JP2002367888A - Aligner, substrate housing apparatus, and device production system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device production system wherein positioning operation in a specific position is efficiently performed before a substrate is conveyed and devices having desired performance can be manufactured. SOLUTION: The device production system SYS has an exposure body portion EX which exposes a substrate P to light to transfer a pattern to the substrate P; conveying units H1 and H2 for conveying the substrate P from the exposure body portion EX to a stage portion ST; and a conveying unit H3 for conveying the substrate P from the stage portion ST to a substrate housing apparatus F. The stage portion ST is provided with a detector 20 which detects the position of a substrate TP held by the conveying units H1 and H2. Based on the result of detection by the detector 20, a control unit CONT requests the information of the position of the conveying units H1 and H3 relative to the stage portion ST, and controls the position of the conveying units H1 and H3 based on the requested position information when the substrate P is conveyed to the stage portion ST.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for exposing a pattern to a substrate, a substrate storage apparatus for storing a substrate, and a device manufacturing system for manufacturing a semiconductor device by a photolithography process using the exposure apparatus. is there.

[0002]

2. Description of the Related Art Conventionally, various exposure apparatuses have been used in a photolithography process for manufacturing a semiconductor element, a liquid crystal display element, a thin film magnetic head, and the like. A mask or reticle (hereinafter, referred to as a “mask”) is illuminated, and an image of a pattern formed on the mask is projected via a projection optical system onto a photosensitive substrate having a surface coated with a photosensitive agent such as a photoresist. An exposure apparatus that performs exposure is generally used. Such an exposure apparatus includes an exposure main unit that exposes a pattern of a mask onto a photosensitive substrate, a mask transport device that loads and unloads a mask with respect to the exposure main unit, and a loading / unloading unit that loads a photosensitive substrate onto the exposure main unit. Unloading substrate transfer device,
It is composed of a plurality of devices such as an exposure main body and a control device for controlling the operation of the transport device, and these are housed in a chamber.

[0003] The photosensitive substrate is obtained by applying a resist (photosensitive agent, photosensitive substance) to a base material such as a wafer or a glass plate. Coating device). The photosensitive substrate coated with the resist is transported by the transport device to the exposure main body in the chamber. On the other hand, the photosensitive substrate that has been subjected to the exposure processing in the exposure main body is transported from the inside of the chamber to a developer (developing device) by a transport device, and is developed by the developer. in this way,
The exposure apparatus is provided with a peripheral device for performing predetermined processing on the photosensitive substrate, and the photosensitive substrate is transported between the exposure main body and the peripheral device.

When a photosensitive substrate is transferred between an exposure apparatus and a peripheral device, the photosensitive substrate is transferred via a transfer stage (transfer stage) provided in a transfer path. In other words, in order to transport the photosensitive substrate from the peripheral device (coater) to the exposure device, the transport device provided on the peripheral device side is placed on the photosensitive substrate transfer stage and provided on the exposure device side. A transfer device holds the photosensitive substrate placed on the transfer stage and transfers it to the exposure main body. On the other hand, in order to transport the photosensitive substrate from the exposure apparatus to the peripheral device (developer), the transport device on the exposure device side transfers the photosensitive substrate, mounts it on the stage unit, and the transport device provided on the peripheral device side The photosensitive substrate placed on the transfer stage is held and transported to a peripheral device.

Here, when the transfer device transports the photosensitive substrate, if the transfer stage unit and the photosensitive substrate are not accurately aligned with each other, for example, the transfer device on the peripheral device side moves to the reference position on the peripheral device side. In some cases, the photosensitive substrate cannot be transported with high accuracy. That is, if the transfer stage unit and the photosensitive substrate are not accurately aligned, when the transfer device on the peripheral device side receives the photosensitive substrate from the transfer stage unit, the transfer device shifts with respect to the reference position of the peripheral device. If the photosensitive substrate is held in the state and transported as it is, the photosensitive substrate may not be transported to the reference position on the peripheral device side. Therefore, the transport device is
When transporting the photosensitive substrate, it is necessary to accurately position the transfer stage unit and the photosensitive substrate. Conventionally, the alignment between the photosensitive substrate held by the transport device and the transfer stage unit has been manually performed by an operator. That is, so that the photosensitive substrate held by the transport device is transported while being positioned with respect to a predetermined position of the transfer stage unit, the operator visually adjusts the position of the transport device while finely adjusting the position thereof, and An offset amount of the transfer device with respect to a predetermined position is obtained, and the posture of the transfer device is adjusted based on the obtained offset amount.

[0006]

As described above, the alignment of the photosensitive substrate with respect to the transfer stage when the photosensitive substrate is transported between the exposure apparatus and the peripheral device is manually performed by an operator. And the work efficiency was very low. If the peripheral device is a coater / developer, the positional relationship between the exposure device and the coater / developer does not change, so there is no need to perform frequent alignment operations. When the photosensitive substrate is transported to the cassette, it is necessary to frequently perform an alignment operation by an operator. That is, the position of the cassette is moved (changed) by various processes such as cassette exchange.
Therefore, each time the cassette is moved and reinstalled, it is necessary to perform the above-described positioning operation by the operator. In this case, the burden on the operator increases, and the overall processing time for device manufacturing including the alignment operation increases, resulting in a decrease in productivity.

[0007] As described above, if the photosensitive substrate is not accurately aligned with the transfer stage, the transfer device receives the photosensitive substrate from the transfer stage when the photosensitive substrate is received from the transfer stage. If the photosensitive substrate is held in a shifted state and transported to the cassette as it is, the photosensitive substrate will not fit in the storage position of the cassette, or the photosensitive substrate will hit the cassette and be damaged. Such inconveniences occur.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and performs a positioning operation for a specific position in a transfer path efficiently and accurately when transferring a substrate to stably transfer the substrate. An exposure apparatus capable of performing a good exposure process, a substrate storage apparatus capable of stably storing a substrate in a storage position, and a device manufacturing system capable of stably manufacturing a device having desired performance by shortening the entire processing time related to device manufacturing. The purpose is to provide.

[0009]

In order to solve the above-mentioned problems, the present invention employs the following structure corresponding to FIGS. 1 to 8 shown in the embodiment. Exposure apparatus (S) of the present invention
Is an exposure main unit (E) for exposing a pattern on a substrate (P).
X) and the substrates (P, T) from the exposure main body (EX) to specific positions (ST, ST2, 21) outside the exposure main body (EX).
An exposure apparatus provided with a transport device (H1, H2) for transporting P), provided in a transport path including a specific position (ST, ST2, 21) of the transport device (H1, H2);
A detecting device (20, 21, 24) for detecting the position of the substrate (TP) held by the transport device (H1), and a specific position (ST) based on the detection result of the detecting device (20, 21, 24). , ST2, 21) of the transfer device (H1), and based on the obtained position information, the substrate (P)
When the transport device (H) for the specific position (ST, ST2, 21) is transported to the specific position (ST, ST2, 21).
And a control device (CONT) for controlling the attitude of 1).

According to the present invention, when the substrate is transferred from the exposure main body to a specific position outside the exposure main body, the position of the substrate held by the transfer device is detected by the detection device, and based on the detection result, Since the position information of the transfer device with respect to the specific position is obtained and the position of the transfer device with respect to the specific position is controlled based on the obtained position information, the transfer device transports the held substrate while accurately positioning the substrate with respect to the specific position. can do. Further, since the positioning operation is performed based on the detection result of the detection device, unlike the conventional positioning operation that is visually performed by the operator, high positioning accuracy can be realized and the burden on the operator can be reduced.

The substrate storage device (F) of the present invention includes a transfer device (H3) for transferring a substrate (P, TP) to and from an exposure device (S) for exposing a pattern on the substrate (P). In the substrate storage apparatus, a reference position (F, 10) in the storage apparatus (F) and a specific position (ST, ST) in the exposure apparatus (S).
Based on the relationship between the storage unit (R) in which the relationship between the posture of the transport device (H3) and the posture of the transport device (H3) with respect to the storage unit (R3) is stored in advance, and the relationship between the storage unit (R) and the specific position (S).
T, 21) and the transport device (H3) for the specific position (ST, 21) when transporting between the reference position (F, 10).
And a control device (CONT) for controlling the attitude of the vehicle.

According to the present invention, when the transfer device provided in the substrate storage device transfers the substrate between the reference position in the storage device and the specific position in the exposure device, the transfer device is previously stored in the storage unit. Based on the relationship between the reference position in the storage device and the attitude of the transport device with respect to a specific position in the exposure device,
Since the attitude of the transfer device with respect to the specific position is controlled, the controlled transfer device holds the substrate at the specific position while being accurately positioned with respect to the specific position, and transfers the substrate to the reference position of the storage device with high accuracy. can do. Therefore, the substrate can be stably stored without hitting the storage device. Further, although the storage device frequently moves with respect to the exposure device, the attitude control of the transfer device can be performed quickly and accurately, so that the overall processing time can be shortened and workability can be improved.

