JPH106262A - Instructing method and its device for robot - Google Patents

Abstract

PROBLEM TO BE SOLVED: To give robot instruction through a very simple procedures irrespective of the shape of a hand accurately without requiring skillfulness of the operator and with no risk of generation of dispersion. SOLUTION: A model of object to be conveyed 15 equipped with a proximity sensor 14 is placed on a hand 10a of a conveying robot 10, and the hand 10a is put in movement. A transparent glass board 13 is accommodated for example in a cassette 11, and the positions of the hand 10a relative to the glass board 13 are sensed from the outputs of the proximity sensor 14 when the hand 10a is moved in the vertical direction, the revolving direction, and the longitudinal direction with respect to the glass board 13, and on the basis of the obtained positions, the reference position is determined.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for automatically teaching a reference position of, for example, a semiconductor wafer transfer robot.
The present invention relates to a teaching method of a robot and a device for easily and accurately teaching a mutual positional relationship between a position where a semiconductor wafer is to be placed in a cassette or a processing apparatus for storing a semiconductor wafer and a transfer robot.

[0002]

2. Description of the Related Art In a method in which a semiconductor wafer is taken out from one device by a transfer robot and transferred to the other device, the position of the semiconductor wafer to be placed in both devices is accurately taught to the transfer robot. is required.

In a normal transfer system, once the position of a semiconductor wafer to be placed in both devices and the mutual position of a transfer robot are instructed, the teaching is not performed every time a semiconductor wafer is loaded and unloaded thereafter. It is configured so that it may be.

However, when a device is newly installed, when the device or the transfer robot is removed from the assembled state by remodeling or periodic inspection of the device, or when the position is changed, the mutual position of the transfer robot and the transfer robot is determined before the actual operation. It is necessary to carry out conveyance in the correct positional relationship by teaching to.

FIG. 10 is a view for explaining a method of teaching the positioning of the semiconductor wafer with respect to the transfer device. The transfer robot 1 has a hand 1a for receiving and taking out a semiconductor wafer 2 as a transfer object at the end of an arm.

The transfer robot 1 has a hand 1a
Axis (R axis) that moves the hand 1a in the front-rear direction in the horizontal plane, and axis (θ axis) that moves the hand 1a in the turning direction in the horizontal plane
And an axis (Z axis) for moving the hand 1a in the vertical direction.

As the hand 1a, a simple plate-shaped hand or a hand having a groove for dropping the semiconductor wafer 2 is used. The transfer of the semiconductor wafer 2 is performed by using a cassette for accommodating the semiconductor wafer 2 or an angle or positioning device
And a device 4 for receiving the semiconductor wafer 2 carried out from the cassette or the angle or alignment device 3 by the transfer robot 1. The device 4 is, for example, another cassette, a processing device, or the like.

[0008] The robot control device 5 includes the transfer robot 1
And comprises a teaching box 5a for teaching the operation of the transfer robot 1, a keyboard 5b for numerically controlling the transfer robot 1, and an external computer 5c.

The teaching of the reference position in such an apparatus is performed as follows. Correlation between the transfer robot 1 and the cassette or the position where the semiconductor wafer 2 of the alignment or alignment device 3 is to be placed, and the relationship between the transfer robot 1 and another cassette or the position where the semiconductor wafer 2 of the processing device 4 is placed. When the interrelationship is adjusted, the transfer robot 1 is jogged by the teaching box 5a, or an operation command is input from the keyboard 5b and the transfer robot 1 is operated by NC control with the help of the external computer 5c. The result is visually checked, and the process is repeated till the optimum position is reached, thereby teaching the transfer robot 1 the reference position of each of the devices 3 and 4.

On the other hand, as another method of automatically teaching a reference position of a transfer robot, there is a technique described in, for example, Japanese Patent Application Laid-Open No. 6-56228. FIG. 11 is a configuration diagram of a semiconductor wafer transfer device to which the teaching method is applied. The same parts as those in FIG. 10 are denoted by the same reference numerals, and detailed description thereof will be omitted.

The cassette 3 contains a model article 7 to which a sensor 6 whose output signal varies in accordance with the distance from the hand 1a of the transport robot 1 is fixed.
The model transported object 7 is formed in a shape similar to the semiconductor wafer 2.

