JP2002374054A - Method of manufacturing printed-wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed-wiring board, in which even a thin insulating board can be conveyed easily and in which a manufacturing process can be simplified. SOLUTION: In a single-sided copper-clad laminate 2, a support film 6 is laminated on a face on the side of the insulating board 3. Thereby, the laminate 2 can be kept easily in a horizontal posture on a roller conveyer 15 during its conveyance, and the laminate 2 can be prevented from falling off. When the laminate 2 is formed to have a thickness as a whole, it can be sandwiched surely between upper rollers 16A and lower rollers 16B so as to be conveyed, and the rollers 16A, 16B can be prevented from idling. The support film 6 can also play a role of protecting conductive bumps 5 in an etching process. Thereby, the production process can be simplified.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, in each step of manufacturing a printed circuit board, a conveyor is sometimes used to transport a single-sided copper-clad laminate used as a material of the printed circuit board.

FIG. 8 shows a process of performing an etching process on the copper-clad laminate 101. In this step, the copper-clad laminate 101 is conveyed while being pinched by a pair of upper and lower roller conveyors 105, and the etching booth 104.
Pass through. An etching nozzle 106 is provided in the etching booth 104, and while the copper-clad laminate 101 passes through the etching booth 104, the copper foil 102
Is sprayed on the surface of the substrate. In advance,
An etching resist 103 is formed on the copper foil 102, and when an etching solution 107 is sprayed on a portion where the etching resist 103 is not formed, the copper foil 102 on that portion is formed.
Is removed. After that, when the etching resist 103 is removed, a conductor circuit is formed.

[0004]

However, the copper-clad laminate 101 often has a thin base material.
It may be difficult to maintain a horizontal posture on the roller conveyor 105. In particular, when the copper-clad laminate 101 is a single-sided copper-clad laminate, the tendency becomes stronger. On the other hand, the roller conveyor 105 has a configuration in which the rollers 108 are connected at predetermined intervals because it is necessary to secure a passage for allowing the etching solution 107 sprayed from the etching nozzle 106 to reach the surface of the copper foil 102. I have. For this reason,
During transport, the copper-clad laminate 101 is
There was a risk of falling from. The upper and lower rollers 10
8, the copper-clad laminate 101 cannot be sandwiched well.
There was a risk that the roller 108 would run idle.

In order to prevent these problems, an end portion 101A of the copper-clad laminate 101 in the traveling direction (left end in FIG. 8)
, A rigid preceding plate 110 is connected to the
0 led the copper-clad laminate 101. For this reason, the manufacturing process has been complicated.

The present invention has been made in view of the above circumstances, and has as its object to provide a method of manufacturing a printed circuit board that can easily transport a thin insulating substrate and can simplify the manufacturing process. Is to provide.

[0007]

According to a first aspect of the present invention, there is provided a method for manufacturing a printed circuit board.
A method for manufacturing a printed circuit board by transporting a laminate provided with a conductor layer on one surface side of an insulating layer, wherein the laminate has a support member attached to a surface opposite to the conductor layer. It is transported by a conveyor.

According to a second aspect of the present invention, there is provided the method of manufacturing a printed circuit board according to the first aspect, wherein a conductive bump is formed on the laminated board so as to project from a surface of the insulating layer opposite to the conductive layer. The support member is attached so as to cover the conductive bump and performs an etching process.

Here, the material of the support member is not particularly limited, and a phenol resin, a melamine resin, an epoxy resin, an unsaturated polyester resin, a silicone resin, a polyimide resin, a thermosetting acrylic resin, a urea resin formed in a film shape. Resin, diallyl phthalate resin, polyurethane resin, etc. or plate-shaped paper-based epoxy resin, synthetic fiber cloth-based epoxy resin, glass cloth-based epoxy resin, paper-based phenolic resin, glass-fabric-based Teflon resin Although a polysulfone resin, a polyethersulfone resin, a polyetherimide resin, or the like can be used, a material which is not dissolved in an etching solution when used in an etching step and also serving as a protective member is preferable.

The thickness of the support member is not particularly limited. However, from the viewpoint of workability when peeling from the printed circuit board, when a flexible member is used, the printed circuit board is horizontally placed. It is preferable to make it thick enough to hold.

According to a third aspect of the present invention, there is provided the method of manufacturing a printed circuit board according to the first or second aspect, wherein the support member is provided with an adhesive layer that loses adhesiveness when heated. It is characterized by being laminated.