The device manufacturing system (SYS) of the present invention
Is an exposure apparatus (S) for exposing a pattern on a substrate (P).
And a peripheral device (F, C / D) provided outside the exposure apparatus (S) and performing a predetermined process on the substrate (P). (H, H2, H3, H4) for transferring the substrate (P, TP) to / from the (F, C / D), and provided in the transfer path of the transfer device (H1, H2, H3, H4). At the specified position (ST, ST2, 21), the substrate (T) held by the transport device (H1, H2, H3, H4)
P) with respect to the specific position (ST, ST2, 21) based on a detection device (20, 21, 24) for detecting the position of the specific position (ST, ST2, 21). , 21).
3, H4), and a transport device for the specific position (ST, ST2, 21) when the substrate (P) is transported to the specific position (ST, ST2, 21) based on the obtained attitude information. And a control device (CONT) for controlling the attitude of (H1, H3, H4).

According to the present invention, when a substrate is transported between an exposure apparatus and a peripheral device by the transport device, the position of the substrate held by the transport device is detected, and the transport path is determined based on the detection result. The position information of the transfer device with respect to a specific position inside is obtained, and the position of the transfer device with respect to the specific position is controlled based on the obtained position information. It can be transported while positioning well. Then, when the substrate positioned with respect to the specific position is further transported to the peripheral device, the substrate is stably transported while being positioned with respect to the peripheral device. Therefore, the peripheral device can stably perform a predetermined process on the substrate, and thus can stably produce a device having desired performance. And since the positioning operation is based on the detection result of the detection device, unlike the conventional positioning operation by the operator, high positioning accuracy can be efficiently realized, and the processing time for device manufacturing is reduced. Can be shortened.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an exposure apparatus, a substrate storage apparatus, and a device manufacturing system according to the present invention will be described with reference to the drawings. FIG. 1 is a view showing one embodiment of a device manufacturing system provided with an exposure apparatus and a substrate storage apparatus (peripheral apparatus) of the present invention, and is a schematic configuration diagram viewed from the side, and FIG. FIG. FIG. 3 is a view showing a transfer stage section provided in a photosensitive substrate transport path between the exposure apparatus and the substrate storage apparatus.
FIG. 4B is a side view, FIG. 4B is a view taken along line LL of FIG. 4A, and FIG. 4 is a block diagram showing a control system of the device manufacturing system SYS.

In FIG. 1 and FIG. 2, a device manufacturing system SYS includes an exposure apparatus S for exposing a pattern on a photosensitive substrate P, and a substrate storage apparatus (externally provided to the exposure apparatus S for storing the photosensitive substrate P). Peripheral device) F and photosensitive substrate P
A coater (peripheral device) C for applying a resist (photosensitive material) to a wafer which is a base material of the present invention, and a developer (peripheral device) D for developing a photosensitive substrate P subjected to exposure processing in an exposure device S ing.

The exposure apparatus S comprises: an exposure main body EX for exposing the pattern of the mask M to the photosensitive substrate P using exposure light;
A first transfer device H1 and a second transfer device H2 for transferring the photosensitive substrate P, and a transfer stage unit provided in a transfer path of the photosensitive substrate P between the substrate storage device F and the exposure main unit EX ( (A stage unit, a specific position) ST, a first pre-alignment unit AR1, and a second pre-alignment unit AR2, which are housed in a chamber C1. On the other hand, the substrate storage device F provided outside the exposure device S includes a third transport device H3 that transports the photosensitive substrate P to and from the exposure device S. A coater C and a developer D (hereinafter, referred to as “coater / developer C / D”) provided outside the exposure apparatus S include a fourth transport apparatus H4 that transports the photosensitive substrate P to and from the exposure apparatus S. And housed in the chamber C2. The third transfer device H3 of the substrate storage device F is stored in the chamber C3.

Openings K and K3 are formed in portions facing the chamber C1 on the exposure apparatus S side and the chamber C3 on the substrate storage apparatus F side, and can be opened and closed in the opening K on the chamber C1 side. A shutter T3 is provided at the opening K3 on the chamber C3 side. When the photosensitive substrate P is transported between the substrate storage device F and the exposure device S, each of the shutters T and T3 is opened. Openings K1 and K2 are also formed in portions facing the chamber C1 and the chamber C2, respectively. An opening / closing shutter T1 is provided in the opening K1 on the chamber C1 side, and an opening K2 on the chamber C2 side is provided. Is provided with a shutter T2 that can be opened and closed. Coater
When the photosensitive substrate P is transported between the developer C / D and the exposure device S, each of the shutters T1 and T2 is opened. The shutters T, T1, T2, T3 are not essential. However, each of the chambers C1 to C3
In order to more strictly control the environment (temperature, atmospheric pressure, humidity, and the like), it is preferable to use such an environment.

As shown in FIG. 1, the exposure main body EX is illuminated with an illumination optical system IL for illuminating a mask M supported on a mask stage MST with exposure light (exposure illumination light), and with exposure light. A projection optical system PL for projecting the image of the pattern of the mask M onto the photosensitive substrate P, a substrate holder PH for holding the photosensitive substrate P, and a substrate stage PST for supporting the substrate holder PH are provided. The exposure main body EX in the present embodiment includes two substrate stages PST1 and PST.
Two.

Here, in the following description, the direction of the optical axis of the projection optical system PL in the exposure main body part EX is assumed to be the Z direction.
The directions orthogonal to the directions are defined as an X direction and a Y direction, respectively. In addition, the rotation directions around the respective axes are θZ, θX,
θY.

The illumination optical system IL includes an exposure light source, an elliptical mirror for condensing a light beam emitted from the light source, an input lens for converting the light beam condensed by the elliptical mirror into a substantially parallel light beam, and a light beam passing through the input lens. A fly-eye integrator that adjusts to a light flux having a substantially uniform illuminance distribution and converts it into exposure light, a condenser lens system that collects exposure light from the fly-eye integrator and illuminates the mask M with uniform illuminance,
And so on.

The mask stage MST supports the mask M via a mask holder having vacuum suction portions at four corners, and is driven by a drive mechanism (not shown) in the X, Y, and Y directions.
The mask M can be finely moved in the θZ direction, thereby positioning the mask M such that the center of the pattern area (mask center) passes through the optical axis of the projection optical system PL. The driving of the mask stage MST is controlled by the control device CONT (see FIG. 4).

The substrate stage PST (PST1, PST
2) supports the photosensitive substrate P via the substrate holder PH. The substrate holder PH has a groove for vacuum suction connected to a vacuum pump (not shown), and holds the photosensitive substrate P by vacuum suction. The substrate stage PST is provided so as to be movable in the X direction, the Y direction, and further in the Z direction and the θZ direction by a driving mechanism (not shown), and is also tilted with respect to the optical axis of the projection optical system PL. It is movably provided, and when the photosensitive substrate P is supported, position adjustment including leveling adjustment of the photosensitive substrate P is enabled. The positions of the substrate holder PH that holds the photosensitive substrate P in the X and Y directions are detected by a laser interferometer, and the position of the photosensitive substrate P in the Z direction is detected by a focus position detection system. The respective detection results of the laser interferometer and the focus position detection system are output to the control unit CONT. Control unit CON
T drives the substrate stage PST via a stage driving mechanism based on the detection results of the laser interference system and the multipoint focus position detection system to control the position of the photosensitive substrate P (see FIG. 4).

As shown in FIG. 2, a first transfer device H capable of transferring a photosensitive substrate P is provided in a chamber C1 of the exposure apparatus S.
1 and a second transfer device H2 are provided. The first transfer device H1 has an X position on the + Y side of the center in the chamber C1.
An X guide 1 is provided so as to extend in the direction, and an arm 2 is provided movably along the X guide 1. The second transfer device H2 is provided so as to extend in the Y direction on the −X side from the center in the chamber C1.
It has a guide portion 3 and an arm portion 4 movably provided along the Y guide portion 3.

The arm portion 2 of the first transfer device H1 and the arm portion 4 of the second transfer device H2 are constituted by articulated robot arms, and the suction portion for holding the photosensitive substrate P at the tip portion by suction. A holding section is provided. Each of the arms of the first transfer device H1 and the second transfer device H2 sucks and holds and releases the photosensitive substrate P by driving and stopping a vacuum pump (not shown) connected to the suction holding unit.
In addition, each of the first transfer device H1 and the second transfer device H2 is provided so as to be pivotable in the θZ direction and provided with a joint so as to be able to expand and contract, so that the held photosensitive substrate P can be transferred to an arbitrary position. It has become. First transport device H1
The driving of the second transfer device H2 is controlled by the control device CONT (see FIG. 4).