The output signal of the sensor 6 is guided to a sensor control circuit 8 and subjected to predetermined processing, and then input to the robot controller 5. The teaching of the reference position in such an apparatus will be described with reference to FIG. The same figure
(a) is a perspective view of the cassette 3 as viewed from the front (robot side), (b) is a sectional view taken along the line AA, and (c) is a sectional view taken along the line BB.

Prior to teaching, the teaching box 5a
To operate the transfer robot 1 by a manual command or automatically by a manual operation at a predetermined approximate position.
Is moved to the operating range of the sensor 6 in the vicinity of the model transported article 6 stored in a predetermined position of the general cassette 3.

Thereafter, the hand 1a of the transfer robot 1 is moved up and down (Z direction), left and right (θ direction), and back and forth (R direction) by an automatic sequence, and the output of the sensor 6 is maximized during each operation. Position data having a value (during each operation in the Z and θ directions) or a predetermined value (during the R direction operation), and adjusting and storing the relative positional relationship between the transport robot 1 and the cassette 3 based on the position data. It will be.

[0015]

However, FIG.
In the teaching method shown in (1), the teaching work is extremely difficult, it takes a long time to increase the accuracy, and since the confirmation is made visually by the worker, not only the result of the teaching differs from person to person, but also the result of the same worker The teaching results also vary.

On the other hand, the teaching method shown in FIG. 11 can provide teaching with high accuracy and without any skill without causing variation among operators. However, the output of the sensor 6 is maximized during operation in the θ direction. Since position data is required, for example, the hand 1a needs to have a tip shape such as a circle or a parabola as shown in FIG. 3B, and a convex shape at the center.

For this reason, if the hand 1a has a notch formed from the tip of the hand to the center as shown in FIG.
Cannot obtain the maximum value from the output, and accurate position data in the θ direction cannot be obtained.

Therefore, it is difficult to apply such a teaching method to a hand having a notch as shown in FIG. However, in a semiconductor manufacturing apparatus, particularly a semiconductor wafer transfer robot applied to a vacuum apparatus, in order to transfer the semiconductor wafer 2 between the transfer robot and an angle or alignment apparatus or a processing apparatus, FIG. In many cases, a hand having the notch shown is used, and it is problematic that teaching of the hand is difficult.

Therefore, the present invention provides a robot teaching method and apparatus capable of teaching with extremely simple work irrespective of the shape of the hand and capable of teaching with high accuracy and without requiring skill and without skill. The purpose is to do.

[0020]

According to the first aspect of the present invention, when a robot is operated to carry out and carry in a conveyed object between at least two devices, the robot teaches a reference position of each device to the robot. In the teaching method, a base formed from an inner peripheral portion and an outer peripheral portion formed around the inner peripheral portion is arranged in each device, and moves following the movement of the robot hand, and moves along with the base and the central portion of the base. A sensor for detecting the peripheral part is provided, the hand is moved in a direction of coming and going with respect to the base, and the position of the hand is detected from each output of the sensor based on the movement in these directions. This is a robot teaching method for teaching a robot based on a position.

With such a robot teaching method,
Even if the shape of the hand is, for example, a notch formed, the sensor that follows the movement of the hand can detect the hand from the outputs of the sensors when the hand is moved in the direction of moving toward and away from the base. Each position can be detected, and the robot can be taught with high accuracy based on each position of these hands.

According to a second aspect of the present invention, there is provided a teaching device for a robot for teaching a reference position of each device to the robot when operating the robot to carry out and carry in a conveyed article between at least two devices. And a base formed from an inner peripheral portion and an outer peripheral portion formed around the inner peripheral portion,
A sensor that moves following the movement of the hand and detects the base and the central part and the peripheral part of the base, and first means for moving the hand in a direction of moving toward and away from the base,
The first means detects each position of the hand from each output of the sensor based on the movement of the hand toward and away from the base, and teaches the robot based on each position of the hand. Means for teaching a robot.

With such a robot teaching device,
When the hand is moved toward and away from the base placed on each device, the sensor moves following the movement, and the sensor moves, for example, by the base and the inner and outer peripheral portions of the base. Is detected. Then, teaching to the robot is performed based on the base detected by this sensor and the boundary between the inner peripheral part and the outer peripheral part of the base, that is, each position of the hand.

