JPH04192547A - Manufacture of substrate for semiconductor mounting use - Google Patents
Manufacture of substrate for semiconductor mounting useInfo
- Publication number
- JPH04192547A JPH04192547A JP32386890A JP32386890A JPH04192547A JP H04192547 A JPH04192547 A JP H04192547A JP 32386890 A JP32386890 A JP 32386890A JP 32386890 A JP32386890 A JP 32386890A JP H04192547 A JPH04192547 A JP H04192547A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- pin body
- solder
- plated
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 title abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 238000007747 plating Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、金属芯板からなる基板を用いて外部への電気
接続用のピン体を設けた半導体搭載用基板の製造方法に
係り、特にピン体を容易かつ確実に設けることのできる
半導体搭載用基板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a semiconductor mounting board in which a board made of a metal core plate is provided with a pin body for electrical connection to the outside. The present invention relates to a method for manufacturing a semiconductor mounting board that allows pin bodies to be provided easily and reliably.
（従来の技術及びその課題）
ＩＣ等の半導体の高密度化、高機能化等に伴ない基板に
多数のスルーホールを設は各スルーホール内に外部への
電気接続用のピン体を固着しな、第７図の斜視図に示す
ようなピングリッドアレイ（以下ｒＰＧＡＪという）が
実用化されている。(Prior art and its problems) With the increasing density and functionality of semiconductors such as ICs, a large number of through holes are provided on a substrate, and a pin for electrical connection to the outside is fixed in each through hole. A pin grid array (hereinafter referred to as rPGAJ) as shown in the perspective view of FIG. 7 has been put into practical use.
基板にピン体を固着した従来のＰＧＡの例を第６図の一
部断面概略図に示した。このＰＧＡでは基板７のスルー
ホール内にスルーホールめっき層１０の内径より小径の
つば付きピン体８を挿入し仮固定した後、半田デイツプ
法により半田９を付着させ、ピン体を固着したものであ
る。An example of a conventional PGA in which a pin body is fixed to a substrate is shown in the partially cross-sectional schematic diagram of FIG. In this PGA, a pin body 8 with a flange having a smaller diameter than the inner diameter of the through-hole plating layer 10 is inserted into the through hole of the substrate 7 and temporarily fixed, and then solder 9 is applied by the solder dip method to fix the pin body. be.
また、他のピン体の固着方法としては、基板へ挿入する
ビシ体の支持部の外径をスルーホールめっき層の内径よ
りも若干大きくし、スルーホール内へ強制嵌合する方法
が知られている。Another known method for fixing the pin body is to make the outer diameter of the supporting part of the pin body inserted into the board slightly larger than the inner diameter of the through-hole plating layer, and forcefully fit it into the through-hole. There is.
しかしながら、前者の方法では、ピン体の仮固定と操作
の面倒な半田デイツプ工程か必要であるため、手間がか
かるという問題があり、また後者の方法ではスルーホー
ルの内径精度を極めて高くする′必要がありコストがか
かることや、ピン体の引抜き強度にばらつきが出やすい
という問題があった。However, the former method requires temporary fixing of the pin body and a complicated soldering process, which is time-consuming, and the latter method requires extremely high precision in the inner diameter of the through-hole. There are problems in that it is expensive and that the pull-out strength of the pin body tends to vary.
本発明は上記欠点を解消した、ピン体を設けた半導体搭
載用基板の製造方法を提供することを目的としている。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a semiconductor mounting board provided with a pin body, which eliminates the above-mentioned drawbacks.
（課題を解決するための手段）
本発明は上記目的を達成するために前もって半田めっき
を施したピン体をスルーホール内へ挿入し、スルーホー
ル内で半田をリフローさせることによりピン体を固着さ
せるものであって、その要旨とするところは、
貫通孔１１を有する金属芯板１に絶縁性樹脂を被覆する
とともに貫通孔１１内に絶縁性樹脂を充填してなる基板
の貫通孔中心部にスルーホールとスルーホール内面にめ
っき層２１を設けて二次孔２を形成し、当該二次孔２内
に、前もって表面に半田めっきを施したピン体３を頭部
で係止するように挿入し、ついで半田めっきをリフロー
させることによりピン体３とスルーホール内面めっき層
２１を固着させることを特徴とするピン体を設けた半導
体搭載用基板の製造方法に存する。(Means for Solving the Problems) In order to achieve the above object, the present invention inserts a pin body which has been solder-plated in advance into a through hole, and fixes the pin body by reflowing the solder within the through hole. The gist of this is that a metal core plate 1 having a through hole 11 is coated with an insulating resin, and the through hole 11 is filled with an insulating resin so that a through hole is inserted into the center of the through hole of the substrate. A secondary hole 2 is formed by providing a plating layer 21 on the inner surface of the hole and through-hole, and a pin body 3 whose surface has been previously plated with solder is inserted into the secondary hole 2 so as to be locked with the head. The method of manufacturing a semiconductor mounting board provided with a pin body is characterized in that the pin body 3 and the through-hole inner surface plating layer 21 are fixed to each other by reflowing solder plating.
