JPH0864547A - Automatic teaching device of semiconductor manufacturing device - Google Patents

Abstract

PURPOSE: To enable the carriage of processed element to be constantly repeated smoothly and precisely. CONSTITUTION: An alignment jig 3 comprising a checked item (ball) 2 for checking the center thereof welded onto the center point of a quartz or SiC made dummy processed element 1 is mounted on a cassette, boat, etc., so that the check item 2 of the jig 3 may be checked for automatically correcting the checking center position to be regular one.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic teaching apparatus for semiconductor manufacturing equipment such as vertical diffusion / CVD equipment.

[0002]

2. Description of the Related Art Semiconductor manufacturing equipment such as vertical diffusion / CV
The automatic teaching device of the D device takes out an object to be processed, for example, a wafer from a cassette on a cassette shelf by a transfer machine and conveys it to a boat. A boat on which a film or a CVD film is generated and a film-processed wafer is placed is carried out from the reaction tube, and the film-processed wafer is transferred from the boat into the cassette on the cassette shelf.

Such an automatic teaching apparatus for a vertical diffusion / CVD apparatus teaches a transfer operation to a transfer machine when a wafer is transferred between a cassette and a boat, and thereafter, the taught operation is accurately performed. Will be repeated. or,
When the operation is not performed due to the displacement, the operation is automatically corrected and the operation is repeated again. At this time, the center of the wafer in the cassette and the center of the wafer in the boat are detected to determine whether or not the wafer is in the proper position, and it is confirmed that the wafer is in the proper position to accurately repeat the wafer transfer operation. .

As a conventional technique, there is no jig for detecting the center of the wafer in the cassette and the center of the wafer in the boat.
When the operator manually carries out the transfer machine, the operator visually judges the route, position, etc. required for the carry-in operation, makes a decision and stores it in the transfer machine. I remember it again.

[0005]

In the above-mentioned conventional example, since the center of the wafer in the cassette and the center of the wafer in the boat are visually measured, it requires skill and a great deal of labor and labor for adjusting the center position. Not only does it take time,
There is a problem that it is difficult to adjust the center position accurately.

[0006]

In order to solve the above-mentioned problems, the apparatus of the present invention takes out an object to be processed from a cassette and conveys it to a boat as shown in FIG. In an automatic teaching device of a semiconductor manufacturing apparatus that processes an object to be processed, conveys the object to be processed to a cassette, and repeats the operation of conveying the object to be processed, the center of a dummy object 1 to be processed made of quartz or SiC. And a positioning jig 3 formed by welding a detected object 2 for detecting the center.
Is placed in a cassette, a boat, or the like, the object 2 to be detected of the jig 3 is detected, and the detection center position is automatically corrected to a normal position.

[0007]

[Operation] With such a configuration, the positioning jig 3 is placed in the cassette or the boat, and the object 2 to be detected provided at the center of the jig 3 is detected. It is judged whether or not it is in the regular position, and when it is not in the regular position, the deviation is corrected, it is confirmed that it is in the regular position, and the transport operation of the object to be processed is repeated.

[0008]

1 (A) and 1 (B) are a plan view and a side view, respectively, showing a first example of a positioning jig used in an apparatus of the present invention. In this embodiment, the wafer is taken out from the cassette of the cassette shelf by a transfer machine and transferred to a boat, and when a large number of wafers are transferred, the boat is carried into a reaction tube, and a diffusion film or a CVD film is transferred to the wafer. In the automatic teaching apparatus of the vertical diffusion / CVD apparatus, in which the wafer having the film formed is returned from the boat to the cassette after the boat is carried out from the reaction tube, the wafer is made of quartz or SiC, for example, In the center of the dummy workpiece 1 made of quartz, quartz or SiC for detecting the center
A positioning jig 3 made by welding a pole 2 made of, for example, quartz, is placed in a cassette or a boat. This jig 3
The pole 2 is detected by a position detection sensor such as an infrared sensor or a sound wave sensor, for example, a position detection infrared sensor, and the detected position is automatically corrected to a regular position.