According to a third aspect of the present invention, in the robot teaching device according to the second aspect, the hand is provided with a notch for escape of the base from the tip of the hand to the center.
According to a fourth aspect of the present invention, in the robot teaching device according to the second aspect, a sensor is provided on a model article having the same shape as the article, the model article is placed on a hand, and the hand is placed on a base. And move them in the direction of contact and separation.

According to a fifth aspect of the present invention, in the robot teaching device according to the second aspect, the base has an inner peripheral portion formed of members having different light transmittances and an outer peripheral portion formed therearound. It is.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram of a semiconductor wafer transfer device to which a robot teaching method is applied.

According to the robot teaching method of the present invention, at least two devices 11 and 12 are operated by operating the transfer robot 10.
For example, when a semiconductor wafer is unloaded and loaded between a cassette 11 for storing semiconductor wafers and a semiconductor wafer processing apparatus 12 such as a single-wafer CVD apparatus, In the teaching method of a robot for teaching a reference position, a transparent glass substrate 13 formed from an inner peripheral portion and an outer peripheral portion formed around the inner peripheral portion is arranged in a cassette 11 and a processing device 12, and the transfer robot 10 Following the movement of the hand 10a, the hand 10a is moved to the same position as the hand 10a, and is provided with a transparent glass substrate 13 and a proximity sensor 14 for detecting a central portion and a peripheral portion of the transparent glass substrate 13. 13, that is, in the up-down direction, the left-right turning direction, and the front-rear direction, and moved in these directions. Detecting the respective positions of the hand 10a from the output of the proximity sensor 14, and performs teaching for transporting robot 10 based on the respective positions of these hands 10a.

Next, the configuration of the apparatus will be described. The transfer robot 10 has a hand 10a at the end of the arm for receiving and taking out a semiconductor wafer.

The transfer robot 10 has a hand 1
Axis (R axis) for moving Oa in the front-rear direction in the horizontal plane;
An axis (θ) for moving the hand 10a in the turning direction in the horizontal plane
Axis) and an axis (Z) for moving the hand 10a in the vertical direction.
Shaft).

As shown in FIG. 2, the hand 10a has a notch 10b formed from the front end to the center to prevent interference with the pusher 12a of the processing apparatus 12 which is a single-wafer CVD apparatus. Also, the hand 10a
A groove 10c for preventing the semiconductor wafer from slipping is formed.

A model transported object 15 is placed on the hand 10a when teaching is performed. This model cargo 15
As shown in FIG. 3, the base has the same shape as the semiconductor wafer, and cuts 15a and 15b, respectively, so that the left and right sides thereof are equal to the width of the hand 10a.

The proximity sensor 14 is mounted on the surface of the model article 15. This proximity sensor 1
Reference numeral 4 denotes an optical type, which is mounted at a position where the optical axis coincides with the center of the outer circumference circle of the base of the model transported object 15.

However, the model transported object 1 is placed on the hand 10a.
5 is placed, the model transported object 15 is placed at the reference position of the hand 10a by the groove 10c of the hand 10a when teaching, that is, placed so as to be concentric with the groove 10c.

The cassette 3 normally stores semiconductor wafers, and is used for teaching when the transparent glass substrate 13 is used.
Is stored. As shown in FIG. 4, the transparent glass substrate 13 is formed of a light-transmitting material in the same shape as the semiconductor wafer, and has a light-opaque disk 1 concentric with the outer circumference circle.
3a are formed. Therefore, the outer peripheral portion of the disk 13a is formed on the light-transmitting ring portion 13b. In this example, it is formed by two different light-transmitting portions,
Two or more types may be used.

The light-impermeable disk 13a is formed by attaching an opaque disk on a circle concentric with the outer circumference of the transparent glass substrate 13, or by masking unnecessary portions and applying an opaque body, or by placing an opaque body on the glass substrate. An opaque film is formed by means such as vapor deposition, and unnecessary portions are removed by means such as etching.

The processing apparatus 12, which is a single-wafer CVD apparatus,
A holder 12b for preventing the semiconductor wafer from slipping;
Transfer robot 10 and processing apparatus 12 for single-wafer CVD apparatus
And a pusher 12a for transferring the semiconductor wafer between the two.

The holder 12b is used for placing the transparent glass substrate 13 at the reference position of the processing device 12 when performing automatic teaching. The processing device 12
When teaching, first, the transparent glass substrate 13 is placed so as to be concentric with the holder 12b with the pusher 12a lowered, and then the pusher 12a is raised to place the transparent glass substrate 13 at a predetermined height position. And wait.

