JP2002353601A - Electronic component mounted body and method for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To use conductive adhesive suitable for increase in the number of pins and reduction in pitch for bonding to enhance the thermal strain resistance characteristics of an electronic component mounted body obtained by bonding an electronic component having electrodes in an area array to an circuit board, thereby enhancing the reliability of bonding. SOLUTION: The conductive adhesive 11 is applied to the electrodes 22 on the electronic component 21 so that the adhesive is in conical shape to form bumps. Then, the electronic component is mounted on the electrodes 32 on a circuit board 31, and the bumps are cured. When bonded to the circuit board 31, the conductive adhesive 11 wets and spreads on the electrodes 32. Therefore, a hand drum shaped junction shape is obtained with ease.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component by using a conductive adhesive when mounting a semiconductor bare chip and a package having electrodes formed in an area array on a printed circuit board or the like. The present invention relates to an electronic component package manufactured using the method.

[0002]

2. Description of the Related Art Conductive adhesive bonding when electronic components are mounted on a circuit board has attracted attention as an advantage over soldering because it has environmental measures and lowers the bonding temperature.
Under these circumstances, in the area array bonding using a conductive adhesive, the following conventional techniques are known as techniques for improving heat distortion characteristics and enabling repair.

Japanese Patent Application Laid-Open No. 2000-12616 (a method of mounting a semiconductor device) discloses that when a protruding electrode of a semiconductor chip and a wiring electrode of a circuit board are bonded with a conductive adhesive, heat is generated at the electrode bonding portion. Prevent cracks,
This is an invention aiming at obtaining high quality bonding. In this conventional example, a projecting electrode of a semiconductor chip and a wiring electrode of a circuit board are electrically connected by a conductive adhesive, and a substantially central portion of the semiconductor chip is heat-set in a sheet-like shape to an opposing portion of the circuit board. By bonding with a mold resin, it is mechanically fixed, and further, liquid thermosetting resin is injected into a gap between the semiconductor chip and the circuit board around the bonded sheet-shaped thermosetting resin, and cured. A method for mounting a semiconductor device to be sealed is disclosed.

Japanese Patent Application Laid-Open No. 7-32148 (Semiconductor device mounting method and semiconductor device mounting body) discloses that a semiconductor device can be mounted on a circuit board with good productivity by using a conductive adhesive.
Another object of the present invention is to provide a method for mounting a semiconductor device which can be connected with high reliability and a mounted body thereof. In this conventional example, a coating film of a thermoplastic conductive adhesive is formed on a support substrate, and the conductive adhesive is heated and maintained in a plastic state, and the conductive adhesive is applied to the projecting contacts of the semiconductor device. After the transfer, the projecting contact is brought into contact with the connection electrode of the circuit board while maintaining the transfer portion of the conductive adhesive in a plastic state,
A mounting method of a semiconductor device in which a conductive adhesive is cooled and cured is disclosed.

Further, Japanese Patent Application Laid-Open No. 2000-294599 (mounting structure and method of manufacturing the same) discloses a mounting structure capable of repairing and ensuring sufficiently high mounting reliability, and a method of manufacturing the same. It is an invention intended to provide. In this conventional example, a mounting structure in which an electrode of an electronic component and an electrode of a substrate are electrically connected via a two-layer conductive adhesive layer, and the two-layer conductive adhesive layer One of them is a thermosetting conductive adhesive layer, the other is a thermoplastic conductive adhesive layer, and in particular, a thermosetting conductive adhesive layer is arranged on the electrode side of the electronic component. The mounting structure has a thermoplastic conductive adhesive layer on the electrode side of the substrate, and the thermoplastic conductive adhesive layer is printed and cured on the substrate electrode, After printing the thermosetting conductive adhesive layer on the thermosetting adhesive layer, mount the electrode of the electronic component on the thermosetting conductive adhesive layer and then apply the thermosetting conductive adhesive layer. A method of manufacturing a mounting structure to be cured is disclosed.