The adhesive used for the adhesive layer is not particularly limited, and a rubber-based adhesive, an acrylic-based adhesive, a styrene / conjugated diene block copolymer-based adhesive, a silicone-based adhesive, or the like may be used. it can. The adhesive may be blended with an appropriate additive such as a crosslinking agent, a tackifier, a plasticizer, a filler, an antioxidant, and the like, if necessary.

Further, in order to lose the adhesiveness by heating, an adhesive mixed with a foaming agent which foams by heating can be used as the adhesive layer. The type of the foaming agent is not particularly limited, but when the manufacturing process includes a step that requires heating, it is preferable to use an adhesive mixed with a foaming agent that foams at a temperature higher than the heating temperature. Specifically, decomposition-type inorganic blowing agents such as ammonium carbonate, ammonium hydrogen carbonate, sodium hydrogen carbonate, ammonium nitrite, sodium borohydride, and azides; and fluorides such as trichloromonofluoromethane and dichloromonofluoromethane. Alkanes, azo compounds such as azobisisobutyronitrile, azodicarbonamide, barium azodicarboxylate, paratoluenesulfonylhydrazide, diphenylsulfone-3,
Hydrazine compounds such as 3'-disulfonylhydrazide, 4,4'-oxybis (benzenesulfonylhydrazide), allylbis (sulfonylhydrazide), and ρ-toluylenesulfonyl semicarbazide and 4,4'-oxybis (benzenesulfonyl semicarbazide) 5-morpholyl-1,2,3,
Triazole-based compounds such as 4-thiatriazole,
N, N'-dinitrosopentamethylenetetramine, N,
Organic foaming agents such as N-nitroso compounds such as N'-dimethyl-N, N'-dinitrosoterephthalamide can be used.

According to a fourth aspect of the present invention, there is provided the method for manufacturing a printed circuit board according to any one of the first to third aspects, wherein the support member has an adhesive layer that loses adhesiveness when irradiated with ultraviolet rays. Characterized in that they are laminated on the laminated plate via an intermediary.

Here, the adhesive layer that loses adhesiveness by irradiating ultraviolet rays is a mixture of a resin as an adhesive component as a main component and a compound polymerizable by ultraviolet rays. Those which react and reduce the adhesiveness can be used.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS <First Embodiment> Hereinafter, a first embodiment embodying a method of manufacturing a printed circuit board according to the present invention will be described in detail with reference to FIGS.

The starting material of the printed circuit board 1 of this embodiment is a single-sided copper-clad laminate 2 (corresponding to the laminate of the present invention) (FIG. 1A). The single-sided copper-clad laminate 2 is placed on one side (lower side in FIG. 1) of an insulating substrate 3 (corresponding to the insulating layer of the present invention) having a thickness of 40 μm and formed of a plate-like glass cloth substrate epoxy resin. And a known structure in which a copper foil 4 having a thickness of 9 μm is attached. In this single-sided copper-clad laminate 2, conductive bumps 5 for connecting the printed board 1 to another board are formed at predetermined positions on the surface on the side of the insulating board 3. The method of forming the conductive bump 5 is as follows.

First, a via hole (not shown) penetrating the insulating substrate 3 in the thickness direction and reaching the copper foil 4 is formed by laser irradiation. As the laser, a carbon dioxide gas laser, an excimer laser, a YAG laser, a UV laser, or the like can be used. Then, the via hole is filled by performing electrolytic plating inside the via hole, and a plating layer is formed. The conductive bumps 5 slightly projecting from the surface of the insulating substrate 3 are formed by further performing solder plating on the plating layer.

A support film 6 (corresponding to a support member of the present invention) having an adhesive layer 6A on one surface is attached to the surface of the insulating substrate 3 on which the conductive bumps 5 are formed as described above. As the support film 6, a film made of polyethylene terephthalate can be used. The support film 6 is adhered so as to cover the projecting portion 5A of the conductive bump 5 in close contact therewith. The support film 6
Has a thickness of 50 to 70 μm. Thereby, the thickness of the entire single-sided copper-clad laminate 2 after lamination is about 100 to 120
μm, and the single-sided copper-clad laminate 2 can be held in a horizontal state.

