JP2002520659A5 - - Google Patents

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Publication number
JP2002520659A5
JP2002520659A5 JP2000559485A JP2000559485A JP2002520659A5 JP 2002520659 A5 JP2002520659 A5 JP 2002520659A5 JP 2000559485 A JP2000559485 A JP 2000559485A JP 2000559485 A JP2000559485 A JP 2000559485A JP 2002520659 A5 JP2002520659 A5 JP 2002520659A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000559485A
Other languages
Japanese (ja)
Other versions
JP2002520659A (ja
Filing date
Publication date
Priority claimed from US09/113,892 external-priority patent/US6368421B1/en
Application filed filed Critical
Publication of JP2002520659A publication Critical patent/JP2002520659A/ja
Publication of JP2002520659A5 publication Critical patent/JP2002520659A5/ja
Pending legal-status Critical Current

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JP2000559485A 1998-07-10 1999-06-30 フォトレジストおよび有機物質を基体表面から取り除くための組成物 Pending JP2002520659A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/113,892 US6368421B1 (en) 1998-07-10 1998-07-10 Composition for stripping photoresist and organic materials from substrate surfaces
US09/113,892 1998-07-10
PCT/EP1999/004498 WO2000003306A1 (en) 1998-07-10 1999-06-30 Composition for stripping photoresist and organic materials from substrate surfaces

Publications (2)

Publication Number Publication Date
JP2002520659A JP2002520659A (ja) 2002-07-09
JP2002520659A5 true JP2002520659A5 (US20050276830A1-20051215-C00018.png) 2006-06-29

Family

ID=22352158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000559485A Pending JP2002520659A (ja) 1998-07-10 1999-06-30 フォトレジストおよび有機物質を基体表面から取り除くための組成物

Country Status (9)

