JP2002369553A - Gate drive circuit of semiconductor device for power - Google Patents
Gate drive circuit of semiconductor device for powerInfo
- Publication number
- JP2002369553A JP2002369553A JP2001172942A JP2001172942A JP2002369553A JP 2002369553 A JP2002369553 A JP 2002369553A JP 2001172942 A JP2001172942 A JP 2001172942A JP 2001172942 A JP2001172942 A JP 2001172942A JP 2002369553 A JP2002369553 A JP 2002369553A
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- Japan
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- value
- drive circuit
- semiconductor device
- gate drive
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electronic Switches (AREA)
- Power Conversion In General (AREA)
- Inverter Devices (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、インバータなど
の電力変換器を構成するIGBT(絶縁ゲート型バイポ
ーラトランジスタ)等の電力用半導体素子のゲート駆動
回路に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gate drive circuit for a power semiconductor device such as an IGBT (insulated gate bipolar transistor) constituting a power converter such as an inverter.
【0002】[0002]
【従来の技術】図3にこの種のIGBTを用いたインバ
ータ主回路図を示す。2. Description of the Related Art FIG. 3 shows a main circuit diagram of an inverter using such an IGBT.
【0003】同図において、1は直流電源(なお、交流
入力の場合は整流器+電解コンデンサの構成となる)、
2は直流を交流に変換するインバータで、各アームはI
GBTとこれに逆並列接続されたダイオードなどから構
成される。3A,3BはIGBTのゲート駆動回路(各
素子対応に設けられる)、4はモータなどの負荷であ
る。In FIG. 1, reference numeral 1 denotes a DC power supply (in the case of AC input, a rectifier + electrolytic capacitor is used);
2 is an inverter for converting DC to AC, and each arm is I
It comprises a GBT and a diode connected in anti-parallel to the GBT. Reference numerals 3A and 3B denote gate drive circuits of the IGBT (provided for each element), and reference numeral 4 denotes a load such as a motor.
【0004】図4にゲート駆動回路の具体例を示す。記
号にaを付して上側アーム素子または信号を示し、記号
にbを付して下側アーム素子または信号を示す。FIG. 4 shows a specific example of a gate drive circuit. A symbol a indicates an upper arm element or signal, and a symbol b indicates a lower arm element or signal.
【0005】5は駆動回路用電源、6,7はIGBT
(T1,T2)をそれぞれターンオン,ターンオフさせ
るためのスイッチ素子、8,9はターンオン,ターンオ
フ用のゲート抵抗で、スイッチ素子6,7は、上位から
の指令信号Sおよび制御部10からのオン指令信号Nま
たはオフ指令信号Fによって動作する。[0005] 5 is a drive circuit power supply, and 6 and 7 are IGBTs.
(T1, T2) switch elements for turning on and off, respectively, 8 and 9 are turn-on and turn-off gate resistors, and switch elements 6 and 7 are a command signal S from the host and an on command from control unit 10. It operates according to the signal N or the off command signal F.
【0006】また、図5にIGBT(T1)ターンオン
時のコレクタ電流(Ic)波形と、対向アーム側ダイオ
ード(D2)の逆回復電圧(Vf)波形の例を示す。FIG. 5 shows an example of a collector current (Ic) waveform when the IGBT (T1) is turned on, and an example of a reverse recovery voltage (Vf) waveform of the opposite arm side diode (D2).
【0007】[0007]
【発明が解決しようとする課題】一般に、インバータな
どの電力変換器から発生する放射ノイズのうち、ノイズ
源として支配的なのは、IGBTターンオン時における
対向アーム側ダイオードの逆回復時の電圧変化率(dv
/dt)である。このdv/dtが高いと、高レベルの
電磁波が放射されることになり、周辺機器が誤動作する
という問題が発生する。定性的にはターンオン用のゲー
ト抵抗値を大きくすればdv/dtを低減できるが、不
必要に大きくするとIGBTターンオン損失が大きくな
り、効率低下を招く。また、IGBTやゲート駆動回路
の内部定数には、特性ばらつきや温度変化による特性変
動があり、さらには、主回路構造や配線方法によっても
このdv/dt値が変わるため、dv/dt値の正確な
管理ができないのが現状である。Generally, among radiation noises generated from a power converter such as an inverter, a dominant noise source is a voltage change rate (dv) during reverse recovery of a diode on the opposite arm side when the IGBT is turned on.
