JP2002532891A5 - - Google Patents
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- Publication number
- JP2002532891A5 JP2002532891A5 JP2000587922A JP2000587922A JP2002532891A5 JP 2002532891 A5 JP2002532891 A5 JP 2002532891A5 JP 2000587922 A JP2000587922 A JP 2000587922A JP 2000587922 A JP2000587922 A JP 2000587922A JP 2002532891 A5 JP2002532891 A5 JP 2002532891A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/212,974 US6300590B1 (en) | 1998-12-16 | 1998-12-16 | Laser processing |
| US09/212,974 | 1998-12-16 | ||
| PCT/US1999/029820 WO2000035623A1 (en) | 1998-12-16 | 1999-12-16 | Laser processing |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002532891A JP2002532891A (ja) | 2002-10-02 |
| JP2002532891A5 true JP2002532891A5 (enExample) | 2007-01-18 |
| JP4289798B2 JP4289798B2 (ja) | 2009-07-01 |
Family
ID=22793200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000587922A Expired - Fee Related JP4289798B2 (ja) | 1998-12-16 | 1999-12-16 | レーザ処理 |
Country Status (7)
| Country | Link |
|---|---|
| US (5) | US6300590B1 (enExample) |
| EP (1) | EP1159103A1 (enExample) |
| JP (1) | JP4289798B2 (enExample) |
| KR (1) | KR100699640B1 (enExample) |
| CN (1) | CN1330580A (enExample) |
| AU (1) | AU2363800A (enExample) |
| WO (1) | WO2000035623A1 (enExample) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5998759A (en) * | 1996-12-24 | 1999-12-07 | General Scanning, Inc. | Laser processing |
| US6300590B1 (en) * | 1998-12-16 | 2001-10-09 | General Scanning, Inc. | Laser processing |
| US8217304B2 (en) | 2001-03-29 | 2012-07-10 | Gsi Group Corporation | Methods and systems for thermal-based laser processing a multi-material device |
| US7838794B2 (en) | 1999-12-28 | 2010-11-23 | Gsi Group Corporation | Laser-based method and system for removing one or more target link structures |
| US7723642B2 (en) * | 1999-12-28 | 2010-05-25 | Gsi Group Corporation | Laser-based system for memory link processing with picosecond lasers |
| US20040134894A1 (en) * | 1999-12-28 | 2004-07-15 | Bo Gu | Laser-based system for memory link processing with picosecond lasers |
| US6281471B1 (en) | 1999-12-28 | 2001-08-28 | Gsi Lumonics, Inc. | Energy-efficient, laser-based method and system for processing target material |
| US20060141681A1 (en) * | 2000-01-10 | 2006-06-29 | Yunlong Sun | Processing a memory link with a set of at least two laser pulses |
| US20030222324A1 (en) * | 2000-01-10 | 2003-12-04 | Yunlong Sun | Laser systems for passivation or link processing with a set of laser pulses |
| US7671295B2 (en) * | 2000-01-10 | 2010-03-02 | Electro Scientific Industries, Inc. | Processing a memory link with a set of at least two laser pulses |
| US6875951B2 (en) * | 2000-08-29 | 2005-04-05 | Mitsubishi Denki Kabushiki Kaisha | Laser machining device |
| US8497450B2 (en) * | 2001-02-16 | 2013-07-30 | Electro Scientific Industries, Inc. | On-the fly laser beam path dithering for enhancing throughput |
| US20070173075A1 (en) * | 2001-03-29 | 2007-07-26 | Joohan Lee | Laser-based method and system for processing a multi-material device having conductive link structures |
| US20030129396A1 (en) * | 2001-12-27 | 2003-07-10 | Gerhard Kiessling | Coating composition for metal conductors and coating process involving the use thereof |
| US6951995B2 (en) | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
| JP2003320466A (ja) * | 2002-05-07 | 2003-11-11 | Disco Abrasive Syst Ltd | レーザビームを使用した加工機 |
| US7119351B2 (en) * | 2002-05-17 | 2006-10-10 | Gsi Group Corporation | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
| CN100374000C (zh) * | 2002-10-04 | 2008-03-05 | 电子科学工业公司 | 在小型元件载体的弹性遮罩中形成尺寸精确的狭槽的方法 |
| JP2004200221A (ja) * | 2002-12-16 | 2004-07-15 | Toray Eng Co Ltd | レーザマーキング方法及び装置 |
| US7616669B2 (en) * | 2003-06-30 | 2009-11-10 | Electro Scientific Industries, Inc. | High energy pulse suppression method |
| US6947454B2 (en) * | 2003-06-30 | 2005-09-20 | Electro Scientific Industries, Inc. | Laser pulse picking employing controlled AOM loading |