[0006]

However, the invention disclosed in Japanese Patent Application Laid-Open No. 2000-12616 includes:
Since a thermosetting adhesive sheet and a thermosetting underfill agent are used as a countermeasure against cracks due to thermal distortion of the conductive adhesive, there is a problem that the number of steps increases and the cost increases.

In the invention disclosed in Japanese Patent Application Laid-Open No. 7-32148, the use of a thermoplastic conductive adhesive has excellent repair properties, but the coating thickness is small. However, there is a problem that the thermal stress generated due to the thermal history after mounting cannot be sufficiently relaxed more than at the time of mounting, and the bonding reliability is reduced.

Further, in the invention disclosed in Japanese Patent Application Laid-Open No. 2000-294599, the bonding of electronic parts is performed via a thermosetting and thermoplastic conductive adhesive layer, and the repair properties are excellent. However, when bonding large-sized electronic components to an area array, the bump shape due to the conductive adhesive is crushed, so that the thermal stress generated at the conductive adhesive joint due to the heat history after mounting can be sufficiently reduced. However, there is a problem that the bonding reliability is reduced, and a problem that the conductive adhesive is overprinted or printed on both sides, so that it is not possible to cope with narrow pitch bonding due to the influence of a short circuit between adjacent electrodes.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and has been described in connection with the area array joining of electronic components, in which a conductive adhesive bonding to cope with a multi-pin and narrow pitch is performed. It is an object of the present invention to provide a mounting method for improving repairability and an electronic component mounted body joined by the mounting method.

[0010]

According to a first aspect of the present invention, there is provided an electronic component mounted body in which electronic components having electrodes in an area array are mounted on a circuit board, wherein an electrode of the electronic component and an electrode of the circuit board are connected to each other. It is characterized by being joined by a drum-shaped conductive adhesive.

A second aspect of the present invention is characterized in that, in the first aspect of the invention, the conductive adhesive is a thermoplastic conductive adhesive.

According to a third aspect of the present invention, in the first aspect of the present invention, at least one of the electrodes of the electronic component and the circuit board is partially cut out, and the conductive portion is formed in the cutout portion of the electrode. It is characterized by being filled with an adhesive.

According to a fourth aspect of the present invention, in the electronic component mounting method for manufacturing the electronic component mounted body according to the second aspect, the thermoplastic conductive adhesive is supplied in a conical shape on the electrodes of the electronic component, and supplied. After forming the conical bump by heating and cooling the thermoplastic conductive adhesive to form a conical bump, the bump is bonded to the electrode of the circuit board by pulse heat thermocompression bonding. Things.

According to a fifth aspect of the present invention, in the electronic component mounting method for manufacturing an electronic component mounted body according to the second aspect, the thermoplastic conductive adhesive is supplied in a conical shape on the electrode of the electronic component, and supplied. Heating and cooling the thermoplastic conductive adhesive thus formed to form a conical bump, and then ultrasonically bonding the bump to an electrode of the circuit board. .

According to a sixth aspect of the present invention, in an electronic component mounted body in which electronic components having electrodes in an area array are mounted on a circuit board, the electronic components are formed in a conical shape with a thermosetting conductive adhesive on the electrodes. An electrode of the electronic component and an electrode of the circuit board are joined by a bump and a thermoplastic conductive adhesive attached to a tip of the bump.

According to a seventh aspect of the present invention, there is provided an electronic component mounted body in which electronic components having electrodes in an area array are mounted on a circuit board, wherein the bumps formed on the electrodes of the electronic components in a conical shape with a thermoplastic conductive adhesive. And an electrode of the electronic component and an electrode of a circuit board are joined by a thermoplastic conductive adhesive having a glass transition temperature (Tg point) lower by 10 ° C. or more than the thermoplastic conductive adhesive attached to the tip of the bump. It is characterized by doing.

