JP2002299282A5 - - Google Patents

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Publication number
JP2002299282A5
JP2002299282A5 JP2001095309A JP2001095309A JP2002299282A5 JP 2002299282 A5 JP2002299282 A5 JP 2002299282A5 JP 2001095309 A JP2001095309 A JP 2001095309A JP 2001095309 A JP2001095309 A JP 2001095309A JP 2002299282 A5 JP2002299282 A5 JP 2002299282A5
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JP
Japan
Prior art keywords
film
forming
metal
silicide film
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001095309A
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English (en)
Japanese (ja)
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JP2002299282A (ja
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Publication date
Application filed filed Critical
Priority to JP2001095309A priority Critical patent/JP2002299282A/ja
Priority claimed from JP2001095309A external-priority patent/JP2002299282A/ja
Publication of JP2002299282A publication Critical patent/JP2002299282A/ja
Publication of JP2002299282A5 publication Critical patent/JP2002299282A5/ja
Withdrawn legal-status Critical Current

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JP2001095309A 2001-03-29 2001-03-29 半導体装置の製造方法 Withdrawn JP2002299282A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001095309A JP2002299282A (ja) 2001-03-29 2001-03-29 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001095309A JP2002299282A (ja) 2001-03-29 2001-03-29 半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006197771A Division JP3971442B2 (ja) 2006-07-20 2006-07-20 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2002299282A JP2002299282A (ja) 2002-10-11
JP2002299282A5 true JP2002299282A5 (cg-RX-API-DMAC7.html) 2005-08-11

Family

ID=18949378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001095309A Withdrawn JP2002299282A (ja) 2001-03-29 2001-03-29 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2002299282A (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4501379B2 (ja) * 2003-09-02 2010-07-14 Ｊｓｒ株式会社 ルテニウム−シリコン混合膜を形成する方法
JP4521327B2 (ja) 2005-07-19 2010-08-11 株式会社東芝 半導体装置の製造方法
WO2007026677A1 (ja) * 2005-09-01 2007-03-08 Nec Corporation 半導体装置の製造方法
US20090045469A1 (en) * 2005-11-28 2009-02-19 Kensuke Takahashi Semiconductor Device and Manufacturing Method Thereof
JP5547877B2 (ja) * 2008-05-23 2014-07-16 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

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