JP2002544669A5 - - Google Patents

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Publication number
JP2002544669A5
JP2002544669A5 JP2000617491A JP2000617491A JP2002544669A5 JP 2002544669 A5 JP2002544669 A5 JP 2002544669A5 JP 2000617491 A JP2000617491 A JP 2000617491A JP 2000617491 A JP2000617491 A JP 2000617491A JP 2002544669 A5 JP2002544669 A5 JP 2002544669A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000617491A
Other languages
Japanese (ja)
Other versions
JP2002544669A (en
Filing date
Publication date
Priority claimed from DE19921230A external-priority patent/DE19921230B4/en
Application filed filed Critical
Publication of JP2002544669A publication Critical patent/JP2002544669A/en
Publication of JP2002544669A5 publication Critical patent/JP2002544669A5/ja
Pending legal-status Critical Current

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JP2000617491A 1999-05-07 2000-05-04 How to handle thin chips for incorporation into smart cards Pending JP2002544669A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19921230A DE19921230B4 (en) 1999-05-07 1999-05-07 Method for handling thinned chips for insertion in chip cards
DE19921230.9 1999-05-07
PCT/EP2000/003988 WO2000068990A1 (en) 1999-05-07 2000-05-04 Method for handling thinned chips for introducing them into chip cards

Publications (2)

Publication Number Publication Date
JP2002544669A JP2002544669A (en) 2002-12-24
JP2002544669A5 true JP2002544669A5 (en) 2007-06-28

Family

ID=7907399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000617491A Pending JP2002544669A (en) 1999-05-07 2000-05-04 How to handle thin chips for incorporation into smart cards

Country Status (6)

Country Link
EP (1) EP1183726A1 (en)
JP (1) JP2002544669A (en)
CN (1) CN1157779C (en)
AU (1) AU4561200A (en)
DE (1) DE19921230B4 (en)
WO (1) WO2000068990A1 (en)

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TW522531B (en) 2000-10-20 2003-03-01 Matsushita Electric Ind Co Ltd Semiconductor device, method of manufacturing the device and mehtod of mounting the device
FR2823012B1 (en) * 2001-04-03 2004-05-21 Commissariat Energie Atomique METHOD FOR SELECTIVELY TRANSFERRING AT LEAST ONE ELEMENT OF AN INITIAL MEDIUM ON A FINAL MEDIUM
DE10117880B4 (en) * 2001-04-10 2009-01-29 Mühlbauer Ag Method for separating electronic components from a composite
US6964086B2 (en) * 2002-03-04 2005-11-15 Matsushita Electric Industrial Co., Ltd. Method of manufacturing thin film piezoelectric element, and element housing jig
US6943056B2 (en) * 2002-04-16 2005-09-13 Renesas Technology Corp. Semiconductor device manufacturing method and electronic equipment using same
JP2004273895A (en) * 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd Dividing method of semiconductor wafer
DE10339559B4 (en) * 2003-08-26 2006-03-02 W.C. Heraeus Gmbh Method for determining the position of component carriers
DE10341186A1 (en) * 2003-09-06 2005-03-31 Martin Michalk Method and device for contacting semiconductor chips
GB2412786A (en) * 2004-03-24 2005-10-05 E2V Tech Uk Ltd Method and apparatus for manufacturing chip scale components or microcomponents
US8426293B2 (en) 2004-07-09 2013-04-23 Semiconductor Energy Laboratory Co., Ltd. IC chip and its manufacturing method
US8728937B2 (en) 2004-07-30 2014-05-20 Osram Opto Semiconductors Gmbh Method for producing semiconductor chips using thin film technology
DE102004036962A1 (en) * 2004-07-30 2006-03-23 Osram Opto Semiconductors Gmbh Production process for a thin film semiconductor chip forms active and contact layers on a growth substrate structures to stacks applies conductive film and removes substrate
EP1774599B1 (en) 2004-07-30 2015-11-04 OSRAM Opto Semiconductors GmbH Method for producing semiconductor chips using thin-film technology and a semiconductor chip produced using thin-film technology
FR2878076B1 (en) * 2004-11-17 2007-02-23 St Microelectronics Sa SLIMMING A SEMICONDUCTOR WAFER
DE102004059599B3 (en) * 2004-12-09 2006-08-17 Infineon Technologies Ag Method for applying an adhesive layer to thinly ground semiconductor chips of a semiconductor wafer
DE102006032821B4 (en) * 2006-07-14 2008-04-10 Mühlbauer Ag Method and device for producing a plurality of chip cards with an adhesive-free fixation of the chip modules
JP5248518B2 (en) * 2006-11-24 2013-07-31 フラウンホッファー−ゲゼルシャフト・ツァー・フォデラング・デル・アンゲワンテン・フォーシュング・エー．ファウ． Electronic, especially fine electronic functional group and its manufacturing method
JP4958287B2 (en) * 2007-05-30 2012-06-20 東京応化工業株式会社 Peeling method in peeling device
DE102010025774A1 (en) 2010-07-01 2012-01-05 Giesecke & Devrient Gmbh Method of making an inlay for a portable data carrier and inlay
JP6417164B2 (en) * 2014-09-18 2018-10-31 芝浦メカトロニクス株式会社 LAMINATE MANUFACTURING DEVICE, LAMINATE, SEPARATING DEVICE, AND LAMINATE MANUFACTURING METHOD