Here, the arm section 2 of the first transfer device H1
Are accessible to the transfer stage unit ST and the first pre-alignment unit AR1. On the other hand, the second
The arm unit 4 of the transfer device H2 can access the first pre-alignment unit AR1, the second pre-alignment unit AR2, and the substrate stage PST (PST1, PST2). Photosensitive substrate P for substrate stage PST
Is performed by the arm unit 4 of the second transport device H2. In addition, instead of not allowing the arm unit 4 of the second transfer device H2 to access the substrate stage PST (PST1, PST2), the photosensitive substrate P is moved between the substrate stage PST and the second pre-alignment unit AR2.
It is also possible to provide a load arm and an unload arm for carrying out the transfer. But,
In the present embodiment, the description will be given assuming that the arm unit 4 of the second transfer device H2 has a sufficiently long configuration (accessible to the substrate stage PST).

In the first pre-alignment unit AR1, rough pre-alignment of the photosensitive substrate P to be exposed with respect to the exposure main body EX is performed. In the second pre-alignment unit AR2, the exposure main body EX of the photosensitive substrate P rough pre-aligned in the first pre-alignment unit AR1
Fine alignment is performed.

As shown in FIG. 1, a substrate storage device (peripheral device) F provided outside the exposure apparatus S has a cassette portion (reference position, storage position) capable of storing a plurality of photosensitive substrates P.
10, a support portion 11 for supporting the cassette portion 10, and the photosensitive substrate P stored in the cassette portion 10 are taken out and transported to the exposure device S side, and the photosensitive substrate P transported from the exposure device S is taken out. And a third transfer device H3 that receives the received data and stores it in the cassette unit 10. An opening K10 is formed in a portion of the cassette unit 10 facing the third transport device H3, and an opening / closing shutter T10 is provided in the opening K10.

The third transfer device H3 accommodated in the chamber C3 includes a Z guide portion 5 provided to extend in the Z direction and an arm portion 6 provided to be able to move up and down along the Z guide portion 5. Have. Arm part 6 of third transfer device H3
Is also constituted by an articulated robot arm, and is provided with a suction holding section for suction holding the photosensitive substrate P at the tip end. The arm 6 sucks and holds and releases the photosensitive substrate P by driving and stopping a vacuum pump (not shown) connected to the sucking and holding unit. Further, the arm section 6 of the third transfer device H3 is provided so as to be pivotable in the θZ direction and to be able to expand and contract joints, so that the held photosensitive substrate P can be transferred to an arbitrary position. .
The driving of the third transport device H3 is controlled by the control device CONT (see FIG. 4).

Then, the arm 6 of the third transfer device H3
Can access the inside of the cassette unit (reference position, storage position) 10 and also can access the transfer stage unit (specific position) ST. That is, the third transfer device H3 of the substrate storage device F is
The photosensitive substrate P is transferred to and from the exposure apparatus S. When the arm unit 6 of the third transport device H3 accesses the inside of the cassette unit 10, the shutter T10 of the cassette unit 10 is opened by an opening / closing device (not shown). When the photosensitive substrate P is transported between the third transport device H3 and the exposure device S, the shutters T and T3 are opened.

The photosensitive substrate P exposed by the exposure main unit EX is transported and stored in the cassette unit 10 of the substrate storage device F by the first to third transport devices H1 to H3. The cassette unit 10 containing a plurality of photosensitive substrates P subjected to the exposure processing is transported to an external device (another coater / developer) by a transport vehicle such as an AGV.
On the other hand, the resist substrate is coated by another coater / developer (not shown), and the unexposed photosensitive substrate P stored in the cassette unit 10 is transferred to the first to third transfer devices H
It can also be conveyed to the exposure main body EX by 1 to H3 and subjected to exposure processing. The cassette unit 10 storing the unexposed photosensitive substrate P is transported to the substrate storage device F from an external device (another coater / developer) by a transport vehicle such as an AGV.

In order to transport the photosensitive substrate P stored in the cassette section 10 of the substrate storage apparatus F to the exposure main body section EX, first, the arm section 6 of the third transport apparatus H3 accesses the inside of the cassette section 10. Then, the photosensitive substrate P accommodated in the cassette unit 10 is held. At this time, the cassette unit 1
The shutter T10 of 0 is in an open state. The arm unit 6 descends after holding the photosensitive substrate P. At the same time, the shutter T and the shutter T3 between the chamber C1 and the chamber C3 are opened. The arm unit 6 transfers the photosensitive substrate P and places it on the stage unit ST. When the photosensitive substrate P is placed on the transfer stage ST, the arm 2 of the first transport device H1 accesses the transfer stage ST and holds the photosensitive substrate P. First transport device H1
Transports the photosensitive substrate P held by the arm unit 2 to the first pre-alignment unit AR1. First pre-alignment unit A
In R1, rough pre-alignment is performed on the exposure main body portion EX of the photosensitive substrate P. The arm 4 of the second transport device H2 accesses the photosensitive substrate P of the first pre-alignment unit AR1, and holds the photosensitive substrate P. Then, after the photosensitive substrate P is finely aligned in the second pre-alignment unit AR2, the second transport device H
The substrate is loaded on the substrate stage PST of the exposure main body EX by the second arm 4. When the photosensitive substrate P is supported on the substrate stage PST, the exposure main body EX
The mask M is illuminated with the exposure light EL by L, and the pattern formed on the mask M is transferred to the photosensitive substrate P supported on the substrate stage PST via the projection optical system PL.

To unload the exposed photosensitive substrate P from the substrate stage PST of the exposure main body EX and transport it to the substrate storage device F, first, the arm section 4 of the second transport device H2 is moved to the substrate stage PST. The PST is accessed, and the photosensitive substrate P supported by the substrate stage PST is held and unloaded. Next, the second transport device H2 transfers the exposed photosensitive substrate P to the first transport device H1. First
The transport device H1 holds the photosensitive substrate P by the arm unit 2 and places it on the transfer stage unit ST. The arm 6 of the third transport device H3 of the substrate storage device F accesses the photosensitive substrate P placed on the transfer stage ST, and holds the photosensitive substrate P. When the third transfer device H3 holds the photosensitive substrate P by the arm 6, the photosensitive substrate P is stored in the cassette unit 10 of the substrate storage device F.

As described above, the photosensitive substrate P includes the first to third substrates.
By the transfer devices H1 to H3, the transfer is performed between the exposure device S and the substrate storage device F via the transfer stage ST. At this time, as described above, the cassette unit 10
Is transported by a transport vehicle such as an AGV to an external device (another coater / developer) in a state where the photosensitive substrate P is stored. Therefore, the position of the cassette unit 10 with respect to the exposure apparatus S and the third substrate transport device H3 changes each time the cassette unit 10 is transported.

Next, the transfer stage ST will be described with reference to FIG. As described above, the transfer stage unit (specific position) ST includes the first to third transfer devices H1 to H3 that transfer the photosensitive substrate P between the exposure main unit EX of the exposure device S and the substrate storage device F. Provided in the transport path, the first transport device H1 or the third transport device
A detection device 20 for detecting the position of the photosensitive substrate P held by the transport device H3 is provided. The detection device 20 includes a stage 21 on which the photosensitive substrate P can be placed, and a stage 21 by the first transfer device H1 or the third transfer device H3.
And a sensor unit 24 for optically detecting the position of the photosensitive substrate P conveyed above. Further, the stage section 21 is provided with lift pins 23 that can move up and down the photosensitive substrate P. Photosensitive substrate P mounted on stage section 21
Is raised by the lift pins 23 to form a space (space for the arm 2 or 6 to enter) between the stage and the stage 21.

The sensor section 24 has a light emitting section 24a provided on the stage section 21 and a light receiving section 24b provided at an upper position facing the light emitting section 24a and capable of receiving a light beam from the light emitting section 24a. I have. The light receiving section 24b is provided on a light receiving section support section 22 that is provided at a distance above the stage section 21 and separated therefrom. The light beam emitted from the light emitting unit 24a has a wavelength different from that of the exposure light. The light emitting unit 24a is a light source 24D (for example, LED)
Emit light flux from

As shown in FIG. 3B, the light emitting section 24a
Are arranged at positions corresponding to the size of the photosensitive substrate P on the stage section 21, and three are provided in the present embodiment. When the photosensitive substrate P is arranged at a predetermined position with respect to the center position (specific position) O of the stage unit 21, the respective positions of the light emitting units 24a are, specifically, the center of the photosensitive substrate P and the stage. Center position O of part 21
Is set so that the light flux emitted from each of the light emitting portions 24a passes near the outside of the edge portion of the photosensitive substrate P when.

