JP2002332472A - Adhesive, adhesive sheet and laminated body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive capable of firmly bonding a metal foil and a ceramic green sheet in order to make a multlayered precise circuit board using the ceramic green sheet small and thin, and having no troubles of clogging on screen mesh even in the case where the adhesive is applied by screen printing; an adhesive sheet; and a laminated body consisting of a ceramic green sheet, an adhesive layer and a metal foil. SOLUTION: A laminated body made of the ceramic green sheet and the metal foil is produced by using an adhesive consisting of a thermoplastic resin (1) and a liquid component (2) having a boiling point of 150-500 deg.C, or an adhesive consisting of a thermoplastic resin (1), the liquid component (2) and the solvent (3) having a boiling point of 50-145 deg.C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive and an adhesive sheet for bonding a ceramic green sheet and a metal foil, and a laminate comprising a ceramic green sheet, an adhesive layer and a metal foil.

[0002]

2. Description of the Related Art In recent years, electronic devices have been miniaturized. However, with the development of portable information terminals and the spread of so-called mobile computing that carries and operates a computer, the miniaturization has been further promoted and these electronic devices have been built in. In such a multilayer wiring board, further miniaturization, thinning and high-definition of a circuit are required.

[0003] Also, electronic devices that require high-speed operation, such as communication devices, have been widely used. To cope with such electronic devices, multilayer devices suitable for high-speed operation have been used. There is a demand for printed wiring boards. The need for high-speed operation includes various requirements, such as accurate switching for high-frequency signals.To perform high-speed operation, shorten the length of the wiring, It is necessary to reduce the width of the wiring and to reduce the gap between the wirings to reduce the time required for transmitting an electric signal. That is, from the standpoint of adapting to high-speed operation, the multilayer wiring board is required to be smaller, thinner, and have higher circuit definition (higher circuit density).

Conventionally, ceramic green sheets containing alumina or the like as a main component have been widely used as insulating substrates in such multilayer wiring boards because of their advantages such as high-frequency characteristics. A method is used in which a conductive paste made of a high melting point metal such as W or Mo is patterned by screen printing, and then the coated ceramic green sheets are laminated and fired.

However, in the method of patterning a conductor by screen printing as described above, the thickness of the conductor is increased, so that the miniaturization, thinning, and high definition of the circuit required for a multilayer wiring board are required. It is becoming impossible to respond to. Japanese Patent Application Laid-Open No. 2000-31623 discloses a metal transfer film for transferring a metal thin film to a ceramic green sheet or the like.

This metal transfer film is composed of a plastic film having a surface with low adhesion to metal, a metal layer provided on the surface, and an adhesive layer provided on the surface of the metal layer. To satisfy the transferability because the adhesion between the layer and the ceramic green sheet is low,
Complicated treatment for reducing the adhesion of the surface of the plastic film to metal is required. In addition, even when the transfer is successfully performed, there is a problem that the metal layer may be peeled off before the baking step due to the low adhesiveness.

Further, if the adhesive used for laminating the ceramic green sheet and the metal foil contains a highly volatile solvent having a low boiling point, the solvent evaporates when applied to an adherend by screen printing. However, there has been a problem that the screen mesh is clogged only by coating a few adherends.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of such a problem.
In order to realize the miniaturization and thinning of multilayer wiring boards using ceramic green sheets, and to realize high-definition circuits, it is possible to firmly bond ceramic thin sheets with metal foils that can be made thin and high-definition. An adhesive, an adhesive sheet, and a laminate comprising a ceramic green sheet, an adhesive layer, and a metal foil that do not cause problems such as clogging of a screen mesh even when applied by screen printing. is there.

[0009]

The adhesive for bonding the ceramic green sheet and the metal foil according to the first aspect of the present invention (hereinafter referred to as the first invention) is a thermoplastic resin (1). And a liquid component (2) having a boiling point of 150 to 500 ° C, wherein the weight ratio of (1) and (2) is 90:10.
~ 5: 95.