以下本発明を図面を参照して具体的に説明する。The present invention will be specifically described below with reference to the drawings.
第１図乃至第５図は、本発明方法の一例を工程順に示し
た、基板及びピン体周辺部分の一部断面概略図である。FIGS. 1 to 5 are schematic partial cross-sectional views of the substrate and the peripheral portion of the pin body, showing an example of the method of the present invention in the order of steps.
第１図は本発明に使用する基板の一部断面概略図であり
、貫通孔１１を有する金属芯板１の両面に絶縁性樹脂を
被覆するとともに貫通孔１１内に絶縁性樹脂を充填した
ものである。FIG. 1 is a schematic partial cross-sectional view of a substrate used in the present invention, in which both surfaces of a metal core plate 1 having a through hole 11 are coated with an insulating resin, and the through hole 11 is filled with an insulating resin. It is.
上記金属芯板１は鉄、鉄合金、アルミニウム、銅等から
なり、通常０．１〜３．０ｍｍ程度の厚みであり、さら
にクロメート処理等の化成処理やサンドブラスト処理等
を施したものが好適に使用できる。The metal core plate 1 is made of iron, iron alloy, aluminum, copper, etc., and has a thickness of usually about 0.1 to 3.0 mm, and is preferably subjected to chemical conversion treatment such as chromate treatment or sandblasting treatment. Can be used.
貫通孔１１は直径が通常０．５〜６．５ｍｍ程度のもの
であり、必要なパターンに前もって打抜きやドリル加工
されたものである。The through holes 11 usually have a diameter of about 0.5 to 6.5 mm, and are punched or drilled in advance into the required pattern.
上記の金属芯板１の両面及び貫通孔に充填される絶縁性
樹脂には熱硬化性樹脂や熱可塑性樹脂の各種樹脂か使用
され、熱硬化性樹脂としては通常のエポキシ樹脂、ポリ
イミド樹脂、不飽和ポリエステル樹脂等が使用でき、熱
可塑性樹脂としては、ポリエーテルエーテルケトン、ポ
リフェニレンサルファイド、ポリエーテルサルフォン等
の耐熱性熱可塑性樹脂が好適に使用できる。また、上記
絶縁性樹脂からなる絶縁層にガラス繊維布等の無機質繊
維布を適宜介在させてもよい。Various resins such as thermosetting resins and thermoplastic resins are used for the insulating resin that is filled in both surfaces and the through holes of the metal core plate 1, and the thermosetting resins include ordinary epoxy resins, polyimide resins, and A saturated polyester resin or the like can be used, and as the thermoplastic resin, a heat-resistant thermoplastic resin such as polyether ether ketone, polyphenylene sulfide, polyether sulfone, etc. can be suitably used. Further, an inorganic fiber cloth such as a glass fiber cloth may be appropriately interposed in the insulating layer made of the above-mentioned insulating resin.
さらに上記絶縁層の片側又は両側の最外層に回路形成用
の銅箔等の金属箔４を設けることができる。なお、上記
構成からなる各素材は熱圧着により一体化することがで
き、金属芯１の両面に被覆された絶縁性樹脂が流動して
貫通孔１１内に充填することができる。Further, a metal foil 4 such as copper foil for circuit formation can be provided on the outermost layer on one or both sides of the insulating layer. The materials having the above structure can be integrated by thermocompression bonding, and the insulating resin coated on both sides of the metal core 1 can flow and fill the through hole 11.