Of these, the two light emitting portions 24a are 9
The two light emitting portions 24a are arranged so as to have a relationship of 0 degrees, and the other one is configured to have a relationship of 90 degrees.
(That is, a relationship of 135 degrees). The light receiving units 24b are provided in the same number as the light emitting units 24a, and are arranged in the light receiving unit support unit 22 in the same positional relationship as the light emitting units 24a.

When the photosensitive substrate P is displaced from the center position O of the stage 21, any one of the light beams emitted from each of the three light-emitting portions 24a is It is set so that it is not blocked by P and does not reach the light receiving section 24b. On the other hand, the photosensitive substrate P is positioned at a predetermined position (that is,
(A position in which the center of the photosensitive substrate P is positioned with respect to the center position O of the first), all the light beams emitted from each of the three light emitting units 24a are transferred to the photosensitive substrate P. It is set so as to reach the light receiving section 24b without being interrupted. The detection signal of the light receiving unit 24b is output to the control device CONT via the sensor amplifier.

Each of the light emitting sections 24a and the light receiving section 2
4b, a pinhole portion 24 that regulates the spread of the light beam from the light emitting portion 24a and guides the light beam to the light receiving portion 24b.
c are provided respectively. The light receiving section 24b receives light passing through the pinhole section 24c.

Further, the transfer stage unit ST is provided with a presence / absence sensor 28 for determining whether or not the photosensitive substrate P exists on the stage unit 21. The presence / absence sensor 28 is, like the sensor unit 24, the stage unit 21.
A light-emitting unit 28a provided at a substantially central portion (at least an inner region of the three light-emitting units 24a),
2 includes a light receiving unit (not shown) provided at a position facing the light emitting unit 28a of the presence / absence sensor 28. When the photosensitive substrate P is present on the stage unit 21, the light beam emitted from the light emitting unit 28a of the presence sensor 28 is blocked by the photosensitive substrate P and does not reach the light receiving unit of the presence sensor 28. On the other hand, when the photosensitive substrate P does not exist on the stage section 21, the light beam emitted from the light emitting section 28a of the presence / absence sensor 28 reaches the light receiving section of the presence / absence sensor 28. The detection signal of the light receiving portion of the presence / absence sensor 28 is output to the control device CONT. Is determined (see FIG. 4).

In the present embodiment, the photosensitive substrate P transported to the exposure main body EX is not limited to the photosensitive substrate P from the substrate storage device F, but is also transported from the coater / developer C / D. I have. Coater / Developer C / D
As shown in FIG. 2, when the photosensitive substrate P is transferred from the substrate to the exposure apparatus S side, the fourth transfer apparatus H4 provided in the chamber C2 of the coater / developer C / D is operated by the coater / developer.
An opening K provided between the chamber C1 and the chamber C2 receives the photosensitive substrate P from the developer C / D.
The photosensitive substrate P is placed on the second transfer stage ST2 provided in the chamber C1 of the exposure apparatus S via the first and second K2. The photosensitive substrate P placed on the second transfer stage ST2 is transferred to the arm 2 of the first transfer device H1.
And is transported by the first transport device H1 to the first pre-alignment unit AR1, and is placed. The photosensitive substrate P that has been roughly pre-aligned by the first pre-alignment unit AR1 is held by the arm unit 4 of the second transport device H2, and is transported to the second pre-alignment unit AR2. Then, after the photosensitive substrate P is finely aligned in the second pre-alignment unit AR2, the second transfer device H2
Is loaded on the substrate stage PST of the exposure main body EX. The photosensitive substrate P conveyed to the substrate stage PST of the exposure main body EX is exposed by the exposure main body EX.

On the other hand, the photosensitive substrate P exposed by the exposure main body EX is not limited to being transported to the substrate storage device F, but is also transported to the coater / developer C / D. Coating the exposed photosensitive substrate P with a coater
To transfer the photosensitive substrate P to the developer C / D, the arm unit 4 of the second transfer device H2 unloads the exposed photosensitive substrate P from the substrate stage PST. The photosensitive substrate P unloaded from the substrate stage PST is transferred from the second transfer device H2 to the arm 2 of the first transfer device H1. The first transport device H1 holding the photosensitive substrate P by the arm 2 places the photosensitive substrate P on the second transfer stage ST2. The exposed photosensitive substrate P placed on the second transfer stage ST2 is held by the fourth transfer device H4 provided in the chamber C2 of the coater / developer C / D, and is held by the coater / developer C / D. It is transported to the D side.

As described above, the photosensitive substrate P is
And between Coater / Developer C / D,
The second and fourth transfer devices H1, H2, and H4 are configured to be transferred via the second transfer stage ST2. Here, the second transfer stage ST2 has the same configuration as the transfer stage ST. That is, the second transfer stage ST2 also includes a light emitting unit and a light receiving unit for detecting the position of the photosensitive substrate P held by the transport device, and a presence / absence sensor for detecting the presence / absence of the photosensitive substrate P. I have.

The unexposed photosensitive substrate P accommodated in the substrate accommodating apparatus F is, for example, inoperable by the coater / developer C / D for some reason and is exposed by the coater / developer C / D. Photosensitive substrate P on body EX
The photosensitive substrate P is appropriately supplied from two peripheral devices (that is, a substrate storage device and a coater / developer) to the exposure main body portion EX of the exposure device S when the transfer cannot be performed. I have.

Next, a method of transporting the photosensitive substrate P in the device manufacturing system SYS having the above-described configuration will be described. As described above, the photosensitive substrate P is transported between the exposure main unit EX and the substrate storage device F via the transfer stage unit (specific position) ST by the first to third transport devices H1 to H3. . At this time, if the photosensitive substrate P is not accurately aligned with the transfer stage ST, when the photosensitive substrate P is transported from the exposure main body EX to the substrate storage device F, the cassette portion of the substrate storage device F The photosensitive substrate P is conveyed in a state where the position of the photosensitive substrate P with respect to the (reference position) 10 deviates from a design value (theoretical value). There is a risk of hitting 10.

Therefore, the photosensitive substrate P transported from the exposure main body EX to the transfer stage ST is positioned at a predetermined position with respect to the center position (specific position) O of the transfer stage ST (center). Calibration (teaching) of the attitude of the first transfer device H1 with respect to the transfer stage ST is performed so that the center of the photosensitive substrate P coincides with the position O). Hereinafter, the teaching process of the first transport device H1 is referred to as a teaching process 1 (first
Teaching process). In addition, the photosensitive substrate P transported from the transfer stage ST to the cassette unit 10 of the substrate storage device F is positioned at a predetermined position with respect to the storage position (reference position) of the cassette unit 10 (storage). The position of the third transfer device H3 with respect to the transfer stage ST is calibrated (teached) so as to be accurately stored in the position. Hereinafter, the teaching process of the third transport device H3 is referred to as teaching process 2
This is referred to as (second teaching process).

In these teaching processes 1 and 2, a test substrate (substrate for position detection) TP is used. The test substrate TP is a substrate on which a photosensitive substance such as a resist is not applied, and has the same shape as the photosensitive substrate (exposure substrate) P on which a resist to be subjected to actual exposure processing is applied. have.

The entire sequence in performing the teaching processes 1 and 2 is as follows. First, the test substrate TP is placed in the cassette unit 10 of the substrate storage device F. next,
The test substrate TP is transported from the cassette section 10 to the transfer stage section ST by the third transport device H3.
At the time of this conveyance, the above-described teaching process 2 is performed (the details of the teaching process 2 will be described later). Next, the transport device H1 transports the test substrate TP placed on the transfer stage ST to the first pre-alignment unit AR1.
Transport to Next, the test substrate TP rough pre-aligned by the first pre-alignment unit AR1 is
The transport device H2 transports to the second pre-alignment unit AR2. Next, the test substrate TP finely pre-aligned by the second pre-alignment unit AR2 is transported by the second transport device H2 to the substrate stage PST. Next, the second transfer device H2 receives the test substrate TP from the substrate stage PST and transfers the test substrate TP to the first transfer device H1.
Next, after receiving the test substrate TP from the second transfer device H2, the first transfer device H1 transfers the test substrate TP to the transfer stage unit ST. At the time of this conveyance, the above-described teaching processing 1 is performed (the details of the teaching processing 1 will be described later). Thus, teaching processes 1 and 2 are completed.