According to an eighth aspect of the present invention, in an electronic component mounted body in which electronic components having electrodes in an area array are mounted on a circuit board, the electrodes of the electronic component and the electrodes of the circuit board are electrically conductive via conductive particles. It is characterized by being joined by an adhesive.

According to a ninth aspect of the present invention, in the invention of the eighth aspect, the electrodes on the electronic component side are joined to the conductive particles with a thermosetting conductive adhesive, and the electrodes on the circuit board side are bonded by a thermoplastic conductive adhesive. And bonding to the conductive particles with an agent.

According to a tenth aspect of the present invention, in the electronic component mounting method for manufacturing an electronic component mounted body according to the eighth or ninth aspect, the conductive particles are arranged in the same manner as an electrode pattern, and the conductive particles are provided on one end side of the conductive particles. Attaching the conductive adhesive and joining to the electrode of the electronic component, attaching the conductive adhesive to the other end side of the conductive particles joined on the electrode of the electronic component, and joining to the electrode of the circuit board. It is characterized by.

[0020]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
A description will be given based on the embodiment shown in FIG. (Embodiment 1) FIG. 1 is a cross-sectional view for explaining an electronic component mounting method and an electronic component mounted body according to Embodiment 1 of the present invention. FIG. Shows one step in the method of forming a conical shape,
1B and 1C show an example of a conical conductive adhesive formed on an electrode of an electronic component. FIG.
As shown in (A), the conductive adhesive 11 is projected by a predetermined height toward the back surface of the print mask 41 by a screen printing method with respect to the print mask 41 having openings in an area array. The conductive adhesive 11 is applied to the electrode 2 of the electronic component 21.
2 and the print mask 41 is raised. On this occasion,
Since the conductive adhesive 11 is left in the form of a film at the mask opening, the state becomes close to stringing, and a conical bump shape gradually narrowing toward the tip is formed.

The conductive adhesive 11 used here is a conductive adhesive containing a flake-like Ag filler and an adhesive, and optimizes the mutual relationship among viscosity, thixotropy, mask opening diameter, and printing mask thickness. By doing so, a conical bump can be formed. As an example, conductive adhesive properties (viscosity: 1
50 to 250 Pa · s, thixotropic index: 0.3 to 0.4),
Good results have been obtained with a mask opening diameter of 0.4 mmφ and a print mask thickness of 200 μm. Here, the conductive adhesive 11
The shape of the conical bump is not limited to the shape as shown in FIG. 1 (B), and may be any shape as long as it becomes thinner from the top of the electrode of the electronic component toward the tip, and toward the tip as shown in FIG. 1 (C). There is no problem with a curved shape. The method of forming the conical bump is not limited to the above method.

FIG. 2 is a sectional view showing an electronic component package according to a first embodiment of the present invention, and is a diagram showing a configuration corresponding to claims 1 and 2. As shown in FIG. The electronic component mounted body shown in FIG. 2 is obtained by supplying the conical conductive adhesive 11 as shown in FIG. It is. The conductive adhesive 11 is
When joining to the circuit board 31, it wets and spreads on the electrode 32, so that a drum shape can be easily obtained as a joining portion shape.

As described above, by forming the conductive adhesive 11 in a drum shape in the area array bonding, the thermal stress generated by the difference in thermal expansion between the electronic component 21 and the circuit board 31 can be easily reduced. become. Here, the use of a thermoplastic conductive adhesive as the conductive adhesive 11 further enhances the stress relaxation effect at the joints.
The bonding reliability can be increased even in the case of mounting a large number of pins and large electronic components where the thermal stress increases. Further, in the joining by the thermoplastic conductive adhesive, repair can be easily performed by heating.