/ Dt). If dv / dt is high, a high level of electromagnetic waves will be radiated, causing a problem that peripheral devices malfunction. Qualitatively, if the gate resistance for turn-on is increased, dv / dt can be reduced, but if it is unnecessarily increased, the IGBT turn-on loss increases and the efficiency is reduced. In addition, internal constants of the IGBT and the gate drive circuit have characteristic fluctuations due to characteristic fluctuations and temperature changes, and furthermore, the dv / dt value changes depending on the main circuit structure and the wiring method. The current situation is that it is not possible to perform any kind of management.
【0008】したがって、この発明の課題は、IGBT
ターンオン時の対向アーム側ダイオードの逆回復時のd
v/dtを低減することにある。Therefore, an object of the present invention is to provide an IGBT
D at the time of reverse recovery of the diode on the opposite arm at turn-on
It is to reduce v / dt.
【0009】[0009]
【課題を解決するための手段】このような課題を解決す
るため、請求項1の発明では、電力変換器を構成する電
力用半導体素子のゲート駆動回路において、前記電力用
半導体素子に印加される電圧の微分値を検出する検出手
段と、この検出値を設定値と比較し検出値が設定値を上
回ったとき所定の出力を出す比較手段と、この比較手段
からの出力に基づき対向アーム側の電力用半導体素子の
ゲート駆動回路のターンオン用ゲート抵抗値を増加させ
るか、または、対向アーム側の電力用半導体素子のゲー
ト・エミッタ間容量を増加させる手段とを備えたことを
特徴とする。According to a first aspect of the present invention, there is provided a gate drive circuit for a power semiconductor device constituting a power converter, wherein the voltage is applied to the power semiconductor device. Detecting means for detecting a differential value of the voltage; comparing means for comparing the detected value with a set value and outputting a predetermined output when the detected value exceeds the set value; Means for increasing the turn-on gate resistance value of the gate drive circuit of the power semiconductor element, or increasing the gate-emitter capacitance of the power semiconductor element on the opposite arm side.
【0010】つまり、対向アーム側ダイオードの逆回復
時のdv/dt(素子に印加される電圧の微分値)を検
出し、この値が或る設定値よりも高い場合は、対向アー
ム側のIGBTのターンオン用ゲート抵抗値またはゲー
ト・エミッタ間容量を大きくする操作を施すことによ
り、dv/dtを設定値以下に抑制できるようにする。
特性ばらつきや温度変化により、高dv/dtが印加さ
れる場合でも、速やかにdv/dtを低減できるように
する。That is, dv / dt (differential value of the voltage applied to the element) at the time of reverse recovery of the opposing arm side diode is detected, and when this value is higher than a certain set value, the IGBT on the opposing arm side is detected. By increasing the turn-on gate resistance value or the gate-emitter capacitance, the dv / dt can be suppressed to a set value or less.
Even when a high dv / dt is applied due to characteristic variations or temperature changes, dv / dt can be quickly reduced.
【0011】[0011]
【発明の実施の形態】図1はこの発明の第1の実施の形
態を示す回路図である。FIG. 1 is a circuit diagram showing a first embodiment of the present invention.
【0012】図示のように、IGBTのコレクタ・エミ
ッタ間にコンデンサ11と抵抗12との直列回路を接続
し、dv/dtが発生するとこれにほぼ比例した変位電
流が流れ、抵抗12に電圧が発生する。この電圧(微分
値)をコンパレータ13によりdv/dtの基準値相当
の電圧値Vrと比較する。コンパレータ13の出力信号
を伝達回路14により上アーム側に伝達するが、この伝
達回路14としてはフォトカプラやレベルシフト回路に
よって実現することができる。15はセットリセットフ
リップフロップ(SRFF)で、dv/dtが設定値よ
りも高い場合にはセットされ、アンドゲート16を介し
てスイッチ17を常にオフとする。As shown in the figure, a series circuit of a capacitor 11 and a resistor 12 is connected between the collector and the emitter of the IGBT. When dv / dt is generated, a displacement current almost proportional to dv / dt flows, and a voltage is generated in the resistor 12. I do. This voltage (differential value) is compared by the comparator 13 with a voltage value Vr corresponding to a reference value of dv / dt. The output signal of the comparator 13 is transmitted to the upper arm side by the transmission circuit 14, and this transmission circuit 14 can be realized by a photocoupler or a level shift circuit. Reference numeral 15 denotes a set / reset flip-flop (SRFF) which is set when dv / dt is higher than a set value, and always turns off the switch 17 via the AND gate 16.
