JP2002293560A5 - - Google Patents

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Publication number
JP2002293560A5
JP2002293560A5 JP2001094075A JP2001094075A JP2002293560A5 JP 2002293560 A5 JP2002293560 A5 JP 2002293560A5 JP 2001094075 A JP2001094075 A JP 2001094075A JP 2001094075 A JP2001094075 A JP 2001094075A JP 2002293560 A5 JP2002293560 A5 JP 2002293560A5
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JP
Japan
Prior art keywords
cutting
glass substrate
laser
respect
cutting method
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JP2001094075A
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English (en)
Japanese (ja)
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JP2002293560A (ja
JP3991608B2 (ja
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Priority to JP2001094075A priority Critical patent/JP3991608B2/ja
Priority claimed from JP2001094075A external-priority patent/JP3991608B2/ja
Publication of JP2002293560A publication Critical patent/JP2002293560A/ja
Publication of JP2002293560A5 publication Critical patent/JP2002293560A5/ja
Application granted granted Critical
Publication of JP3991608B2 publication Critical patent/JP3991608B2/ja
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Expired - Fee Related legal-status Critical Current

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JP2001094075A 2001-03-28 2001-03-28 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置 Expired - Fee Related JP3991608B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001094075A JP3991608B2 (ja) 2001-03-28 2001-03-28 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001094075A JP3991608B2 (ja) 2001-03-28 2001-03-28 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007120581A Division JP4775313B2 (ja) 2007-05-01 2007-05-01 レーザ切断方法

Publications (3)

Publication Number Publication Date
JP2002293560A JP2002293560A (ja) 2002-10-09
JP2002293560A5 true JP2002293560A5 (enExample) 2005-02-24
JP3991608B2 JP3991608B2 (ja) 2007-10-17

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ID=18948325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001094075A Expired - Fee Related JP3991608B2 (ja) 2001-03-28 2001-03-28 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置

Country Status (1)

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JP (1) JP3991608B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100906543B1 (ko) * 2004-12-08 2009-07-07 가부시키가이샤 레이져 솔루션즈 피분할체에 있어서의 분할 기점 형성 방법, 피분할체의 분할 방법, 및 펄스 레이저광에 의한 피가공물의 가공방법
CN100481337C (zh) * 2004-12-08 2009-04-22 雷射先进科技株式会社 被分割体的分割起点形成方法、被分割体的分割方法
KR100693947B1 (ko) 2006-05-17 2007-03-12 케이 이엔지(주) 레이저를 이용한 대형 유리의 절단 방법
DE102007008634B3 (de) * 2007-02-16 2008-08-07 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Trennen von Verbundglasscheiben
JP5171294B2 (ja) * 2008-02-06 2013-03-27 株式会社ディスコ レーザ加工方法
JP2009255114A (ja) * 2008-04-15 2009-11-05 Linkstar Japan Co Ltd 脆性材料基板の加工装置および切断方法
JP5074272B2 (ja) * 2008-04-15 2012-11-14 株式会社リンクスタージャパン 脆性材料基板の加工装置および切断方法
JP5220465B2 (ja) * 2008-04-15 2013-06-26 株式会社リンクスタージャパン 脆性材料基板の加工装置および加工方法
KR101010310B1 (ko) * 2008-05-06 2011-01-25 세메스 주식회사 스크라이빙 장치, 그리고 이를 이용한 기판 절단 장치 및방법
JP2012221912A (ja) * 2011-04-14 2012-11-12 Nissan Motor Co Ltd 電極製造方法および電極製造装置
CN113369712B (zh) * 2021-06-23 2023-03-24 业成科技（成都）有限公司 镭射切割方法、装置及计算机可读存储介质

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