JP2002374039A5 - - Google Patents

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Publication number
JP2002374039A5
JP2002374039A5 JP2002050548A JP2002050548A JP2002374039A5 JP 2002374039 A5 JP2002374039 A5 JP 2002374039A5 JP 2002050548 A JP2002050548 A JP 2002050548A JP 2002050548 A JP2002050548 A JP 2002050548A JP 2002374039 A5 JP2002374039 A5 JP 2002374039A5
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JP
Japan
Prior art keywords
material layer
layer
light
laser
refractive index
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002050548A
Other languages
English (en)
Japanese (ja)
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JP2002374039A (ja
Filing date
Publication date
Application filed filed Critical
Priority to US10/085,204 priority Critical patent/US6975663B2/en
Priority to JP2002050548A priority patent/JP2002374039A/ja
Priority claimed from JP2002050548A external-priority patent/JP2002374039A/ja
Publication of JP2002374039A publication Critical patent/JP2002374039A/ja
Priority to US10/697,035 priority patent/US7245647B2/en
Publication of JP2002374039A5 publication Critical patent/JP2002374039A5/ja
Priority to US11/220,826 priority patent/US20060093010A1/en
Priority to US11/759,615 priority patent/US7590159B2/en
Pending legal-status Critical Current

Links

JP2002050548A 1999-10-28 2002-02-26 光送受信システムおよび光通信システム Pending JP2002374039A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US10/085,204 US6975663B2 (en) 2001-02-26 2002-02-26 Surface-emission laser diode operable in the wavelength band of 1.1-7μm and optical telecommunication system using such a laser diode
JP2002050548A JP2002374039A (ja) 2001-02-27 2002-02-26 光送受信システムおよび光通信システム
US10/697,035 US7245647B2 (en) 1999-10-28 2003-10-31 Surface-emission laser diode operable in the wavelength band of 1.1-1.7mum and optical telecommunication system using such a laser diode
US11/220,826 US20060093010A1 (en) 2001-02-26 2005-09-08 Surface-emission laser diode operable in the wavelength band of 1.1-1.7 um and optical telecommunication system using such a laser diode
US11/759,615 US7590159B2 (en) 2001-02-26 2007-06-07 Surface-emission laser diode operable in the wavelength band of 1.1-1.7 micrometers and optical telecommunication system using such a laser diode

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-53225 2001-02-27
JP2001053225 2001-02-27
JP2002050548A JP2002374039A (ja) 2001-02-27 2002-02-26 光送受信システムおよび光通信システム

Publications (2)

Publication Number Publication Date
JP2002374039A JP2002374039A (ja) 2002-12-26
JP2002374039A5 true JP2002374039A5 (https=) 2005-06-23

Family

ID=26610242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002050548A Pending JP2002374039A (ja) 1999-10-28 2002-02-26 光送受信システムおよび光通信システム

Country Status (1)

Country Link
JP (1) JP2002374039A (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4631248B2 (ja) * 2003-02-24 2011-02-16 富士ゼロックス株式会社 光書込みヘッド、光プリンタおよび光量補正方法
JP2006245488A (ja) * 2005-03-07 2006-09-14 Ricoh Co Ltd 二次元面発光レーザーアレイおよび光走査装置および画像形成装置
JP5017804B2 (ja) * 2005-06-15 2012-09-05 富士ゼロックス株式会社 トンネル接合型面発光半導体レーザ装置およびその製造方法
JP5055717B2 (ja) * 2005-06-20 2012-10-24 富士ゼロックス株式会社 面発光型半導体レーザ
JP5005937B2 (ja) * 2006-03-24 2012-08-22 古河電気工業株式会社 面発光レーザ素子
KR101360294B1 (ko) * 2008-05-21 2014-02-11 광주과학기술원 반사형 광학 센서장치
JP5980193B2 (ja) 2013-11-29 2016-08-31 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 光モジュール及び光モジュール製造方法。
JP7228176B2 (ja) * 2017-11-10 2023-02-24 豊田合成株式会社 Ｉｉｉ族窒化物半導体発光素子
JP2022191643A (ja) * 2021-06-16 2022-12-28 住友電気工業株式会社 面発光レーザの製造方法、面発光レーザの検査方法及び面発光レーザの検査装置
JP7393753B2 (ja) * 2021-07-31 2023-12-07 株式会社フジキン 濃度測定装置
CN116137416A (zh) * 2021-11-17 2023-05-19 山东华光光电子股份有限公司 一种具有机械应力可控结构的GaAs基大功率激光器外延片及其制备方法
CN116207612B (zh) * 2023-03-30 2025-11-25 扬州乾照光电有限公司 一种vcsel外延结构及其制作方法、vcsel芯片
CN119670673B (zh) * 2025-02-20 2025-05-16 合肥芯谷微电子股份有限公司 一种多层htcc陶瓷rf sip封装管壳的设计方法及封装器件

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