JP2002307029A - Cleaning sheet, and method for cleaning board treatment device using the same - Google Patents
Cleaning sheet, and method for cleaning board treatment device using the sameInfo
- Publication number
- JP2002307029A JP2002307029A JP2000230339A JP2000230339A JP2002307029A JP 2002307029 A JP2002307029 A JP 2002307029A JP 2000230339 A JP2000230339 A JP 2000230339A JP 2000230339 A JP2000230339 A JP 2000230339A JP 2002307029 A JP2002307029 A JP 2002307029A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- layer
- cleaning sheet
- cleaning layer
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種の基板処理装
置をクリーニングするシート、及びこれを用いた基板処
理装置のクリーニング方法に関し、例えば、半導体、フ
ラットパネルディスプレイ、プリント基板などの製造装
置や検査装置など、異物を嫌う基板処理装置のクリーニ
ングシート及びクリーニング方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet for cleaning various types of substrate processing apparatuses and a method for cleaning a substrate processing apparatus using the same. 1. Field of the Invention The present invention relates to a cleaning sheet and a cleaning method for a substrate processing apparatus that dislikes foreign substances, such as an apparatus.
【０００２】[0002]
【従来の技術】各種基板処理装置は、各搬送系と基板と
を物理的に接触させながら搬送する。その際、基板や搬
送系に異物が付着していると、後続の基板を次々に汚染
することになり、定期的に装置を停止させ、洗浄処理を
する必要があった。このため、稼働率低下や多大な労力
が必要になるという問題があった。これらの問題を解決
するため、粘着性の物質を固着した基板を搬送すること
により基板処理装置内の付着した異物をクリーニング除
去する方法が提案されている（例えば特開平１０−１５
４６８６号）。2. Description of the Related Art Various substrate processing apparatuses transport substrates while physically contacting each transport system with a substrate. At that time, if foreign matter is attached to the substrate or the transport system, the subsequent substrate is contaminated one after another, and it is necessary to periodically stop the apparatus and perform a cleaning process. For this reason, there has been a problem that the operation rate is reduced and a large amount of labor is required. In order to solve these problems, there has been proposed a method of cleaning and removing adhered foreign matter in a substrate processing apparatus by transporting a substrate to which an adhesive substance is adhered (for example, Japanese Patent Application Laid-Open No. H10-15).
No. 4686).
【０００３】[0003]
【発明が解決しようとする課題】粘着性の物質を固着し
た基板を搬送することにより基板処理装置内の付着した
異物をクリーニング除去する方法は、前述の課題を克服
する有効な方法である。しかしこの方法では粘着性物質
と装置接触部とが強く接着しすぎて剥れない恐れがあ
り、基板を確実に搬送できなくなる恐れがあった。本発
明は、このような事情に照らし、基板処理装置内に基板
を確実に搬送できると共に、装置内に付着している異物
を簡便に低減できるクリーニングシートを提供すること
を目的としている。A method for cleaning and removing foreign substances adhered in a substrate processing apparatus by transporting a substrate to which an adhesive substance is fixed is an effective method for overcoming the above-mentioned problems. However, in this method, the sticky substance and the device contact portion may be so strongly adhered that they cannot be peeled off, and the substrate may not be transported reliably. In view of such circumstances, an object of the present invention is to provide a cleaning sheet that can surely transport a substrate into a substrate processing apparatus and can easily reduce foreign substances attached to the apparatus.
【０００４】[0004]
【課題を解決するための手段】本発明者らは、上記の目
的を達成するために、鋭意検討した結果、クリーニング
シートあるいはクリーニングシートを設けた基板等の搬
送部材を搬送することにより、基板処理装置内の付着し
た異物をクリーニング除去するにあたり、該クリーニン
グ層の表面自由エネルギーを特定値未満とすることによ
り、基板処理装置内を確実に搬送でき、さらに異物も簡
便に低減できることを見出し、本発明を完成するに至つ
た。Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, transported a cleaning member or a transport member such as a substrate provided with a cleaning sheet, thereby achieving substrate processing. The present invention has been found that, when cleaning and removing foreign substances adhered in the apparatus, by setting the surface free energy of the cleaning layer to a value less than a specific value, it is possible to reliably transport the inside of the substrate processing apparatus and further easily reduce foreign substances. Was completed.
