
JP2003008082A JP2002137637A JP2002137637A JP2003008082A JP 2003008082 A JP2003008082 A JP 2003008082A JP 2002137637 A JP2002137637 A JP 2002137637A JP 2002137637 A JP2002137637 A JP 2002137637A JP 2003008082 A JP2003008082 A JP 2003008082A
Authority
JP
Japan
Prior art keywords
light emitting
light
fluorescent substance
emitting diode
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002137637A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003008082A5 (https=
Inventor
Ryoma Suenaga
良馬 末永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP2002137637A priority Critical patent/JP2003008082A/ja
Publication of JP2003008082A publication Critical patent/JP2003008082A/ja
Publication of JP2003008082A5 publication Critical patent/JP2003008082A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Devices (AREA)
  • Led Device Packages (AREA)
JP2002137637A 2002-05-13 2002-05-13 発光ダイオード及びその形成方法 Pending JP2003008082A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002137637A JP2003008082A (ja) 2002-05-13 2002-05-13 発光ダイオード及びその形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002137637A JP2003008082A (ja) 2002-05-13 2002-05-13 発光ダイオード及びその形成方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP02554599A Division JP3367096B2 (ja) 1999-02-02 1999-02-02 発光ダイオードの形成方法

Publications (2)

Publication Number Publication Date
JP2003008082A true JP2003008082A (ja) 2003-01-10
JP2003008082A5 JP2003008082A5 (https=) 2006-02-23

Family

ID=19194514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002137637A Pending JP2003008082A (ja) 2002-05-13 2002-05-13 発光ダイオード及びその形成方法

Country Status (1)

Country Link
JP (1) JP2003008082A (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005103198A1 (ja) * 2004-04-23 2005-11-03 Sumitomo Chemical Company, Limited 蛍光体
JP2006324486A (ja) * 2005-05-19 2006-11-30 Mitsubishi Electric Corp 半導体発光装置
KR100665121B1 (ko) * 2005-02-28 2007-01-09 삼성전기주식회사 파장변환형 발광 다이오드 패키지 제조방법
JP2008270820A (ja) * 2007-04-23 2008-11-06 Samsung Electro Mech Co Ltd 発光装置及びその製造方法
US7651887B2 (en) 2004-09-22 2010-01-26 Dow Corning Toray Company, Ltd. Optical semiconductor device and method of manufacturing thereof
JP2012227500A (ja) * 2011-04-19 2012-11-15 Lingsen Precision Industries Ltd 発光ダイオードのパッケージング構造

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005103198A1 (ja) * 2004-04-23 2005-11-03 Sumitomo Chemical Company, Limited 蛍光体
US7892451B2 (en) 2004-04-23 2011-02-22 Sumitomo Chemical Company, Limited Phosphor
US7651887B2 (en) 2004-09-22 2010-01-26 Dow Corning Toray Company, Ltd. Optical semiconductor device and method of manufacturing thereof
KR100665121B1 (ko) * 2005-02-28 2007-01-09 삼성전기주식회사 파장변환형 발광 다이오드 패키지 제조방법
JP2006324486A (ja) * 2005-05-19 2006-11-30 Mitsubishi Electric Corp 半導体発光装置
JP2008270820A (ja) * 2007-04-23 2008-11-06 Samsung Electro Mech Co Ltd 発光装置及びその製造方法
US8735935B2 (en) 2007-04-23 2014-05-27 Samsung Electronics Co., Ltd Small size light emitting device and manufacturing method of the same
JP2012227500A (ja) * 2011-04-19 2012-11-15 Lingsen Precision Industries Ltd 発光ダイオードのパッケージング構造

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