| EP1538424B1 (de) * | 2003-12-04 | 2007-09-26 | Festo AG & Co | Mikrowellenwegmesssystem für elektrodynamischen Direktantrieb |
| KR100462358B1 (ko) * | 2004-03-31 | 2004-12-17 | 주식회사 이오테크닉스 | 폴리곤 미러를 이용한 레이저 가공장치 |
| US8383982B2 (en) * | 2004-06-18 | 2013-02-26 | Electro Scientific Industries, Inc. | Methods and systems for semiconductor structure processing using multiple laser beam spots |
| US7935941B2 (en) * | 2004-06-18 | 2011-05-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures |
| US7923306B2 (en) * | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
| US8148211B2 (en) * | 2004-06-18 | 2012-04-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously |
| US20060000814A1 (en) | 2004-06-30 | 2006-01-05 | Bo Gu | Laser-based method and system for processing targeted surface material and article produced thereby |
| US7227098B2 (en) * | 2004-08-06 | 2007-06-05 | Electro Scientific Industries, Inc. | Method and system for decreasing the effective pulse repetition frequency of a laser |
| US7372878B2 (en) * | 2004-08-06 | 2008-05-13 | Electro Scientific Industries, Inc. | Method and system for preventing excessive energy build-up in a laser cavity |
| DE102004053298B4 (de) * | 2004-08-26 | 2008-10-09 | ARGES Gesellschaft für Industrieplanung und Lasertechnik m.b.H. | Scankopf als Teil einer Laser Bohr- und Schneideinrichtung |
| US7378288B2 (en) * | 2005-01-11 | 2008-05-27 | Semileds Corporation | Systems and methods for producing light emitting diode array |
| US8290239B2 (en) * | 2005-10-21 | 2012-10-16 | Orbotech Ltd. | Automatic repair of electric circuits |
| JP5203573B2 (ja) * | 2006-03-23 | 2013-06-05 | ミヤチテクノス株式会社 | レーザ加工装置 |
| US8198566B2 (en) * | 2006-05-24 | 2012-06-12 | Electro Scientific Industries, Inc. | Laser processing of workpieces containing low-k dielectric material |
| US8084706B2 (en) * | 2006-07-20 | 2011-12-27 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
| JP2010515577A (ja) * | 2007-01-05 | 2010-05-13 | ジーエスアイ・グループ・コーポレーション | マルチパルス・レーザー加工のためのシステム及び方法 |
| WO2009039184A2 (en) * | 2007-09-19 | 2009-03-26 | Gsi Group Corporation | Link processing with high speed beam deflection |
| US7982160B2 (en) * | 2008-03-31 | 2011-07-19 | Electro Scientific Industries, Inc. | Photonic clock stabilized laser comb processing |
| US8178818B2 (en) * | 2008-03-31 | 2012-05-15 | Electro Scientific Industries, Inc. | Photonic milling using dynamic beam arrays |
| GB0900036D0 (en) * | 2009-01-03 | 2009-02-11 | M Solv Ltd | Method and apparatus for forming grooves with complex shape in the surface of apolymer |
| WO2011082065A2 (en) * | 2009-12-30 | 2011-07-07 | Gsi Group Corporation | Link processing with high speed beam deflection |
| CN102133687A (zh) * | 2010-01-26 | 2011-07-27 | 豪晶科技股份有限公司 | 激光加工装置 |
| CN102097529A (zh) * | 2010-11-05 | 2011-06-15 | 张立国 | 一种紫外激光薄膜太阳能电池清边方法 |
| TWI608886B (zh) | 2011-07-05 | 2017-12-21 | 電子科學工業股份有限公司 | 用於提供聲光束偏轉器與聲光調變器使用期間之溫度穩定性之系統與方法 |
| US10562132B2 (en) * | 2013-04-29 | 2020-02-18 | Nuburu, Inc. | Applications, methods and systems for materials processing with visible raman laser |
Family Cites Families (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US487850A (en) * | 1892-12-13 | Shaded lamp-chimney | ||
| US3740523A (en) * | 1971-12-30 | 1973-06-19 | Bell Telephone Labor Inc | Encoding of read only memory by laser vaporization |
| BE794202A (fr) * | 1972-01-19 | 1973-05-16 | Intel Corp | Liaison fusible pour circuit integre sur substrat semi-conducteur pour memoires |
| US3941973A (en) * | 1974-06-26 | 1976-03-02 | Raytheon Company | Laser material removal apparatus |
| US4044222A (en) * | 1976-01-16 | 1977-08-23 | Western Electric Company, Inc. | Method of forming tapered apertures in thin films with an energy beam |
| US4399345A (en) * | 1981-06-09 | 1983-08-16 | Analog Devices, Inc. | Laser trimming of circuit elements on semiconductive substrates |