【０００５】即ち本発明は、クリーニング層が、表面自
由エネルギーが３０ｍＪ／ｍ2未満である物質からなる
クリーニングシート（請求項１）、支持体の少なくとも
片面に、表面自由エネルギーが３０ｍＪ／ｍ2未満であ
るクリーニング層が設けられてなるクリーニングシート
（請求項２）、支持体の片面に表面自由エネルギーが３
０ｍＪ／ｍ2未満であるクリーニング層が設けられ、他
面に通常の粘着剤層が設けられてなるクリーニングシー
ト（請求項３）、クリーニング層の水の接触角が、９０
度を超えることを特徴とする請求項１〜３いずれか記載
のクリーニングシート（請求項４）、クリーニング層
が、実質的に粘着性を有さず、引張り強さが２０００Ｍ
Ｐａ以下であることを特徴とする請求項１〜４いずれか
記載のクリーニングシート（請求項５）、クリーニング
層が、活性エネルギーにより硬化されてなる粘着剤層で
あることを特徴とする請求項１〜５いずれか記載のクリ
ーニングシート（請求項６）などに係るものである。[0005] The present invention provides the cleaning layer, the cleaning sheet surface free energy is formed of material less than 30 mJ / m 2 (claim 1), on at least one surface of the support, the surface free energy of less than 30 mJ / m 2 A cleaning sheet provided with a cleaning layer having a surface free energy of 3
A cleaning sheet having a cleaning layer having a thickness of less than 0 mJ / m 2 and a normal pressure-sensitive adhesive layer provided on the other surface (Claim 3).
The cleaning sheet according to any one of claims 1 to 3, wherein the cleaning layer has substantially no tackiness and a tensile strength of 2000M.
The cleaning sheet according to any one of claims 1 to 4, wherein the pressure is equal to or less than Pa (claim 5), and the cleaning layer is an adhesive layer cured by active energy. (5) The cleaning sheet according to any one of (5) to (5).
【０００６】[0006]
【発明の実施の形態】本発明のクリーニングシートのク
リーニング層は、その表面自由エネルギーが３０ｍＪ／
ｍ2未満、好ましくは２５〜１５ｍＪ／ｍ2であることが
必要である。本発明においてクリーニング層（固体）の
表面自由エネルギーとは、クリーニング層表面に対して
水およびヨウ化メチレンを用いてそれぞれ接触角を測定
し、この測定値と接触角測定液体の表面自由エネルギー
値（文献より既知）を、Youngの式および拡張Fowkesの
式から導かれる下記の式１に代入し、得られる二つの式
を連立一次方程式として解くことにより、求められる固
体の表面自由エネルギー値を意味するものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS The cleaning layer of the cleaning sheet of the present invention has a surface free energy of 30 mJ /.
It needs to be less than m 2 , preferably 25 to 15 mJ / m 2 . In the present invention, the surface free energy of the cleaning layer (solid) refers to the contact angle of the cleaning layer surface measured with water and methylene iodide, and the measured value and the surface free energy value of the contact angle measurement liquid ( (Known from the literature) into the following equation 1 derived from Young's equation and the extended Fowkes equation, and solves the resulting two equations as a system of linear equations, meaning the surface free energy value of the solid obtained. Things.
【０００７】＜式１＞ （１＋ｃｏｓθ）γL＝２・■ルート（γs dγL d）＋２
・■ルート（γs pγL p） ただし、式中の各記号は、それぞれ以下の通りである。 θ：接触角 γL：接触角測定液体の表面自由エネルギー γL d：γLにおける分散力成分 γL p：γLにおける極性力成分 γs d：固体の表面自由エネルギーにおける分散力成分 γs p：固体の表面自由エネルギーにおける極性力成分<Equation 1> (1 + cos θ) γ L = 2 ■ root (γ s d γ L d ) +2
· ■ However Route (γ s p γ L p) , wherein each symbol is as follows. theta: contact angle gamma L: the surface of the contact angle measurement liquid free energy γ L d: γ dispersion force component in L γ L p: polar force component gamma s d in gamma L: dispersion force component in the surface free energy of the solid gamma s p : Polar force component in surface free energy of solid
【０００８】また、クリーニング層表面の水の接触角は
９０度を超える、好ましくは１００度以上となるように
するのが望ましい。 本発明においては、クリーニング
層の表面自由エネルギーや水の接触角をこのような特定
の範囲に設定することにより、クリーニングシートなど
の搬送時にクリーニング層が被クリーニング部位と強く
接着することがなく、確実に搬送できるという効果が得
られる。また、クリーニング層の引張り強さ（試験法Ｊ
ＩＳ Ｋ７１２７に準ずる）が、２０００ＭＰａ以下、
好ましくは１ＭＰａより大きいことが望ましく、かかる
範囲内に設計することにより、クリーニング層が実質的
に粘着性を有さず、搬送トラブルを発生することなく、
異物を除去することができる。Further, it is desirable that the contact angle of water on the surface of the cleaning layer is more than 90 degrees, preferably 100 degrees or more. In the present invention, by setting the surface free energy of the cleaning layer and the contact angle of water in such a specific range, the cleaning layer does not strongly adhere to the portion to be cleaned when the cleaning sheet or the like is conveyed. The effect of being able to be conveyed is obtained. Also, the tensile strength of the cleaning layer (test method J
IS K7127) but 2000 MPa or less,
Preferably, it is more than 1 MPa, and by designing within such a range, the cleaning layer has substantially no tackiness, and does not cause transport trouble.
