JP2002299481A5 - - Google Patents

Download PDF

Info

Publication number
JP2002299481A5
JP2002299481A5 JP2001106252A JP2001106252A JP2002299481A5 JP 2002299481 A5 JP2002299481 A5 JP 2002299481A5 JP 2001106252 A JP2001106252 A JP 2001106252A JP 2001106252 A JP2001106252 A JP 2001106252A JP 2002299481 A5 JP2002299481 A5 JP 2002299481A5
Authority
JP
Japan
Prior art keywords
electronic component
metal layer
container
opening frame
component package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001106252A
Other languages
English (en)
Japanese (ja)
Other versions
JP3831937B2 (ja
JP2002299481A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001106252A priority Critical patent/JP3831937B2/ja
Priority claimed from JP2001106252A external-priority patent/JP3831937B2/ja
Publication of JP2002299481A publication Critical patent/JP2002299481A/ja
Publication of JP2002299481A5 publication Critical patent/JP2002299481A5/ja
Application granted granted Critical
Publication of JP3831937B2 publication Critical patent/JP3831937B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2001106252A 2001-04-04 2001-04-04 電子部品用パッケージ Expired - Fee Related JP3831937B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001106252A JP3831937B2 (ja) 2001-04-04 2001-04-04 電子部品用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001106252A JP3831937B2 (ja) 2001-04-04 2001-04-04 電子部品用パッケージ

Publications (3)

Publication Number Publication Date
JP2002299481A JP2002299481A (ja) 2002-10-11
JP2002299481A5 true JP2002299481A5 (cg-RX-API-DMAC10.html) 2004-11-25
JP3831937B2 JP3831937B2 (ja) 2006-10-11

Family

ID=18958792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001106252A Expired - Fee Related JP3831937B2 (ja) 2001-04-04 2001-04-04 電子部品用パッケージ

Country Status (1)

Country Link
JP (1) JP3831937B2 (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7569926B2 (en) * 2005-08-26 2009-08-04 Innovative Micro Technology Wafer level hermetic bond using metal alloy with raised feature
JP6305713B2 (ja) * 2013-09-24 2018-04-04 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージの製造方法
US12015001B2 (en) * 2022-03-15 2024-06-18 Taiwan Semiconductor Manufacturing Company Ltd. Bonding structure and method thereof
JP7900190B2 (ja) * 2022-05-27 2026-08-04 太陽誘電株式会社 電子部品、フィルタおよびマルチプレクサ

Similar Documents

Publication Publication Date Title
JP2009545001A5 (cg-RX-API-DMAC10.html)
KR100952096B1 (ko) 전자 부품 패키지용 덮개 및 그 덮개의 제조 방법
WO2004101368A3 (en) Closure seal for a container
KR840007700A (ko) 개봉이 용이한 히이트 시일 뚜껑
JPH11278482A (ja) 開封用把手を有する容器蓋
JP2013171907A5 (cg-RX-API-DMAC10.html)
JP2007019403A5 (cg-RX-API-DMAC10.html)
JP2005353885A5 (cg-RX-API-DMAC10.html)
JP3751414B2 (ja) キャリアテープ、その製造方法、その製造装置およびキャリアテープ体
JP2007173306A5 (cg-RX-API-DMAC10.html)
JP7652160B2 (ja) 電子部品パッケージ及び電子部品パッケージの製造方法
JP2008193581A5 (cg-RX-API-DMAC10.html)
JP5294413B2 (ja) 電子部品の封止装置
JP2009088024A (ja) 電子部品封止体の蓋体、及びそれを用いた電子部品封止体
JP2000294665A (ja) 電子部品およびその製造方法
JP4974284B2 (ja) パッケージの封止方法
JP4339088B2 (ja) 樹脂ボードの端末構造及び端末処理方法
JP2017011249A (ja) 電子部品用パッケージの金属カバー
JP3693450B2 (ja) 固体イメージセンサ装置
JP2001028484A (ja) 電子部品用パッケージ
JP2004304017A (ja) 電子部品パッケ−ジ
JPH03123864U (cg-RX-API-DMAC10.html)
JPS61259903A (ja) 入れものの閉止装置の製造方法
JPH0536298Y2 (cg-RX-API-DMAC10.html)
CA2315601A1 (en) Process for producing a container having a resealable closure