JPH04192547A - Manufacture of substrate for semiconductor mounting use - Google Patents
Manufacture of substrate for semiconductor mounting useInfo
- Publication number
- JPH04192547A JPH04192547A JP32386890A JP32386890A JPH04192547A JP H04192547 A JPH04192547 A JP H04192547A JP 32386890 A JP32386890 A JP 32386890A JP 32386890 A JP32386890 A JP 32386890A JP H04192547 A JPH04192547 A JP H04192547A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- pin body
- plated
- solder
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To manufacture a substrate, for semiconductor mounting use, in which a pin body has been installed by a method wherein a plated layer is formed on the inner face of a through hole, a secondary hole is formed, the pin body whose surface has been plated with a solder in advance is inserted into the secondary hole in such a way that it is coupled and stopped by its head part and the plated solder is made to reflow.
CONSTITUTION: A metal core sheet 1 having a through hole 11 is coated with an insulating resin; a plated layer 21 is formed on the inner face of the through hole in the through-hole central part in the substrate where the insulating resin has been filled into the through hole 11; a secondary hole 2 is formed. A pin body 3 whose surface has been plated with a solder in advance is inserted into the secondary hole 2 in such a way that it is couple and stopped by its head part. Then, the plated solder is made to reflow; the pin body 3 is fixed and bonded to the plated layer 21 on the inner face of the through hole. In this case, the solder which has been plated in advance on the surface of the pin body 3 acts as a bonding material which is made to reflow and melted easily so as to fix and bond the pin body to the secondary hole after the pin body has been inserted into the secondary hole. Thereby, the pin body 3 can be fixed and bonded easily to the substrate, and a process is shortened.
COPYRIGHT: (C)1992,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32386890A JPH04192547A (en) | 1990-11-27 | 1990-11-27 | Manufacture of substrate for semiconductor mounting use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32386890A JPH04192547A (en) | 1990-11-27 | 1990-11-27 | Manufacture of substrate for semiconductor mounting use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04192547A true JPH04192547A (en) | 1992-07-10 |
Family
ID=18159493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32386890A Pending JPH04192547A (en) | 1990-11-27 | 1990-11-27 | Manufacture of substrate for semiconductor mounting use |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04192547A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002326252A (en) * | 2001-05-02 | 2002-11-12 | Idemitsu Petrochem Co Ltd | Metal inserted polyphenylene sulfide resin molded part |
| JP2008028376A (en) * | 2006-06-20 | 2008-02-07 | Sanyo Electric Co Ltd | Circuit board, semiconductor module and method of manufacturing circuit board |
| JP2011165836A (en) * | 2010-02-09 | 2011-08-25 | Mitsubishi Electric Corp | Power semiconductor device |
-
1990
- 1990-11-27 JP JP32386890A patent/JPH04192547A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002326252A (en) * | 2001-05-02 | 2002-11-12 | Idemitsu Petrochem Co Ltd | Metal inserted polyphenylene sulfide resin molded part |
| JP2008028376A (en) * | 2006-06-20 | 2008-02-07 | Sanyo Electric Co Ltd | Circuit board, semiconductor module and method of manufacturing circuit board |
| US8378229B2 (en) | 2006-06-20 | 2013-02-19 | Sanyo Electric Co., Ltd. | Circuit board and method for manufacturing semiconductor modules and circuit boards |
| JP2011165836A (en) * | 2010-02-09 | 2011-08-25 | Mitsubishi Electric Corp | Power semiconductor device |
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