Foreign matter can be removed.
【０００９】かかるクリーニング層は、その表面自由エ
ネルギーが上記の特定値未満であればその材質などは特
に限定されないが、紫外線や熱などの活性エネルギー源
により硬化、架橋して、その分子構造が三次元網状化し
て粘着力が低下もしくは消失した粘着剤層が好ましい。
かかる粘着剤層を用いると、搬送時にクリーニング層
が被クリーニング部と強く接着することがなく、確実に
搬送できる。 またクリーニング層の厚さは特に限定さ
れないが、通常５〜１００μｍ程度である。The material of the cleaning layer is not particularly limited as long as its surface free energy is less than the above-mentioned specific value. However, the cleaning layer is cured and cross-linked by an active energy source such as ultraviolet light or heat to have a tertiary molecular structure. A pressure-sensitive adhesive layer in which the adhesive force has been reduced or disappeared due to a reticulated network is preferable.
When such a pressure-sensitive adhesive layer is used, the cleaning layer does not strongly adhere to the portion to be cleaned at the time of transport, and can be transported reliably. The thickness of the cleaning layer is not particularly limited, but is usually about 5 to 100 μm.
【００１０】かかるクリーニング層の具体例としては、
例えば感圧接着性ポリマーに分子内に不飽和二重結合を
１個以上有する化合物と重合開始剤を少なくとも含有さ
せたものを、活性エネルギーにより重合硬化反応させて
粘着性が実質的に消失されてなるものが挙げられる。
かかる感圧接着性ポリマーとしては、例えばアクリル
酸、アクリル酸エステル、メタクリル酸、メタクリル酸
エステルから選ばれる（メタ）アクリル酸及び／又は
（メタ）アクリル酸エステルを主モノマーとしたアクリ
ル系ポリマーが挙げられる。このアクリル系ポリマーの
合成にあたり、共重合モノマーとして分子内に不飽和二
重結合を２個以上有する化合物を用いるか、あるいは合
成後のアクリル系ポリマーに分子内に不飽和二重結合を
有する化合物を官能基間の反応で化学結合させるなどし
て、アクリル系ポリマーの分子内に不飽和二重結合を導
入しておくことにより、このポリマー自体も活性エネル
ギーにより重合硬化反応に関与させるようにすることも
できる。As a specific example of such a cleaning layer,
For example, a pressure-sensitive adhesive polymer containing at least a compound having at least one unsaturated double bond in a molecule and a polymerization initiator is subjected to a polymerization curing reaction by active energy to substantially eliminate tackiness. What is.
Examples of such a pressure-sensitive adhesive polymer include acrylic polymers having a main monomer of (meth) acrylic acid and / or (meth) acrylic ester selected from acrylic acid, acrylic acid ester, methacrylic acid, and methacrylic acid ester. Can be In synthesizing this acrylic polymer, a compound having two or more unsaturated double bonds in the molecule is used as a copolymerization monomer, or a compound having an unsaturated double bond in the molecule is synthesized from the synthesized acrylic polymer. By introducing an unsaturated double bond into the molecule of the acrylic polymer, for example, by chemically bonding through a reaction between functional groups, the polymer itself can be involved in the polymerization curing reaction by active energy. Can also.