| US4483005A (en) * | 1981-09-24 | 1984-11-13 | Teradyne, Inc. | Affecting laser beam pulse width |
| US4535219A (en) * | 1982-10-12 | 1985-08-13 | Xerox Corporation | Interfacial blister bonding for microinterconnections |
| US4713518A (en) | 1984-06-08 | 1987-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device manufacturing methods |
| EP0165685B1 (en) * | 1984-06-20 | 1992-09-23 | Gould Inc. | Laser-based system for the total repair of photomasks |
| USRE34192E (en) * | 1985-05-01 | 1993-03-09 | Spectra-Physics, Laser Diode Systems, Inc. | Miniaturized Q-switched diode pumped solid state laser |
| JPS6286851A (ja) | 1985-10-14 | 1987-04-21 | Nec Corp | レ−ザ−トリミング装置 |
| US4823320A (en) * | 1986-05-08 | 1989-04-18 | Texas Instruments Incorporated | Electrically programmable fuse circuit for an integrated-circuit chip |
| US4752455A (en) * | 1986-05-27 | 1988-06-21 | Kms Fusion, Inc. | Pulsed laser microfabrication |
| US5022040A (en) * | 1986-05-30 | 1991-06-04 | Hughes Aircraft Company | Upconversion pumped lasers |
| US4705698A (en) | 1986-10-27 | 1987-11-10 | Chronar Corporation | Isolation of semiconductor contacts |
| US4847850A (en) * | 1986-12-23 | 1989-07-11 | Spectra-Physics, Inc. | Continuum generation with miniaturized Q-switched diode pumped solid state laser |
| US4853758A (en) | 1987-08-12 | 1989-08-01 | American Telephone And Telegraph Company, At&T Bell Laboratories | Laser-blown links |
| US5070392A (en) * | 1988-03-18 | 1991-12-03 | Digital Equipment Corporation | Integrated circuit having laser-alterable metallization layer |
| US5059764A (en) * | 1988-10-31 | 1991-10-22 | Spectra-Physics, Inc. | Diode-pumped, solid state laser-based workstation for precision materials processing and machining |
| US5225924A (en) * | 1989-04-07 | 1993-07-06 | Dainippon Screen Mfg. Co., Ltd. | Optical beam scanning system |
| US5025300A (en) * | 1989-06-30 | 1991-06-18 | At&T Bell Laboratories | Integrated circuits having improved fusible links |
| IL91240A (en) * | 1989-08-07 | 1994-07-31 | Quick Tech Ltd | Pulsed laser apparatus and systems and techniques for its operation |
| US5008512A (en) * | 1989-09-08 | 1991-04-16 | Microelectronics And Computer Technology Corporation | Method of laser bonding electrical members |
| US5021362A (en) * | 1989-12-29 | 1991-06-04 | At&T Bell Laboratories | Laser link blowing in integrateed circuit fabrication |
| US5066291A (en) * | 1990-04-25 | 1991-11-19 | Cincinnati Sub-Zero Products, Inc. | Solid-state laser frequency conversion system |
| US5241212A (en) * | 1990-05-01 | 1993-08-31 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having a redundant circuit portion and a manufacturing method of the same |
| JP3150322B2 (ja) * | 1990-05-18 | 2001-03-26 | 株式会社日立製作所 | レーザによる配線切断加工方法及びレーザ加工装置 |
| DE4203804C2 (de) | 1991-03-22 | 1994-02-10 | Siemens Ag | Verfahren zur Herstellung von Kontakten auf einer mit einer UV-transparenten Isolationsschicht bedeckten leitenden Struktur in höchstintegrierten Schaltkreisen |
| US5268911A (en) * | 1991-07-10 | 1993-12-07 | Young Eddie H | X-cut crystal quartz acousto-optic modulator |
| US5293025A (en) * | 1991-08-01 | 1994-03-08 | E. I. Du Pont De Nemours And Company | Method for forming vias in multilayer circuits |
| US5163062A (en) * | 1991-10-16 | 1992-11-10 | The United States Of America As Represented By The Secretary Of The Navy | Method of frequency shifting using a chromium doped laser transmitter |
| US5235154A (en) * | 1992-04-28 | 1993-08-10 | International Business Machines Corporation | Laser removal of metal interconnects |
| US5323053A (en) * | 1992-05-28 | 1994-06-21 | At&T Bell Laboratories | Semiconductor devices using epitaxial silicides on (111) surfaces etched in (100) silicon substrates |
| US5265114C1 (en) | 1992-09-10 | 2001-08-21 | Electro Scient Ind Inc | System and method for selectively laser processing a target structure of one or more materials of a multimaterial multilayer device |
