JP2002512441A5 - - Google Patents

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Publication number
JP2002512441A5
JP2002512441A5 JP2000544982A JP2000544982A JP2002512441A5 JP 2002512441 A5 JP2002512441 A5 JP 2002512441A5 JP 2000544982 A JP2000544982 A JP 2000544982A JP 2000544982 A JP2000544982 A JP 2000544982A JP 2002512441 A5 JP2002512441 A5 JP 2002512441A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000544982A
Other languages
Japanese (ja)
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JP2002512441A (ja
Filing date
Publication date
Priority claimed from US09/294,247 external-priority patent/US6242739B1/en
Application filed filed Critical
Publication of JP2002512441A publication Critical patent/JP2002512441A/ja
Publication of JP2002512441A5 publication Critical patent/JP2002512441A5/ja
Pending legal-status Critical Current

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JP2000544982A 1998-04-21 1999-04-20 反射率スペクトル測定を用いた半導体の非破壊分析 Pending JP2002512441A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US8263998P 1998-04-21 1998-04-21
US60/082,639 1998-04-21
US09/294,247 US6242739B1 (en) 1998-04-21 1999-04-19 Method and apparatus for non-destructive determination of film thickness and dopant concentration using fourier transform infrared spectrometry
US09/294,247 1999-04-19
PCT/US1999/008721 WO1999054679A1 (en) 1998-04-21 1999-04-20 Non-destructive analysis of a semiconductor using reflectance spectrometry

Publications (2)

Publication Number Publication Date
JP2002512441A JP2002512441A (ja) 2002-04-23
JP2002512441A5 true JP2002512441A5 (enExample) 2006-03-23

Family

ID=26767688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000544982A Pending JP2002512441A (ja) 1998-04-21 1999-04-20 反射率スペクトル測定を用いた半導体の非破壊分析

Country Status (7)

Country Link
US (1) US6242739B1 (enExample)
EP (1) EP1078217B1 (enExample)
JP (1) JP2002512441A (enExample)
AU (1) AU743188B2 (enExample)
CA (1) CA2328624A1 (enExample)
DE (1) DE69917899T2 (enExample)
WO (1) WO1999054679A1 (enExample)

Cited By (2)

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US7948636B2 (en) 2003-03-06 2011-05-24 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
US7952724B2 (en) 2005-01-20 2011-05-31 Zygo Corporation Interferometer with multiple modes of operation for determining characteristics of an object surface