【0013】これにより、ターンオン用のゲート抵抗値
が抵抗8と18との並列抵抗値から抵抗8のみの値とな
って、高抵抗値化が実現できる。As a result, the turn-on gate resistance becomes the value of only the resistor 8 from the parallel resistance of the resistors 8 and 18, and a high resistance can be realized.
【0014】その結果、IGBT(T1)のターンオン
時のdi/dtが低減し、ひいてはダイオード(D2)
のdv/dtが低減することとなる。また、SRFF1
5は信号Tが或る一定期間入力しない場合(インバータ
の運転停止状態)にリセットされるよう、そのリセット
端子にはワンショット回路19の出力が導入されてい
る。As a result, di / dt at the time of turning on the IGBT (T1) is reduced, and the diode (D2)
Dv / dt is reduced. In addition, SRFF1
The output of the one-shot circuit 19 is introduced to its reset terminal 5 so that it is reset when the signal T is not inputted for a certain period of time (inverter operation stop state).
【0015】図2は図1の変形例を示す回路図である。FIG. 2 is a circuit diagram showing a modification of FIG.
【0016】その基本的な動作は図1と同じであるが、
dv/dtを低減するためにコンデンサ20を用いる点
が特徴である。The basic operation is the same as in FIG.
The feature is that the capacitor 20 is used to reduce dv / dt.
【0017】すなわち、SRFF15がセットされると
スイッチ21がオンし、コンデンサ20をIGBT(T
1)のゲート・エミッタ間に接続するようにする。これ
により、上記と同様ダイオード(D2)のdv/dtが
低減されることとなる。That is, when the SRFF 15 is set, the switch 21 is turned on, and the capacitor 20 is connected to the IGBT (T
The connection is made between the gate and the emitter in 1). As a result, dv / dt of the diode (D2) is reduced in the same manner as described above.
【0018】以上の実施例では、下アーム側ダイオード
のdv/dtを検出して上アーム側のゲート駆動回路を
操作する場合についてのみ説明したが、上アーム側ダイ
オードのdv/dtを検出して下アーム側のゲート駆動
回路を操作する回路も実際に設けられており、上記と同
様に動作させることは勿論である。In the above embodiment, only the case where the dv / dt of the lower arm side diode is detected and the gate drive circuit of the upper arm side is operated has been described, but the dv / dt of the upper arm side diode is detected. A circuit for operating the gate drive circuit on the lower arm side is actually provided, and it is needless to say that the circuit is operated in the same manner as described above.
【0019】[0019]
【発明の効果】この発明によれば、IGBT,ダイオー
ドおよびゲート駆動回路の特性ばらつきや、温度変化に
よる特性変動や、または主回路構造や配線方法などによ
る相間での差異がある場合でも、dv/dtを或る値以
下にすることができ、これにより、高い放射ノイズレベ
ルによる周辺機器の誤動作現象などを防止することが可
能となる。According to the present invention, dv / d is obtained even when there is a characteristic variation of the IGBT, the diode and the gate drive circuit, a characteristic variation due to a temperature change, or a difference between phases due to a main circuit structure or a wiring method. dt can be set to a certain value or less, which makes it possible to prevent malfunction of peripheral devices due to a high radiation noise level.
【0020】また、大容量装置におけるIGBT並列接
続の場合の主回路構造上の原因や、並列されるIGBT
やダイオードの特性上または駆動上にアンバランスがあ
ることで、或る特定の素子のみに高dv/dtが印加さ
れる場合でも、この発明によれば、dv/dtの低減が
可能となる。Further, the cause of the main circuit structure in the case of parallel connection of IGBTs in a large capacity device,
According to the present invention, dv / dt can be reduced even when high dv / dt is applied only to a specific element due to imbalance in characteristics or driving of the diode.
