JP2002326252A - Metal inserted polyphenylene sulfide resin molded part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for molding a metal inserted polyphenylene sulfide resin molded part constituted by integrally holding a metal member like a metal terminal for a lead frame along with a polyphenylene sulfide resin in a good adhesion state and excellent in heat resistance and general physical properties, the metal inserted polyphenylene sulfide resin molded part and a semiconductor manufacturing apparatus having the same. SOLUTION: The metal inserted PPS resin molded pat is manufactured by subjecting the metal member, to which blasting processing is preliminarily applied, to insert molding using a PPS resin molding compound. The metal inserted PPS resin molded part and the semiconductor manufacturing apparatus having the same are also disclosed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a polyphenylene sulfide (hereinafter abbreviated as PPS) resin molded part in which a metal member is inserted, and a method for producing the same. More specifically, the present invention provides a metal insert PP having excellent heat resistance, general physical properties, and the like, in which a metal member such as a metal terminal for a lead frame is integrally held with good adhesion to a resin.
The present invention relates to an S resin molded part, particularly to a semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art In recent years, in the fields of electric and electronic equipment parts, automobile equipment parts, chemical equipment parts, and other mechanical equipment parts, the demand for resin molded parts in which metal members are joined and integrally held has increased. ing. In a resin molded part obtained by joining and integrating such metal members, the adhesion at the joint with the metal member is a very important problem in terms of its function.
On the other hand, PPS resin, which is a crystalline thermoplastic resin, has excellent physical properties as an engineering plastic and is frequently used as a material for various components. However, when a metal member is insert-molded with PPS resin, poor adhesion to the metal member often poses a problem. If the adhesion to the metal member is poor, moisture or air, and if there is a process for liquid treatment, the treatment liquid enters through the gap between the metal terminal and the resin and remains. Corrosion and contamination of the contacts.

Therefore, in order to solve such problems, conventionally, (1) potting an epoxy resin having good adhesion to metal to the base of a metal member protruding from a resin portion after molding, (2) ) After the elements and bonding wires arranged on the insert metal member are protected with polyimide resin or epoxy resin, resin molding is performed. (3)
JP-A-61-113242, JP-A-7-3291
As described in Japanese Patent Application Laid-Open No. 04-2004, etc., a treatment such as a treatment with a silane coupling agent is performed on an insert metal member on which elements are arranged before resin molding. However, such a method has drawbacks in that the steps are complicated and the cost is inevitably high. Also, as described in JP-A-59-8756, a method of adding various special additives to a PPS resin or blending an elastomer component to improve the adhesion (Japanese Patent Laid-Open No. No. 123461) has been proposed, but these methods have not always been effective enough.

[0004]

SUMMARY OF THE INVENTION Under such circumstances, the present invention provides a heat-resistant and heat-resistant metal member, such as a metal terminal for a lead frame, which is integrally held with good adhesion to a resin. An object of the present invention is to provide a method for efficiently manufacturing a metal insert PPS resin molded part having excellent general physical properties and the like.

[0005]

Means for Solving the Problems The present inventors have conducted intensive studies on a method of manufacturing a metal insert PPS resin molded part having good adhesion between the metal member and the PPS resin, and as a result, the metal member contacting the resin has been obtained. It has been found that the above object can be achieved by performing wet blasting on the surface in advance. The present invention has been completed based on such findings. That is, the present invention is characterized in that a metal member subjected to wet blasting in advance is insert-molded with a PPS resin molding material.
An object of the present invention is to provide a method for producing an S resin molded part. The present invention also provides a metal insert PPS resin molded part obtained by the above-described production method, and a semiconductor manufacturing apparatus having the molded part.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The metal member used in the method for manufacturing a metal insert PPS resin molded part of the present invention is not particularly limited, and various materials such as copper, iron, nickel, cobalt, aluminum, zinc, gold, Alternatively, there may be mentioned those made of alloys and the like, and among these, metal members made of copper and metal members plated with nickel are suitable for the surface treatment in the present invention. In the method of the present invention, these metal members are subjected to wet blasting beforehand, or after wet blasting, and then subjected to plating. The plating method is not particularly limited, and may be appropriately selected from various methods such as electroplating, chemical plating, ultrasonic plating, vacuum deposition, sputtering, and ion plating according to various situations. However, the electroplating method and the chemical plating method are particularly preferable because the effects of the present invention can be sufficiently exhibited.