【００１１】ここで、分子内に不飽和二重結合を１個以
上有する化合物（以下、重合性不飽和化合物という）と
しては、不揮発性でかつ重量平均分子量が１００００以
下の低分子量体であるのがよく、特に硬化時の接着剤層
の三次元網状化が効率よくなされるように、５０００以
下の分子量を有しているのが好ましい。また、クリーニ
ング層に添加される重合開始剤は、特に限定されず公知
のものを使用でき、例えば活性エネルギー源に熱を用い
る場合は、ベンゾイルパーオキサイド、アゾビスイソブ
チロニトリルなどの熱重合開始剤、また光を用いる場合
は、ベンゾイル、ベンゾインエチルエーテル、シベンジ
ル、イソプロピルベンゾインエーテル、ベンゾフェノ
ン、ミヒラーズケトンクロロチオキサントン、ドデシル
チオキサントン、ジメチルチオキサントン、アセトフェ
ノンジエチルケタール、ベンジルジメチルケタール、α
−ヒドルキシシクロヒキシルフェニルケトン、２−ヒド
ロキシジメチルフェニルプロパン、２，２−ジメトキシ
−２−フェニルアセトフェノンなどの光重合開始剤が挙
げられる。Here, the compound having one or more unsaturated double bonds in the molecule (hereinafter referred to as a polymerizable unsaturated compound) is a low molecular weight compound which is nonvolatile and has a weight average molecular weight of 10,000 or less. In particular, the adhesive layer preferably has a molecular weight of 5,000 or less so that the three-dimensional network of the adhesive layer at the time of curing can be efficiently formed. The polymerization initiator to be added to the cleaning layer is not particularly limited, and a known initiator can be used. For example, when heat is used as an active energy source, a thermal polymerization initiator such as benzoyl peroxide or azobisisobutyronitrile is used. When light is used, benzoyl, benzoin ethyl ether, cibenzyl, isopropyl benzoin ether, benzophenone, Michler's ketone chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, acetophenone diethyl ketal, benzyl dimethyl ketal, α
Photopolymerization initiators such as -hydroxyloxycyclohexylphenyl ketone, 2-hydroxydimethylphenylpropane and 2,2-dimethoxy-2-phenylacetophenone.
【００１２】またかかるクリーニング層が支持体に設け
られる場合（請求項２）の支持体としては特に限定され
ないが、例えばポリエチレン、ポリエチレンテレフタレ
ート、アセチルセルロース、ポリカーボネート、ポリプ
ロピレン、ポリアミド、ポリイミド、ポリカルボジイミ
ドなどのプラスチックフィルムなどが挙げられる。その
厚みは通常１０〜１００μｍ程度である。When the cleaning layer is provided on the support (claim 2), the support is not particularly limited. Examples of the support include polyethylene, polyethylene terephthalate, acetylcellulose, polycarbonate, polypropylene, polyamide, polyimide, and polycarbodiimide. Plastic films and the like can be mentioned. Its thickness is usually about 10 to 100 μm.
【００１３】本発明はさらに、支持体の片面にクリーニ
ング層が設けられ、他面に通常の粘着剤層が設けられて
なるクリーニングシート（請求項３）も提供する。 こ
の通常の粘着剤層は、粘着機能を満たす限りその材質な
どは特に限定されず、通常の粘着剤（例えばアクリル
系、ゴム系など）を用いることができる。かかる構成と
することにより、クリーニングシートを通常の粘着剤層
により各種基板や他のテープ・シートなどの搬送部材に
貼り付けて、クリーニング機能付き搬送部材として装置
内に搬送して、被洗浄部位に接触させてクリーニングす
ることができる。 また、上記の基板などの搬送部材を
再利用するために、クリーニング後に基板をかかる粘着
剤層から剥がす場合は、かかる通常の粘着剤層の粘着力
は再剥離できる範囲であれば特に限定されないが、シリ
コンウエハ（ミラー面）に対する１８０°引き剥がし粘
着力が０．２０〜０．９８Ｎ／１０ｍｍ、特に０．４０
〜０．９８Ｎ／１０ｍｍ程度であれば、搬送中に剥離す
ることなく、かつクリーニング後に容易に再剥離できる
ので好ましい。The present invention further provides a cleaning sheet in which a cleaning layer is provided on one side of a support and a normal pressure-sensitive adhesive layer is provided on the other side. The material and the like of the normal pressure-sensitive adhesive layer are not particularly limited as long as the pressure-sensitive adhesive function is satisfied, and a normal pressure-sensitive adhesive (for example, acrylic or rubber-based) can be used. With this configuration, the cleaning sheet is attached to a transport member such as various substrates or other tapes / sheets with a normal pressure-sensitive adhesive layer, and is transported into the apparatus as a transport member with a cleaning function, so that the cleaning sheet is applied to a portion to be cleaned. It can be cleaned by contact. Further, in order to reuse the transfer member such as the substrate, when the substrate is peeled off from the pressure-sensitive adhesive layer after cleaning, the adhesive force of the normal pressure-sensitive adhesive layer is not particularly limited as long as the pressure-sensitive adhesive layer can be peeled off. 180 ° peel adhesion to silicon wafer (mirror surface) is 0.20 to 0.98 N / 10 mm, especially 0.40
A thickness of about 0.98 N / 10 mm is preferable because it can be easily peeled off after cleaning without peeling during transport.