(Embodiment 2) FIG. 3 is a cross-sectional view for explaining an electronic component mounted body according to Embodiment 2 of the present invention, and corresponds to claim 3. The electronic component package according to the second embodiment includes:
Ring-shaped electrode 33 lacking the central part of the electrode of circuit board 31
In this configuration, the electrode 22 of the electronic component 21 is joined to the ring-shaped electrode 33 via the conductive adhesive 11. In particular, it has been found that the phenomenon of joint destruction due to thermal stress generated by a difference in thermal expansion, which is a phenomenon that is remarkably observed in thermosetting conductive adhesive bonding, is separation of the interface between the conductive adhesive and the electrode. With the progress of the interface separation, the connection resistance gradually increases.

Therefore, in the electronic component mounted body of the second embodiment,
The electrode 33 is formed in a pattern shape in which a central portion is removed, and is joined in a structure in which the conductive adhesive 11 is filled in the removed pattern portion. Thereby, the interface peeling caused by thermal stress in the thermosetting conductive adhesive bonding stops at the center of the electrode, so that the bonding reliability of the electronic component mounted body is improved. In addition,
In this embodiment, the electrode 33 has a ring shape, but the same effect can be obtained if a part of the electrode is removed. Further, in the present embodiment, the electrode 33 on the circuit board 31 side is partially cut away, but further effects can be obtained by forming the electronic component 21 and both electrodes partially cut out. Can be

(Embodiment 3) FIG. 4 is a cross-sectional view for explaining an electronic component mounting method according to Embodiment 3 of the present invention, and corresponds to claim 4. The thermoplastic conductive adhesive 11 is formed in a conical shape on the electrode 22 of the electronic component 21, and is heated and cooled to form a bump. In this heating and cooling curing,
The electronic component 21 is heated with the thermoplastic conductive adhesive 11 facing down, the diluent is blown off, the adhesive is melted, and cooled to room temperature to form bumps.

At the time of bonding to the circuit board 31, the electronic component 21 side is heated by pulse heating to make the thermoplastic conductive adhesive 11 in a molten state, and is pressed against the circuit board 31. At this time, by controlling the gap between the electronic component 21 and the circuit board 31, the thermoplastic conductive adhesive bonding shape can maintain the drum shape, and after cooling and curing as it is, the thermocompression bonding tool 51 is raised. Joining is completed.

As described above, in this embodiment, the electronic component 2
When joining 1 to the circuit board 31, the reversible melting and solidifying action of the thermoplastic conductive adhesive 11 by heating and cooling is used, so that the joining time can be shortened. here,
Preliminary heating to the extent that the thermoplastic conductive adhesive 11 does not melt on the circuit board 31 side improves the reliability of joining to the circuit board 31 side.

(Embodiment 4) FIG. 5 is a cross-sectional view for explaining an electronic component mounting method according to Embodiment 4 of the present invention, and corresponds to claim 5. The thermoplastic conductive adhesive 11 is formed in a conical shape on the electrode 22 of the electronic component 21, and is heated and cooled to form a bump. In this heating and cooling curing,
The electronic component 21 is heated with the thermoplastic conductive adhesive 11 facing down, the diluent is blown off, the adhesive is melted, and cooled to room temperature to form bumps.

At the time of bonding to the circuit board 31, the energy generated by the ultrasonic vibrator 52 is sequentially transmitted to the electronic component 21 via the horn 53 and the tool 54,
The thermoplastic conductive adhesive 11 is joined to the electrodes 32 on the circuit board 31 by ultrasonically oscillating the electronic component 2 in the horizontal (in-plane) direction. This is because the thermoplastic conductive adhesive 11 is melted by frictional heat generated on the bonding surface by the ultrasonic vibration, and the melted thermoplastic conductive adhesive is bonded to the electrode 32 on the circuit board 31.

As described above, according to the invention of this embodiment, since it is not necessary to heat the electronic component 21 and the circuit board 31, it is possible to reduce the thermal strain at the joint and to reduce the peripheral part when joining the retrofitted component. No need to heat parts.