After the completion of the teaching processes 1 and 2,
The operator may remove the test substrate TP from the transfer stage ST to start processing the exposure substrate P, or may drive the third transport device H3 based on the result of the above-described teaching process 2. Test and control substrate TP from transfer and transfer stage ST to cassette 10
May be conveyed to check the correctness of the teaching process 2 and then remove the test substrate TP stored in the cassette unit 10.

In the above-described embodiment, the teaching process 1 is performed after the teaching process 2 is performed first. However, the present invention is not limited to this, and a procedure in which the teaching process 1 is performed first, and then the teaching process 2 is performed may be adopted. One example is the following procedure. First, the operator manually places the test substrate TP on the first pre-alignment unit AR1. Thereafter, the flow of the substrate by the automatic transfer similar to the above (first pre-alignment unit AR1
→ Second transport device H2 → Second pre-alignment unit AR2 →
The test substrate TP is transferred by the second transfer device H2 → substrate stage PST → second transfer device H2 → first transfer device H1 → transfer stage section ST). Then, the first transport device H
The teaching process 1 is performed when the test substrate 1 transports the test substrate TP to the transfer stage ST. Next, after the operator manually removes the test substrate TP from the delivery stage ST, the test substrate T
After that, the test substrate TP is transferred from the cassette section 10 to the transfer stage section ST by the third transfer device H3.
Are transported, and a teaching process 2 is performed during the transport.

The teaching processes 1 and 2 may be performed not only continuously but also individually as needed. In this case, as described above, when performing the teaching process 1, the operator performs the first pre-alignment unit AR.
1, the test substrate TP is placed on the transfer stage ST, and then the test substrate TP is automatically transported to the transfer stage ST to perform the teaching process 1. An operator may load the test substrate TP into 10 and then automatically carry the test substrate TP to the transfer stage ST to perform the teaching process 2.

Hereinafter, detailed operations in the above-described teaching processing 1 and 2 will be described with reference to FIGS. First, a teaching processing procedure (teaching processing 1) of the first transport device H1 with respect to the transfer stage ST will be described with reference to FIG.

First, the control device CONT causes the arm 2 of the first transfer device H1 to hold the test substrate TP,
As shown in FIG. 2, the arm 2 holding the test substrate TP
The transfer stage ST is arranged above the stage 21 (step SA1). Here, the test substrate TP
Is the first through the pre-alignment units AR1 and AR2
It is assumed that the sheet has been transferred to the transfer device H1. That is, as described above, the test substrate TP passes through the same transport path as that of the actual process (actual exposure processing) and the first transport device H1.
Is held by the arm part 2 of the first arm. That is, the test substrate T
After the P is positioned with respect to the exposure main body EX, the second
It has been transported to the first transport device H1 via the transport device H2.

Next, the control unit CONT operates the test substrate TP held by the arm unit 2 of the first transfer unit H1.
Is detected by the detecting device 2 with respect to the transfer stage ST.
Detection is performed using 0 (step SA2). Control device CO
The NT causes the light emitting unit 24a of the sensor unit 24 to emit a light beam for position detection.

The control device CONT includes three light receiving sections 24b.
It is determined whether or not the test substrate TP is at a predetermined position with respect to the transfer stage ST based on the respective detection signals (step SA3). Here, if the light beams emitted from all the light emitting units 24a among the three light emitting units 24a are detected by the light receiving unit 24b, the first transport device H
The test substrate TP held by the first arm 2 is
This is a state where the stage 21 is at a predetermined position with respect to the center position O (a state where the center of the test substrate TP coincides with the center position O). On the other hand, there are three light emitting portions 24a
If at least one of the light beams emitted from each of the light beams is shielded by the test substrate TP and is not received by the light receiving unit 24b, the test light beam held by the arm unit 2 of the first transport device H1 is used. The substrate TP is in a state where it is not at a predetermined position with respect to the center position O of the stage section 21 (a state shifted). Thus, the control device CONT is:
The light beam emitted from each of the light emitting units 24a is
4b, the test substrate T held on the arm unit 2 of the first transfer device H1 depends on whether or not each of the test substrates T has been detected.
The position of P with respect to the transfer stage ST is detected.

All three light receiving sections 24b are light emitting sections 24a.
When the test substrate TP is received at a predetermined position with respect to the transfer stage ST when the light flux from the first transfer device ST is received, the attitude (transport coordinates) of the first transfer device H1 with respect to the transfer stage ST is predetermined. It is a state of. On the other hand, of the three light receiving sections 24b,
When b does not receive the light beam from the light emitting unit 24a because it is blocked by the test substrate TP, the test substrate TP is not transported to a predetermined position with respect to the transfer stage unit ST. The attitude (transport coordinates) of one transport device H1 is not in a predetermined state. In this way, the control unit CONT controls the transfer stage unit S based on the detection result of the sensor unit 24 (detection device 20).
The attitude information of the first transport device H1 with respect to T can be obtained. The predetermined state of the first transfer device H1 is a posture state in which the center position O of the stage unit 21 of the transfer stage unit ST and the center of the test substrate TP can be matched.

In step SA3, if it is determined that the test substrate TP held in the first transport device H1 is not at a predetermined position based on the detection result of the detection device 20, the control device CONT will control the first transport device H1. The first transfer device H1 is moved so that the test substrate TP held in the first position is placed at a predetermined position (step SA4). That is, the control unit CONT moves the arm unit 2 holding the test substrate TP in the XY directions while emitting light beams from each of the three light emitting units 24a. The position (movement) of the test substrate TP is controlled such that all of the light beams emitted from the respective components are received by the light receiving section 24b without being blocked by the test substrate TP.

Thereafter, the flow returns to step SA2 to confirm whether or not the test substrate TP has been positioned at a predetermined position. Then, in step SA3, if it is still out of the predetermined position, the operation in step SA4 is repeated. In step SA4, the first transport device H1
If the test substrate TP held in the first position is placed at a predetermined position (in other words, if the determination of YES is made in step SA3), the control device CONT holds the attitude of the first transfer device H1 at this time ( (Step SA5).
Specifically, the control device CONT calculates an offset amount (correction amount) of the attitude of the first transport device H1 determined in step SA4 with respect to the attitude (position in the transport coordinate system) of the first transport device H1 in step SA2. Hold. In this case, the attitude information or the offset amount of the first transport device H1 is stored in the storage unit R (see FIG. 4) connected to the control device CONT. As described above, the attitude information of the first transport device H1 at that time is obtained based on the position information of the test substrate TP obtained in step SA2, and the obtained attitude information of the first transport device H1 and the movement amount in step SA4 are obtained. Based on the test substrate T
Correction amount (offset amount) of the first transport device H1 for arranging P at a predetermined position with respect to the transfer stage ST
Is required.

On the other hand, if it is determined in step SA3 that the test substrate TP held in the first transfer device H1 is at a predetermined position based on the detection result of the detection device 20, the control device CONT performs the first transfer. It is determined that the attitude of the apparatus H1 with respect to the transfer stage ST is also in the predetermined state, and the attitude information of the first transport apparatus H1 at this time is stored in the storage unit R connected to the control apparatus CONT (step SA5).

As described above, when the attitude of the first transfer device H1 capable of transferring the test substrate TP to the predetermined position with respect to the transfer stage ST is obtained, the control device CONT
Terminates the teaching process for the first transport device H1.

Next, the teaching processing procedure (teaching processing 2) of the third transfer device H3 with respect to the transfer stage ST will be described with reference to FIG. The test substrate (position detection substrate) TP is also used in the teaching process of the posture of the third transfer device H3 with respect to the transfer stage ST when the photosensitive substrate P is transferred from the transfer stage ST.

The test substrate TP is stored in the cassette section 10 of the substrate storage device F. The control device CONT is
The test substrate TP stored in the cassette unit 10 is held by the arm unit 6 of the third transfer device H3. At this time,
The control unit CONT stores the attitude (position in the transport coordinate system) of the third transport unit H3 when the arm unit 6 of the third transport unit H3 accesses the cassette unit 10 and holds the test substrate TP in the storage unit R. It is stored (step SB1). That is, the control device CONT stores the attitude of the third transport device H3 at the storage position of the cassette unit 10 and, consequently, the storage position of the cassette unit 10 in the storage unit R.

When the control unit CONT causes the third transfer unit H3 to hold the test substrate TP in the cassette unit 10,
The arm 6 holding the test substrate TP is transferred to the transfer stage ST above the stage 21 of the transfer stage ST as shown in FIG. 3 (step SB2).

Next, the control unit CONT operates the test substrate TP held on the arm unit 6 of the third transfer unit H3.
Is detected by the detecting device 2 with respect to the transfer stage ST.
Detection is performed using 0 (step SB3). Control device CO
The NT causes the light emitting unit 24a of the sensor unit 24 to emit a light beam for position detection.