On the other hand, the output terminal of the proximity sensor 14
It is connected to an external computer 20. The external computer 20 receives an output signal of ON (ON) and OFF (OFF) of the proximity sensor 14, acquires position data from the robot controller 21 as needed based on the output signal, performs storage and calculation. And a function of transmitting teaching position data to the robot controller 21.

Specifically, the external computer 20 directs the hand 10a toward and away from the transparent glass substrate 13, ie, the vertical direction (Z direction), the left and right turning direction (θ direction).
And a first unit for sending position data to be moved in the order of the front-rear direction (R direction) to the robot controller 21.

Further, the external computer 20 detects each position of the hand 10a from each output signal of the proximity sensor 14 when the hand 10a is moved in the vertical direction, the left and right turning direction and the front and rear direction by the first means. , These hands 10
There is provided second means for transmitting teaching position data to the transfer robot 10 based on each position of a.

Here, the second means of the external computer 20 calculates the reference position in the vertical direction from the output signal of the proximity sensor 14 when the hand 10a is moved in the vertical direction, and turns the hand 10a left and right. The turning direction reference position is obtained from the output signal of the proximity sensor 14 of the
It has a function of obtaining a reference position in the front-rear direction from an output signal of the proximity sensor 14 when a is moved in the front-rear direction.

The robot controller 21 controls the operation of the transfer robot 10, and is connected to a teaching box 21a for teaching the operation of the transfer robot 10 and an external computer 20.

Next, the teaching of the apparatus constructed as described above will be described with reference to the automatic teaching flowcharts shown in FIGS. On the hand 10a of the transfer robot 10, a model transfer object 15 to which the proximity sensor 14 shown in FIG. 3 is attached is placed. The model transported object 15 is placed so as to be concentric with the groove 10c of the hand 10a.
It is placed at the reference position of the hand 10a.

On the other hand, the cassette 11 houses the transparent glass substrate 13 shown in FIG. The transparent glass substrate 13 is stored in all positions of the cassette 11 where semiconductor wafers are to be stored.

In the processing device 12, the transparent glass substrate 13 is placed so as to be concentric with the holder 12b with the pusher 12a lowered, and the pusher 12a is raised to raise the transparent glass substrate 13 to a predetermined height. Place it in the position and wait.

Prior to the automatic teaching, the teaching box 21a is operated, the transfer robot 10 is manually operated, and the hand 10a on which the transparent glass substrate 13 is placed is moved to, for example, the transparent glass substrate 1 stored in the cassette 11.
3 is disposed in the vicinity of the light-impermeable disk 13a.

When the proximity sensor 14 outputs an ON signal near the disk 13a of the transparent glass substrate 13, the operation of the transfer robot 10 is stopped. In such a state, the sequence of the automatic teaching flowchart of the external computer 20 is started.

First, the external computer 20 sends position data to the robot controller 21 according to the automatic teaching sequence.
To the robot 10 in steps # 1 to # 5.
In the vertical direction (Z
Direction).

That is, in step # 1, the robot arm of the transfer robot 10 is lowered by ΔZ in the Z direction, and
In step 2, it is detected whether an OFF signal has been output from the proximity sensor 14.

Then, the disk 13a of the transparent glass substrate 13 comes out of the detection range of the proximity sensor 14, and the proximity sensor 14
When the OFF signal is output from the controller, the lowering of the robot arm is stopped.

Next, the process proceeds to step # 3.
The robot arm of the transfer robot 10 is raised in the Z direction and returned to the original position, and while the robot arm is being raised, it is detected in step # 4 whether the ON signal has been output again from the proximity sensor 14.

Then, the disk 13a of the transparent glass substrate 13 enters the detection range of the proximity sensor 14, and the proximity sensor 14
When the ON signal is output from, the ascent of the robot arm is stopped.

Next, the process proceeds to step # 5, where the current position where the raising of the robot arm is stopped, that is, the hand 1
Stores the current position in the vertical direction 0a as Z _1, adds the correction value obtained in advance with respect to the current position Z _1,
And stores the value as a vertical reference position Z _O relative to the robot.

Next, the external computer 20 sends the position data to the robot controller 21 according to the automatic teaching sequence, and in steps # 6 to # 18,
Of the turning position (θ
Direction).