(Embodiment 5) FIG. 6 is a cross-sectional view for explaining an electronic component package according to a fifth embodiment of the present invention. FIG. 6A shows a state in which a conical bump is formed on the electrode 22 of the electronic component 21 with the first conductive adhesive 12 and then the second conductive adhesive 13 is attached to the tip of the bump. ing. Second conductive adhesive 13
Can be transferred by forming a second conductive adhesive layer 43 having a predetermined thickness on the tray 42 and immersing the tip of the conical bump. Here, by making the bump shape conical, the second conductive adhesive 13 can be easily attached without short-circuiting with the adjacent bump.

FIG. 6B shows an electronic component mounted body in which the conical bumps made of the first conductive adhesive 12 and the second conductive adhesive 13 are area-array bonded.
Here, when the first conductive adhesive 12 is a thermosetting conductive adhesive and the second conductive adhesive 13 is a thermoplastic conductive adhesive, the thermoplastic conductive adhesive is easily heated by heating after the joining is completed. Since it can be separated at the portion 13 and the amount of the conductive adhesive remaining on the electrode 32 of the circuit board 31 can be reduced,
Repair joining becomes easy.

(Embodiment 6) A diagram for explaining an electronic component package according to a sixth embodiment of the present invention is the same as FIG. 6 for describing an electronic component package of the fifth embodiment. This will be described with reference to a cross-sectional view. The electronic component package according to the sixth embodiment corresponds to claim 7. The electronic package according to the sixth embodiment is different from the first embodiment in that the first conductive adhesive formed on the electrode 22 of the electronic component 21 is a thermoplastic conductive adhesive. FIG. 6 shows the attaching step.
Since this is the same as the case of the fifth embodiment of (A), the description is omitted. FIG. 6B shows an electronic component package in which the conical bumps made of the first conductive adhesive 12 and the second conductive adhesive 13 are area-array bonded. Here, the first conductive adhesive 12 is a thermoplastic conductive adhesive as described above, and the second conductive adhesive 13 is at least 10 ° C. lower than the glass transition temperature (Tg point) of the first conductive adhesive 12. In the case of using a thermoplastic conductive adhesive, bonding reliability with respect to thermal stress can be improved because the thermoplastic conductive adhesive is used for bonding. Further, if the second conductive adhesive 13 is heated to a temperature at which it softens, 2 can easily be separated at the portion of the conductive adhesive 13, and at this time, the amount of the conductive adhesive remaining on the electrodes 32 of the circuit board 31 can be reduced, so that the repair bonding is facilitated.

FIG. 7 is a diagram showing high-temperature separation characteristics of thermoplastic conductive adhesives having different glass transition temperatures (Tg points) used in the electronic component package of Example 6. Here, a diagram of a thermoplastic conductive adhesive having a Tg point different by about 20 ° C. is shown, but as shown in FIG. 7, when heated to 80 ° C. to 100 ° C., only the second conductive adhesive 13 side is exposed. The bonding strength can be reduced, and good separation characteristics can be obtained.

(Embodiment 7) FIG. 8 is a cross-sectional view for explaining an electronic component package according to a seventh embodiment of the present invention.
1 shows an electronic component mounted body in which one electrode 22, 32 is bonded via a first conductive adhesive 12, a conductive particle 14, and a second conductive adhesive 13. The conductive particles 14 may be metal particles or resin particles coated with metal.

As shown in FIG. 8, when the electronic component 21 and the circuit board 31 are joined with a conductive adhesive, the conductive particles 14 are interposed between the first and second conductive adhesives 12 and 13. By doing so, even if the weight of the electronic component 21 increases, the joint does not collapse. For this reason, when joining
The gap between the electronic component 21 and the circuit board 31 can be increased even when the reflow and the batch heating and curing in the oven are performed, so that the bonding reliability against thermal stress can be improved. Here, by using a thermoplastic conductive adhesive as the second conductive adhesive 13, separation can be easily performed at a heating temperature of 150 ° C. or less, and repair can be easily performed. The repair of the electronic component 21 can be easily performed by using only the first conductive adhesive 12 as a thermoplastic conductive adhesive.