The invention described in claim 2 of the present application (hereinafter referred to as “second
The adhesive for bonding the ceramic green sheet and the metal foil is a thermoplastic resin (1), a liquid component (2) having a boiling point of 150 to 500 ° C., and a boiling point of 50 to 1
It consists of a solvent (3) at 45 ° C., wherein the weight ratio of (1) and (2) is 90:10 to 5:95, and the weight ratio of [(1) + (2)] and (3) is 5:95. It is characterized by being mixed at ~ 90: 10.

The invention according to claim 3 of the present application (hereinafter referred to as the third
The adhesive for bonding the ceramic green sheet and the metal foil is a thermoplastic resin (1) and a liquid component (2) having a boiling point of 150 to 500 ° C.
(1) and (2) are mixed at a weight ratio of 90:10 to 5:95, and do not contain a liquid component having a boiling point of less than 150 ° C.

The invention according to claim 4 of the present application (hereinafter referred to as the fourth
The adhesive sheet for adhering the ceramic green sheet and the metal foil is a thermoplastic resin (1).
And a liquid component (2) having a boiling point of 150 to 500 ° C,
(1) and (2) are mixed at a weight ratio of 90:10 to 5:95 and formed into a sheet.

According to a fifth aspect of the present invention, there is provided a laminate comprising a ceramic green sheet and a metal foil, wherein the adhesive is the adhesive according to any one of the first to third aspects. Alternatively, it is characterized by being laminated using the adhesive sheet of the fourth invention.

According to a sixth aspect of the present invention, there is provided a laminate comprising a ceramic green sheet and a metal foil laminated on each other.
C., 50% RH, and peeling speed of 300 mm / min.
An 80-degree peel strength is 1 N / 25 mm or more.

Hereinafter, the present invention will be described in detail. As the adhesive for adhering the ceramic green sheet and the metal foil of the first invention, an adhesive composed of a thermoplastic resin (1) and a liquid component (2) is used.

The thermoplastic resin (1) is not particularly restricted but includes, for example, polyolefin resins such as polyethylene and polypropylene; polybutadiene, polychloroprene, polyisoprene, styrene-butadiene copolymer,
Elastomer resins such as acrylonitrile-butadiene copolymer; polyether resins such as polyethylene oxide, polypropylene oxide and polytetramethylene glycol; polyvinyl acetate, ethylene-vinyl acetate copolymer, polyvinyl chloride, ethylene-vinyl chloride copolymer Coalescing,
Polyvinylidene chloride, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polyvinyl formal,
Polyvinyl resins such as polyvinyl acetal, polyvinyl butyral, and polyvinyl ether; (meth) acrylic resins, (meth) acrylate copolymers, styrene- (meth) acrylate copolymers, styrene resins, polyester resins, and polycarbonate resins , A ketone resin, an acrylonitrile-styrene copolymer, an acrylonitrile-butadiene-styrene copolymer, and the like.

The thermoplastic resin (1) preferably has a glass transition temperature of 30 to 150 ° C., more preferably 50 to 150 ° C., since high adhesiveness can be exhibited. Further, in consideration of the thermal decomposability at the time of firing, (meth) acrylic resin, (meth) acrylate copolymer, styrene- (meth) acrylate copolymer, styrene resin, butyral resin and the like are preferably used. . These may be used alone or in combination of two or more.

The liquid component (2) used in the present invention is not particularly limited as long as it has a boiling point at normal pressure of 150 to 500 ° C., for example, diethyl phthalate,
Phthalate ester plasticizers such as dibutyl phthalate and di-2-ethylhexyl phthalate; aliphatic dibasic ester plasticizers such as dibutyl adipate, di-2-ethylhexyl azelate and di-2-ethylhexyl sebacate; triethyl Plasticizers such as phosphate plasticizers such as phosphate, tributyl phosphate and triphenyl phosphate; glycols such as ethylene glycol and diethylene glycol; glycol ethers such as diethylene glycol dimethyl ether and ethylene glycol monobutyl ether; 1,6-hexanediol; Diols such as octanediol; ketone solvents such as isophorone; ester solvents such as butyl carbitol acetate.