[0007] The wet blasting process is a process in which a mixed fluid of abrasive grains, water and air is applied to a metal member surface from a direction substantially perpendicular thereto, and the following conditions are usually employed.
There is no particular limitation on the abrasive grains, but alumina particles are preferably used. The average particle diameter of alumina is not particularly limited as long as it is commonly used, but preferably,
Those having a lead interval of 8 μm to 1/3 are used. The alumina particles are usually used in the form of a slurry with water,
The alumina particle concentration is usually from 80 to 800 g / l. Conditions for wet blasting the metal member surface are as follows:
Since it is affected by the discharge amount of the mixed fluid, the slurry and air pressure, the distance to the metal member, the processing speed, and the like, the setting is made in consideration of the state of the surface of the metal member after wet blasting. As the wet blasting conditions, the processing pressure is usually 0.05 to 1 MPa. In the surface state of the metal member subjected to the wet blasting, the average surface roughness Sa is preferably 0.1 μm or more, and particularly preferably 0.2 μm or more. Preferred examples of the PPS resin molding material used in the method of the present invention include those containing a PPS resin and an inorganic filler as main components.
Here, the PPS resin has the general formula (I)

[0008]

Embedded image

(Wherein, R ¹ is an alkyl group having 1 to 6 carbon atoms, an alkoxyl group having 1 to 6 carbon atoms, a phenyl group, a carboxylic acid / metal salt, an amino group, a nitro group, a halogen atom such as fluorine or bromine, etc.) And m is 0 to 4
Is an integer. N represents an average degree of polymerization of 1.3 to 30.
And a polymer having a repeating unit of 70 mol% or more.

The PPS resin is generally known to have a substantially straight-chain molecular structure having no branched or cross-linked structure and a structure having a branched or cross-linked structure according to the production method. Can be used without any particular limitation. As a preferred PPS resin for use in the present invention, a p-phenylene sulfide unit is used as a repeating unit in an amount of 70%.
Homopolymers or copolymers containing at least 80 mol%, more preferably at least 80 mol%, can be mentioned. If this repeating unit is less than 70 mol%, the original crystallinity, which is a characteristic of a crystalline polymer, tends to be low, and sufficient mechanical properties tend not to be obtained, which is not preferable. Examples of the copolymerizable structural unit include m-phenylene sulfide unit, o-phenylene sulfide unit, p, p′-diphenylene ketone sulfide unit, p, p′-diphenylene sulfone sulfide unit, and p, p′-biphenylene sulfide unit. , P, p'-diphenylene ether sulfide unit,
p, p'-diphenylene methylene sulfide unit, p,
p'-diphenylene cumenyl sulfide unit, naphthyl sulfide unit and the like.

The PPS resin can be obtained, for example, by subjecting a dihalogeno aromatic compound and a sulfur source to a polycondensation reaction in a polar organic solvent by a method known per se. The melt viscosity of the PPS resin used in the present invention is not particularly limited, but is preferably in the range of 5 to 100 Pa · s at 300 ° C. and 200 sec ⁻¹ . On the other hand, as the inorganic filler, silica, alumina, talc,
Mica, kaolin, clay, silica alumina, carbon black, calcium carbonate, titanium oxide, lithium carbonate, calcium sulfate, barium carbonate, magnesium carbonate, magnesium sulfate, glass powder, glass beads, glass flake, glass balloon, silicon nitride, aluminum nitride And whiskers such as glass fiber, carbon fiber, aramid fiber, potassium titanate whisker, silicon carbide whisker, wollastonite, and zinc oxide whisker. These can be used alone or in combination of two or more.