That is, in step # 6, the robot arm of the transfer robot 10 is turned right (rotated by Δθ to the right) as shown in FIG. 8, and while the robot arm is turned right, the proximity sensor is turned in step # 7. 14 to O
It is detected whether the FF signal has been output.

Then, the disk 13a of the transparent glass substrate 13 comes off the detection range of the proximity sensor 14, and the proximity sensor 14
When the OFF signal is output from the controller, the robot arm stops turning right.

Next, the process proceeds to step # 8, in which the robot arm of the transfer robot 10 is turned left (turned to the left) to return to the original position, and while the robot arm is turned left, the proximity sensor 14 is turned in step # 9. To detect whether or not an ON signal has been output.

The disk 13a of the transparent glass substrate 13 enters the detection range of the proximity sensor 14, and the proximity sensor 14
When the ON signal is output from, the left turning of the robot arm is stopped.

[0059] Turning now to step # 10, back to the robot arm is turning left, stores was stopped as the current position theta ₁ of the first robot turning direction. Subsequently, in step # 11, the robot arm of the transfer robot 10 is turned to the left (Δθ rotation to the left) as shown in FIG.
At 12, it is detected whether an OFF signal has been output from the proximity sensor 14.

Then, the disk 13a of the transparent glass substrate 13 comes out of the detection range of the proximity sensor 14, and the proximity sensor 14
, The robot arm stops turning left.

Next, the process proceeds to step # 13, in which the robot arm of the transfer robot 10 is turned right (rotated to the right) to return to the original position. It is detected whether an ON signal has been output from the sensor 14.

Then, the disk 13a of the transparent glass substrate 13 enters the detection range of the proximity sensor 14, and the proximity sensor 14
When the ON signal is output from, the robot arm stops turning right.

[0063] Next, in step # 15, back to the right pivoting the robot arm, for storing was stopped as the current position theta ₂ of the second robot turning direction. Next, in step # 16, the external computer 20 reads the first and second current positions θ ₁ and θ ₂ when the robot 10 turns left and right, and reads the intermediate position between these positions θ ₁ and θ ₂ . Positions θ _O , θ _O = (θ ₁ + θ ₂ ) / 2 (1)

The intermediate position θ _O thus obtained is located on the line L connecting the turning center 10b of the robot 10 and the center 13c of the transparent glass substrate 13, as shown in FIG. The external computer 20 stores the intermediate position θ _O obtained by calculation in step # 17 as the turning direction reference position, and turns the robot 10 to the turning direction reference position θ _O in the next step # 18.

Next, the external computer 20 sends the position data to the robot controller 21 in accordance with the automatic teaching sequence, and in steps # 19 to # 31,
The position in the front-rear direction (R direction) of the relative position between 0 and the transparent glass substrate 13 is sensed.

That is, in step # 19, the robot arm of the transfer robot 10 is moved to the R position as shown in FIG.
In step # 20, it is detected whether the OFF signal has been output from the proximity sensor 14 while the robot arm is moving forward.

Then, the disk 13a of the transparent glass substrate 13 comes out of the detection range of the proximity sensor 14, and the proximity sensor 14
When the OFF signal is output from, the advance of the robot arm is stopped.

Next, the operation proceeds to step # 21, and then the robot arm of the transfer robot 10 is retracted and returned to the original position, and the ON signal is outputted from the proximity sensor 14 in step # 22 while the robot arm is retracted. Is output.

The disk 13a of the transparent glass substrate 13 enters the detection range of the proximity sensor 14, and the proximity sensor 14
When the ON signal is output from the controller, the robot arm stops retreating.

[0070] Turning now to step # 23, back to retract the robot arm, for storing was stopped as the current position R ₁ of the first robot longitudinal direction. Subsequently, in step # 24, the robot arm of the transfer robot 10 is retracted, and it is detected whether the OFF signal is output from the proximity sensor 14 in step # 25 while retracting the robot arm.

Then, the disk 13a of the transparent glass substrate 13 comes out of the detection range of the proximity sensor 14, and the proximity sensor 14
Outputs an OFF signal from the controller, the robot arm stops retreating.

Next, the operation proceeds to step # 26, in which the robot arm of the transfer robot 10 is moved forward to return to the original position, and the robot arm is moved forward in step # 2.
At 7, it is detected whether an ON signal has been output from the proximity sensor 14.