If the boiling point of the liquid component (2) is less than 150 ° C., it tends to volatilize from the adhesive layer, so that stable adhesive strength cannot be obtained. May be. The liquid component (2) preferably has a boiling point of 200 to 450 ° C. These may be used alone or in combination of two or more.

In the first invention, the thermoplastic resin (1) and the liquid component (2) are in a weight ratio [(1):
(2)] It is used in a range of 90:10 to 5:95. When the ratio of the thermoplastic resin (1) exceeds 90,
Sufficient adhesive strength cannot be obtained due to low penetration of the adhesive into the ceramic green sheet. If it is less than 5, the cohesive strength is insufficient due to the large amount of the liquid component (2), and sufficient adhesive strength cannot be obtained. Sometimes. A particularly preferred range is
The weight ratio of (1) :( 2) is 50:50 to 5:95.

Next, the second invention will be described. As the adhesive for bonding the ceramic green sheet and the metal foil according to the second aspect of the present invention, an adhesive comprising a thermoplastic resin (1), a liquid component (2) and a solvent (3) is used.

The above thermoplastic resin (1), liquid component (2)
Are used as in the first invention, and the weight ratio between (1) and (2) is 9 for the same reason as in the first invention.
0:10 to 5:95, preferably 5
0:50 to 5:95.

The solvent (3) is not particularly limited as long as it is capable of dissolving the thermoplastic resin (1) and the liquid component (2). The solvent (3) is appropriately determined according to the thermoplastic resin (1) used. Selected. As such a solvent (3),
For example, alcohol solvents such as methanol, ethanol, and 2-propanol; ketone solvents such as acetone and methyl ethyl ketone; ester solvents such as methyl acetate and ethyl acetate; ether solvents such as diethyl ether and tetrahydrofuran; hexane and heptane And the like; and hydrocarbon solvents such as toluene and xylene. These may be used alone or in combination of two or more. Of these, the boiling point at normal pressure is 5
Those having a temperature of 0 to 145 [deg.] C. are suitably used from the viewpoints of handleability and volatility during coating.

[0024] The adhesive of the second invention is obtained by adding the above-mentioned thermoplastic resin (1) and liquid component (2) to a solvent (3) by adding [(1) +
(2)]: obtained by dissolving so that the weight ratio of (3) is in the range of 5:95 to 90:10. If the ratio of the solvent (3) is more than 95, the amount of the solvent is increased, so that the cost is increased. If the ratio is less than 10, poor dissolution or high viscosity is caused.

Next, the third invention will be described. The adhesive for bonding the ceramic green sheet and the metal foil of the third invention is a thermoplastic resin (1) and a liquid component (2).
Which do not contain a liquid component having a boiling point of less than 150 ° C. at normal pressure. The above thermoplastic resin (1)
As the liquid component (2), the same as in the first invention is used.

In the adhesive of the third invention, if a liquid component having a boiling point of less than 150 ° C. at normal pressure is contained, a stable adhesive strength cannot be obtained since the adhesive easily evaporates from the adhesive layer.
When the adhesive is applied to the adherend by screen printing, the liquid component volatilizes, which may cause clogging of the screen mesh. Therefore, when the suitability for screen printing is required, the adhesive of the third invention, which does not contain a liquid component having a boiling point of less than 150 ° C., is preferably used.

Next, the fourth invention will be described. The adhesive sheet for bonding the ceramic green sheet and the metal foil of the fourth invention is made of a thermoplastic resin (1) and a boiling point of 150.
What consists of a liquid component (2) at -500 ° C is used. As the thermoplastic resin (1) and the liquid component (2), the same ones as in the first invention are used.

