JP2003007775A - Method and device for manufacturing tape carrier for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the manufacturing method/device of a tape carrier for semiconductor device, with which tape deformation does not occur even if a processing is performed by a plasma device that can perform the processing under atmospheric pressure. SOLUTION: In tape carrier transport mechanisms (6a and 6b), a tape 8 of the tape carrier is made to pass through an inner plasma discharge space, by using a plasma processor 2 which can perform the processing under atmospheric pressure for a dry cleaning process by the plasma processing. Pressing rolls 7 pressing the TAB tape 8 to the tape carrier transport area of the plasma discharge space from above and below, giving prescribed tension and preventing a warp in the widthwise direction of the TAB tape 8 are arranged in the tape carrier transport area of the plasma discharge space part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for manufacturing a tape carrier for a semiconductor device, which is an electric circuit component used in a semiconductor package.

[0002]

2. Description of the Related Art Generally, a TAB tape includes a tape base material made of an insulating film such as a polyimide resin, and a copper foil attached to the base material. The copper foil is patterned to include wiring leads, bonding pads, solder ball mounting pads, and the like. It is composed of a circuit pattern.

In such a tape carrier for a semiconductor device such as a TAB tape, the contamination of the tape surface impairs the original performance of the tape carrier for a semiconductor device, making it difficult to manufacture a tape carrier for a semiconductor device having sufficient characteristics. Let's train.

For example, in a TAB tape, contamination of wiring leads and pads on the tape surface leads to defects such as defective bonding, reduced ball shear strength of solder balls, and reduced electrical characteristics. Greatly affects the tape performance as a tape carrier. Therefore, in the production of the TAB tape, it is required to keep the cleanliness of the tape surface high.

Particularly in the case of the TAB tape, since the rigidity is lower than that of the lead frame, the stability of wire bonding with respect to the gold-plated surface of the pad is low, and therefore, the improvement of the characteristics is required. One of the factors that affect the strength and stability of the connection is A
The cleanliness of the u-plated surface may be mentioned.

Conventionally, wet cleaning with pure water has been mainly used as a method for removing contamination, but in order to improve surface cleanliness, in addition to wet cleaning such as water cleaning, dry cleaning such as ultraviolet ray or plasma cleaning is performed. It is effective to combine the treatments.
That is, it is expected that the wire bondability will be improved by increasing the cleanliness.

In the case of the plasma cleaning process, the cleaning mechanism itself has not been clarified yet, but it is relatively commonly used in the semiconductor chip mounting process, the liquid crystal display manufacturing process, etc. It is known that it is possible ("Detergent / cleaning dictionary", first edition, p.340, "12.2.2 Plasma cleaning", published by Asakura Shoten Co., Ltd.).

[0008]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
UV cleaning is applied to long tape products such as tapes, but plasma cleaning processing is not applied at present. The reason for this is that plasma cleaning generally requires processing under reduced pressure, resulting in large equipment and cost, poor workability, and long processing time resulting in practical processing speed. It seems that there is a problem such as not being.

On the other hand, it is clear that if dry treatment by plasma treatment is used in addition to wet cleaning as described above, cleanliness can be improved and wire bondability can be expected to be improved.

Therefore, although the present inventors are not known,
Plasma equipment that can be processed under normal pressure (for example, atmospheric pressure plasma equipment (Aiplasm manufactured by Matsushita Electric Works Machine and Vision)
a)) is equipped with a tape carrier transport mechanism in combination, and the device obtained by the combination of both is used.
By treating the TAB tape, it is proposed that the TAB tape excellent in wire bonding property and surface cleanability be efficiently manufactured at low cost.

However, the dry cleaning itself of the TAB tape by plasma treatment is possible only by simply combining the tape carrier transport mechanism with the plasma equipment capable of processing under normal pressure, but the plasma treatment using the plasma equipment capable of processing under normal pressure. It has been found that there is a problem that the TAB tape is deformed (warp in the width direction) by applying the above.

Therefore, an object of the present invention is to solve the above-mentioned problems and to perform a tape cleaning process for a semiconductor device capable of performing a plasma cleaning process which does not cause the deformation of the tape even if the process is performed by a plasma device capable of processing under normal pressure. To provide a flat TAB tape with less deformation and warpage.

[0013]

In order to achieve the above object, the present invention is configured as follows.