つぎに第１図に示した基板には第２図に示すように、貫
通孔１１の中心部にスルーホールとスルーホール内面に
めっき層２１を設けて二次孔２を形成する。スルーホー
ルの形成は通常のドリル加工によればよく、めっき層は
銅等の金属を無電解めっき法により設ければよい。また
、最外層の金属箔４には必要に応じてエツチング等によ
り回路パターンを形成する。Next, as shown in FIG. 2, in the substrate shown in FIG. 1, a secondary hole 2 is formed by providing a through hole in the center of the through hole 11 and a plating layer 21 on the inner surface of the through hole. The through holes may be formed by ordinary drilling, and the plating layer may be formed by electroless plating of a metal such as copper. Furthermore, a circuit pattern is formed on the outermost layer of metal foil 4 by etching or the like, if necessary.
上記二次孔２には第３図に示すように、ピン体３を挿入
する。ピン体３はＮｉ等の導電性に優れた金属からなり
、形状としては頭部を有する形状であれば種々形状のも
のか使用でき、二次孔２に挿入後、頭部で係止される。A pin body 3 is inserted into the secondary hole 2, as shown in FIG. The pin body 3 is made of a metal with excellent conductivity such as Ni, and can be of various shapes as long as it has a head, and is locked by the head after being inserted into the secondary hole 2. .
ここで、ピン体３頭部の形状は第３図に示すように、頭
部下部３１が貫通孔１１上部の絶縁性樹脂のへこみ（ひ
け）Ｓと時間−となる形状とすることが好ましく、より
確実な固着が可能になると共に頭部の最上部を平滑にす
れば基板自体の表面と面一にすることができ、次工程で
の加工がやり易くなる。Here, as shown in FIG. 3, the shape of the head of the pin body 3 is preferably such that the lower part 31 of the head forms a depression (sink) S in the insulating resin at the upper part of the through hole 11. More reliable fixing is possible, and by smoothing the top of the head, it can be made flush with the surface of the substrate itself, making it easier to process in the next step.
また、本発明で使用するピン体３の表面には前もって半
田めっきを施しておく必要があり、半田めっきの厚さは
二次孔への挿入の容易さや必要とされるピン体の引抜き
強度等を考慮して適宜法めればよい。In addition, the surface of the pin body 3 used in the present invention must be solder plated in advance, and the thickness of the solder plating depends on factors such as ease of insertion into the secondary hole and required pull-out strength of the pin body. It is only necessary to take appropriate measures into consideration.
つぎに上記ピン体３を二次孔２に挿入した後、ピン体表
面の半田めっきをリフローさせる必要があり、リフロー
させるには、第４図に示すようにピン体頭部が下方にな
るようにして、リフロー炉内のコンベアー５に載置して
加熱すれはよく、加熱温度は３００℃程度で行なえばよ
い。このように頭部を下方にしてリフローさせることに
より半田が二次孔との接合部分に集まり易く、より固着
が確実になり好ましい。半田めっきはりフロー後冷却さ
れて第５図に示すように固着部分６として、二次孔との
接合が図れる。Next, after inserting the pin body 3 into the secondary hole 2, it is necessary to reflow the solder plating on the surface of the pin body.To reflow, the head of the pin body should be positioned downward as shown in Figure 4. Then, it may be placed on the conveyor 5 in a reflow oven and heated, and the heating temperature may be about 300°C. By performing reflow with the head facing downward in this manner, the solder tends to gather at the joint portion with the secondary hole, and the adhesion becomes more reliable, which is preferable. After the solder plating has flowed, it is cooled, and as shown in FIG. 5, it forms a fixed part 6 and can be joined to the secondary hole.
（作 用）
上記のように前もってピン体表面に施された半田めっき
は二次孔に挿入された後リフローにより容易に溶解して
ピン体と二次孔を固着できる接合材として作用する。(Function) As described above, the solder plating previously applied to the surface of the pin body is easily dissolved by reflow after being inserted into the secondary hole, and acts as a bonding material that can fix the pin body and the secondary hole.
（発明の効果）
本発明は、以上説明したように構成されているので、以
下に記載されるような効果を奏する。(Effects of the Invention) Since the present invention is configured as described above, it produces effects as described below.
（１）基板へのピン体の固着が容易で、工程を大幅に短
縮できる。(1) It is easy to fix the pin body to the board, and the process can be significantly shortened.
（２）ピン体の引抜き強度を向上でき、またばらつきを
低減できる。(2) The pull-out strength of the pin body can be improved and variations can be reduced.