In this embodiment having the above structure, the vertical diffusion C
The positioning jig 3 is placed in the cassette of the VD device or in the boat, and the pole 2 of the jig 3 is detected by the position detecting infrared sensor. It is judged whether or not this detection position is in the normal position, and if the center of the wafer is not in the normal position where the center of the cassette or boat can be set, correct the deviation and confirm that the wafer is in the normal position. The carrying operation is repeated, and the film forming operation is repeated. When the position is deviated from the normal position, it is automatically corrected and the wafer transfer operation and the film forming operation are executed again.

When the alignment jig shown in FIG. 1 is used, the center of the wafer can be more accurately detected by the position detection infrared sensor than the conventional example in which the center position of the wafer in the cassette or the boat is visually determined. The position can be quickly and automatically corrected, and the wafer transfer operation can always be performed smoothly and accurately. It should be noted that a jig having only a pole placed on the center of the wafer cannot automatically convey the pole due to displacement of the pole, drop, etc. However, the alignment jig 3 in the present invention can be easily placed directly on the boat. Of course, since the pole 2 is welded, there is no risk of the pole being displaced or dropped, and it can be automatically conveyed. Further, although a jig having a pole attached to the center of the wafer can be automatically transported, ultrasonic cleaning cannot be performed, and gas may be released from the adhesive under low pressure. It is possible to carry it out into the customer's clean room without any fear of gas emission.

FIGS. 2A and 2B are a plan view and a side view showing a second example of the positioning jig of the present invention. In the first example shown in FIG. 1, there is a possibility that the pole 2 of the jig 3 and the boat column forming the boat may be erroneously detected. In order to avoid this erroneous detection, in the second example shown in FIG. 2, the boat pillar 5 forming the boat 4 is provided on either the left or right side of the pole 2 welded to the center of the dummy workpiece 1, for example, the left side. It is made by welding a concealing plate 6 made of concealing quartz or SiC, for example, quartz. With such a configuration, the positioning jig 3 of the present invention is placed on the boat 4, and the pole 2 of the jig 3 is detected by the position detection infrared sensor. At this time, when the position detecting infrared sensor is swung from the left to the right, the central pole 2 can be reliably detected without hiding and detecting the boat pillar 5 on the left side by the concealing plate 6.

In the first and second examples shown in FIGS. 1 and 2, since they are made of quartz and transparent, the detection of the pole 2 by the position detection infrared sensor may be erroneous detection. Therefore, in order to avoid this erroneous detection, at least the pole 2 and the concealing plate 6, for example, the entire jig is processed to be opaque. By thus making the jig 3 opaque, the pole 2 can be accurately detected.

[0013]

As described above, according to the present invention, the jig for alignment is formed by welding the object 2 to be detected for detecting the center of the dummy object 1 made of quartz or SiC. 3 is placed in a cassette, a boat, etc.
Is detected, and the detection center position is automatically corrected so as to be a normal position. Therefore, the transport operation of the object to be processed can always be performed smoothly and accurately.

[Brief description of drawings]

1A and 1B are a plan view and a side view showing a first example of a positioning jig used in an apparatus of the present invention.

2A and 2B are a plan view and a side view, respectively, showing a second example of the positioning jig in the present invention.

[Explanation of symbols]

 1 Dummy processed object 2 Detected object (pole) 3 Jig for alignment 4 Boat 5 Boat pillar 6 Hiding plate

Claims (1)

[Claims] 1. An object to be treated is taken out from a cassette and conveyed to a boat, the boat is loaded into a reaction tube to treat the object to be treated, and the treated object is conveyed to a cassette to be treated. In an automatic teaching device of a semiconductor manufacturing apparatus that repeatedly carries out the above-mentioned transport operation, a positioning jig formed by welding an object to be detected for detecting the center of a dummy object made of quartz or SiC to a cassette An automatic teaching device for a semiconductor manufacturing apparatus, which is placed in a boat or the like, detects an object to be detected by the jig, and automatically corrects the detection center position to a regular position.