According to a first aspect of the present invention, in a method of manufacturing a tape carrier for a semiconductor device having a dry cleaning step by plasma processing, a plasma processing apparatus capable of performing processing under normal pressure is used in the step, and plasma discharge inside thereof is used. The tape carrier is allowed to pass through the space portion, and in the tape carrier transport area of the plasma discharge space portion, the tape carrier is pressed by a pressing roll to apply a predetermined tension to prevent the tape carrier from warping in the width direction. To do.

In the method of manufacturing a tape carrier for a semiconductor device, it is preferable that the pressing roll is cooled (claim 2).

According to a third aspect of the present invention, in a tape carrier manufacturing apparatus for a semiconductor device having a dry cleaning step by plasma processing, a plasma processing apparatus capable of performing processing under normal pressure is provided for the step, and plasma inside thereof is provided. A tape carrier transport mechanism that allows the tape carrier to pass through the discharge space is provided, and the tape carrier is pressed from above and below in the tape carrier transport area of the plasma discharge space to give a predetermined tension to prevent warping in the width direction of the tape carrier. It is characterized by the provision of a pressing roll to prevent it.

In this semiconductor device tape carrier manufacturing apparatus, it is preferable that the pressing roll in the tape carrier transport region of the plasma discharge space portion is provided with a mechanism for cooling itself (claim 4).

<Main Points of the Invention> In the present invention, TAB is used.
A plasma device that can be processed under atmospheric pressure is used for plasma processing of tape carriers for semiconductor devices such as tape, and the function of pressing the tape is held in the tape carrier transfer area of the plasma discharge space on the tape transfer line using a pressing roll. As a result, the tape carrier is given a predetermined tension by this, and the warp of the tape carrier is significantly suppressed.

Further, the pressing roll having a function of pressing the tape is provided with a function of cooling itself to radiate heat generated by plasma irradiation, so that damage to the tape base material can be reduced. it can. As a result, even if the heat-resistant tape portion joining the dummy tape arrives and the tape adhesive material comes into contact with the heated pressing roll, the solvent component does not evaporate, and therefore the tape or roll is formed by the volatile component. It is possible to prevent the inconvenience of being contaminated.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below based on the illustrated embodiments. (Embodiment 1) FIG. 1 shows an outline of an apparatus for manufacturing a tape carrier for a semiconductor device according to a first embodiment of the present invention. Here, as a tape carrier for a semiconductor device, a TAB tape is taken as an example.

This TAB tape manufacturing apparatus comprises an atmospheric pressure plasma device (Aiplasma) 2 manufactured by Matsushita Electric Works Machine and Vision, which has a plasma irradiation unit 1, a TAB tape unwinding device (unwinding unit) 3, and a TAB tape winding device. It has a configuration including an apparatus (winding unit) 4, a tape support roll 5, and a roll (constant speed transport roll) 6 for transporting the TAB tape at a constant speed. Further, according to the features of the present invention, this manufacturing apparatus holds the TAB tape (base tape) 8 from above and below in the tape transport region (tape carrier transport region) of the plasma discharge space to apply a predetermined tension. The roll 7 is provided.

The constant-speed transport roll 6 constitutes a tape carrier transport mechanism. The constant-speed transport roll 6 is provided on the inlet side of the atmospheric pressure plasma device 2 to support the lower side of the TAB tape 8 and a pair of transport rolls is provided on the outlet side. Exit side transport roll 6
and b. Also, the pressing roll 7
Has a function of pressing the tape in the tape transfer area of the plasma discharge space to transfer the tape, and a central pressing roll 71 located below the tape corresponding to the plasma irradiation unit 1, the central pressing roll 71, and the above-mentioned. The front pressing roll 72 provided between the inlet side conveying rolls 6a, the central pressing roll 71, and the outlet side conveying roll 6b.
It is configured to have a rear side pressing roll 73 provided therebetween.

The TAB tape 8 is unwound from the roll of the unwinding device 3 and is fed at a constant speed by the tape drive rolls (the inlet side feed roll 6a and the outlet side feed roll 6b) of the constant velocity feed roll 6 to the atmospheric pressure. The TAB tape winding device 4 passes through the plasma discharge space below the plasma irradiation part 1 of the plasma device 2 and passes through the tape support roll 5 provided between the atmospheric pressure plasma device 2 and the TAB tape winding device 4. It is taken up by the take-up roll.