【００１４】クリーニングシートが貼り付けられる搬送
部材としては特に限定されないが、例えば半導体ウエ
ハ、ＬＣＤ、ＰＤＰなどのフラットパネルディスプレイ
用基板、その他コンパクトディスク、ＭＲヘッドなどの
基板などが挙げられる。The transport member to which the cleaning sheet is adhered is not particularly limited, and examples thereof include semiconductor wafers, substrates for flat panel displays such as LCDs and PDPs, and other substrates such as compact disks and MR heads.
【００１５】[0015]
【実施例】以下、本発明を実施例に基づいて説明する
が、本発明はこれらに限定されるものではない。 な
お、以下、部とあるのは重量部を意味するものとする。 実施例 アクリル酸−２−エチルヘキシル３０部、アクリル酸メ
チル７０部、及びアクリル酸１０部からなるモノマ―混
合液から得たアクリルポリマー（重量平均分子量２８０
万）１００部に対して、ジペンタエリストロールヘキサ
アクリレート（日本合成化学社製：商品名：ＵＶ １７
００Ｂ）１５０部、ポリイソシアネート化合物（日本ポ
リウレタン工業製：商品名：コロネートＬ）３部、およ
び光重合開始剤としてベンジルジメチルケタール（チバ
・スペシャリティケミカルズ製：商品名：イルガキュア
ー６５１）１０部を均一に混合して、紫外線硬化型粘着
剤溶液Ａを調整した。 このクリーニング層用粘着剤に
中心波長３６５ｎｍの紫外線を積算光量１０００ｍＪ／
ｃｍ2照射して硬化させたところ、クリーニング層の表
面は実質的に粘着性は有しておらず、クリーニング層の
紫外線硬化後の引張り強さは１４４０ＭＰａであった。
ここで引張り強さは、試験法ＪＩＳ Ｋ７１２７に準
じて測定した。一方、アクリル酸−２−エチルヘキシル
７５部、アクリル酸メチル２０部、及びアクリル酸５部
からなるモノマ―混合液から得たアクリルポリマー（重
量平均分子量７０万）１００部に対して、ポリエチレン
グリコ―ル２００ジメタクリレ―ト（新中村化学製：商
品名：ＮＫエステル４Ｇ）５０部、ウレタンアクリレ―
ト（新中村化学製：商品名：Ｕ−Ｎ−０１）５０部、お
よびポリイソシアネート化合物（日本ポリウレタン工業
製：商品名：コロネートＬ）３部を均一に混合して、感
圧性粘着剤溶液Ｂを調整した。この感圧性粘着剤溶液Ｂ
を、幅２５０ｍｍ、厚み２５μｍのポリエステル製支持
体フィルムの片面に、乾燥後の厚みが１０μｍになるよ
うに塗布して通常の粘着剤層を設け、その表面に厚み３
８μｍのポリエステル系剥離フィルムを貼った。 次に
支持体フィルムのもう一方の側に、前記の紫外線硬化型
粘着剤溶液Ａを乾燥後の厚みが１０μｍになるように塗
布してクリーニング層を設け、その表面に同様の剥離フ
ィルムを貼った。このシートに中心波長３６５ｎｍの紫
外線を積算光量１０００ｍＪ／ｃｍ2照射して、本発明
のクリーニングシートを得た。 このクリーニングシー
トのクリーニング層側の剥離フィルムを剥がし、このク
リーニング層の表面自由エネルギーを測定したところ、
１８．４ｍＪ／ｍ2、水の接触角は１０５．１度であっ
た。EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. Hereinafter, “parts” means “parts by weight”. Example An acrylic polymer (weight average molecular weight 280) obtained from a monomer mixture consisting of 30 parts of 2-ethylhexyl acrylate, 70 parts of methyl acrylate, and 10 parts of acrylic acid
100,000 parts per 100 parts of dipentaerythrol hexaacrylate (manufactured by Nippon Synthetic Chemical Co., Ltd .: trade name: UV 17
00B) 150 parts, 3 parts of a polyisocyanate compound (manufactured by Nippon Polyurethane Industry: trade name: Coronate L), and 10 parts of benzyldimethyl ketal (manufactured by Ciba Specialty Chemicals: trade name: Irgacure 651) as a photopolymerization initiator. To prepare an ultraviolet-curable pressure-sensitive adhesive solution A. Ultraviolet light having a central wavelength of 365 nm was applied to the cleaning layer adhesive at an integrated light amount of 1000 mJ /
When cured by irradiation with cm 2 , the surface of the cleaning layer had substantially no tackiness, and the tensile strength of the cleaning layer after ultraviolet curing was 1440 MPa.