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL132639A (en) * 1999-10-28 2003-11-23 Nova Measuring Instr Ltd Optical measurements of patterned structures
AU2001279247A1 (en) * 2000-08-10 2002-02-25 Sensys Instruments Corporation Database interpolation method for optical measurement of diffractive microstructures
US6947135B2 (en) * 2002-07-01 2005-09-20 Therma-Wave, Inc. Reduced multicubic database interpolation method for optical measurement of diffractive microstructures
US7869057B2 (en) * 2002-09-09 2011-01-11 Zygo Corporation Multiple-angle multiple-wavelength interferometer using high-NA imaging and spectral analysis
US7139081B2 (en) * 2002-09-09 2006-11-21 Zygo Corporation Interferometry method for ellipsometry, reflectometry, and scatterometry measurements, including characterization of thin film structures
US6623995B1 (en) * 2002-10-30 2003-09-23 Taiwan Semiconductor Manufacturing Company Optimized monitor method for a metal patterning process
US7006222B2 (en) * 2003-01-08 2006-02-28 Kla-Tencor Technologies Corporation Concurrent measurement and cleaning of thin films on silicon-on-insulator (SOI)
US7106454B2 (en) 2003-03-06 2006-09-12 Zygo Corporation Profiling complex surface structures using scanning interferometry
KR101169293B1 (ko) 2003-03-06 2012-07-30 지고 코포레이션 주사 간섭측정을 이용한 복합 표면 구조의 프로파일링
CN1784587B (zh) * 2003-03-06 2010-09-08 齐戈股份有限公司 使用扫描干涉测量形成复杂表面结构的轮廓
US7271918B2 (en) * 2003-03-06 2007-09-18 Zygo Corporation Profiling complex surface structures using scanning interferometry
JP2007506070A (ja) 2003-09-15 2007-03-15 ザイゴ コーポレーション 表面形状を薄膜コーティングを通して求めるための三角測量法及びシステム
TWI335417B (en) * 2003-10-27 2011-01-01 Zygo Corp Method and apparatus for thin film measurement
US20060012582A1 (en) * 2004-07-15 2006-01-19 De Lega Xavier C Transparent film measurements
US7884947B2 (en) * 2005-01-20 2011-02-08 Zygo Corporation Interferometry for determining characteristics of an object surface, with spatially coherent illumination
US7179665B1 (en) 2005-02-17 2007-02-20 Midwest Research Institute Optical method for determining the doping depth profile in silicon
KR101054786B1 (ko) * 2005-05-19 2011-08-05 지고 코포레이션 박막 구조체에 관한 정보를 위해 저 코히어런스 간섭 측정 신호를 분석하기 위한 방법 및 시스템
US20060266743A1 (en) * 2005-05-30 2006-11-30 National Chiao Tung University Laser-ablated fiber devices and method of manufacturing the same
WO2007044786A2 (en) * 2005-10-11 2007-04-19 Zygo Corporation Interferometry method and system including spectral decomposition
US7469164B2 (en) * 2006-06-26 2008-12-23 Nanometrics Incorporated Method and apparatus for process control with in-die metrology
US7522288B2 (en) * 2006-07-21 2009-04-21 Zygo Corporation Compensation of systematic effects in low coherence interferometry
US7924435B2 (en) * 2006-12-22 2011-04-12 Zygo Corporation Apparatus and method for measuring characteristics of surface features
US7889355B2 (en) * 2007-01-31 2011-02-15 Zygo Corporation Interferometry for lateral metrology
US7619746B2 (en) * 2007-07-19 2009-11-17 Zygo Corporation Generating model signals for interferometry
DE102007034289B3 (de) * 2007-07-20 2009-01-29 Helmholtz-Zentrum Berlin Für Materialien Und Energie Gmbh Verfahren zur in-situ-Bestimmung der stofflichen Zusammensetzung von optisch dünnen Schichten, Anordnungen zur Durchführung und Anwendungen des Verfahrens
US8072611B2 (en) * 2007-10-12 2011-12-06 Zygo Corporation Interferometric analysis of under-resolved features
JP5222954B2 (ja) * 2007-11-13 2013-06-26 ザイゴ コーポレーション 偏光スキャンを利用した干渉計
US8126677B2 (en) 2007-12-14 2012-02-28 Zygo Corporation Analyzing surface structure using scanning interferometry
US8120781B2 (en) 2008-11-26 2012-02-21 Zygo Corporation Interferometric systems and methods featuring spectral analysis of unevenly sampled data
US8115932B2 (en) * 2009-05-28 2012-02-14 Corning Incorporated Methods and apparatus for measuring ion implant dose
WO2011137512A1 (en) * 2010-05-03 2011-11-10 Aurora Control Technologies Inc. Non-contact measurement of the dopant content of semiconductor layers
US8804106B2 (en) * 2011-06-29 2014-08-12 Kla-Tencor Corporation System and method for nondestructively measuring concentration and thickness of doped semiconductor layers
WO2013061417A1 (ja) * 2011-10-26 2013-05-02 三菱電機株式会社 膜厚測定方法
US9140542B2 (en) 2012-02-08 2015-09-22 Honeywell Asca Inc. Caliper coating measurement on continuous non-uniform web using THz sensor
ES2988690T3 (es) * 2013-11-15 2024-11-21 Luna Innovations Inc Sistema para determinar al menos una propiedad de una muestra de lámina dieléctrica mediante el uso de radiación de terahercios
US10156476B2 (en) * 2014-11-13 2018-12-18 Bae Systems Information And Electronic Systems Integration Inc. Solid state wideband fourier transform infrared spectrometer
EP4070072B1 (en) * 2019-12-05 2026-03-18 Aurora Solar Technologies (Canada) Inc. Systems and methods of characterizing semiconductor materials
US20250349623A1 (en) * 2024-05-09 2025-11-13 Kla Corporation Measurement Condition Dependent, Multi-Dimensional Model Of Optical Dispersion Of Semiconductor Structures

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4555767A (en) 1982-05-27 1985-11-26 International Business Machines Corporation Method and apparatus for measuring thickness of epitaxial layer by infrared reflectance
US4625114A (en) 1985-07-15 1986-11-25 At&T Technologies, Inc. Method and apparatus for nondestructively determining the characteristics of a multilayer thin film structure
US5091320A (en) * 1990-06-15 1992-02-25 Bell Communications Research, Inc. Ellipsometric control of material growth
US5386118A (en) 1992-05-11 1995-01-31 Shin-Etsu Handotai Co., Ltd. Method and apparatus for determination of interstitial oxygen concentration in silicon single crystal
US5354575A (en) * 1993-04-16 1994-10-11 University Of Maryland Ellipsometric approach to anti-reflection coatings of semiconductor laser amplifiers
US5408322A (en) * 1993-04-26 1995-04-18 Materials Research Corporation Self aligning in-situ ellipsometer and method of using for process monitoring
US5604581A (en) 1994-10-07 1997-02-18 On-Line Technologies, Inc. Film thickness and free carrier concentration analysis method and apparatus
EP0737856B1 (en) * 1995-04-14 2010-04-28 J.A. Woollam Co. Inc. A method of investigating samples by changing polarisation
US5900633A (en) * 1997-12-15 1999-05-04 On-Line Technologies, Inc Spectrometric method for analysis of film thickness and composition on a patterned sample

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7948636B2 (en) 2003-03-06 2011-05-24 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
US7952724B2 (en) 2005-01-20 2011-05-31 Zygo Corporation Interferometer with multiple modes of operation for determining characteristics of an object surface

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