When passing through the atmospheric pressure plasma device 2, TA
The B tape 8 is subjected to a dry cleaning treatment with plasma from the plasma generating electrode forming the plasma irradiation unit 1,
The tape surface is cleaned. At this time, as shown in FIG. 2, there is no pressing roll 71 in the passage portion of the plasma irradiation unit 1 of the atmospheric pressure plasma device 2,
If only the inlet-side transport roll 6a and the outlet-side transport roll 6b are provided in the sheet, the TAB tape 8 that has been irradiated with plasma is warped in the width direction.

However, in this embodiment, since the pressing roll 7 is provided in the conveying path in the atmospheric pressure plasma apparatus 2, the TAB tape 8 is the central pressing roll 71 from below in the plasma irradiation section 1. While being supported flatly, as a result of being pressed flatly from above by the front side pressing roll 72 and the rear side pressing roll 73 in the front and rear in the transport direction, a predetermined tension is applied.
The warp of the TAB tape 8 is significantly suppressed.

TAB processed using this apparatus (FIG. 1)
Table 1 shows the results of comparing the amount of warp of the tape with the device (FIG. 2) not using the pressing roll 7.

[0027]

[Table 1]

A 48 mm wide TAB tape before plasma treatment was cut into a length of 150 mm and the warp in the width direction of the tape was measured. As a result, the amount of warp was 1 to 2 mm. In the case where the TAB tape was subjected to the plasma treatment without using the pressing roll, the amount of warp of the tape was increased to 6 to 7 mm. However, by performing the plasma treatment with the apparatus equipped with the pressing roll of the present embodiment, the warpage was increased. The amount was significantly reduced to 2-3 mm, and the effect of the press roll on the reduction of warpage was confirmed. (Embodiment 2) FIG. 3 schematically shows a manufacturing apparatus according to a second embodiment of the present invention. As in the first embodiment, this manufacturing apparatus includes an atmospheric pressure plasma device (Aiplasma) 2 manufactured by Matsushita Electric Works Machine and Vision, a TAB tape unwinding device 3, a TAB tape winding device 4, a tape support roll 5, and a tape. Is provided with a roll (constant speed transport roll) 6 for transporting the tape at a constant speed, and a pressing roll 7 for pressing the tape. The pressing roll 7 corresponds to the plasma irradiation unit 1 and is located below the central pressing roll 71, the central pressing roll 71, and the inlet side transport roll 6a.
It is configured to have a front pressing roll 72 provided between them, and a rear pressing roll 73 provided between the central pressing roll 71 and the outlet side transport roll 6b, and this point also relates to the first embodiment. Is the same as.

However, in the case of the embodiment shown in FIG. 3, the central pressing roll 71 is not simply configured as a roller, but has a flow passage for flowing a cooling fluid for drawing out heat generated by plasma processing and radiating the heat. The press roll 7a is provided, which is different from the configuration shown in FIG. In the case of this embodiment, the pressing roll 7a provided with a flow path for flowing the cooling fluid is composed of a pipe-shaped pressing roll 7a forming a pipe path for flowing the cooling water.

Similar to the first embodiment, the TAB tape (base material) is unwound from the unwinding device 3 and is a tape-driving roll which is a tape-driving roll for constant-speed conveyance. After being passed through the plasma irradiation unit 1 and subjected to dry cleaning by plasma by the exit side transport roll 6b), it is taken up by the take-up roll through the tape support roll 5. At that time, as described above, the TAB tape 8 is pressed from above and below by the central pressing roll 71 provided in the plasma irradiation unit 1, and the front pressing roll 72 and the rear pressing roll 73 provided before and after in the transport direction. Then, a predetermined tension is applied, and the occurrence of warpage of the TAB tape 8 is significantly suppressed.

On the other hand, the operational effects or advantages obtained in the structure for plasma-processing the TAB tape by using the apparatus having the roll with cooling function as the pressing roll 7 according to the present embodiment are as follows. It is in.

That is, the TAB tape is long and is wound around a reel, but dummy tapes are used at both ends of the product. This dummy tape and T
A heat-resistant tape is used for the joint of the AB tape, but the solvent component of this tape adhesive volatilizes when it contacts the roll heated by the heat during the plasma treatment,
May contaminate tape or roll.