Next, a photosensitive dry film 7 is attached to the surface on the copper foil 4 side of the single-sided copper-clad laminate 2 (FIG. 1B). Next, a photomask film corresponding to a predetermined conductor pattern 8 (corresponding to the conductor layer of the present invention) is aligned and superposed on the dry film 7, and exposure and development are performed. Thus, an etching resist 9 corresponding to the predetermined conductor pattern 8 is formed (FIG. 1C).

Next, an etching process is performed. FIG. 3 is a schematic view of the etching apparatus 10. An etching booth 11 formed in a box shape is provided in the etching processing apparatus 10.
Are provided, and both side walls 12 of the etching booth 11 are provided.
A and 12B have a carry-in port 13 and a carry-out port 14, respectively.
Is provided. Inside the etching booth 11, a pair of upper and lower roller conveyors 15A and 15B (corresponding to the conveyor of the present invention) enter from the entrance 13 and pass through the etching booth 11, and extend from the exit 14 to the outside. It is installed as follows. Upper and lower roller conveyor 15A,
The interval of 15B is slightly smaller than the thickness of the single-sided copper-clad laminate 2 on which the support film 6 is laminated.

Each of the roller conveyors 15A and 15B has a configuration in which cylindrical rollers 16 are connected in parallel.
The upper and lower rollers 16A, 16B rotate in a predetermined direction (the direction of the arrow in the figure) while sandwiching the single-sided copper-clad laminate 2 to move the single-sided copper-clad laminate 2 from the carry-in port 13 to the carry-out port 1.
4 can be conveyed. In each of the roller conveyors 15A and 15B, the rollers 16 are connected at a fixed interval, and the gap 17
Thus, the etching liquid 20 can be sprayed on the single-sided copper-clad laminate 2.

Below the lower roller conveyor 15B,
A discharge pipe 18 having an etching nozzle 19 capable of ejecting an etching solution 20 is provided. The discharge pipe 18 is arranged in parallel with the conveying direction of the roller conveyor 15, and the discharge pipe 18 is provided with a plurality of etching nozzles 19 opened upward at a substantially uniform pitch. An end of the discharge pipe 18 extends out of the etching booth 11 and is connected to a pump 21 and an etching solution tank 22.

When etching is performed by the etching apparatus 10, the single-sided copper-clad laminate 2 is placed on the roller conveyors 15A and 15A so that the copper foil 4 faces downward.
Set between B. Next, the roller conveyor 15 is operated to transport the single-sided copper-clad laminate 2 from the carry-in port 13 of the etching booth 11 to the carry-out port 14 at a constant speed. Here, since the support film 6 is laminated on the single-sided copper-clad laminate 2, the single-sided copper-clad laminate 2 can be kept in a horizontal position during transportation. Therefore, the gap 1 between the rollers 16
7 does not cause the single-sided copper-clad laminate 2 to drop. Also,
By providing a thickness, the single-sided copper-clad laminate 2 can be reliably sandwiched and transported by the upper and lower rollers 16A and 16B.

Then, while the single-sided copper-clad laminate 2 passes through the etching booth 11, the pump 21 is operated,
The etching liquid 20 is jetted from the etching nozzle 19 toward the copper foil 4 of the single-sided copper-clad laminate 2. Then, a portion of the copper foil 4 that is not protected by the etching resist 9 is dissolved and removed by the etching solution 20,
The conductor pattern 8 is formed (FIG. 2D). At this time, since the support film 6 is stuck so as to cover the protruding portion 5A of the conductive bump 5 formed on the surface on the insulating substrate 3 side, the conductive bump 5
It can also function as protection from

After the completion of the etching process, the etching resist 9 and the support film 6 are peeled off to complete the printed board 1 (FIG. 2E).

As described above, according to the present embodiment, the support film 6 is attached to the surface on the insulating substrate 3 side of the single-sided copper-clad laminate 2. Thereby, it becomes easy to maintain the horizontal posture on the roller conveyor 15 during conveyance,
The single-sided copper-clad laminate 2 can be prevented from falling. In addition, by providing the entire single-sided copper-clad laminate 2 with a thickness, the sheet can be reliably sandwiched and transported by the upper and lower rollers 16A and 16B, and the idle rotation of the roller 16 can be prevented. Further, since the support film 6 is adhered so as to cover the protruding portion 5A of the conductive bump 5 in close contact therewith, it can also serve to protect the conductive bump 5 in the etching step. Thus, the manufacturing process can be simplified.