Then, the disk 13a of the transparent glass substrate 13 enters the detection range of the proximity sensor 14, and the proximity sensor 14
When the ON signal is output from, the advance of the robot arm is stopped.

[0074] Next, in step # 28, back to advance the robot arm, for storing was stopped as a second current position R ₂ of the robot turning direction. Next, in step # 29, the external computer 20 reads the first and second current positions R ₁ and R ₂ when the robot 10 is moved forward and backward, and reads the intermediate position R _O between these positions R ₁ and R _2. , R _O = (R ₁ + R ₂ ) / 2 (2).

The intermediate position R _O thus obtained is located on the center 13c of the transparent glass substrate 13 as shown in FIG. In step # 30, the external computer 20 stores the calculated intermediate position R _O as the longitudinal reference position.

By executing the above automatic teaching sequence,
The vertical reference position Z _O , the turning direction reference position θ _O , and the front-rear reference position R _{O of the} robot 10 with respect to the cassette 11 are obtained, and the external computer 20 determines in step # 31 that the reference positions (Z _O , θ _{O 2} , R _O ) are stored in the robot controller 21 as the teaching position of the robot 10, and the automatic teaching sequence for the cassette 11 of the robot 10 ends.

On the other hand, the teaching box 21a is operated, the transfer robot 10 is manually operated, and the hand 10a is placed near the disk 13a of the transparent glass substrate 13 placed at the reference position of the single-wafer CVD apparatus 12. I do.

Hereinafter, the above automatic teaching sequence is started, and
In steps # 1 to # 5 similar to the above, single wafer CVD
The transparent glass substrate 13 and the robot 1 placed on the device 12
Sensing the position of 0 and in the vertical direction of the relative position (Z direction), and detects the current position Z ₁₀ in the vertical direction of the hand 10a, adds the correction value obtained in advance with respect to the current position Z ₁₀ and stores the value as a vertical reference position Z _f with respect to the transport robot 10.

Next, the external computer 20 sends the position data to the robot controller 21 in accordance with the automatic teaching sequence, and in steps # 6 to # 18, the turning of the relative position between the robot 10 and the transparent glass substrate 13 is performed. sensing the position of the direction (theta direction), and stores the turning direction reference position theta _g.

Next, the external computer 20 sends the position data to the robot controller 21 in accordance with the automatic teaching sequence, and in steps # 19 to # 31, as described above.
Among the relative positions of the robot 10 and the transparent glass substrate 13, the position in the front-rear direction (R direction) is sensed, and the turning direction reference position _Rh is stored.

By executing the above automatic teaching sequence,
The vertical reference position Z _f , the turning direction reference position θ _g , and the front-back direction reference position R _{h of the} robot 10 with respect to the single-wafer CVD apparatus 12 are obtained.
Is the reference position (Z _f , θ _g ,
R _h ) is stored in the robot controller 21 as the teaching position of the robot 10, and the single-wafer CVD apparatus 1 of the robot 10 is stored.
The automatic teaching sequence for No. 2 ends.

As described above, in one embodiment,
Even if the shape of the hand 10a is formed, for example, with the notch 10b, the hand 10a is moved by the proximity sensor 14 following the movement of the hand 10a.
3 from the outputs of the proximity sensor 14 when the hand 1 is moved in the vertical direction, the turning direction, and the front-back direction with respect to
0a is detected with respect to the transparent glass substrate 13, and the reference position is obtained based on these positions.
Even when the notch 10b is formed in the hand 10a, the teaching of the transfer robot 10 to the cassette 11 and the processing device 12 can be automatically and accurately performed without variation in the teaching result.

Therefore, in a semiconductor wafer transfer robot applied to a semiconductor manufacturing apparatus, particularly a vacuum apparatus, the transfer of the semiconductor wafer 2 between the transfer robot 10 and the angle or positioning device or the processing device 12 is performed. Since the hand 10a having the notch 10b formed therein is applied, the transfer robot 10, the mounting table for the cassette 11, the angle or positioning device, and the processing device 12 are newly installed, repaired, rearranged, and the like. When the hand 10a is once removed from the assembled state and then re-taught, regardless of the shape of the hand 10a, the teaching can be automatically performed. Can be taught without any skill.

