JP2002331589A5 - - Google Patents
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- Publication number
- JP2002331589A5 JP2002331589A5 JP2002061852A JP2002061852A JP2002331589A5 JP 2002331589 A5 JP2002331589 A5 JP 2002331589A5 JP 2002061852 A JP2002061852 A JP 2002061852A JP 2002061852 A JP2002061852 A JP 2002061852A JP 2002331589 A5 JP2002331589 A5 JP 2002331589A5
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- metal
- liquid crystal
- preferable
- surface roughness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 7
- 229920000106 Liquid crystal polymer Polymers 0.000 description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 229920001169 thermoplastic Polymers 0.000 description 6
- 239000004416 thermosoftening plastic Substances 0.000 description 6
- 239000011888 foil Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002061852A JP2002331589A (ja) | 2001-03-07 | 2002-03-07 | 金属張積層板の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-63382 | 2001-03-07 | ||
| JP2001063382 | 2001-03-07 | ||
| JP2002061852A JP2002331589A (ja) | 2001-03-07 | 2002-03-07 | 金属張積層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002331589A JP2002331589A (ja) | 2002-11-19 |
| JP2002331589A5 true JP2002331589A5 (enExample) | 2004-11-25 |
Family
ID=26610773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002061852A Pending JP2002331589A (ja) | 2001-03-07 | 2002-03-07 | 金属張積層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002331589A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8771458B2 (en) | 2005-07-27 | 2014-07-08 | Kuraray Co., Ltd. | Method of making wiring boards covered by thermotropic liquid crystal polymer film |
| CN107107475B (zh) * | 2014-12-26 | 2019-03-12 | Ａｇｃ株式会社 | 层叠板和柔性印刷基板的制造方法 |
| KR102124856B1 (ko) * | 2018-12-18 | 2020-06-19 | 주식회사 성우하이텍 | 롤 포밍 장치 및 방법 |
| JPWO2023162662A1 (enExample) * | 2022-02-28 | 2023-08-31 | ||
| WO2024204238A1 (ja) * | 2023-03-29 | 2024-10-03 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルム、積層体、並びにそれらの製造方法 |
| CN119858320B (zh) * | 2025-01-17 | 2025-08-22 | 湖北强大包装实业有限公司 | 一种镭射膜复合设备及该复合设备的控制方法 |
-
2002
- 2002-03-07 JP JP2002061852A patent/JP2002331589A/ja active Pending
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