Further, the inorganic filler may be subjected to a surface treatment with a coupling agent or the like in order to improve the adhesion to the PPS resin. As a coupling agent,
In addition to a silane-based or titanium-based coupling agent, any conventionally known coupling agent can be arbitrarily selected and used. Among these inorganic fillers, a granular inorganic filler is suitable for more effectively expressing the adhesion between the inserted metal member and the PPS resin. In addition, silica, alumina, and glass beads are suitable as an inorganic filler for a metal insert resin molded part for a semiconductor manufacturing apparatus. In the PPS resin molding material used in the present invention, the mixing ratio of the PPS resin and the inorganic filler is not particularly limited.
20 to 40 parts by weight of inorganic filler per 100 parts by weight of PS resin
It is blended at a ratio of 0 parts by weight. If the amount of the inorganic filler is less than 20 parts by weight, it is difficult to obtain a resin molded part having desired physical properties, and the adhesion between the inserted metal member and the PPS resin may be insufficient. On the other hand, if the amount exceeds 400 parts by weight, the fluidity of the molding material may be extremely reduced, and molding may be difficult. In addition, the adhesion between the inserted metal member and the PPS resin may be reduced.

The PPS resin molding material used in the method of the present invention may optionally include (a) an elastomer, (b) an epoxysilane compound, (c) an epoxy resin, and (c) as long as the object of the present invention is not impaired. d) Other additive components can be blended. The elastomer of the component (a) is not particularly limited, and examples thereof include an olefin-based elastomer, a polyamide-based elastomer, a polyester-based elastomer, a vinyl copolymer-based elastomer, a diene-based elastomer, and a silicone-based elastomer.

As the olefin elastomer, α-
Examples also include those obtained by graft copolymerizing an unsaturated carboxylic acid or an anhydride thereof with an olefin base polymer.
α-olefin refers to ethylene, propylene, butene-
1, isobutene, pentene-1,4-methylpentene-
And unsaturated carboxylic acids or anhydrides thereof, such as maleic acid, fumaric acid, itaconic acid, methylmaleic acid, acrylic acid, methacrylic acid, crotonic acid, citraconic acid. , Maleic anhydride, itaconic anhydride, methylmaleic anhydride, glycidyl acrylate, and the like. Specifically, the monomer component is a copolymer of ethylene, an α, β-unsaturated carboxylic acid alkyl ester, and maleic anhydride, each having a repeating unit content of 50 to 90% by weight, 5 to 49% by weight, 0.5 to 10% by weight, preferably 60 to 85% by weight, 7 to 45% by weight, 1 to 8% by weight
Ethylene copolymer. α, β-
As the unsaturated carboxylic acid alkyl ester, an unsaturated carboxylic acid having 3 to 8 carbon atoms, for example, an alkyl ester of acrylic acid, methacrylic acid or the like, specifically,
Methyl acrylate, ethyl acrylate, acrylic acid-n
-Propyl, isopropyl acrylate, acrylic acid-n
-Butyl, isobutyl acrylate, t-butyl acrylate, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate,
N-butyl methacrylate, isobutyl methacrylate,
T-butyl methacrylate and the like. This ethylene copolymer was prepared at MI (190 ° C., 21.18 N
Is preferably 0.1 to 1000. It is preferably from 0.2 to 500, more preferably from 1 to 100.

The polyamide-based elastomer is a polyamide-based block copolymer in which a polyamide hard segment and another soft segment are bonded. As such a soft segment, for example, a polyalkylene oxide (an alkyl group having 2 to 6 carbon atoms) is typical. As the polyamide component as a hard segment, polyamide 6, polyamide 66, polyamide 6, 1
2, polyamides such as polyamide 11 and polyamide 12, and polyether components as soft segments include polyoxyethylene glycol, polyoxypropylene glycol, and polyoxytetramethylene glycol.

As the polyester-based elastomer, a multi-block polymer using a highly crystalline aromatic polyester for a hard segment and an amorphous polyether or an aliphatic polyester for a soft segment is used. As such a hard segment, for example, polyethylene terephthalate, polybutylene terephthalate, terephthalic acid-based crystalline polyester such as polycyclohexane dimethylene terephthalate, and as the soft segment, for example, polytetramethylene ether glycol, polypropylene glycol, Aliphatic polyethers such as polyethylene glycol, or aliphatic dicarboxylic acids such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pyromelic acid, suberic acid, azelaic acid, sebacic acid and ethylene glycol, propylene glycol, butane Aliphatic polyesters obtained from diols, pentanediol, neopentyl glycol, hexanediol, octanediol, glycols such as decanediol, etc. It is below.