Here, the tensile strength was measured according to the test method JIS K7127. On the other hand, 100 parts of an acrylic polymer (weight-average molecular weight: 700,000) obtained from a monomer mixture comprising 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate, and 5 parts of acrylic acid are mixed with polyethylene glycol. 50 parts of 200 dimethacrylate (manufactured by Shin-Nakamura Chemical: trade name: NK ester 4G), urethane acrylate
(Shin-Nakamura Chemical: trade name: UN-01) 50 parts and polyisocyanate compound (trade name: Coronate L, manufactured by Nippon Polyurethane Industry Co., Ltd.) 3 parts are uniformly mixed to obtain a pressure-sensitive adhesive solution B. Was adjusted. This pressure-sensitive adhesive solution B
Is applied on one side of a polyester support film having a width of 250 mm and a thickness of 25 μm so that the thickness after drying becomes 10 μm to provide a normal pressure-sensitive adhesive layer.
An 8 μm polyester release film was applied. Next, on the other side of the support film, the above-mentioned ultraviolet-curable pressure-sensitive adhesive solution A was applied so that the thickness after drying became 10 μm, a cleaning layer was provided, and a similar release film was stuck on the surface thereof. . The sheet was irradiated with an integrated amount of light of 1000 mJ / cm 2 with ultraviolet rays having a central wavelength of 365 nm to obtain a cleaning sheet of the present invention. When the release film on the cleaning layer side of the cleaning sheet was peeled off and the surface free energy of the cleaning layer was measured,
The contact angle with water was 18.4 mJ / m 2 and the water contact angle was 105.1 degrees.
【００１６】このクリーニングシートの通常の粘着剤層
側の剥離フィルムを剥がし、８ｉｎｃｈのシリコンウエ
ハの裏面（ミラー面）にハンドローラで貼り付け、クリ
ーニング機能付き搬送用クリーニングウエハを作製し
た。The release film on the normal pressure-sensitive adhesive layer side of the cleaning sheet was peeled off and affixed to the back surface (mirror surface) of an 8-inch silicon wafer with a hand roller to produce a transport cleaning wafer having a cleaning function.
【００１７】一方、基板処理装置のウエハステージを取
り外し、レーザー式異物測定装置で、０．３μｍ以上の
異物を測定したところ、８ｉｎｃｈウエハサイズのエリ
ア内で２１０００個であった。On the other hand, when the wafer stage of the substrate processing apparatus was removed, and a foreign substance having a size of 0.3 μm or more was measured by a laser type foreign substance measuring apparatus, the number of foreign substances was 21,000 in an 8-inch wafer size area.
【００１８】次いでこのクリーニングウエハのクリーニ
ング層側の剥離フィルムを剥がし、基板処理装置内に搬
送させたところ、１００枚連続搬送させても、クリーニ
ング層が被クリーニング部位と強く接着することはまっ
たく起こらず、問題なくクリーニング搬送できた。ま
た、その後にウエハステージを取り外し、レーザー式異
物測定装置で０．３μｍ以上の異物を測定したところ、
８ｉｎｃｈウエハサイズのエリア内で１００００個とな
っており、クリーニング前に付着していた異物数の半分
に低減することができた。Next, when the release film on the cleaning layer side of the cleaning wafer was peeled off and transported into the substrate processing apparatus, the cleaning layer did not strongly adhere to the portion to be cleaned even when 100 wafers were continuously transported. , Cleaning cleaning was carried out without any problem. After that, the wafer stage was removed, and a foreign substance of 0.3 μm or more was measured with a laser type foreign substance measuring device.