The control device CONT includes three light receiving sections 24b.
It is determined whether or not the test substrate TP is at a predetermined position with respect to the transfer stage ST based on the respective detection signals (step SB4). Here, if the light beams emitted from all the light emitting units 24a among the three light emitting units 24a are detected by the light receiving unit 24b, the third transport device H
The test substrate TP held by the arm 6 of the third
This is a state where the stage 21 is at a predetermined position with respect to the center position O (a state where the center of the test substrate TP coincides with the center position O). On the other hand, there are three light emitting portions 24a
If at least one of the light beams emitted from each of the light beams is blocked by the test substrate TP and is not received by the light receiving portion 24b, the test light beam held by the arm portion 2 of the third transport device H3 is not used. The substrate TP is in a state where it is not at a predetermined position with respect to the center position O of the stage section 21 (a state shifted). Thus, the control device CONT is:
The light beam emitted from each of the light emitting units 24a is
4b, the test substrate T held on the arm unit 6 of the third transport device H3 depends on whether or not the test substrate T has been detected.
The position of P with respect to the transfer stage ST is detected.

When all of the three light receiving sections 24b receive the light beam from the light emitting section 24a, the test substrate TP is transported to a predetermined position with respect to the transfer stage section ST. The attitude (transport coordinates) of the third transport apparatus H3 with respect to is in a predetermined state. on the other hand,
When any one of the three light receiving units 24b does not receive the light beam from the light emitting unit 24a while being blocked by the test substrate TP, the test substrate TP is positioned at a predetermined position with respect to the transfer stage unit ST. Since the sheet is not conveyed, the third conveying device H3 for the transfer stage ST
Is not in a predetermined state. In this way, the control device CONT operates the sensor unit 24 (the detecting device 2).
Based on the detection result of 0), the attitude information of the third transport device H3 with respect to the transfer stage ST can be obtained. The predetermined state of the third transfer device H3 is a posture state in which the center position O of the stage unit 21 of the transfer stage unit ST and the center of the test substrate TP can be matched.

If it is determined in step SB4 that the test substrate TP held in the third transport device H3 is not at a predetermined position based on the detection result of the detection device 20, the control device CONT determines whether the third transport device H3 The third transport device H3 is moved so that the test substrate TP held in the third position is placed at a predetermined position (step SB5). That is, the control device CONT moves the arm unit 6 holding the test substrate TP in the XY directions while emitting light beams from each of the three light emitting units 24a, and in the transfer stage unit ST, the three light emitting units 24a The position (movement) of the test substrate TP is controlled such that all of the light beams emitted from the respective components are received by the light receiving section 24b without being blocked by the test substrate TP.

Thereafter, the flow returns to step SB3, and it is confirmed in step SB4 whether the test substrate TP has been positioned at a predetermined position. If it is not positioned at the predetermined position, the operation of step SB5 is repeated. In step SB5, when the test substrate TP held by the third transfer device H3 is disposed at a predetermined position (in other words, when the determination of YES is made in step SB4), the control device CONT performs the processing at this time. The attitude of the three-transport device H3 is held (stored) (Step SB)
6). Specifically, the control device CONT determines in step SB
3 with respect to the attitude (position in the transport coordinate system) of the third transport device H3 in step SB5.
An offset amount (correction amount) of the attitude of the transport device H3 is obtained and held. In this case, the attitude information or the offset amount of the third transport device H3 is also stored in the storage unit R. Thus, the test substrate T determined in step SB3
Based on the position information of P, the attitude information of the third transport device H3 at that time is obtained, and based on the obtained attitude information of the third transport device H3, a predetermined amount of the test substrate TP is transferred to the transfer stage unit ST. A correction amount (offset amount) of the third transport device H3 to be arranged at the position is obtained.

On the other hand, if it is determined in step SB4 that the test substrate TP held in the third transfer device H3 is at a predetermined position based on the detection result of the detection device 20, the control device CONT performs the third transfer. The attitude of the device H3 with respect to the transfer stage ST is also determined to be in the predetermined state, and the attitude information of the third transport device H3 at this time is stored in the storage unit R connected to the control device CONT (step SB6).

As described above, when the posture of the third transfer device H3 capable of transferring the test substrate TP to the predetermined position with respect to the transfer stage ST is obtained, the control device CONT
Ends the teaching process for the third transport device H3.

Here, the storage unit R stores the test substrate T transported from the storage position of the cassette unit 10 by the third transport device H3.
A posture in which P can be arranged at a predetermined position (position positioned at the center position O) with respect to the stage section 21 is stored. Since the reproducibility of the operation of the third transfer device H3 is good and the reciprocating operation is the same, if the test substrate TP is positioned and placed at the center position O of the stage 21, the third transfer The apparatus H3 controls the stage unit 21 based on the relationship between the attitude (position in the transport coordinate system) with respect to the transfer stage unit ST and the storage position of the cassette unit 10 obtained by the teaching process and stored in the storage unit R. The loaded test substrate TP can be held and transported to the storage position of the cassette unit 10. Note that the same can be said for the above-described operation reproducibility in the first transfer device H1.

As described above with reference to FIGS. 5 and 6, the storage unit R stores the first transfer device H1 in the test substrate P.
The attitude information of the first transfer device H1 that can be arranged at a predetermined position with respect to the transfer stage ST, which is obtained when the test substrate TP is transferred to the transfer stage ST, is stored. The storage position of the cassette unit 10 obtained when the third transfer device H3 transfers the test substrate TP between the cassette unit 10 and the transfer stage unit ST, and the position of the third transfer device H3 with respect to the transfer stage unit ST. The relationship with the posture is stored.

Next, a photosensitive substrate (exposure substrate) P coated with a resist (photosensitive material) is applied by the first transport device H1 and the third transport device H3 that have been subjected to the teaching process using the test substrate TP. A method of transporting the substrate between the substrate storage device F and the exposure main body EX will be described with reference to FIG. As described above, the photosensitive substrates P stored in the cassette unit 10 of the substrate storage device F are the third substrates.
After being taken out of the cassette unit 10 by the transport device H3, the transfer stage unit ST, the first transport device H1, the first transport device H1,
The wafer is conveyed to the exposure main body EX via the pre-alignment unit AR1, the second conveyance device H2, and the second pre-alignment unit AR2, and subjected to exposure processing. The exposed photosensitive substrate P is exposed to the exposure main body E by the second transport device H2.
After being unloaded from the X substrate stage PST, the first
It is passed to the transport device H1. The first transfer device H1 transfers the exposed photosensitive substrate P to the transfer stage ST.

The first transfer device H1 is operated by the transfer stage S
When the photosensitive substrate P is transported to the T, the control device CONT
Controls the attitude of the first transport device H1 with respect to the transfer stage ST based on the attitude information of the first transport device H1 with respect to the transfer stage ST stored in the storage unit R in the teaching process. That is, the control device CONT corrects the attitude (position in the transport coordinate system) of the first transport device H1 so that the center of the photosensitive substrate P and the center position O of the stage section 21 of the transfer stage section ST match. (Step SC1).

Next, the control device CONT transfers the photosensitive substrate P held by the first transfer device H1 whose attitude has been controlled and arranges it above the transfer stage ST (step SC).
2).

The controller CONT detects the position of the photosensitive substrate P, which is arranged above the transfer stage ST, with respect to the transfer stage ST by the first transfer device H1 using the detector 20 (step SC3).

The control device CONT performs the first
It is determined whether the photosensitive substrate P held by the transport device H1 is at a predetermined position with respect to the transfer stage ST (step SC4). That is, it is determined whether or not the center of the photosensitive substrate P and the center position O of the stage 21 are positioned.

In step SC4, if it is determined that the photosensitive substrate P is at a predetermined position with respect to the transfer stage ST, the control unit CONT transfers the photosensitive substrate P to the first transfer device H1 and transfers the photosensitive substrate P to the stage unit of the transfer stage ST. 21 (step SC5). Here, the lift pins 23 provided on the stage unit 21 move up to receive the photosensitive substrate P from the first transfer device H1. When the photosensitive substrate P is transferred to the lift pins 23, the control device CO
NT moves the arm 2 of the first transfer device H1 to the lift pin 23.
And the stage portion 21 is retracted, and the lift pins 23 that have received the photosensitive substrate P are lowered.
Thus, the photosensitive substrate P is positioned at the center position O of the stage section 21.
It is placed while being positioned with respect to.