(Embodiment 8) FIG. 9 is a sectional view for explaining an electronic component mounting method according to an eighth embodiment of the present invention.
FIG. As shown in FIG. 9A, first,
The conductive plate 14 is adsorbed and arranged in a pattern corresponding to the electrode pattern for joining the conductive particles 14 by the adsorbing plate 44. Next, the first conductive adhesive 12 formed on the tray 42 to a predetermined thickness is formed.
The arranged conductive particles 14 are immersed in the conductive adhesive layer 45, and the first conductive adhesive 12 is attached. Here, by setting the conductive adhesive layer film thickness to １ ／ or less of the conductive particle diameter,
Good adhesion of the first conductive adhesive 12 can be achieved without causing a short circuit between adjacent conductive particles.

Next, as shown in FIG. 9B, the conductive particles 14 are mounted on the electrodes 22 of the electronic component 21 via the first conductive adhesive 12 and are cured by heating. Next, FIG.
As shown in FIG. 9C, a method similar to that of FIG.
The second conductive adhesive 13 is applied to the conductive particle 14 on the circuit board bonding side.
Is attached. By bonding the second conductive adhesive 13 onto the electrodes 32 of the circuit board 31, an electronic component mounted body is manufactured.

As described above, according to the invention of this embodiment, by arranging the conductive particles in the initial stage so as to correspond to the electrode pattern, there is no need for positioning with respect to the supply of the conductive adhesive which contributes to the bonding, and the narrowing is achieved. It becomes possible to join with good productivity and reliability even with pitch joining.

[0041]

According to the first aspect of the present invention, when the electrodes of the electronic component and the electrodes of the circuit board are joined in an area array, the electrodes are joined by a drum-shaped conductive adhesive.
Since the stress can be relaxed at the drum-shaped joint, the thermal stress generated due to the difference in thermal expansion between the electronic component and the circuit board can be easily reduced, and the joining reliability of the electronic component mounted body can be improved. Can be.

According to the second aspect of the present invention, the conductive adhesive for forming the drum-shaped joint between the electrode of the electronic component of the electronic component mounted body and the electrode of the circuit board is made of a thermoplastic conductive adhesive. The effect of relieving the thermal stress generated by the thermal expansion difference between the circuit board and the
Even in the mounting of a large-sized electronic component, the bonding reliability of the electronic component mounted body can be improved, and repair can be easily performed by heating.

According to the third aspect of the present invention, the electrode of the electronic component is joined to the electrode of the circuit board in a structure in which the electrode has a shape in which a part of the electrode is removed, and the removed pattern portion is filled with a conductive adhesive. As a result, the progress of interfacial peeling caused by thermal stress that is remarkably observed in the thermosetting conductive adhesive bonding having a small thermal stress relaxation effect can be stopped, so that the bonding reliability of the electronic component mounted body can be improved. it can.

When the electrode of the electronic component is joined to the electrode of the circuit board, the thermoplastic conductive adhesive formed as a bump is melted by heating.
By joining the circuit board to the circuit board by the pulse heat compression method of cooling and curing, the time for joining the electrodes of the electronic component and the electrodes of the circuit board can be shortened, and the productivity can be improved.

According to a fifth aspect of the present invention, when an electrode of an electronic component is joined to an electrode of a circuit board, the electronic component having a thermoplastic conductive adhesive formed as a bump is joined to the circuit board by an ultrasonic joining method. By doing so, there is no need to heat the electronic components and the circuit board, so that the thermal distortion of the joint can be reduced, the joining reliability can be improved, and the peripheral components can be heated when joining the retrofitted components. Is unnecessary, so that the thermal strain at the joint can be reduced, and the joining reliability of the peripheral parts can be improved.