The number was 10,000 in the area of the 8-inch wafer size, which was able to be reduced to half of the number of foreign substances adhered before cleaning.
【００１９】比較例 クリーニング層用粘着剤として、アクリル酸−２−エチ
ルヘキシル３０部、アクリル酸メチル７０部、及びアク
リル酸１０部からなるモノマ―混合液から得たアクリル
ポリマー（重量平均分子量２８０万）１００部に対し
て、ポリエチレングリコ―ル２００ジメタクリレ―ト
（新中村化学製：商品名：ＮＫエステル４Ｇ）１００
部、ポリエチレングリコ―ル６００ジアクリレ―ト（新
中村化学製：商品名：ＮＫエステルＡ−６００）１００
部、ポリイソシアネート化合物（日本ポリウレタン工業
製：商品名：コロネートＬ）３部を均一に混合して調整
した粘着剤溶液Ｃを用いた。 このクリーニング層の引
張り強さを実施例と同様にして測定したところ、０．１
ＭＰａであった。実施例と同様にしてクリーニングシー
トを作製し、このクリーニング層の表面自由エネルギー
を測定したところ、５７．３ｍＪ／ｍ2、水の接触角は
４９．４度であった。Comparative Example As an adhesive for a cleaning layer, an acrylic polymer (weight average molecular weight: 2.8 million) obtained from a monomer mixture composed of 30 parts of 2-ethylhexyl acrylate, 70 parts of methyl acrylate, and 10 parts of acrylic acid 100 parts by weight of polyethylene glycol 200 dimethacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd .: trade name: NK ester 4G) 100
Part, polyethylene glycol 600 diacrylate (trade name: NK Ester A-600, manufactured by Shin-Nakamura Chemical)
And PSA solution C prepared by uniformly mixing 3 parts of a polyisocyanate compound (manufactured by Nippon Polyurethane Industry: trade name: Coronate L). When the tensile strength of this cleaning layer was measured in the same manner as in the example, it was 0.1%.
MPa. A cleaning sheet was prepared in the same manner as in the example, and the surface free energy of the cleaning layer was measured. The result was 57.3 mJ / m 2 , and the contact angle of water was 49.4 degrees.
【００２０】このクリーニングシートから実施例と同じ
方法で作製した搬送用クリーニングウエハを、基板処理
装置内に搬送させたところ、１枚目でウエハステージに
固着し、搬送できなくなった。When a transfer cleaning wafer produced from the cleaning sheet in the same manner as in the embodiment was transferred into the substrate processing apparatus, the first sheet was fixed to the wafer stage and could not be transferred.
【００２１】[0021]
【発明の効果】以上のように本発明のクリーニングシー
トによれば、基板処理装置内を確実に搬送できると共
に、装置内に付着している異物を簡便に低減することが
できる。As described above, according to the cleaning sheet of the present invention, it is possible to reliably convey the inside of the substrate processing apparatus and to easily reduce foreign substances adhering to the inside of the apparatus.
Claims (8)
が３０ｍＪ／ｍ2未満である物質からなるクリーニング
シート。1. A cleaning sheet wherein the cleaning layer is made of a substance having a surface free energy of less than 30 mJ / m 2 .
ネルギーが３０ｍＪ／ｍ 2未満であるクリーニング層が
設けられてなるクリーニングシート。2. A free surface surface on at least one surface of the support.
Energy is 30mJ / m TwoCleaning layer is less than
Cleaning sheet provided.
０ｍＪ／ｍ2未満であるクリーニング層が設けられ、他
面に通常の粘着剤層が設けられてなるクリーニングシー
ト。3. A support having a surface free energy of 3 on one side.
A cleaning sheet provided with a cleaning layer of less than 0 mJ / m 2 and a normal pressure-sensitive adhesive layer on the other surface.
を超えることを特徴とする請求項１〜３いずれか記載の
クリーニングシート。4. The cleaning sheet according to claim 1, wherein a contact angle of water of the cleaning layer exceeds 90 degrees.