As the diene elastomer, for example,
Natural rubber, polybutadiene, polyisoprene, polyisobutylene, neoprene, polysulfide rubber, thiochol rubber, acrylic rubber, urethane rubber, silicone rubber, epichlorohydrin rubber, styrene-butadiene block copolymer (SBR), hydrogenated styrene-butadiene block copolymer Polymers (SEB, SEBC), styrene-butadiene-styrene block copolymer (SBS),
Hydrogenated styrene-butadiene-styrene block copolymer (SEBS), styrene-isoprene block copolymer (SIR), hydrogenated styrene-isoprene block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS ), Hydrogenated styrene-isoprene-styrene block copolymer (SEPS), or ethylene propylene rubber (EPM), ethylene propylene diene rubber (EPDM), or butadiene-acrylonitrile-styrene-core-shell rubber (ABS);
Methyl methacrylate-butadiene-styrene-core-shell rubber (MBS), methyl methacrylate-butyl acrylate-styrene-core-shell rubber (MAS), octyl acrylate-butadiene-styrene-core-shell rubber (MABS), alkyl acrylate-butadiene-acrylonitrile-styrene-core-shell Rubber (A
ABS), butadiene-styrene-core-shell rubber (S
BR), methyl methacrylate-butyl acrylate-
Core-shell type particle-like elastic bodies such as siloxane-containing core-shell rubbers such as siloxane, or rubbers obtained by modifying these.

In addition, polyorganosiloxane rubbers can also be mentioned, and those obtained by copolymerizing a polyorganosiloxane and a crosslinking agent are preferable. Examples of the polyorganosiloxane include hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, dodecamethylcyclohexasiloxane, trimethyltriphenylcyclotrisiloxane, and tetramethyltetraphenylcyclotetrasiloxane. Examples of the crosslinking agent include trifunctional or tetrafunctional siloxane-based crosslinking agents such as trimethoxymethylsilane, triethoxyphenylsilane, tetramethoxysilane, tetraethoxysilane, and tetrabutoxysilane.

The epoxy silane compound as the component (b) means a silane compound having an epoxy group, and in particular, one or more epoxy groups in one molecule and Si—O
A silane compound having one or more R groups (R represents an alkyl group) is preferable. Here, R has 1 to 1 carbon atoms.
And an alkyl group having 20 carbon atoms.
Are preferred. As the epoxy silane, specifically, γ-glycidoxypropyltrimethoxysilane, β
-(3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane and the like. There is no particular limitation on the method of addition,
For example, an integral blend is used.

The epoxy resin of the component (c) includes:
It has one or two or more epoxy groups in the molecule, and a liquid or solid state can be used. For example, bisphenol A, resorcinol, hydroquinone, pyrocatechol, bisphenol F, 1,3,5-
Glycidyl ethers of bisphenols such as trihydroxybenzene, trihydroxydiphenyldimethylmethane, and 4,4'-dihydroxybiphenyl; glycidyl ethers such as diglycidyl ether of halogenated bisphenolbutanediol instead of bisphenol; and glycidyl phthalate. Glycidyl ester,
It is obtained by reacting epichlorohydrin with glycidyl epoxy resins such as glycidylamines such as N-glycidylaniline, epoxidized polyolefins, and non-glycidyl epoxy resins such as dicyclopentadiene dioxide and cyclic novolak phenol resins. A novolak type epoxy resin, or a resin obtained by substituting a halogen group such as chlorine or bromine, an alkoxyl group, a carboxyl group, a hydroxyl group, or the like with these compounds is used. As the novolak-type phenol resin, those obtained by a condensation reaction between phenols and formaldehyde are suitable.

Other additives such as component (d) include various additives such as antioxidants, heat stabilizers, lubricants, coloring agents, plasticizers, conductivity-imparting agents, polyamides, silicone resins and silicones. Examples include oils, silicone oils into which various functional groups are introduced, resins such as polyolefins, polyethersulfones, and polyphenylene ethers, and pigments. An elastomer of the component (a) in the PPS resin molding material used in the present invention,
There are no particular restrictions on the amounts of the epoxy silane compound (b) and the epoxy resin (c),
The amount of the component (a) is usually selected in the range of 3 to 50 parts by weight, preferably 6 to 40 parts by weight, based on 100 parts by weight of the PPS resin. The amount of component (b) is PPS.
The amount is usually 0.05 to 1.2 parts by weight, preferably 0.1 to 1.2 parts by weight, based on 100 parts by weight of the total amount of the resin, the inorganic filler and the component (a). on the other hand,
The compounding amount of the component (c) is usually 0.1 to 100 parts by weight of the total amount of the PPS resin, the inorganic filler and the component (a).
To 3 parts by weight, preferably 0.3 to 2.5 parts by weight.