In step SC5, when the photosensitive substrate P is placed at a predetermined position of the transfer stage ST, the control unit CONT operates the third transfer unit H3 of the substrate storage unit F.
The transfer stage unit ST is accessed, and the photosensitive substrate P placed on the transfer stage unit ST is held by the arm unit 6 of the third transfer device H3 (step SC).
6). Here, the control device CONT stores the storage position of the cassette unit 10 of the substrate storage device F stored in the storage unit R, and the third transfer device H3 with respect to the transfer stage unit ST.
Of the third transfer device H3 with respect to the delivery stage ST based on the relationship with the posture (position in the transfer coordinate system) of the third transfer device H3.
Control the attitude of In other words, the control device CONT holds the photosensitive substrate P positioned with respect to the center position O of the transfer stage ST in such a manner as to hold the photosensitive substrate P and transport it to the storage position of the cassette unit 10. The attitude of the transport device H3 is controlled.

After holding the photosensitive substrate P by the third transport device H3, the control device CONT transports the photosensitive substrate P to the cassette section 10 of the substrate storage device F (step SC7). The third transfer device H3 is based on a relationship between the storage position of the cassette unit 10 of the substrate storage device F stored in the storage unit R and the attitude of the third transfer device H3 with respect to the transfer stage unit ST. The photosensitive substrate P is held in a state in which the attitude with respect to the unit ST is controlled, and is conveyed to the cassette unit 10, so that the photosensitive substrate P does not collide with the cassette unit 10 and is stably placed in the storage position of the cassette unit 10 with high accuracy. Transported.

On the other hand, in step SC4, although the attitude of the first transfer device H1 with respect to the transfer stage ST is controlled based on the result of the above-described teaching processing, the photosensitive substrate P is transferred to the transfer stage ST for some reason. If it is determined that it is not at the predetermined position with respect to the unit ST, the control device CONT performs an error process (step SC8). As an example of the error processing, the control device CON
T is such that all of the respective light beams from the light emitting unit 24a are detected by the light receiving unit 24b, that is, the photosensitive substrate P
The arm 2 of the first transport device H1 holding the photosensitive substrate P is slightly moved in the XY directions so that the center of the stage 21 and the center position O of the stage 21 are positioned. And
After the photosensitive substrate P is positioned with respect to the transfer stage ST, the photosensitive substrate P is placed on the stage 21. The control unit CONT stores the attitude of the first transfer apparatus H1 with respect to the transfer stage ST at this time in the storage unit R, and based on the stored attitude information, transfers the next photosensitive substrate P. First transport device H1
May be performed. That is, the teaching process may be performed again using the photosensitive substrate P, and the posture information stored in the storage unit R when controlling the posture of the first transport device H1 with respect to the transfer stage unit ST may be updated.

The error handling is performed by the control unit CON.
T stops the transfer operation of the photosensitive substrate P by the first transfer device H1 and uses a display device (display or lamp) and an alarm device (alarm) (not shown) provided outside the exposure device S, Notify that the photosensitive substrate P has not been transported to the predetermined position of the transfer stage ST,
The operator may be prompted to perform the teaching process using the test substrate TP again. The operator can search for and specify the cause (such as a failure in the sensor unit) of the photosensitive substrate P not being transported to a predetermined position of the transfer stage ST based on the display on the display device. Then, the operator can determine whether or not the teaching process is necessary again using the test substrate TP, for example, according to the specified cause.

As described above, the position of the test substrate TP held by the first transfer device H1 is detected by the detection device 20.
The attitude information of the first transport device H1 with respect to the transfer stage ST is obtained based on the detection result, and the photosensitive substrate P is transferred from the exposure main body EX to the transfer stage ST based on the obtained attitude information. Since the attitude of the first transfer device H1 with respect to the transfer stage ST during transfer is controlled, the first transfer device H1 moves the held photosensitive substrate P to a predetermined position (center (A position positioned with respect to the position O).

Then, using the test substrate TP, the relationship between the storage position of the cassette unit 10 and the attitude of the third transfer device H3 with respect to the transfer stage unit ST is determined in advance and stored in the storage unit R. Based on the relationship stored in the storage unit R, a third
Since the posture of the transfer device H3 is controlled, the third transfer device H3 is moved from the transfer stage ST to the cassette 1
When the photosensitive substrate P is transported to 0, the photosensitive substrate P positioned and placed with respect to the center position O of the transfer stage ST is stably placed in the storage position of the cassette unit 10 based on the above relationship. Can be transported. Although the cassette unit 10 frequently moves with respect to the exposure device S and the third transport device H3, according to the present embodiment, the teaching process of the third transport device H3 can be performed efficiently with high accuracy. Therefore, workability can be improved.

Since the teaching process of the first transport device H1 and the third transport device H3 is performed based on the detection result of the detection device 20, high positioning accuracy can be obtained unlike the conventional posture adjustment by the operator. And the burden on the operator can be reduced. In addition, since the teaching process can be performed efficiently in a short time, the overall processing time related to device manufacturing can be shortened, and workability and productivity can be improved.

Since the test substrate TP to which the resist is not applied is used in the teaching process, the test substrate TP is erroneously replaced during the teaching process.
Even if it hits, the generation of dust due to the resist being stripped can be suppressed. Furthermore, since a test substrate TP having a higher shape accuracy can be used as compared with a photosensitive substrate (exposure substrate) P to which a resist is applied and used in an actual process, the transport devices H1 and H3 Can be performed with high accuracy.

In the above-described embodiment, the teaching process controls the attitudes of the first transport device H1 and the third transport device H3 when transporting the substrate P (TP) from the exposure main body EX to the substrate storage device F. However, it is also possible to control the posture when the substrate P (TP) is transported from the substrate storage device F to the exposure main body EX. However, when the substrate P (TP) is transported from the substrate storage device F to the exposure main unit EX, the substrate P (TP) for the exposure main unit EX is transported in the first and second pre-alignment units AR1 and AR2 in the transport path. ) Is performed, the positioning of the substrate P (TP) with respect to the exposure main body EX can be accurately performed even if the positioning process of the substrate P (TP) with respect to the transfer stage ST is omitted in the transfer stage ST. Is

In the above embodiment, the third transfer device H3 of the substrate storage device F has been described as being controlled by the control device CONT provided on the exposure device S side. An apparatus is provided, and the third transport device H3 can be controlled by the second control device.
Then, by connecting a second storage unit that stores the posture information obtained in the teaching process to the second control device, the second control device is stored in the second storage unit. The third transfer device H3 can be controlled based on the information.

In the initial stage (before step SA1) in performing the teaching processing of the first transport device H1, the test substrate TP is positioned with respect to the exposure main body EX, and then the second transport device H2 is moved to the second transport device H2. Although it has been described that the first transfer device H1 is transported and held by the first transfer device H1, the teaching process of the first transfer device H1 is performed after the teaching process of the third transfer device H3 is performed. The substrate TP is transferred to the cassette unit 10 of the substrate storage device F.
The test substrate TP is transferred to the transfer stage ST by using the third transfer device H3 that has been subjected to the teaching process, and the test substrate TP placed on the transfer stage ST is transferred to the first transfer unit H3. After being held by the device H1, the teaching process of the first transport device H1 may be performed.

In the above embodiment, the peripheral device for transporting the photosensitive substrate P to the exposure device S is referred to as the substrate storage device F.
However, a coater / developer C / D may be used. In this case, the attitude control of the fourth transport device H4 of the coater / developer C / D and the attitude control of the first transport device H1 of the exposure apparatus S are for the second transfer stage ST2.

In the present embodiment, the exposure apparatus main body has two substrate stages, but may be one substrate stage.

In the above embodiment, the sensors 28 and 24 are arranged and arranged as shown in FIG. 3, but the present invention is not limited to this, and the arrangement and number of sensors may be changed as appropriate. Further, in the above embodiment, the transfer stage unit ST
The test substrate TP and the exposure substrate P are placed on the upper part.
The substrate may be directly exchanged between the arm 2 and the arm 2.

The transfer stage ST includes an exposure main body E
It may be located anywhere on the transport path between X and the substrate storage device (peripheral device) F. Further, for example, the attitude of the transport device may be controlled with respect to the first pre-alignment unit AR1.

In the exposure main body part EX (exposure apparatus S) of the above embodiment, a step of exposing the pattern of the mask M while the mask M and the photosensitive substrate P are stationary and sequentially moving the photosensitive substrate P step by step. The present invention can be applied to an AND-repeat type exposure apparatus, or can be applied to a scanning type exposure apparatus that exposes the pattern of the mask M by synchronously moving the mask M and the photosensitive substrate P.

The application of the exposure main body part EX is, for example, an exposure apparatus for manufacturing a semiconductor, an exposure apparatus for a liquid crystal for exposing a liquid crystal display element pattern on a square glass plate, or an exposure apparatus for manufacturing a thin film magnetic head. It can be widely applied to devices and the like.