The thermoplastic resin (1) and the liquid component (2)
Is 90:10 for the same reason as in the first invention.
~ 5: 95, preferably 50: 50 ~
5:95.

The above-mentioned adhesive sheet is formed, for example, by applying the adhesive of the first invention on a film of plastic, paper or the like to which a release property has been imparted by applying a silicone resin, a fluororesin, etc. Alternatively, it can be obtained by volatilizing all. As a method of obtaining the adhesive sheet other than the above, for example, a method of extruding a mixture of the thermoplastic resin (1) and the liquid component (2) into a sheet, and the like can be mentioned.

Next, the fifth invention will be described. The laminate of the fifth invention is formed from a laminate in which the ceramic green sheet and the metal foil are laminated using the adhesive according to any one of the first to third inventions or the adhesive sheet of the fourth invention. You.

As the ceramic green sheet,
A mixture obtained by molding a mixture of ceramic powder such as alumina, a binder resin, and a plasticizer into a sheet is used.
The metal foil is not particularly limited, but is preferably a metal suitable for forming a wiring layer of a wiring board, for example, gold,
A metal foil such as a low-resistance metal such as silver, copper, or aluminum, or an alloy containing at least one of these low-resistance metals is preferably used.

To manufacture the laminate of the fifth invention, the first to
After applying the adhesive of the third invention to one or both of the ceramic green sheet and the metal foil using a spray, a roll coater, a flow coater, a brush, screen printing, or the like, a solvent (3 ) Is volatilized to form an adhesive layer on the adherend. Since the ceramic green sheet is a porous material, the solvent (3) may be volatilized at any stage before or after the bonding step described below. Further, a part of the solvent may be volatilized to the extent that a cohesive force is exhibited in the adhesive layer, or the entire solvent may be volatilized.

Next, one of the adhesive layers formed on the adherend with the above-mentioned adhesive and the other adherent or the adhesive layer formed on the adherend are pressed with a press, an applicator, a roller or the like. Then, by laminating at room temperature or under heating, the laminate of the fifth invention is obtained.

When using the adhesive sheet of the fourth invention,
The laminated body of the fifth invention is obtained by inserting an adhesive sheet between the ceramic green sheet and the metal foil and bonding them together at normal temperature or by heating using a press, an applicator, a roller, or the like. Further, after previously laminating the adhesive sheet on one of the ceramic green sheet and the metal foil, using a press, an applicator, a roller, or the like, by laminating the other adherend at room temperature or under heating, the lamination A body may be made.

The thickness of the adhesive layer or the adhesive sheet is preferably in the range of 1 to 100 μm. If the thickness is less than 1 μm, sufficient adhesive strength cannot be obtained, and if it exceeds 100 μm, poor adhesion of the metal foil may occur during firing. More preferably, it is 3 to 50 μm.

When the wiring layer of the wiring board is formed from the metal foil, the wiring pattern may be formed after the ceramic green sheet and the metal foil are bonded, or the wiring pattern may be formed from the metal foil before bonding. After that, it may be bonded to the ceramic green sheet.

The laminate of the sixth invention is a laminate comprising a ceramic green sheet and a metal foil laminated on each other.
1 of a ceramic green sheet and a metal foil measured under the conditions of 3 ° C., 50% RH, and a peeling speed of 300 mm / min.
80 degree peel strength is 1 N / 25 mm or more. Preferably 3N / 25mm or more, more preferably 5N / 25mm
That is all. If the 180-degree peel strength is less than 1 N / 25 mm, the metal foil may peel off from the ceramic green sheet in a stage before firing when used for a multilayer wiring board.

The lamination is performed via an adhesive layer. The adhesive is not particularly limited as long as it can bond the ceramic green sheet and the metal foil, and is used in the form of an adhesive, an adhesive sheet, a double-sided pressure-sensitive adhesive tape, among others,
The adhesive of the third invention or the adhesive sheet of the fourth invention is particularly preferably used.