<Second Embodiment> Next, a second embodiment of the present invention will be described with reference to FIGS.

This embodiment is different from the first embodiment in the configuration of the support member. That is, the support plate 33 (of the present invention) is placed on the insulating substrate 3 (FIG. 4A) of the single-sided copper-clad laminate 2 on which the conductive bumps 5 are formed in the same manner as in the first embodiment via the heat release sheet 30. (Corresponding to the supporting member) (FIG. 4B). Here, the heat-releasable sheet 30 is formed on the adhesive layer 3 containing a foaming agent on both sides of the polyester film 31.
2 is formed. Further, as the support plate 33, a glass cloth substrate epoxy resin formed in a plate shape having a thickness of 0.8 mm can be used.

A dry film 7 is attached to the surface of the single-sided copper-clad laminate 2 on the side of the copper foil 4 and exposed and developed in the same manner as in the first embodiment to form an etching resist (FIG. 4C).

Next, an etching process is performed by the same etching apparatus 10 as in the first embodiment (FIG. 5).
D). Here, the support plate 33 is attached to the single-sided copper-clad laminate 2. Since the support plate 33 is a hard plate, the single-sided copper-clad laminate 2 can be reliably kept in a horizontal position during transportation. Therefore, the single-sided copper-clad laminate 2 does not fall from the gap 17 between the rollers 16. In addition, by providing the entire single-sided copper-clad laminate 2 with a thickness, the single-sided copper-clad laminate 2 can be reliably sandwiched and transported by the upper and lower rollers 16A and 16B. Further, the support plate 33 can also serve to protect the conductive bumps 5 from the etching solution 20. After completion of this etching process, the etching resist 9
Is peeled off.

Finally, the foaming agent contained in the adhesive layer 32 of the heat-releasable sheet 30 is foamed by heat-treating the single-sided copper-clad laminate 2, and the heat-releasable sheet 30 and the single-sided copper-clad laminate 2 are supported. The plate 33 is peeled off (FIG. 5E). Thus, the printed circuit board 1 is completed (FIG. 5F).

As described above, in the present embodiment, the support plate 33 is adhered to the surface on the insulating substrate 3 side of the single-sided copper-clad laminate 2 via the heat release sheet 30. Thereby, the same operation and effect as those of the first embodiment can be obtained. Further, the adhesive layer 32 of the heat release sheet 30 loses adhesiveness by heating. For this reason, even when a rigid plate or a thick plate is used as the support plate 33,
The support plate 33 can be easily peeled off without damaging the printed board 1.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIG.

This embodiment is different from the above embodiment in the structure of the adhesive layer. That is, the UV release film 40 is attached on the insulating substrate 3 of the single-sided copper-clad laminate 2 on which the conductive bumps 5 are formed in the same manner as in the first embodiment. The UV release film 40 is formed of an adhesive layer 42 whose adhesiveness is reduced by irradiating ultraviolet rays to a support film 41 (corresponding to the support member of the present invention) made of a polyvinyl chloride resin.
And Adw made by Lintec Co., Ltd.
ill (trademark) D-201 or the like can be used.

A dry film 7 is adhered to the surface of the single-sided copper-clad laminate 2 on the side of the copper foil 4 and exposed and developed as in the first embodiment to form an etching resist.

Next, an etching process is performed by the same etching apparatus 10 as in the first embodiment. here,
Since the UV release film 40 is attached to the single-sided copper-clad laminate 2, the single-sided copper-clad laminate 2 can be reliably kept in a horizontal position during transportation, as in the first embodiment. In addition, by providing the entire single-sided copper-clad laminate 2 with a thickness, the single-sided copper-clad laminate 2 can be reliably sandwiched and transported by the upper and lower rollers 16A and 16B. Further, the UV release film 40 can also serve to protect the conductive bumps 5 from the etching solution 20. After the completion of the etching process, the etching resist 9 is removed.

Finally, from above the UV release film 40, an ultraviolet ray 43 is used to irradiate an ultraviolet ray with an irradiation amount of 100 to 100.
Irradiation is performed under the conditions of 1000 mJ / cm ² and irradiation time of 1 to 5 minutes (FIG. 6A). Thereby, the adhesiveness of the adhesive layer 42 is reduced, and the UV release film 40 and the single-sided copper-clad laminate 2 are separated (FIG. 6B). Thus, the printed circuit board 1 is completed.