The PPS resin molding material used in the method of the present invention is prepared by blending the PPS resin, the inorganic filler, and each of the optional components [components (a) to (d)] used as necessary, and melt-kneading them, for example. Thus, it can be prepared. The melt-kneading can be carried out by a usual known method.
By uniformly mixing and dispersing in the S resin, a predetermined molding material is obtained. For the melt-kneading, a twin-screw extruder, a single-screw extruder or the like can usually be suitably used. The conditions for melt-kneading are not particularly limited, but are usually 280 to 350 ° C.
Preferably, it is melt-kneaded at a temperature of 285 to 330 ° C. In the present invention, a metal insert PPS resin molded part is manufactured by insert-molding a metal member subjected to wet blasting with the PPS resin molding material. As a molding method, a conventionally known general insert molding method may be used, for example, a method in which a metal member surface-treated with silver is arranged at an appropriate position of a mold, and integrally insert-molded by injection molding. Is preferably used.

The present invention also provides a metal insert PPS resin molded part manufactured by the above-described method, and a semiconductor manufacturing apparatus having the metal insert resin molded part. As the metal insert resin molded part, for example, a capacitor, a resistor, a coil, a micro switch,
Dip switches, electrical and electronic equipment parts such as connectors, and the like, as a semiconductor device, for example, a diode,
Examples include transistors, FETs, IGBTs, IPMs, thyristors, optical semiconductors, and ICs.

[0024]

Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. Production Example 1 A hydrous sodium sulfide (Na ₂₎ was placed in a polymerization tank equipped with a stirrer.
And S · 5H ₂ O) 833 mol, molar lithium chloride 830 and N- methyl-2-pyrrolidone of 500 L and 1 hour dehydrated and held in 145 ° C. under vacuum.
Next, after the reaction system was cooled to 45 ° C, 905 mol of dichlorobenzene was added, and polymerization was performed at 260 ° C for 3 hours. The PPS resin was obtained by washing the obtained product 5 times with hot water, 1 time with N-methyl-2-pyrrolidone at 170 ° C., and 3 times with water, and drying at 185 ° C.

The PPS resin has a shear rate of 300.degree.
The melt viscosity at 00 / s was 12 Pa · s.
In Examples and Comparative Examples, the following three types of A, B and C were used as PPS resin molding materials. A: Idemitsu PPS / C-140S manufactured by Idemitsu Petrochemical Co., Ltd.
F ". B: 30 parts by weight of the PPS resin obtained in Production Example 1 and 70 parts by weight of silica (“FB74” manufactured by Denki Kagaku Kogyo Co., Ltd.) were used at a cylinder temperature of 280 to 350 using a twin screw extruder “TEM35B” manufactured by Toshiba Machine Co., Ltd. Melted and kneaded at a temperature of ℃, and pelletized. C: 44 parts by weight of the PPS resin obtained in Production Example 1, 50 parts by weight of silica (described above), and 6 parts by weight of an olefin-based copolymer [“Rotada-AX8860” manufactured by Sumitomo Atchem Co., Ltd.] were biaxially manufactured by Toshiba Machine Co., Ltd. Using an extruder "TEM35B", the cylinder temperature is set at 280-350 ° C, melt-kneaded, and pelletized.