The thickness of the adhesive layer is preferably in the range of 1 to 100 μm for the same reason as in the fifth invention.

In the measurement of the 180-degree peel strength, both the ceramic green sheet and the metal foil have flexibility, and the peel angle may not be maintained at 180 degrees when the laminate is peeled off. In this case, either the ceramic green sheet or the metal foil is fixed to a metal plate, a plate such as a plastic plate using a double-sided adhesive tape, an adhesive, etc., so that the peeling angle is maintained at 180 degrees. It is preferable to measure the peeling adhesive strength.

(Function) The adhesive of the first to third inventions and the fourth
Since the adhesive sheet of the present invention contains the thermoplastic resin (1) and the liquid component (2) in the adhesive layer after bonding,
It is suitable for bonding porous materials, and enables strong bonding between the ceramic green sheet and the metal foil. The laminate of the fifth invention obtained in this way can reduce the size and thickness of the multilayer wiring board and reduce the circuit size. It can be used as an effective material for high definition. In the laminate of the sixth invention, since the ceramic green sheet and the metal foil have high adhesive strength,
With respect to the stress in the manufacturing process of the multilayer wiring board and the like, problems such as peeling of the metal foil do not occur, and high productivity can be achieved.

[0042]

Embodiments of the present invention will be described below. Example 1 Preparation of Adhesive 15 parts by weight of a methacrylate copolymer having a glass transition temperature of 72 ° C. (trade name: IBM-2, manufactured by Sekisui Chemical Co., Ltd.)
15 parts by weight of di-2-ethylhexyl phthalate (manufactured by Sekisui Chemical Co., Ltd., trade name: DOP, boiling point: 386 ° C.) and 70 parts by weight of ethyl acetate were placed in a polyvin and dissolved by a shaker to prepare an adhesive.

Preparation of Laminate A few drops of the above-mentioned adhesive were deposited on an electrolytic copper foil (thickness: 12 μm) formed by electrolytic plating, applied by a bar coater, and then left at room temperature for 30 minutes to obtain ethyl acetate. Was volatilized to form an adhesive layer. The thickness of the adhesive layer was 25 μm. A ceramic green sheet is superimposed on the adhesive layer forming surface of the electrolytic copper foil, and the temperature is 55 ° C., the surface pressure is 9.8 N / c.
Heat pressing was performed for 1 minute under the conditions of m ² to obtain a laminate.

Example 2 Preparation of Adhesive Sheet The adhesive prepared in Example 1 was applied to the release surface of a polyethylene terephthalate (PET) film (manufactured by Lintec Co., Ltd., trade name: PET5001) which had been subjected to a silicone release treatment on one side. After applying using an applicator, it was dried at 110 ° C. for 2 minutes to prepare an adhesive sheet having a thickness of 15 μm.

Preparation of Laminate The above-mentioned adhesive sheet with a PET film was laminated on a ceramic green sheet at room temperature under a linear pressure of 49 N / cm, the PET film was peeled off, and electrolytic copper formed by electrolytic plating was used. Foil (thickness: 12 μm) was overlapped and laminated at room temperature under a linear pressure of 49 N / cm to obtain a laminate.

Example 3 Butyral resin having a glass transition temperature of 61 ° C. (trade name: Eslec BL-, manufactured by Sekisui Chemical Co., Ltd.)
S) 10 parts by weight, di-2-ethylhexyl sebacate (trade name: DOS, manufactured by Daihachi Chemical Co., Ltd., boiling point: 377 ° C.) 20
Parts by weight and 70 parts by weight of ethanol in a polyvin,
The mixture was dissolved in a shaker to prepare an adhesive. A laminate was obtained in the same manner as in Example 1 except that the above-mentioned adhesive was used.

Example 4 An adhesive sheet was obtained in the same manner as in Example 2 except that the adhesive prepared in Example 3 was used, and then a laminate was produced.