According to a sixth aspect of the present invention, a conical bump is formed on an electrode of an electronic component with a thermosetting conductive adhesive, and a thermoplastic conductive adhesive is adhered to the tip of the conical bump, so that a short circuit between adjacent bumps is prevented. It can be used for narrow pitch bonding. Also, by bonding to the circuit board with a thermoplastic conductive adhesive, the thermoplastic conductive adhesive portion can be easily separated by heating when heated, and the amount of conductive adhesive remaining on the circuit board electrode at the time of separation Therefore, the regenerating process on the electrodes becomes unnecessary, so that the repair joining between the electronic component of the electronic component mounted body and the circuit board can be facilitated.

According to a seventh aspect of the present invention, a short-circuit between adjacent bumps is prevented by forming a conical bump on an electrode of an electronic component with a thermoplastic conductive adhesive and attaching the thermoplastic conductive adhesive to a tip of the conical bump. It can be used for narrow pitch bonding. In addition, a thermoplastic conductive adhesive having a glass transition temperature (Tg point) lower by 10 ° C. or more than the thermoplastic conductive adhesive that forms the conical bump at the tip of the conical bump is attached to and bonded to the circuit board. Thus, if heated, the thermoplastic conductive adhesive portion having a lower Tg point can be easily separated, and the amount of the conductive adhesive remaining on the circuit board electrode at the time of separation can be reduced, thereby eliminating the need for regeneration treatment on the electrode. Therefore, repair joining can be facilitated.
Furthermore, since the conical bumps are formed by the thermoplastic conductive adhesive, the effect of reducing the thermal stress acting on the joint can be increased, and the joint reliability of the electronic component mounted body can be improved.

According to the eighth aspect of the present invention, by joining via conductive particles, even in the case of a large-sized electronic component, the crushing of the joint can be suppressed. Even so, the gap between the electronic components and the circuit board can be gained,
The bonding reliability against thermal stress can be improved together with the productivity of the electronic component package.

According to a ninth aspect of the present invention, in an electronic component mounting body for joining an electrode of an electronic component and an electrode of a circuit board with a conductive adhesive via conductive particles, a thermoplastic conductive adhesive is used as a bonding agent on the circuit board side. By using this, separation can be easily performed at a heating temperature of 150 ° C. or less, and the amount of the conductive adhesive remaining on the circuit board electrode at the time of separation can be reduced. Repair joining between the electronic component of the mounted body and the circuit board can be facilitated.

According to the tenth aspect, since the conductive particles can be arranged in a predetermined pattern and the conductive adhesive can be supplied by a transfer method, high-precision positioning in the supply step is not required, and the electronic components can be arranged at a narrow pitch. And the electrodes of the circuit board can be joined with high productivity and reliability.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an electronic component mounting method and an electronic component mounted body according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view for illustrating the electronic component package according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating an electronic component package according to a second embodiment of the present invention.

FIG. 4 is a sectional view for explaining an electronic component mounting method according to a third embodiment of the present invention.

FIG. 5 is a sectional view for explaining an electronic component mounting method according to a fourth embodiment of the present invention.

FIG. 6 is a cross-sectional view for explaining an electronic component package according to Examples 5 and 6 of the present invention.

FIG. 7 is a diagram showing high-temperature separation characteristics of thermoplastic conductive adhesives having different glass transition temperatures (Tg points) used in an electronic component package according to Embodiment 6 of the present invention.

FIG. 8 is a sectional view for explaining an electronic component package according to a seventh embodiment of the present invention.

FIG. 9 is a sectional view for explaining an electronic component mounting method according to an eighth embodiment of the present invention.