Examples 1 to 6 (1) The entire surface of a copper TO-220 lead frame was subjected to wet blasting. The average surface roughness Sa of this frame is (a) 0.14 μm, (b) 0.25 μm,
(c) It was 0.42 μm. (2) The entire surface of the copper TO-220 lead frame was nickel-plated, and wet blasting was further performed thereon. The average surface roughness Sa of this frame is
(d) 0.13 μm, (e) 0.33 μm, (f) 0.98 μ
m. The wet blasting of the above (1) and (2) is performed by using a wet blasting cell with an XY-θ axis manufactured by Macho Co., Ltd., using an alumina (# 320) slurry, and treating at a processing speed (work feed speed) of 30 mm. / S. The processing pressure was 0.15, 0.20, 0.25 MPa,
By the 0.15 MPa treatment, the average surface roughness Sa (a),
(d) is treated with 0.20 MPa to (b) and (e).
(C) and (f) were obtained by 25 MPa treatment. (3) (1) Silver plating was applied to the entire surface of the lead frame obtained in (a). Average surface roughness Sa of this frame
Was (g) 0.11 μm. (4) (1) Silver deposition was performed on the entire surface of the lead frame obtained in (a). The average surface roughness Sa of this frame is
(h) It was 0.13 μm. Vacuum evaporation uses VCP-410A manufactured by Vacuum Kiko Co., Ltd., and the degree of vacuum is 5.333 ×.
The deposition was performed at 10 ⁻³ Pa at a deposition rate of 4 nm to a thickness of 100 nm. Next, a semiconductor chip was mounted on each of the above lead frames and was provided for molding. These lead frames are set in a mold, and three types of PPS resin molding materials A, B, and C are used.
A test part was molded using an O-022 lead frame as an insert. These test parts were evaluated for adhesion by the following method. Table 1 shows the results.

<Evaluation of Adhesion Property> After the test parts were molded, they were left at room temperature for one day, immersed in a commercially available red ink at 100 ° C. for one hour, and moved into the gap between the metal lead frame and the PPS resin by capillary action. The presence or absence of the penetrated ink was visually observed, and the adhesion between the metal lead frame and the PPS resin was evaluated according to the following criteria. In addition, evaluation is n =
Performed at 10. ：: No penetration was observed. ：: Ink penetration stopped outside the V groove. Δ: Intrusion of ink into the V groove was observed, but did not reach the chip. ×: Penetrated to the chip.

[0028]

[Table 1]

[0029]

[Table 2]

Comparative Examples 1 to 12 As the PPS resin molding material, the same three types of molding materials A, B and C used in the examples were used. (H) A copper lead frame (average surface roughness Sa: 0.08 μm), (i) using a nickel-plated copper lead frame (average surface roughness Sa is 0.06 μm) and (j) and (k) using silane-treated lead frames in the same manner as in Examples. The inserted test parts were molded, and the adhesion of each test part was evaluated. Table 2 shows the results. The silane treatment of the lead frame was performed by the following method. That is, a silane treatment was performed by spraying a 30% by weight aqueous solution of γ-glycidoxypropyltriethoxysilane on the entire surface of the lead frame with a spray gun, followed by drying in a dryer for 1 hour.

[0031]

[Table 3]

[0032]

The PPS resin molded part in which the metal member according to the present invention is inserted has particularly excellent adhesion between the metal member and the PPS resin. Various obstacles can be improved, and it can be economically and efficiently produced, and is suitable as various functional components.

[Brief description of the drawings]

FIG. 1 is a plan view of a lead frame on which semiconductor chips used in Examples and Comparative Examples are mounted.

[Explanation of symbols]

 1 semiconductor chip 2 V groove

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) B29K 105: 16 B29K 105: 16 105: 22 105: 22 B29L 31:34 B29L 31:34 (72) Inventor Satoshi Kinouchi Chiba 4F206 AA34 AB11 AD03 AD28 AD33 AH37 JA07 JB12 JB17 JF05 4J002 CL06X CN01W CN011 DA016 DA036 DE106 DE136 DE146 DE186 DE226 DE236 DF016 DG046 DG056 DJ006 DJ016 G016 FA006 5F067 AA04 DC00

Claims (5)

[Claims] 1. A method for producing a molded part of a polyphenylene sulfide resin into which a metal is inserted, wherein a metal surface is subjected to wet blasting in advance and then insert-molded with a polyphenylene sulfide resin. 2. A method for producing a polyphenylene sulfide resin molded part in which a metal is inserted, wherein a metal surface is subjected to wet blasting in advance, plated, and insert-molded with a polyphenylene sulfide resin. 3. A polyphenylene sulfide resin comprising 100 parts by weight of polyphenylene sulfide and inorganic filler 20 to
The method for producing a polyphenylene sulfide resin molded part according to claim 1, which is a resin composition comprising 400 parts by weight. 4. A metal insert polyphenylene sulfide resin molded part produced by the method according to claim 1, 2 or 3. 5. A semiconductor manufacturing apparatus provided with a metal insert polyphenylene sulfide resin molded part manufactured by the method according to claim 1.