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DE3122981A1 (en) * 1981-06-10 1983-01-05 GAO Gesellschaft für Automation und Organisation mbH, 8000 München METHOD FOR INSTALLING IC COMPONENTS IN ID CARD
JPS61112345A (en) * 1984-11-07 1986-05-30 Toshiba Corp Manufacture of semiconductor device
JPS61280660A (en) * 1985-06-06 1986-12-11 Toshiba Corp Manufacture of semiconductor device
GB2221469B (en) * 1985-12-27 1990-09-05 Fsk Kk Adhesive sheet suitable for use in dicing semiconductor wafers into chips
DE3639630A1 (en) * 1986-11-20 1988-06-01 Gao Ges Automation Org DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
DE3901402A1 (en) * 1989-01-19 1990-07-26 Telefonbau & Normalzeit Gmbh Method for the manufacture of a chip card
JP2829064B2 (en) * 1989-11-27 1998-11-25 株式会社ジャパンエナジー Method for manufacturing semiconductor device
JPH03286553A (en) * 1990-04-03 1991-12-17 Furukawa Electric Co Ltd:The Dicing method
JP2874279B2 (en) * 1990-05-10 1999-03-24 三菱電機株式会社 Method for manufacturing thin semiconductor device
JP2610703B2 (en) * 1990-09-05 1997-05-14 住友電気工業株式会社 Method for manufacturing semiconductor device
US5268065A (en) * 1992-12-21 1993-12-07 Motorola, Inc. Method for thinning a semiconductor wafer
FR2701139B1 (en) * 1993-02-01 1995-04-21 Solaic Sa Method for implanting a micro-circuit on an intelligent card and / or memory card body, and card comprising a micro-circuit thus implanted.
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FR2715501B1 (en) * 1994-01-26 1996-04-05 Commissariat Energie Atomique Method for depositing semiconductor wafers on a support.
US5480842A (en) * 1994-04-11 1996-01-02 At&T Corp. Method for fabricating thin, strong, and flexible die for smart cards
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DE29502080U1 (en) * 1995-02-09 1995-03-23 Interlock Ag Device for producing ID cards and ID card produced thereafter
US6342434B1 (en) * 1995-12-04 2002-01-29 Hitachi, Ltd. Methods of processing semiconductor wafer, and producing IC card, and carrier
DE19602821C1 (en) * 1996-01-26 1997-06-26 Siemens Ag Method for producing a data card
EP0824301A3 (en) * 1996-08-09 1999-08-11 Hitachi, Ltd. Printed circuit board, IC card, and manufacturing method thereof
EP0858050A3 (en) * 1997-02-07 2001-03-28 Keylink Gestao e Investimentos Lda Procedure for the continuous manufacture of microchip carrier cards and cards obtained via the seid procedure
DE19708615C1 (en) * 1997-03-03 1998-07-23 Siemens Ag Chip-card module design and manufacture
DE19732644C1 (en) * 1997-07-29 1998-11-12 Siemens Ag Production of non-contact smart cards with printed information
JPH1191275A (en) * 1997-09-25 1999-04-06 Dainippon Printing Co Ltd Manufacture of non-contact type ic card and non-contact type ic card
AU3144899A (en) * 1998-03-14 1999-10-11 Michael Stromberg Method and device for treating wafers presenting components during thinning of the wafer and separation of the components
JP2000040677A (en) * 1998-07-23 2000-02-08 Nippon Telegr & Teleph Corp <Ntt> Manufacture of semiconductor element

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