However, when a roll having a cooling function such as a pressing roll 7a having a cooling fluid passage is used as the central pressing roll 71 which receives the plasma irradiation as described above, the heat generated on the TAB tape by the plasma irradiation is used. Is effectively pumped to the outside and radiated well, so that damage to the tape substrate can be reduced. As a result, even when the heat-resistant tape portion joining the dummy tape to both ends of the TAB tape arrives, the solvent component of the tape adhesive does not come into contact with the heated roll during the plasma treatment and volatilize, and therefore volatilizes. The inconvenience of tape or roll contamination by the components is prevented.

[0034]

As described above, according to the present invention, the following excellent effects can be obtained.

According to the invention of claim 1 or 3, TA
For plasma processing of tape carriers for semiconductor devices such as B tapes, a plasma device that can be processed under atmospheric pressure is used, and the function of pressing the tape is held in the tape carrier transfer area of the plasma discharge space on the tape transfer line. As a result, the tape carrier is given a predetermined tension, and the occurrence of warpage of the tape carrier is significantly suppressed.

Further, according to the invention of claim 2 or 4, since the function of cooling itself is added to the pressing roll having the function of pressing the tape, the heat generated by the plasma irradiation is radiated. It is possible to reduce damage to the tape base material. As a result, even if the heat-resistant tape portion joining the dummy tape arrives and the tape adhesive material comes into contact with the heated pressing roll, the solvent component does not evaporate, and therefore the tape or roll is formed by the volatile component. It is possible to prevent the inconvenience of being contaminated.

[Brief description of drawings]

FIG. 1 shows a manufacturing apparatus according to a first embodiment of the present invention, and is a schematic view showing an example of a configuration including a plasma apparatus having a function of pressing a base tape and capable of performing processing under normal pressure.

FIG. 2 is a schematic diagram showing an example of the structure of a manufacturing apparatus to be compared with the present invention, and showing a manufacturing apparatus using a plasma device that does not have a function of pressing a base tape and can be processed under normal pressure. .

FIG. 3 shows a manufacturing apparatus according to a second embodiment of the present invention, and is a schematic view showing an example of a configuration including a plasma apparatus having a function of pressing a base tape and capable of performing processing under normal pressure.

[Explanation of symbols]

1 Plasma irradiation part 2 Atmospheric pressure plasma equipment 3 TAB tape unwinding device (unwinding section) 4 TAB tape winding device (winding unit) 5 Tape support roll 6 constant speed transport roll 6a Entrance side transport roll 6b Exit side transport roll 7 Press roll 7a Pipe-shaped pressing roll 71 Central press roll 72 Front holding roll 73 Rear press roll 8 TAB tape

Continued front page    (72) Inventor Osamu Yoshioka             Hitachi, 1-1 Hidaka-cho, Hitachi City, Ibaraki Prefecture             Electric Cable Co., Ltd. F term (reference) 5F044 MM02 MM06 MM48 MM49

Claims (4)

[Claims] 1. A method of manufacturing a tape carrier for a semiconductor device having a dry cleaning step by plasma treatment, wherein a plasma processing apparatus capable of processing under atmospheric pressure is used in the step, and the tape carrier is passed through a plasma discharge space portion therein. In the tape carrier transportation area of the plasma discharge space, the tape carrier is pressed by a pressing roll to give a predetermined tension to prevent warpage in the width direction of the tape carrier. Production method. 2. The method of manufacturing a tape carrier for a semiconductor device according to claim 1, wherein the pressing roll is cooled. 3. An apparatus for manufacturing a tape carrier for a semiconductor device, which has a dry cleaning step by plasma processing, wherein a plasma processing apparatus capable of processing under normal pressure is provided for the step, and the tape carrier is provided inside the plasma discharge space portion. A tape carrier transport mechanism for passing the tape carrier was provided, and a press roll was provided to prevent the tape carrier from warping in the width direction by pressing the tape carrier from above and below in the tape carrier transport area of the plasma discharge space to apply a predetermined tension. An apparatus for manufacturing a tape carrier for a semiconductor device, which is characterized in that 4. The apparatus for manufacturing a tape carrier for a semiconductor device according to claim 3, wherein the pressing roll in the tape carrier transporting region of the plasma discharge space portion is provided with a mechanism for cooling itself.