さず、引張り強さが２０００ＭＰａ以下であることを特
徴とする請求項１〜４いずれか記載のクリーニングシー
ト。5. The cleaning sheet according to claim 1, wherein the cleaning layer has substantially no tackiness and has a tensile strength of 2000 MPa or less.
り硬化されてなる粘着剤層であることを特徴とする請求
項１〜５いずれか記載のクリーニングシート。6. The cleaning sheet according to claim 1, wherein the cleaning layer is an adhesive layer cured by activation energy.
粘着剤層を介して搬送部材に設けられてなるクリーニン
グ機能付き搬送部材。7. The cleaning sheet according to claim 3,
A transport member with a cleaning function provided on the transport member via an adhesive layer.
グシート又は請求項７記載の搬送部材を、基板処理装置
内に搬送することを特徴とする基板処理装置のクリーニ
ング方法。8. A method for cleaning a substrate processing apparatus, comprising transporting the cleaning sheet according to claim 1 or the transport member according to claim 7 into a substrate processing apparatus.
Priority Applications (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000230339A JP3740002B2 (en) | 2000-07-31 | 2000-07-31 | Cleaning sheet and substrate processing apparatus cleaning method using the same |
| EP20100011695 EP2266716A2 (en) | 2000-06-06 | 2001-05-08 | Cleaning member |
| CNB018106811A CN100400185C (en) | 2000-06-06 | 2001-05-08 | Cleaning sheet conveying member using the same and substrate processing equipment cleaning method using them |
| EP07004040.7A EP1782894A3 (en) | 2000-06-06 | 2001-05-08 | Process for preparing a conveying member with a cleaning function and cleaning sheet for use in the process |
| PCT/JP2001/003848 WO2001094036A1 (en) | 2000-06-06 | 2001-05-08 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| MYPI20012130A MY135752A (en) | 2000-06-06 | 2001-05-08 | Cleaning member |
| US10/297,173 US7713356B2 (en) | 2000-06-06 | 2001-05-08 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| KR1020027016584A KR100786437B1 (en) | 2000-06-06 | 2001-05-08 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| DE2001629687 DE60129687T2 (en) | 2000-06-06 | 2001-05-08 | CLEANING ELEMENT |
| EP20100011696 EP2266717A2 (en) | 2000-06-06 | 2001-05-08 | Cleaning member |
| EP01926156A EP1286792B1 (en) | 2000-06-06 | 2001-05-08 | Cleaning member |
| US11/014,779 US7793668B2 (en) | 2000-06-06 | 2004-12-20 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| US11/229,586 US20060105164A1 (en) | 2000-06-06 | 2005-09-20 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| US12/851,797 US20100319151A1 (en) | 2000-06-06 | 2010-08-06 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000230339A JP3740002B2 (en) | 2000-07-31 | 2000-07-31 | Cleaning sheet and substrate processing apparatus cleaning method using the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005242841A Division JP4163705B2 (en) | 2005-08-24 | 2005-08-24 | Conveying member with cleaning function and method for cleaning substrate processing apparatus using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002307029A true JP2002307029A (en) | 2002-10-22 |
| JP3740002B2 JP3740002B2 (en) | 2006-01-25 |
Family
ID=18723312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000230339A Expired - Fee Related JP3740002B2 (en) | 2000-06-06 | 2000-07-31 | Cleaning sheet and substrate processing apparatus cleaning method using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3740002B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201723121A (en) * | 2015-09-01 | 2017-07-01 | Lintec Corp | Adhesive sheet |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08203857A (en) * | 1995-01-30 | 1996-08-09 | Nitto Denko Corp | Adhesive tape for eliminating foreign object on semiconductor wafer |
| JPH10154686A (en) * | 1996-11-22 | 1998-06-09 | Toshiba Corp | Method of cleaning semiconductor substrate processing device |
-
2000
- 2000-07-31 JP JP2000230339A patent/JP3740002B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08203857A (en) * | 1995-01-30 | 1996-08-09 | Nitto Denko Corp | Adhesive tape for eliminating foreign object on semiconductor wafer |
| JPH10154686A (en) * | 1996-11-22 | 1998-06-09 | Toshiba Corp | Method of cleaning semiconductor substrate processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3740002B2 (en) | 2006-01-25 |
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