【図1】この発明の第1の実施の形態を示す構成図であ
る。FIG. 1 is a configuration diagram showing a first embodiment of the present invention.
【図2】この発明の第2の実施の形態を示す構成図であ
る。FIG. 2 is a configuration diagram showing a second embodiment of the present invention.
【図3】IGBTを用いたインバータの従来例を示す構
成図である。FIG. 3 is a configuration diagram showing a conventional example of an inverter using an IGBT.
【図4】図3のゲート駆動回路例を示す回路図である。FIG. 4 is a circuit diagram illustrating an example of the gate drive circuit of FIG. 3;
【図5】図4のダイオードにおける逆回復電圧を説明す
るための波形図である。FIG. 5 is a waveform diagram for explaining a reverse recovery voltage in the diode of FIG.
1…直流電源、2…インバータ回路、3A,3B…ゲー
ト駆動回路、4…モータ(負荷)、5…ゲート駆動回路
用電源、6,7,17,21…スイッチ、8,9,18
…ゲート抵抗、10…制御回路、11,20…コンデン
サ、12…抵抗、13…コンパレータ、14…伝達回
路、15…セットリセットフリップフロップ(SRF
F)、16…アンドゲート、19…ワンショット回路、
T1,T2…IGBT、D1,D2…ダイオード。DESCRIPTION OF SYMBOLS 1 ... DC power supply, 2 ... Inverter circuit, 3A, 3B ... Gate drive circuit, 4 ... Motor (load), 5 ... Gate drive circuit power supply, 6,7,17,21 ... Switch, 8,9,18
... gate resistance, 10 ... control circuit, 11, 20 ... capacitor, 12 ... resistance, 13 ... comparator, 14 ... transmission circuit, 15 ... set / reset flip-flop (SRF
F), 16: AND gate, 19: One shot circuit,
T1, T2: IGBT, D1, D2: diode.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H03K 17/56 H03K 17/56 Z Fターム(参考) 5H007 AA03 BB06 CA01 CB04 CB05 CC07 CC23 DB03 5H740 AA05 BA11 BB01 BB05 BB09 BB10 HH05 MM05 5J055 AX25 BX16 CX07 DX09 DX72 EY01 EY10 EY12 EZ10 EZ25 EZ27 EZ32 FX18 FX32 GX01 GX04 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H03K 17/56 H03K 17/56 Z F-term (Reference) 5H007 AA03 BB06 CA01 CB04 CB05 CC07 CC23 DB03 5H740 AA05 BA11 BB01 BB05 BB09 BB10 HH05 MM05 5J055 AX25 BX16 CX07 DX09 DX72 EY01 EY10 EY12 EZ10 EZ25 EZ27 EZ32 FX18 FX32 GX01 GX04
Claims (1)
のゲート駆動回路において、 前記電力用半導体素子に印加される電圧の微分値を検出
する検出手段と、この検出値を設定値と比較し検出値が
設定値を上回ったとき所定の出力を出す比較手段と、こ
の比較手段からの出力に基づき対向アーム側の電力用半
導体素子のゲート駆動回路のターンオン用ゲート抵抗値
を増加させるか、または、対向アーム側の電力用半導体
素子のゲート・エミッタ間容量を増加させる手段とを備
えたことを特徴とする電力用半導体素子のゲート駆動回
路。1. A gate drive circuit for a power semiconductor device constituting a power converter, comprising: detecting means for detecting a differential value of a voltage applied to the power semiconductor device; and comparing the detected value with a set value. A comparing unit that outputs a predetermined output when the detected value exceeds a set value, and increasing the turn-on gate resistance value of the gate drive circuit of the power semiconductor element on the opposite arm side based on the output from the comparing unit, or Means for increasing the gate-emitter capacitance of the power semiconductor device on the side of the opposing arm.