As described above, in this embodiment, the UV release film 40 is attached to the surface of the single-sided copper-clad laminate 2 on the insulating substrate 3 side. Thereby, the first
The same operation and effect as the embodiment can be obtained. In addition, the adhesive layer 42 of the UV release film 40 loses adhesiveness when irradiated with ultraviolet rays. Therefore, the UV release film 40 can be easily peeled off without damaging the printed board 1.

<Fourth Embodiment> Next, a fourth embodiment of the present invention will be described with reference to FIG.

This embodiment is different from the above embodiment in the configuration of the adhesive layer. That is, the adhesive layer 50 is formed on the insulating substrate 3 of the single-sided copper-clad laminate 2 on which the conductive bumps 5 are formed in the same manner as in the first embodiment. This adhesive layer 5
0 is an adhesive containing a foaming agent that foams by heating;
It is formed by mixing with an adhesive whose adhesiveness is reduced by ultraviolet rays and applying the mixture on the insulating substrate 3. And
The support plate 33 is attached on the adhesive layer 50 (FIG. 7).
A).

A dry film 7 is adhered to the surface of the single-sided copper-clad laminate 2 on the side of the copper foil 4 and exposed and developed as in the first embodiment to form an etching resist.

Next, an etching process is performed by the same etching apparatus 10 as in the first embodiment. here,
Since the support plate 33 is attached to the single-sided copper-clad laminate 2, the single-sided copper-clad laminate 2 can be reliably kept in a horizontal position during conveyance as in the first embodiment. In addition, by providing the entire single-sided copper-clad laminate 2 with a thickness, the single-sided copper-clad laminate 2 can be reliably sandwiched and transported by the upper and lower rollers 16A and 16B. Further, the support plate 33 is provided with the conductive bumps 5.
Can be also protected from the etching solution 20. After the completion of the etching process, the etching resist 9 is removed.

Finally, by heating the single-sided copper-clad laminate 2, the foaming agent contained in the adhesive layer 50 is foamed, and the single-sided copper-clad laminate 2 and the support plate 33 are separated. At the same time, from above the support plate 33, the ultraviolet lamp 43
Is applied under the conditions of an irradiation amount of 100 to 1000 mJ and an irradiation time of 1 to 5 minutes. Thereby, the adhesive layer 42
Of the support plate 33 and the single-sided copper-clad laminate 2
And peel off. Thus, the printed circuit board 1 is completed.

As described above, in this embodiment, the support plate 33 is adhered to the surface on the insulating substrate 3 side of the single-sided copper-clad laminate 2 via the adhesive layer 50. Thereby, the same operation and effect as those of the first embodiment can be obtained. In addition, the adhesive layer 50 loses adhesiveness by heating and irradiation of ultraviolet rays. Therefore, the support plate 33 can be easily peeled off without damaging the printed board 1.

The technical scope of the present invention is not limited by the above-described embodiments, and the following ones are also included in the technical scope of the present invention. Others
The technical scope of the present invention extends to an equivalent range. (1) In the above embodiments, the single-sided copper-clad laminate 2 on which the support film 6 or the support plate 33 is laminated is transported by the roller conveyor 15 in the etching process.
The steps to which the present invention can be applied are not limited to the above embodiments, and may be a step of developing an etching resist or a step of removing the etching resist. (2) In each of the above embodiments, the etching nozzle 19 is provided below the roller conveyor 15 and the single-sided copper-clad laminate 2
Although the etching solution 20 was sprayed from the lower surface side of the above, according to the present invention, the direction of spraying the etching solution is not limited to the above embodiments, and the copper foil surface of the single-sided copper-clad laminate is conveyed upward, An etching solution may be sprayed from above. (3) According to the second embodiment, the heat release sheet 30 has a configuration in which the adhesive layer 32 containing a foaming agent is formed on both surfaces of the film 31. However, according to the present invention, the heat release sheet 30 does not necessarily have both surfaces. It is not necessary for the adhesive layer to contain a foaming agent, and only the adhesive layer on the laminate side may contain a foaming agent. (4) According to the fourth embodiment, the adhesive layer 50 is formed by mixing an adhesive containing a foaming agent that foams by heating and an adhesive whose adhesiveness is reduced by ultraviolet rays, and applying the mixture on the insulating substrate 3. However, according to the present invention, it is not necessary to mix and use both adhesives, and an adhesive containing a foaming agent is formed on a part of the insulating layer, and the adhesiveness is increased by ultraviolet rays. The lowering adhesive layer may be formed in other portions.