Country Link
US (1) US6368421B1 (US20050276830A1-20051215-C00018.png)
EP (1) EP1097405B1 (US20050276830A1-20051215-C00018.png)
JP (1) JP2002520659A (US20050276830A1-20051215-C00018.png)
KR (1) KR100602463B1 (US20050276830A1-20051215-C00018.png)
CN (1) CN1316317C (US20050276830A1-20051215-C00018.png)
DE (1) DE69934229T2 (US20050276830A1-20051215-C00018.png)
MY (1) MY117049A (US20050276830A1-20051215-C00018.png)
TW (1) TW544551B (US20050276830A1-20051215-C00018.png)
WO (1) WO2000003306A1 (US20050276830A1-20051215-C00018.png)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090127253A1 (en) * 1997-06-06 2009-05-21 Philip Stark Temperature-controlled induction heating of polymeric materials
US6939477B2 (en) 1997-06-06 2005-09-06 Ashland, Inc. Temperature-controlled induction heating of polymeric materials
US7521405B2 (en) 2002-08-12 2009-04-21 Air Products And Chemicals, Inc. Process solutions containing surfactants
US7129199B2 (en) 2002-08-12 2006-10-31 Air Products And Chemicals, Inc. Process solutions containing surfactants
US7348300B2 (en) 1999-05-04 2008-03-25 Air Products And Chemicals, Inc. Acetylenic diol ethylene oxide/propylene oxide adducts and processes for their manufacture
US6319835B1 (en) * 2000-02-25 2001-11-20 Shipley Company, L.L.C. Stripping method
KR100360985B1 (ko) * 2000-04-26 2002-11-18 주식회사 동진쎄미켐 레지스트 스트리퍼 조성물
CA2446140C (en) * 2000-05-02 2008-11-18 Tribond, Inc. Temperature-controlled induction heating of polymeric materials
KR20020072595A (ko) * 2001-03-12 2002-09-18 (주)에스티디 동판의 산화막 형성방법 및 이에 의해 제조된 동판
KR100429455B1 (ko) * 2001-06-11 2004-05-04 동우 화인켐 주식회사 포토레지스트의 에지 비드를 제거하는 세정용액 및 이를이용한 세정방법
KR100772810B1 (ko) * 2001-12-18 2007-11-01 주식회사 하이닉스반도체 포토레지스트 세정액 조성물
US7563753B2 (en) 2001-12-12 2009-07-21 Hynix Semiconductor Inc. Cleaning solution for removing photoresist
KR100772809B1 (ko) * 2001-12-18 2007-11-01 주식회사 하이닉스반도체 포토레지스트 세정액 조성물
US20030196685A1 (en) * 2001-12-18 2003-10-23 Shipley Company, L.L.C. Cleaning composition and method
JP2005514661A (ja) * 2002-01-11 2005-05-19 クラリアント インターナショナル リミテッド ポジ型またはネガ型フォトレジスト用の洗浄剤組成物
JP4045180B2 (ja) * 2002-12-03 2008-02-13 Azエレクトロニックマテリアルズ株式会社 リソグラフィー用リンス液およびそれを用いたレジストパターン形成方法
US20040259746A1 (en) * 2003-06-20 2004-12-23 Warren Jonathan N. Concentrate composition and process for removing coatings from surfaces such as paint application equipment
US7018939B2 (en) * 2003-07-11 2006-03-28 Motorola, Inc. Micellar technology for post-etch residues
JP5162131B2 (ja) 2003-10-28 2013-03-13 サッチェム, インコーポレイテッド 洗浄溶液およびエッチング液、ならびにそれらを用いる方法
US7867696B2 (en) * 2004-04-15 2011-01-11 The Boeing Company Method and apparatus for monitoring saturation levels of solvents used during rapid prototyping processes
KR20050101458A (ko) * 2004-04-19 2005-10-24 주식회사 하이닉스반도체 포토레지스트 세정액 조성물 및 이를 이용한 패턴 형성방법
TWI253888B (en) * 2004-12-09 2006-04-21 Advanced Semiconductor Eng Method of packaging flip chip and method of forming pre-solders on substrate thereof
KR100690347B1 (ko) * 2005-04-09 2007-03-09 주식회사 엘지화학 박리액 조성물, 이를 이용한 박리 방법 및 그 박리 장치
US20070099810A1 (en) * 2005-10-27 2007-05-03 Hiroshi Matsunaga Cleaning liquid and cleaning method
JP5000260B2 (ja) * 2006-10-19 2012-08-15 AzエレクトロニックマテリアルズIp株式会社 微細化されたパターンの形成方法およびそれに用いるレジスト基板処理液
JP2009014938A (ja) * 2007-07-03 2009-01-22 Toagosei Co Ltd レジスト剥離剤組成物
JP5306755B2 (ja) * 2008-09-16 2013-10-02 AzエレクトロニックマテリアルズIp株式会社 基板処理液およびそれを用いたレジスト基板処理方法
KR101579846B1 (ko) * 2008-12-24 2015-12-24 주식회사 이엔에프테크놀로지 포토레지스트 패턴 제거용 조성물 및 이를 이용한 금속 패턴의 형성 방법
WO2010098899A1 (en) 2009-02-25 2010-09-02 Mallinckrodt Baker, Inc. Multipurpose acidic, organic solvent based microelectronic cleaning composition
US8444768B2 (en) * 2009-03-27 2013-05-21 Eastman Chemical Company Compositions and methods for removing organic substances
US8614053B2 (en) * 2009-03-27 2013-12-24 Eastman Chemical Company Processess and compositions for removing substances from substrates
MY185453A (en) * 2009-07-30 2021-05-19 Basf Se Post ion implant stripper for advanced semiconductor application
WO2012161790A1 (en) * 2011-02-24 2012-11-29 John Moore Concentrated chemical composition and method for removing photoresist during microelectric fabrication
CN102436153B (zh) * 2011-10-28 2013-06-19 绍兴文理学院 印花网版感光胶剥离剂
CN102427039A (zh) * 2011-11-02 2012-04-25 上海宏力半导体制造有限公司 光阻去除方法
ES2564426B2 (es) 2014-09-19 2016-09-12 Universidad De Oviedo Marcador de patologías oculares
US10073351B2 (en) * 2014-12-23 2018-09-11 Versum Materials Us, Llc Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation
TWI692679B (zh) * 2017-12-22 2020-05-01 美商慧盛材料美國責任有限公司 光阻剝除劑
KR102391389B1 (ko) * 2021-09-15 2022-04-28 (주)네프코 세정 용이성 및 내마모성이 우수한 친환경 포토마스크 및 이의 제조방법
CN113832471B (zh) * 2021-09-26 2024-03-08 苏州至绒新能源科技有限公司 一种用于快速剥离聚酰亚胺薄膜的清洗剂及其应用