| EP0620586B1 (en) | 1993-04-05 | 2001-06-20 | Denso Corporation | Semiconductor device having thin film resistor |
| JPH0714853A (ja) * | 1993-06-18 | 1995-01-17 | Fujitsu Ltd | シリコン基板上の化合物半導体装置とその製造方法 |
| US5453594A (en) * | 1993-10-06 | 1995-09-26 | Electro Scientific Industries, Inc. | Radiation beam position and emission coordination system |
| JP2590710B2 (ja) * | 1993-11-26 | 1997-03-12 | 日本電気株式会社 | 半導体装置およびその製造方法 |
| US5611946A (en) * | 1994-02-18 | 1997-03-18 | New Wave Research | Multi-wavelength laser system, probe station and laser cutter system using the same |
| US5521932A (en) * | 1994-05-03 | 1996-05-28 | Light Solutions Corporation | Scalable side-pumped solid-state laser |
| US5685995A (en) | 1994-11-22 | 1997-11-11 | Electro Scientific Industries, Inc. | Method for laser functional trimming of films and devices |
| US5696778A (en) * | 1995-05-09 | 1997-12-09 | Ophir Corporation | Method of and apparatus for generating intracavity double raman shifted laser pulses |
| US6007963A (en) * | 1995-09-21 | 1999-12-28 | Sandia Corporation | Method for extreme ultraviolet lithography |
| US5760674A (en) * | 1995-11-28 | 1998-06-02 | International Business Machines Corporation | Fusible links with improved interconnect structure |
| JP3396356B2 (ja) * | 1995-12-11 | 2003-04-14 | 三菱電機株式会社 | 半導体装置,及びその製造方法 |
| US6287900B1 (en) * | 1996-08-13 | 2001-09-11 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device with catalyst addition and removal |
| US6103992A (en) * | 1996-11-08 | 2000-08-15 | W. L. Gore & Associates, Inc. | Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias |
| US5998759A (en) * | 1996-12-24 | 1999-12-07 | General Scanning, Inc. | Laser processing |
| US6025256A (en) | 1997-01-06 | 2000-02-15 | Electro Scientific Industries, Inc. | Laser based method and system for integrated circuit repair or reconfiguration |
| US6057221A (en) * | 1997-04-03 | 2000-05-02 | Massachusetts Institute Of Technology | Laser-induced cutting of metal interconnect |
| KR100228533B1 (ko) * | 1997-06-23 | 1999-11-01 | 윤종용 | 반도체 집적회로의 용단가능한 퓨즈 및 그 제조방법 |
| US5968847A (en) * | 1998-03-13 | 1999-10-19 | Applied Materials, Inc. | Process for copper etch back |
| US6057180A (en) | 1998-06-05 | 2000-05-02 | Electro Scientific Industries, Inc. | Method of severing electrically conductive links with ultraviolet laser output |
| US6339604B1 (en) * | 1998-06-12 | 2002-01-15 | General Scanning, Inc. | Pulse control in laser systems |
| US6181728B1 (en) * | 1998-07-02 | 2001-01-30 | General Scanning, Inc. | Controlling laser polarization |
| US6144118A (en) * | 1998-09-18 | 2000-11-07 | General Scanning, Inc. | High-speed precision positioning apparatus |
| KR100294346B1 (ko) * | 1998-11-07 | 2001-07-12 | 허인구 | 제거가능한 토목용 앵커 |
| US6300590B1 (en) * | 1998-12-16 | 2001-10-09 | General Scanning, Inc. | Laser processing |
| US6172325B1 (en) * | 1999-02-10 | 2001-01-09 | Electro Scientific Industries, Inc. | Laser processing power output stabilization apparatus and method employing processing position feedback |
-
1998
- 1998-12-16 US US09/212,974 patent/US6300590B1/en not_active Expired - Lifetime
-
1999
- 1999-12-16 CN CN99814447A patent/CN1330580A/zh active Pending
- 1999-12-16 JP JP2000587922A patent/JP4289798B2/ja not_active Expired - Fee Related
- 1999-12-16 WO PCT/US1999/029820 patent/WO2000035623A1/en not_active Ceased
- 1999-12-16 KR KR1020017007407A patent/KR100699640B1/ko not_active Expired - Fee Related
- 1999-12-16 EP EP99967342A patent/EP1159103A1/en not_active Withdrawn
- 1999-12-16 AU AU23638/00A patent/AU2363800A/en not_active Abandoned
-
2001
- 2001-10-02 US US09/968,541 patent/US6559412B2/en not_active Expired - Lifetime
-
2003
- 2003-05-05 US US10/428,938 patent/US6911622B2/en not_active Expired - Lifetime
-
2005
- 2005-05-17 US US11/130,232 patent/US20050211682A1/en not_active Abandoned
-
2006
- 2006-05-24 US US11/440,127 patent/US20060283845A1/en not_active Abandoned