TW545096B - Method for manufacturing thin circuit board - Google Patents

Abstract

A method for manufacturing thin circuit board includes the following steps. First of all, a substrate having a core layer and at least one metal layer is provided. The metal layer having a circuitry area and a stiffener area is formed on the side surface of the core layer. And then, only the circuitry area is thinned. Furthermore, a carrier system with a plurality of rolls is provided. The substrate moves through the rotating rolls, wherein the stiffener area of the substrate is provided on the front edge relative to the substrate moving direction in order to improve the stiffness of the front edge of the substrate. Finally, the circuitry area is patterned, and the stiffener area and the corresponding core layer are cut away.

Description

545096

(1) [Technical Field to which the Invention belongs] The present invention relates to a method for manufacturing a circuit board, and more particularly, to a method for manufacturing a thin circuit board. (1), [Prior art circuit substrates are used in general printed circuit boards, which can be used as integrated electronics in electronic products, and the high-performance is continuously reduced, as shown in Figure 1, formed in the core layer 11, Under 200 // m, imine (BT), or! ^ Make a thin four-layer board as a panel, and then etch it. Provide two pieces with a vacuum laminator to etch two pieces of negative resist as a cover or plasma etching. The plating method is performed on the outermost layer of copper foil on the perimeter wall of the small hole as shown in FIG. 2] The substrate often used in today's electronics related industries, in addition to the printed circuit board, also includes a substrate. In recent years, it has been gradually developed toward a small area, light weight, thin thickness, and high-tech trends. Therefore, the circuit pitch of the circuit board has been gradually reduced as much as possible. 'The thin circuit board 10 includes a core layer 11 and metal layers 12 on both sides. In general, the thickness of the core layer 11 can be made of C-stage bismaleic acid 醯 -4 epoxy resin. The metal layer 2 is generally a copper foil. Take an example: a thin circuit board is provided, which is a patterning method for the metal layer 2. The single panel with the adhesive-backed copper drop of the B-stage is pressed onto the metal layer 2 at the same time by using a piece of adhesive-backed copper foil. Next, a portion of copper is selectively engraved on the screen, and a small hole is formed by mechanical drilling, and a metal layer is formed by electroless plating and electricity as a via. Finally, the imaging circuit is fabricated to complete the thin four-layer board. ’Is a patterned thin circuit board 丨 〇 Metal layers on both sides

545096 V. Description of the invention (2) 12 Generally, the thin circuit substrate 10 is placed in a traction system 2000 so that the metal layers 12 on both sides of the thin circuit substrate 10 pass through a reaction tank (not shown) (In the figure). The traction system 2000 is composed of a plurality of rollers 001, which use the rollers 001 to roll to drive the thin circuit board 100 forward. The rollers 001 are designed in two rows. The thin circuit substrate 10 can be smoothly driven forward, and chemicals can be sprayed during the driving of the thin circuit substrate 10. The lack of metal layer bends and braces, leading the method forward rate. The method of the substrate 10 is low to match the tape or traction system. Also easy to scratch how to solve, such as 12 caused by very curved deformation of the edge, and then, although the edge is clamped to solve the paperclip system at each station 'outside, by the roller, the thin type shown in Figure 3, due to the thin circuit board 丨〇 the core layer 丨 丨 and the ground thin 'thin circuit board 丨 〇 will be affected by its own gravity', especially in the edge part because there is no roller 2 〇1 branch will be stuck between the two rollers 〇1 (as shown in the figure) (Shown in 3), without causing subsequent boards to chase one after another, which seriously affects the goodness of the product, such as sticking thick boards with tape, or paper clips on thin circuits to improve the stiffness of the thin circuit board The problem that the edge of the substrate is stuck in the two rollers 001. However, regardless of the size of the machine, each station requires additional manpower to remove and re-attach new tape or paper clips before sending it. This not only causes an increase in manpower, but also severely reduces the productivity due to the pollution of the tape. The potion of the reaction tank and the paper clip also affect the quality of the process and the life of the machine. Therefore, the question of the circuit board card is really an important issue. C), [invention content]