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1487737A (en) * 1973-11-05 1977-10-05 Nat Res Dev Paint removers
US4395479A (en) 1981-09-23 1983-07-26 J. T. Baker Chemical Company Stripping compositions and methods of stripping resists
US4395348A (en) * 1981-11-23 1983-07-26 Ekc Technology, Inc. Photoresist stripping composition and method
US4403029A (en) 1982-09-02 1983-09-06 J. T. Baker Chemical Company Stripping compositions and methods of stripping resists
US4491530A (en) 1983-05-20 1985-01-01 Allied Corporation Brown stain suppressing phenol free and chlorinated hydrocarbons free photoresist stripper
DE3580827D1 (de) 1984-10-09 1991-01-17 Hoechst Japan K K Verfahren zum entwickeln und zum entschichten von photoresistschichten mit quaternaeren ammomiumverbindungen.
US4770713A (en) 1986-12-10 1988-09-13 Advanced Chemical Technologies, Inc. Stripping compositions containing an alkylamide and an alkanolamine and use thereof
JPS63163457A (ja) * 1986-12-26 1988-07-06 Asahi Chem Ind Co Ltd フオトレジスト用剥離剤組成物
USH366H (en) * 1987-03-18 1987-11-03 The United States Of America As Represented By The Secretary Of The Army Microemulsions containing sulfolanes
CH670832A5 (en) 1987-03-19 1989-07-14 Rico S A Lausanne Paint and varnish stripping compsn. - comprising chloro-hydrocarbon free resin solubiliser, swelling agent, solvent for surfactant, surfactant, thickener and dissolving assistant
US5102573A (en) * 1987-04-10 1992-04-07 Colgate Palmolive Co. Detergent composition
JP2553872B2 (ja) 1987-07-21 1996-11-13 東京応化工業株式会社 ホトレジスト用剥離液
US4824763A (en) 1987-07-30 1989-04-25 Ekc Technology, Inc. Triamine positive photoresist stripping composition and prebaking process
US5185235A (en) 1987-09-09 1993-02-09 Tokyo Ohka Kogyo Co., Ltd. Remover solution for photoresist
JP2591626B2 (ja) 1987-09-16 1997-03-19 東京応化工業株式会社 レジスト用剥離液
US4853315A (en) 1988-01-15 1989-08-01 International Business Machines Corporation O-quinone diazide sulfonic acid monoesters useful as sensitizers for positive resists
US4781804A (en) * 1988-03-02 1988-11-01 Delco Electronics Corporation Electrolytic organic mold flash removal
US5098594A (en) * 1988-05-20 1992-03-24 The Boeing Company Carbonate/diester based solvent
JP2571136B2 (ja) 1989-11-17 1997-01-16 日本ゼオン株式会社 ポジ型レジスト組成物
US5279771A (en) 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
CA2062027C (en) 1991-03-04 1998-05-19 William Aldrich Liquid control system for diagnostic cartridges used in analytical instruments
GB9118042D0 (en) 1991-08-21 1991-10-09 Kodak Ltd Silver image bleaching solution and process
US5308745A (en) 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
US5612303B1 (en) * 1993-06-15 2000-07-18 Nitto Chemical Industry Co Ltd Solvent composition
JP3233379B2 (ja) 1993-08-26 2001-11-26 東京応化工業株式会社 レジスト用剥離液組成物
US5419779A (en) 1993-12-02 1995-05-30 Ashland Inc. Stripping with aqueous composition containing hydroxylamine and an alkanolamine
JPH07199455A (ja) 1993-12-28 1995-08-04 Tokyo Ohka Kogyo Co Ltd ポジ型ホトレジスト組成物
US5545353A (en) 1995-05-08 1996-08-13 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
US5597678A (en) 1994-04-18 1997-01-28 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
US5554312A (en) 1995-01-13 1996-09-10 Ashland Photoresist stripping composition
US5563119A (en) 1995-01-26 1996-10-08 Ashland Inc. Stripping compositions containing alkanolamine compounds
US5541033A (en) 1995-02-01 1996-07-30 Ocg Microelectronic Materials, Inc. Selected o-quinonediazide sulfonic acid esters of phenolic compounds and their use in radiation-sensitive compositions
US5733948A (en) * 1995-09-06 1998-03-31 Mac Dermid, Imaging Technology, Inc. Tack-free photopolymer printing plate
JP2802990B2 (ja) * 1995-12-19 1998-09-24 株式会社ハクリバー 清浄剤

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