The exposure light source of the exposure main body EX of this embodiment is not only a g-line (436 nm), an h-line (405 nm) and an i-line (365 nm), but also a KrF excimer laser (2
48 nm), ArF excimer laser (193 nm), F
_Two lasers (157 nm) can also be used.

The magnification of the projection optical system PL may be not only a reduction system but also any of an equal magnification and an enlargement system.

[0099] As the projection optical system PL, using a material which transmits far ultraviolet rays such as quartz and fluorite as the glass material when using a far ultraviolet ray such as an excimer laser, catadioptric system when using a F ₂ laser or X-ray Alternatively, use a refraction optical system.

The substrate stage PST and the mask stage MS
When a linear motor is used for T, either an air levitation type using an air bearing or a magnetic levitation type using Lorentz force or reactance force may be used. Also,
The stage may be a type that moves along a guide or a guideless type that does not have a guide.

When a plane motor is used as the stage driving device, one of the magnet unit (permanent magnet) and the armature unit is connected to the stage, and the other of the magnet unit and the armature unit is connected to the moving surface of the stage. (Base).

The reaction force generated by the movement of the substrate stage PST may be mechanically released to the floor (ground) by using a frame member as described in Japanese Patent Application Laid-Open No. 8-166475. The present invention is also applicable to an exposure apparatus having such a structure.

As described in JP-A-8-330224, the reaction force generated by the movement of the mask stage MST is mechanically moved to the floor (ground) using a frame member.
You may escape to The present invention is also applicable to an exposure apparatus having such a structure.

As described above, the exposure apparatus according to the embodiment of the present invention converts various subsystems including the components described in the claims of the present application into predetermined mechanical accuracy, electrical accuracy,
It is manufactured by assembling to maintain optical accuracy. Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electric systems to ensure these various accuracy Are adjusted to achieve electrical accuracy. The process of assembling the various subsystems into the exposure apparatus includes mechanical connection, wiring connection of an electric circuit, and piping connection of a pneumatic circuit between the various subsystems. It goes without saying that there is an assembling process for each subsystem before the assembling process from these various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed, and various precisions of the entire exposure apparatus are secured. It is desirable that the manufacture of the exposure apparatus be performed in a clean room in which the temperature, cleanliness, and the like are controlled.

As shown in FIG. 8, for a semiconductor device, a step 201 for designing the function and performance of the device, and a step 20 for manufacturing a mask based on the design step
2. Step 20 of manufacturing a substrate which is a base material of the device
3. A substrate processing step 204 of exposing a mask pattern to a substrate by the exposure apparatus of the above-described embodiment, a device assembling step (including a dicing step, a bonding step, and a package step) 205, and an inspection step 20
6 and so on.

[0106]

According to the present invention, when a substrate is transported between an exposure apparatus and a peripheral device by the transport device, the position of the substrate held by the transport device is detected, and based on the detection result, Since the posture information of the transfer device with respect to a specific position in the transfer path is obtained and the posture of the transfer device with respect to the specific position is controlled based on the obtained position information, the transfer device accurately moves the held substrate with respect to the specific position. It can be transported while positioning. Then, by transporting the substrate to the peripheral device after accurately positioning the substrate with respect to the specific position, the substrate is accurately positioned and transported also to the peripheral device. Can be stably performed with high accuracy. Therefore, a device having desired performance can be stably manufactured. Further, since the positioning operation is based on the detection result of the detection device, high positioning accuracy can be obtained, and the overall processing time for device manufacturing can be shortened, thereby improving workability and productivity. be able to.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating an embodiment of a device manufacturing system including an exposure apparatus and a substrate storage apparatus according to the present invention, as viewed from a side.

FIG. 2 is a diagram of the device manufacturing system of FIG. 1 as viewed from above information.

FIG. 3 is a view showing a stage unit according to the present invention,
(A) is a side view, (b) is an LL arrow view of (a).

FIG. 4 is a block diagram showing a control system of the device manufacturing system of the present invention.

FIG. 5 is a flowchart for explaining a teaching process for a first transport device in the device manufacturing system of the present invention.

FIG. 6 is a flowchart for explaining a teaching process for a third transport device in the device manufacturing system of the present invention.

FIG. 7 is a flowchart for explaining a procedure for transporting a substrate using a transport device that has been subjected to teaching processing.

FIG. 8 is a flowchart illustrating an example of a manufacturing process of a semiconductor device.

[Explanation of symbols]

 Reference Signs List 10 Cassette unit (reference position, storage position) 20 Detector 21 Stage unit (specific position) 24 Sensor unit CONT control unit EX Exposure main unit F Substrate storage unit (peripheral device, reference position) H1 First transfer device H2 Second transfer Device H3 Third transport device H4 Fourth transport device P Photosensitive substrate (substrate, exposure substrate) R Storage unit S Exposure device ST Delivery stage unit (stage unit, specific position) SYS device manufacturing system TP Test substrate (substrate, Position detection board)

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5F031 CA02 CA05 CA07 CA11 FA01 FA07 FA11 FA12 FA15 GA08 GA45 GA47 GA48 GA49 GA58 HA13 HA33 HA53 HA57 HA60 JA05 JA06 JA14 JA17 JA22 JA29 JA32 JA36 JA51 KA10 KA11 KA20 LA03 LA04 LA07 LA08 MA26 MA27 NA02 NA09 NA10 PA02 5F046 AA17 CD05 DA09 DA30

Claims (10)

[Claims] An exposure apparatus comprising: an exposure main body for exposing a pattern to a substrate; and a transport device for transporting the substrate from the exposure main body to a specific position outside the exposure main body. A detection device that is provided in a conveyance path including the specific position and detects a position of the substrate held by the conveyance device; and a posture of the conveyance device with respect to the specific position based on a detection result of the detection device. When information is obtained, based on the obtained posture information, when transferring the substrate to the specific position,
An exposure device, comprising: a control device that controls a posture of the transport device with respect to the specific position. 2. The exposure apparatus according to claim 1, wherein the detecting device is provided at the specific position, and is transported onto the stage by the transport device, and a stage on which the substrate can be placed. And a sensor unit for optically detecting the substrate. 3. The exposure apparatus according to claim 1, wherein the detection operation by the detection device is performed using a position detection substrate to which a photosensitive substance is not applied. 4. The exposure apparatus according to claim 3, wherein the control device is configured to apply a photosensitive material based on the attitude information obtained when the transport device transports the position detection substrate. An exposure apparatus, comprising: controlling a posture of the transfer device with respect to the specific position when the exposure substrate is transferred to the specific position. 5. A substrate storage device provided with a transfer device that transfers a substrate to and from an exposure device that exposes a pattern on a substrate, wherein the reference position in the storage device and a specific position in the exposure device are different from each other. A storage unit in which the relationship with the posture of the transfer device is stored in advance, based on the relationship stored in the storage unit, when transferring the substrate between the specific position and the reference position, A control device for controlling a posture of the transfer device with respect to the specific position. 6. The substrate storage device according to claim 5, wherein the storage unit transports the position detection substrate to which the photosensitive material is not applied between the specific position and the reference position. A substrate storage device for storing the relationship obtained at the time of the operation. 7. The substrate storage device according to claim 5, wherein the reference position includes a storage position where a plurality of substrates coated with a photosensitive material are stored. 8. An exposure apparatus for exposing a pattern to a substrate,
A device manufacturing system including a peripheral device provided outside the exposure apparatus and performing a predetermined process on the substrate; a transport device configured to transport the substrate between the exposure device and the peripheral device; A detection device that detects a position of the substrate held by the transport device with respect to the specific position, at a specific position provided in a transport path of the transport device; and the specific position based on a detection result of the detection device. For obtaining the attitude information of the transfer device with respect to, based on the obtained attitude information, when transferring the substrate to the specific position,
A device for controlling a posture of the transfer device with respect to the specific position. 9. The device manufacturing system according to claim 8, wherein the control device obtains a relationship between a reference position in the peripheral device and a posture of the transfer device with respect to the specific position, and based on the obtained relationship. And a step of correcting the attitude of the transfer apparatus with respect to the specific position when transferring the substrate from the specific position to the reference position. 10. The device manufacturing system according to claim 8, wherein the specific position is provided in the exposure apparatus, and wherein the control device removes a position detection substrate on which a photosensitive substance is not applied. A device for controlling the attitude of the transport apparatus with respect to the specific position when transporting an exposure substrate coated with a photosensitive material, based on the attitude information obtained when the transport apparatus transports the substrate. Manufacturing system.