Comparative Example 1 Methacrylic acid ester copolymer having a glass transition temperature of 72 ° C. (trade name, manufactured by Sekisui Chemical Co., Ltd.)
IBM-2) 2 parts by weight, di-2-ethylhexyl phthalate (manufactured by Sekisui Chemical Co., Ltd., trade name: DOP, boiling point 386 ° C) 4
Eight parts by weight and 50 parts by weight of ethyl acetate were placed in a polybin and dissolved with a shaker to prepare an adhesive. A laminate was obtained in the same manner as in Example 1 except that the above-mentioned adhesive was used.

Comparative Example 2 An adhesive sheet was produced in the same manner as in Example 2 except that the adhesive of Comparative Example 1 was used. However, a sheet-like material could not be obtained due to low cohesive strength. Was.

Comparative Example 3 Butyral resin having a glass transition temperature of 61 ° C. (trade name: Eslec BL-, manufactured by Sekisui Chemical Co., Ltd.)
S) 15 parts by weight, 1 part by weight of di-2-ethylhexyl sebacate (manufactured by Daihachi Chemical Co., Ltd., trade name: DOS, boiling point: 377 ° C.) and 84 parts by weight of ethanol are placed in a polybin, dissolved by a shaker, and adhesive Was prepared. A laminate was obtained in the same manner as in Example 1 except that the above-mentioned adhesive was used.

Comparative Example 4 An adhesive sheet was obtained in the same manner as in Example 2 except that the adhesive prepared in Comparative Example 3 was used, and a laminate was produced.

The laminates obtained in Examples 1 to 4 and Comparative Examples 1, 3, and 4 were evaluated for normal adhesion and bending resistance by the following methods. The results are shown in Table 1. (Normal adhesiveness) 25 mm x 100 mm
And a ceramic green sheet side was stuck on a 2.5 mm-thick aluminum plate with a double-sided tape. The test piece thus obtained was subjected to a tensile test at a temperature of 23 ° C.
At 180 ° C., 50% RH, and a peeling speed of 300 mm / min, a 180 ° peel test for peeling the copper foil from the ceramic green sheet was performed, and the adhesive strength was measured.

(Bending resistance) The obtained laminate was 10 mm ×
The test piece was cut out to 100 mm, and the green sheet side of the laminate was attached to the outside of the ABS pipe having an outer diameter of 84 mm such that the longitudinal direction of the laminate was the circumferential direction of the ABS pipe. This test specimen was subjected to 24 ° C under the conditions of 23 ° C and 50% RH.
After standing for a time, the presence or absence of peeling was evaluated.

[0054]

[Table 1]

Example 5 Preparation of Adhesive 20 parts by weight of a methacrylate copolymer having a glass transition temperature of 72 ° C. (trade name: IBM-2, manufactured by Sekisui Chemical Co., Ltd.)
40 parts by weight of di-2-ethylhexyl phthalate (manufactured by Sekisui Chemical Co., Ltd., trade name: DOP, boiling point: 386 ° C.) and 40 parts by weight of butyl carbitol acetate (boiling point: 247 ° C.) are placed in a polybin and dissolved with a shaker. Then, an adhesive was prepared.

Preparation of Laminate A few drops of the above adhesive were dropped on an electrolytic copper foil (thickness: 12 μm) formed by an electrolytic plating method, and the adhesive was applied by a bar coater so as to have an application amount of 15 g / m ² . Thereafter, the ceramic green sheets are superimposed, and 55 ° C. and a surface pressure of 9.
Heat press was performed for 1 minute under the condition of 8 N / cm ² to obtain a laminate.

Example 6 Polystyrene resin having a glass transition temperature of 100 ° C. (trade name: G6, manufactured by Nippon Polystyrene Co., Ltd.)
90N) 10 parts by weight, di-2-ethylhexyl phthalate (manufactured by Sekisui Chemical Co., Ltd., trade name: DOP, boiling point 386 ° C.) 45
Parts by weight and 45 parts by weight of isophorone (boiling point: 215 ° C.) were placed in a polyvin, and dissolved by a shaker to prepare an adhesive. A laminate was obtained in the same manner as in Example 5, except that the above adhesive was used.