（３）ピン体の頭部下部の形状を絶縁層のひけと合致さ
せることにより基板表面を平滑にすることとができ、ピ
ン体固着後の工程（例えばダムの設置）上有利である。(3) By matching the shape of the lower part of the head of the pin body with the sink mark of the insulating layer, the substrate surface can be made smooth, which is advantageous in the process after fixing the pin body (for example, installing a dam).
第１図乃至第５図は、本発明方法の一例を工程順に示し
た、基板及びピン体周辺部分の一部断面概略図、第６図
は従来のＰＧＡを示す一部断面概略図、第７図はＰＧＡ
の一例を示す斜視図である。
１・・・金属芯板
１１・・・貫通孔
２・・・二次孔 ２１・・・スルーホール内面めっ
き層
３・・・ピン体
３１・・・ピン体の頭部下部
Ｓ・・・へこみ形状1 to 5 are schematic partial cross-sectional views of the substrate and the surrounding area of the pin body, showing an example of the method of the present invention in the order of steps; FIG. 6 is a partial cross-sectional schematic view showing a conventional PGA; The figure is PGA
It is a perspective view showing an example. 1...Metal core plate 11...Through hole 2...Secondary hole 21...Through hole inner surface plating layer 3...Pin body 31...Lower part of the head of the pin body S...dent shape
Claims (2)
脂を被覆するとともに貫通孔（１１）内に絶縁性樹脂を
充填してなる基板の貫通孔中心部にスルーホールとスル
ーホール内面にめっき層（２１）を設けて二次孔（２）
を形成し、当該二次孔（２）内に、前もって表面に半田
めっきを施したピン体（３）を頭部で係止するように挿
入し、ついで半田めっきをリフローさせることによりピ
ン体（３）とスルーホール内面めっき層（２１）を固着
させることを特徴とするピン体を設けた半導体搭載用基
板の製造方法。1. A metal core plate (1) having a through hole (11) is coated with an insulating resin, and the through hole (11) is filled with an insulating resin. Provide a plating layer (21) and create secondary holes (2)
A pin body (3) whose surface has been previously plated with solder is inserted into the secondary hole (2) so as to be locked at the head, and then the solder plating is reflowed to form the pin body (3). 3) A method for manufacturing a semiconductor mounting board provided with a pin body, characterized by fixing a through-hole inner surface plating layer (21).
部の絶縁性樹脂のへこみ形状ｓと略同一であることを特
徴とする請求項１記載の半導体搭載用基板の製造方法。2. 2. The method of manufacturing a semiconductor mounting board according to claim 1, wherein the shape of the lower head portion (31) of the pin body (3) is substantially the same as the shape s of the depression in the insulating resin above the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32386890A JPH04192547A (en) | 1990-11-27 | 1990-11-27 | Manufacture of substrate for semiconductor mounting use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32386890A JPH04192547A (en) | 1990-11-27 | 1990-11-27 | Manufacture of substrate for semiconductor mounting use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04192547A true JPH04192547A (en) | 1992-07-10 |
Family
ID=18159493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32386890A Pending JPH04192547A (en) | 1990-11-27 | 1990-11-27 | Manufacture of substrate for semiconductor mounting use |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04192547A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002326252A (en) * | 2001-05-02 | 2002-11-12 | Idemitsu Petrochem Co Ltd | Metal inserted polyphenylene sulfide resin molded part |
| JP2008028376A (en) * | 2006-06-20 | 2008-02-07 | Sanyo Electric Co Ltd | Circuit board, semiconductor module and method of manufacturing circuit board |
| JP2011165836A (en) * | 2010-02-09 | 2011-08-25 | Mitsubishi Electric Corp | Power semiconductor device |
-
1990
- 1990-11-27 JP JP32386890A patent/JPH04192547A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002326252A (en) * | 2001-05-02 | 2002-11-12 | Idemitsu Petrochem Co Ltd | Metal inserted polyphenylene sulfide resin molded part |
| JP2008028376A (en) * | 2006-06-20 | 2008-02-07 | Sanyo Electric Co Ltd | Circuit board, semiconductor module and method of manufacturing circuit board |
| US8378229B2 (en) | 2006-06-20 | 2013-02-19 | Sanyo Electric Co., Ltd. | Circuit board and method for manufacturing semiconductor modules and circuit boards |
| JP2011165836A (en) * | 2010-02-09 | 2011-08-25 | Mitsubishi Electric Corp | Power semiconductor device |
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