Priority Applications (1)
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JP2001172942A JP2002369553A (en) | 2001-06-07 | 2001-06-07 | Gate drive circuit of semiconductor device for power |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001172942A JP2002369553A (en) | 2001-06-07 | 2001-06-07 | Gate drive circuit of semiconductor device for power |
Publications (1)
Publication Number | Publication Date |
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JP2002369553A true JP2002369553A (en) | 2002-12-20 |
Family
ID=19014487
Family Applications (1)
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JP2001172942A Pending JP2002369553A (en) | 2001-06-07 | 2001-06-07 | Gate drive circuit of semiconductor device for power |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007166655A (en) * | 2007-02-05 | 2007-06-28 | Hitachi Ltd | Device for driving power semiconductor element |
JP2010233310A (en) * | 2009-03-26 | 2010-10-14 | Nissan Motor Co Ltd | Power conversion apparatus, and method for discharge of the same |
WO2010149431A3 (en) * | 2009-06-26 | 2011-07-14 | Siemens Aktiengesellschaft | Method for controlling a reverse-conducting igbt |
WO2010149432A3 (en) * | 2009-06-26 | 2011-07-14 | Siemens Aktiengesellschaft | Method for controlling a reverse-conducting igbt |
DE102012207147A1 (en) * | 2012-04-27 | 2013-10-31 | Infineon Technologies Ag | Method for driving power semiconductor switches |
CN104377941A (en) * | 2014-12-12 | 2015-02-25 | 中国电建集团中南勘测设计研究院有限公司 | Load-side control IGBT (insulated gate bipolar transistor) series voltage sharing circuit |
CN104377942A (en) * | 2014-12-12 | 2015-02-25 | 中国电建集团中南勘测设计研究院有限公司 | High-voltage IGBT (insulated gate bipolar transistor) series conversion voltage-sharing circuit |
JP2015211568A (en) * | 2014-04-28 | 2015-11-24 | 三菱電機株式会社 | Gate drive circuit |
CN112787489A (en) * | 2019-11-05 | 2021-05-11 | 株式会社日立制作所 | Driving device and driving method for semiconductor device, and power conversion device |
WO2023149193A1 (en) * | 2022-02-02 | 2023-08-10 | パナソニックIpマネジメント株式会社 | Power conversion device |
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007166655A (en) * | 2007-02-05 | 2007-06-28 | Hitachi Ltd | Device for driving power semiconductor element |
JP2010233310A (en) * | 2009-03-26 | 2010-10-14 | Nissan Motor Co Ltd | Power conversion apparatus, and method for discharge of the same |
WO2010149431A3 (en) * | 2009-06-26 | 2011-07-14 | Siemens Aktiengesellschaft | Method for controlling a reverse-conducting igbt |
WO2010149432A3 (en) * | 2009-06-26 | 2011-07-14 | Siemens Aktiengesellschaft | Method for controlling a reverse-conducting igbt |
DE102012207147B4 (en) * | 2012-04-27 | 2016-01-21 | Infineon Technologies Ag | Method for driving power semiconductor switches |
US8994413B2 (en) | 2012-04-27 | 2015-03-31 | Infineon Technologies Ag | Method for driving power semiconductor switches |
DE102012207147A1 (en) * | 2012-04-27 | 2013-10-31 | Infineon Technologies Ag | Method for driving power semiconductor switches |
JP2015211568A (en) * | 2014-04-28 | 2015-11-24 | 三菱電機株式会社 | Gate drive circuit |
CN104377941A (en) * | 2014-12-12 | 2015-02-25 | 中国电建集团中南勘测设计研究院有限公司 | Load-side control IGBT (insulated gate bipolar transistor) series voltage sharing circuit |
CN104377942A (en) * | 2014-12-12 | 2015-02-25 | 中国电建集团中南勘测设计研究院有限公司 | High-voltage IGBT (insulated gate bipolar transistor) series conversion voltage-sharing circuit |
CN112787489A (en) * | 2019-11-05 | 2021-05-11 | 株式会社日立制作所 | Driving device and driving method for semiconductor device, and power conversion device |
JP2021078166A (en) * | 2019-11-05 | 2021-05-20 | 株式会社日立製作所 | Driving device and driving method of semiconductor device and power conversion device |
JP7300370B2 (en) | 2019-11-05 | 2023-06-29 | 株式会社日立製作所 | Driving device and driving method for semiconductor device, and power conversion device |
CN112787489B (en) * | 2019-11-05 | 2023-10-03 | 株式会社日立制作所 | Semiconductor device driving device, semiconductor device driving method, and power conversion device |
WO2023149193A1 (en) * | 2022-02-02 | 2023-08-10 | パナソニックIpマネジメント株式会社 | Power conversion device |
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