According to the first aspect of the present invention, the laminate is conveyed by the roller conveyor with the support member attached to the surface opposite to the conductor layer. This makes it easier to keep the laminate in a horizontal position during transportation, and prevents the laminate from falling.

According to the second aspect of the present invention, in the etching step, the support member closely covers the protruding portion of the conductive bump formed on the surface of the insulating layer of the laminate opposite to the conductor layer. Is pasted. This allows
With a single support member, the laminate can be easily transported while effectively protecting the conductive bumps from the etching solution, and the manufacturing process can be simplified. In addition, during the etching process, generally, a roller conveyor is often used to transport the laminate. In such a case, the thickness of the entire laminate is increased so that the laminate can be reliably sandwiched between the upper and lower rollers, thereby preventing the rollers from running idle. Thus, the manufacturing process can be simplified.

According to the third aspect of the present invention, the support member is laminated on the printed circuit board via the adhesive layer which loses adhesiveness when heated. Therefore, when the support member becomes unnecessary, the support member can be easily peeled off by heating without damaging the printed circuit board.

According to the fourth aspect of the present invention, the support member is laminated on the printed circuit board via the adhesive layer which loses adhesiveness when irradiated with ultraviolet rays. Therefore, when the support member becomes unnecessary, the support member can be easily peeled off by irradiating ultraviolet rays without damaging the printed circuit board.

[Brief description of the drawings]

FIG. 1 shows a method of manufacturing a printed circuit board according to a first embodiment. FIG. 1 (A) A cross-sectional view in which conductive bumps are formed on a single-sided copper-clad laminate. Sectional view with dry film attached (C) Sectional view with etching resist formed

FIG. 2 is a view showing a manufacturing process of the printed circuit board according to the first embodiment; FIG. 2D is a cross-sectional view in which an etching solution is sprayed on a copper foil; FIG.

FIG. 3 is a cross-sectional view of the etching apparatus of the present embodiment.

FIG. 4 shows a method of manufacturing a printed circuit board according to a second embodiment. FIG. 1 (A) A cross-sectional view in which conductive bumps are formed on a single-sided copper-clad laminate. Sectional view with film attached (C) Sectional view with etching resist formed

FIG. 5 is a cross-sectional view showing a manufacturing process of the printed circuit board according to the second embodiment; FIG. 2D is a cross-sectional view in which an etching solution is sprayed on a copper foil; FIG. Cross section of board

FIG. 6 is a view showing a manufacturing process of the printed circuit board according to the third embodiment. (A) A cross-sectional view of the UV release film irradiated with ultraviolet rays. (B) A cross-sectional view of the UV release film peeled off.

FIG. 7 is a sectional view of a printed circuit board according to a fourth embodiment with a support plate attached thereto.

FIG. 8 is a sectional view showing a conventional etching step.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Printed circuit board 2 ... Single-sided copper clad laminated board (laminated board) 3 ... Insulating board (insulating layer) 5 ... Conductive bumps 6, 41 ... Support film (supporting member) 8 ... Conductor pattern (conductor layer) 15 ... Roller Conveyor (Conveyor) 32, 42, 50 Adhesive layer 33 Support plate (support member)

Claims (4)

[Claims] 1. A method for manufacturing a printed circuit board by transporting a laminate having a conductor layer on one surface side of an insulating layer, wherein the laminate has a support member on a surface opposite to the conductor layer. A method of manufacturing a printed circuit board, wherein the printed circuit board is transported by a conveyor in a state of being attached. 2. The laminated plate is formed with a conductive bump protruding from a surface of the insulating layer opposite to the conductor layer, and the support member is attached so as to cover the conductive bump. 2. The method for manufacturing a printed circuit board according to claim 1, wherein an etching process is performed. 3. The method for manufacturing a printed circuit board according to claim 1, wherein the support member is laminated on the laminate via an adhesive layer that loses adhesiveness when heated. . 4. The laminate according to claim 1, wherein the support member is laminated on the laminate via an adhesive layer that loses adhesiveness when irradiated with ultraviolet rays. Manufacturing method of printed circuit board.