Example 7 Methacrylic acid ester copolymer having a glass transition temperature of 72 ° C. (trade name, manufactured by Sekisui Chemical Co., Ltd.)
IBM-2) 10 parts by weight, di-2-ethylhexyl phthalate (Sekisui Chemical Co., Ltd., trade name: DOP, boiling point 386 ° C)
An adhesive was prepared by placing 50 parts by weight and 40 parts by weight of ethyl acetate in a polybin and dissolving it in a shaker. A laminate was obtained in the same manner as in Example 5, except that the above adhesive was used.

The adhesives and laminates obtained in Examples 5 to 7 were evaluated for normal adhesion and suitability for screen printing by the following methods, and the results are shown in Table 2. (Normal adhesiveness) The obtained laminate was evaluated in the same manner as in Example 1.

(Suitability for Screen Printing) The obtained adhesive was electrolytically plated with a screen printer at a work size of 30 cm × 30 cm (thickness:
12 μm) so as to have a coating amount of 15 g / m ² . The adhesive was applied to 100 pieces of electrolytic copper foil in the same manner, and the presence or absence of clogging of the screen mesh was evaluated by visual observation. The case where no clogging occurred was indicated by 、, and the case where clogging occurred was indicated by ×. The number of coated sheets until the occurrence of clogging is indicated in parentheses.

[0061]

[Table 2]

[0062]

The present invention has the above-described structure, and includes the first to third embodiments.
By making a laminate using the adhesive of the invention or the adhesive sheet of the fourth invention, strong adhesion between the ceramic green sheet and the metal foil is possible, and by using the obtained laminate, a multilayer is obtained. It is possible to reduce the size and thickness of the wiring board and to increase the definition of the circuit. Further, since the adhesive sheet of the fourth invention contains almost no solvent, there is almost no contamination of the working environment, and by using the adhesive sheet having a uniform thickness, it is possible to easily form a wiring board having high thickness accuracy. it can.

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Claims (6)

[Claims] A thermoplastic resin (1) and a boiling point of 150 to 5
An adhesive for bonding a ceramic green sheet and a metal foil comprising a liquid component (2) at a temperature of 00 ° C. and mixed in a weight ratio of (1) and (2) of 90:10 to 5:95. 2. A thermoplastic resin (1) having a boiling point of 150 to 50.
It comprises a liquid component (2) at 0 ° C. and a solvent (3) having a boiling point of 50 to 145 ° C., and the weight ratio of (1) to (2) is 90:10.
An adhesive for bonding a ceramic green sheet and a metal foil in which [(1) + (2)] and (3) are mixed at a weight ratio of 5:95 to 90:10. 3. A thermoplastic resin (1) and a boiling point of 150 to 5.
A liquid component (2) at a temperature of 00 ° C., wherein the weight ratio of (1) and (2) is 90:10 to 5:95, and
An adhesive for bonding a ceramic green sheet and a metal foil, which does not contain a liquid component having a boiling point of less than 150 ° C. 4. A thermoplastic resin (1) and a boiling point of 150 to 5.
It is composed of a liquid component (2) at 00 ° C., wherein (1) and (2) are mixed in a weight ratio of 90:10 to 5:95 to bond a ceramic green sheet formed into a sheet shape to a metal foil. Adhesive sheet. 5. A laminate obtained by laminating a ceramic green sheet and a metal foil using the adhesive according to any one of claims 1 to 3 or the adhesive sheet according to claim 4. 6. A laminate of a ceramic green sheet and a metal foil, which is measured under the conditions of 23 ° C., 50% RH and a peeling speed of 300 mm / min. A laminate having a peel strength of 1 N / 25 mm or more.