JP2002353622A5 - - Google Patents

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Publication number
JP2002353622A5
JP2002353622A5 JP2002076523A JP2002076523A JP2002353622A5 JP 2002353622 A5 JP2002353622 A5 JP 2002353622A5 JP 2002076523 A JP2002076523 A JP 2002076523A JP 2002076523 A JP2002076523 A JP 2002076523A JP 2002353622 A5 JP2002353622 A5 JP 2002353622A5
Authority
JP
Japan
Prior art keywords
resin film
multilayer wiring
copper foil
adhesive layer
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002076523A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002353622A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002076523A priority Critical patent/JP2002353622A/ja
Priority claimed from JP2002076523A external-priority patent/JP2002353622A/ja
Priority to KR1020020015757A priority patent/KR100573999B1/ko
Priority to US10/102,628 priority patent/US6831236B2/en
Priority to TW91105644A priority patent/TW536926B/zh
Priority to CNB021078718A priority patent/CN100471357C/zh
Publication of JP2002353622A publication Critical patent/JP2002353622A/ja
Priority to US10/920,185 priority patent/US6914199B2/en
Publication of JP2002353622A5 publication Critical patent/JP2002353622A5/ja
Pending legal-status Critical Current

Links

JP2002076523A 2001-03-23 2002-03-19 多層配線板、多層配線用基材及びその製造方法 Pending JP2002353622A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002076523A JP2002353622A (ja) 2001-03-23 2002-03-19 多層配線板、多層配線用基材及びその製造方法
KR1020020015757A KR100573999B1 (ko) 2001-03-23 2002-03-22 다층 배선판, 다층 배선판용 기재 및 그 제조 방법
US10/102,628 US6831236B2 (en) 2001-03-23 2002-03-22 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
TW91105644A TW536926B (en) 2001-03-23 2002-03-22 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
CNB021078718A CN100471357C (zh) 2001-03-23 2002-03-25 多层线路板组件,多层线路板组件单元及其制造方法
US10/920,185 US6914199B2 (en) 2001-03-23 2004-08-18 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001085224 2001-03-23
JP2001-85224 2001-03-23
JP2002076523A JP2002353622A (ja) 2001-03-23 2002-03-19 多層配線板、多層配線用基材及びその製造方法

Publications (2)

Publication Number Publication Date
JP2002353622A JP2002353622A (ja) 2002-12-06
JP2002353622A5 true JP2002353622A5 (enExample) 2005-09-08

Family

ID=26611924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002076523A Pending JP2002353622A (ja) 2001-03-23 2002-03-19 多層配線板、多層配線用基材及びその製造方法

Country Status (1)

Country Link
JP (1) JP2002353622A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005072187A (ja) * 2003-08-22 2005-03-17 Denso Corp 多層回路基板およびその製造方法
JP2008300773A (ja) * 2007-06-04 2008-12-11 Daisho Denshi:Kk 発光素子搭載用配線板の製造方法及び発光素子搭載用配線板
US12424807B2 (en) * 2022-07-08 2025-09-23 Agc Automotive Americas Co. Method of manufacturing a window assembly with a solderless electrical connector

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