The present invention is not limited to the above embodiment, but may be modified as follows. For example, the reference position is detected in the order of the vertical direction, the turning direction, and the front-back direction, but these may be reversed.

The proximity sensor 14 is provided on the transparent glass substrate 1.
The third embodiment outputs an ON signal when approaching the disk 13a. However, the processing in the external computer 20 is changed to output an OFF signal when approaching the disk 13a. An ON signal may be output when the signal is turned on.

Further, although the proximity sensor 14 is attached to the model transported object 15, a teaching hand in which the hand 10a and the proximity sensor 14 are integrated without using the model transported object 15 may be manufactured. Any configuration may be used as long as it can be attached to the reference position of the hand 10a.

[0087]

As described in detail above, according to the first aspect of the present invention, teaching can be performed with extremely simple work regardless of the shape of the hand, and it is highly accurate, does not cause variations among operators, and does not require skill. Can provide a teaching method of a robot that can be taught by a robot.

Further, according to the second to fifth aspects of the present invention, teaching can be performed by extremely simple work regardless of the shape of the hand, and teaching can be performed with high accuracy without variation by an operator and without skill. A teaching device for a robot can be provided.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a first embodiment of a semiconductor wafer transfer apparatus to which a robot teaching method according to the present invention is applied.

FIG. 2 is a configuration diagram of a hand used in the apparatus.

FIG. 3 is a configuration diagram of a model transport object used in the apparatus.

FIG. 4 is a configuration diagram of a transparent glass substrate used in the apparatus.

FIG. 5 is an automatic teaching flowchart showing a teaching portion of a vertical reference position of the apparatus.

FIG. 6 is an automatic teaching flowchart showing a teaching portion of a turning direction reference position of the apparatus.

FIG. 7 is an automatic teaching flowchart showing a teaching portion of a reference position in the front-rear direction of the apparatus.

FIG. 8 is a diagram showing an operation for obtaining a turning direction reference position of the robot arm.

FIG. 9 is a diagram illustrating an operation of obtaining a reference position in the front-rear direction of the robot arm.

FIG. 10 is a configuration diagram of a semiconductor wafer transfer device to which a conventional positioning teaching method is applied.

FIG. 11 is a configuration diagram of a semiconductor wafer transfer device to which another conventional positioning teaching method is applied.

FIG. 12 is a configuration diagram of a cassette.

FIG. 13 is an external view of a hand in which a notch is formed.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Transfer robot, 10a ... Hand, 11 ... Cassette, 12 ... Processing equipment, such as a single wafer CVD device, 13 ... Transparent glass substrate, 14 ... Proximity sensor, 15 ... Model conveyed object, 20 ... External computer, 21 ... Robot controller.

Claims (5)

[Claims] 1. A method of teaching a reference position of each device to a robot when operating a robot to carry and unload a conveyed product between at least two devices, wherein the inner peripheral portion and the inner peripheral portion thereof are provided. A base formed from an outer peripheral part formed around the base is arranged in each of the devices, and the base moves along with the movement of the hand of the robot to detect the base and a central part and a peripheral part of the base. A sensor is provided, each of which moves the hand in a direction of coming and going with respect to the base, detecting each position of the hand from each output of the sensor based on the movement in these directions, and A teaching method for a robot, wherein teaching to the robot is performed based on the teaching. 2. A teaching device of a robot for teaching a reference position of each device to the robot when operating a robot to carry and unload a conveyed product between at least two devices, wherein the teaching device is arranged in each device. A base formed from an inner peripheral part and an outer peripheral part formed around the base, and a sensor that moves following the movement of the hand and detects the base and the central part and the peripheral part of the base. A first means for moving the hand in a direction of moving toward and away from the base; and a first means for moving the hand in a direction of moving the hand toward and away from the base by the first means. Second means for detecting each position of the hand from the output and teaching the robot based on each position of the hand;
A teaching device for a robot, comprising: 3. The robot teaching device according to claim 2, wherein the hand has the notch for escape of the base formed from a tip portion of the hand to a center portion. 4. The sensor is provided on a model conveyed object having the same shape as the conveyed object, the model conveyed object is placed on the hand, and the hand is moved toward and away from the base. The robot teaching device according to claim 2, wherein: 5. The robot teaching device according to claim 2, wherein the base has an inner peripheral portion formed of members having different light transmittances and an outer peripheral portion formed therearound.