545096 V. Description of the invention (3) A method for manufacturing a board, which can increase the stiffness of the edge of a thin circuit board, to avoid the problem that the board is too thin and easily deformed when the traction system drives the board. As a result, the traction system cannot smoothly drive the thin circuit board forward. In order to achieve the above object, the manufacturer of the thin circuit substrate according to the present invention includes the following steps. First, a substrate is provided, the substrate has: a layer and at least one metal 4 'metal layer is located in a nuclear circuit formation area and- Stiffen 1. Next, the circuit system is thinned. This traction system is provided with a plurality of, the halo roller rolls forward, among which; the solid; the wheel, the substrate is to advance the substrate by these to the leading edge; Sorry, in the end, remove the "layered patterned circuit using the base circuit substrate manufacturing method * degree to improve the stiffness of the edge of the substrate ', the layer (stiffened area) has a thick enough thickness and rigidity, to Bearing its own Cao can make the thin circuit board have a foot edge that will not be subject to its own gravity. The circuit board is stuck in the roller of the traction system, and is curved. The V-induced deformation area in the present invention is by adding local metal; The ground is pushed ^ In addition, the use of other materials, such as thickness and thickness, is not necessary to worry about, so that the contamination caused by the medicine or the operating time;: = bring other boards, ~ K to find problems.

545096 V. Description of the invention (4): Refer to FIG. 4 to FIG. 7 ′, which are schematic sectional views of a method for manufacturing a thin circuit substrate according to a preferred embodiment of the present invention. First, as shown in FIG. 4, a thin circuit substrate 4G. The thin circuit substrate 4 () is a __ double panel, including a core layer 41 (core) and metal layers 42 formed on both sides of the core layer. The core The material of the layer 41 may be bismaleic acid imine 21S = lei: lde_Triazine (BT) 4FR_4m oxygen resin, and the core is white and the thickness is less than about 20 0. The metal layer 42 is a copper-copper layer (copper) foil) 〇Metal screen 49 and two. 422 two sections. If the thin "Road, electricity and radio forming area 421 and the stiffening area where U: area \ road ^ continue to form the circuit area, area 421, this area is for the future Beans on I1, 4 pairs of X 16 inches on the edges are 42 2 stiffeners, and 8 series k are sufficient stiffness for thin circuit board 4 0. As shown in Fig. 5, first form 忐 _ ^ w φ,. ^, 7 without opening ^ into the resist layer 30 on the stiffening area 422, and 3◦ is Γ ::! In this narrative, the resistance layer circuit is defined by: Ding Xue: Thickness, ^ Dedicated Thickness of the Soil ^ ^ 厗. When the circuit formation region 42 1 is thinned to a pre-Γ as shown in FIG. 1A = the etch-resistant layer 30, a thin circuit substrate 4 can be obtained. ′, And park b not), in which the formation area 421 is strengthened. In addition, the thickness of 箸 ^ ^ is greater than that of the thinned circuit. + In the step of forming the circuit forming region 421, the solution is also formed on the circuit forming region 421 ^ w, and sulfuric acid and hydrogen peroxide are used to increase the laser light in this region. Absorption treatment br (7㈣cess), (c0 user), red window connected with neodymium, and then carbon dioxide laser light (excimer u ㈣ shells, etc. ⑽ ⑽: YAG laser), or laser J Temple method to thin circuit formation regions 421 to

II surface 545096 V. Description of the invention (5) Predetermined thickness. Next, as shown in FIG. 7, the thin circuit board 40 is placed in a unified system of 2000. The traction system and the 200 system are driven by a plurality of rollers 201 to drive the thin circuit board 40 forward. Among them, the roller 201 can make contact with the thin circuit substrate 40 at each thickness by its own gravity. When the thin circuit substrate 40 'is placed in the traction system 2000, the stiffening area 422 is positioned at the leading edge of the circuit substrate 40' in the advancing direction. In order to make the thin circuit board 40 rigid enough to prevent the substrate from being bent and deformed and stuck to the rollers 20, the width a of the stiffening region 42 2 is preferably larger than the pitch β of the rollers 201. Generally, the distance between the rollers 201 is about lcni. Hesitantly, with the drive of the traction system 200, the thin circuit substrate 40 is advanced, and a series of exposure and chemical processes are performed on this circuit formation area 421, and then the circuit formation area 421 is patterned into lines. Most: Remove the stiffening area 4 22 and its corresponding core layer 41. Taken from the above, the present invention has the following advantages: The manufacturing method of the thin circuit board invented by the first person is to use a thin metal layer (stiffened area) with a thicker thickness, so as to make it stronger. Therefore, the front edge of the thin circuit board can be made as a clay plate. Due to its own gravity, the thin type:: = = cannot be smoothly pushed. <In the exhibition round, the present invention is enhanced by increasing the thickness of the local metal layer ', so there is no need to worry about the use of other materials, for example: 5: other plates, the pollution caused by the medicinal solution or the length ^ to join 545096 V. Description of the Invention (6) Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some changes without departing from the spirit and scope of the present invention. Changes and retouching, therefore, the scope of protection of the present invention shall be determined by the scope of the appended patent application.