[Explanation of symbols]

11: conductive adhesive, 12: first conductive adhesive, 13: second conductive adhesive, 14: conductive particles, 21: electronic component, 2
Reference numeral 2 denotes an electrode, 31 denotes a circuit board, 32 denotes an electrode, 33 denotes a ring-shaped electrode, 41 denotes a printing mask, 42 denotes a tray, 43 denotes a conductive adhesive layer, 44 denotes a suction plate, and 45 denotes a conductive adhesive layer.
Reference numeral 51 denotes a thermocompression bonding tool, 52 denotes an ultrasonic vibrator, 53 denotes a horn, and 54 denotes a tool.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E319 AA03 AB05 AC12 BB11 CC12 CD16 GG11 5F044 KK01 KK12 KK17 KK18 LL07 QQ02 QQ03 QQ05

Claims (10)

[Claims] 1. An electronic component mounting body in which electronic components having electrodes in an area array shape are mounted on a circuit board, wherein the electrodes of the electronic component and the electrodes of the circuit board are joined by a drum-shaped conductive adhesive. An electronic component mounted body characterized in that: 2. The electronic component package according to claim 1, wherein the conductive adhesive is a thermoplastic conductive adhesive. 3. The electronic component package according to claim 1, wherein a part of at least one of the electrodes of the electronic component and the circuit board is cut out, and the conductive part is formed in the cutout part of the electrode. An electronic component mounted body filled with an adhesive. 4. The method for mounting an electronic component according to claim 2, wherein the thermoplastic conductive adhesive is supplied in a conical shape on an electrode of the electronic component, and the supplied thermoplastic resin is supplied. A method for mounting an electronic component, comprising heating a conductive adhesive, cooling it, and then hardening to form a conical bump, and then bonding the bump to an electrode of the circuit board by pulse heat thermocompression bonding. 5. The electronic component mounting method for manufacturing an electronic component mounted body according to claim 2, wherein the thermoplastic conductive adhesive is supplied in a conical shape on an electrode of the electronic component, and the supplied thermoplastic resin is supplied. A method for mounting an electronic component, comprising: heating a conductive adhesive, and then cooling and curing the conductive adhesive to form a conical bump, and then ultrasonically bonding the bump to an electrode of the circuit board. 6. An electronic component mounted body having an electronic component having electrodes in an area array shape mounted on a circuit board, comprising: a bump formed in a conical shape with a thermosetting conductive adhesive on the electrode of the electronic component; An electronic component mounted body, wherein an electrode of the electronic component and an electrode of the circuit board are joined by a thermoplastic conductive adhesive attached to a tip of the electronic component. 7. An electronic component mounted body in which electronic components having electrodes in an area array shape are mounted on a circuit board, wherein a bump formed in a conical shape with a thermoplastic conductive adhesive on the electrode of the electronic component; Glass transition temperature (Tg point) of 10 ° C from the thermoplastic conductive adhesive attached to the tip
An electronic component mounted body, wherein the electrode of the electronic component and the electrode of the circuit board are joined by the low thermoplastic conductive adhesive. 8. An electronic component mounted body having an electronic component having electrodes in an area array shape mounted on a circuit board, wherein the electrodes of the electronic component and the electrodes of the circuit board are joined by conductive adhesive via conductive particles. An electronic component mounted body characterized in that: 9. The electronic component package according to claim 8, wherein the electrode on the electronic component side is bonded to the conductive particles with a thermosetting conductive adhesive, and the electrode on the circuit board side is bonded with a thermoplastic conductive adhesive. An electronic component mounted body joined to the conductive particles by an agent. 10. The electronic component mounting method according to claim 8, wherein the conductive particles are arranged in the same manner as an electrode pattern, and the conductive adhesive is applied to one end of the conductive particles. The method according to claim 1, further comprising attaching the conductive particles to the electrodes of the electronic component, attaching the conductive adhesive to the other end of the conductive particles bonded to the electrodes of the electronic component, and bonding the conductive adhesive to the electrodes of the circuit board. Component mounting method.