Page 10 545096 Brief description of the drawings (5) [Simplified description of the drawings] FIG. 1 is a schematic cross-sectional view of a thin circuit board. FIG. 2 is a schematic diagram of a thin circuit substrate driven by a traction system. Fig. 3 is a schematic diagram of the substrate stuck in the roller when the edge of the thin circuit substrate is deformed. 4 to 7 are schematic views of a method for manufacturing a thin circuit board according to the present invention. Component symbol description:

10 Thin circuit board 11 Core layer 12 Metal layer 2 0 0 Traction system 2 0 1 Roller 3 0 Etching layer 40 Thin circuit board 4 0 ’Thin circuit board

41 Core layer 4 2 Metal layer 421 Circuit formation area 4 2 1 Circuit formation area 4 2 2 Stiffening area

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Claims (1)

545096 VI. Application for patent scope 1. A method for manufacturing a thin circuit substrate, comprising: (a) providing a substrate including a core layer and at least one metal layer, the metal layer being located on the side of the core layer, and the metal layer Including a circuit forming area and a stiffening area; (b) thinning the thickness of the circuit forming area and maintaining the thickness of the stiffening area; (c) placing the thinned substrate in a traction system so that the substrate Moving forward, the stiffening area of the substrate is located at the leading edge of its moving direction; (d) patterning the circuit forming area of the substrate, and (e) removing the stiffening area and its corresponding core layer portion. 2. The method for manufacturing a thin circuit board according to item 1 of the scope of the patent application, wherein in step (b), an etching resist is formed on the stiffened area. 3. The method for manufacturing a thin circuit substrate as described in item 2 of the scope of the patent application, wherein the etching resist layer is an acid-base resistant film. 4. The method for manufacturing a thin circuit board according to item 2 of the scope of the patent application, wherein after the step (b) is completed, the etching resist layer formed on the stiffened area is removed. 5. The method for manufacturing a thin circuit board as described in item 1 of the scope of the patent application, wherein the thickness of the core layer is less than 2 0 // // m. 545096 VI. Application for patent scope 6 · The manufacturing method of the thin circuit board as described in item 1 of the patent application scope, wherein the traction system is provided with a plurality of rollers to move the substrate forward, and the width of the stiffening area is greater than two The distance between the two wheels. 7 _ The method for manufacturing a thin circuit board as described in item 1 of the scope of patent application, wherein the width of the stiffening region is greater than 1 cm. 8. The method for manufacturing a thin circuit board according to item 1 of the scope of patent application, wherein the metal layer is a copper foil. 9. The method for manufacturing a thin circuit substrate as described in item 1 of the scope of the patent application, wherein the material of the core layer is bismaleimide-triazine (BT) 〇1 〇 · If the scope of the patent application is The method for manufacturing a thin circuit board according to item 1, wherein the material of the core layer is FR-4 epoxy resin. 11. A method for manufacturing a thin circuit substrate, comprising: (a) providing a substrate including a core layer and at least one metal layer, the metal layer being located on a side of the core layer, the metal layer including a circuit forming region and A stiffening region whose thickness is greater than the thickness of the circuit forming region, (b) placing the substrate in a traction system to advance the substrate, and the stiffening region of the substrate is located at the leading edge of its moving direction; 545096 6. Scope of patent application (c) Pattern the circuit formation area; and (d) Remove the stiffening area and its corresponding core layer. Fan Li specially asked to apply the method to check the thickness of the thin plate-type road plate made by other parties in the thick layer of the core. Fan Li specially asked to apply to the front board as law. The base distance is between the moving wheel and the wheel. JU3-* — JTU rolls a number of two and doubles in the lead zone with a large system and a wide system. The manufacturing method of the thin circuit board according to item 11 of the patent scope, wherein the width of the stiffening region is greater than 1 cm. 1 5. The method for manufacturing a thin circuit board as described in item 11 of the scope of patent application, wherein the metal layer is a copper pig. 16 · The method for manufacturing a thin circuit board as described in item 11 of the scope of the patent application, wherein the material of the core layer is bismaleimide-triazine (BT) 〇1 7. As the patent is applied for The method for manufacturing a thin circuit board according to the item 11 of the scope, wherein the material of the core layer is FR-4 epoxy resin. Page 14