JP2007013109A
(ja )
2007-01-18
通信回路モジュール
EP1723836A4
(en )
2007-04-25
PCB TOPOPOLOGY FOR HIGH-FREQUENCY CIRCUIT
TW200635460A
(en )
2006-10-01
Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor
CA2432179A1
(en )
2003-12-27
High efficiency stepped impedance filter
EP2040519A3
(en )
2009-05-06
Wired Circuit Board
EP1274126A3
(en )
2004-12-15
Circuit board, method for manufacturing same, and high-output module
JP2001007456A5
(https= )
2005-01-06
WO2009061789A3
(en )
2009-09-03
Methods of forming magnetic vias to maximize inductance in integrated circuits and structures formed thereby
JP2002009452A5
(https= )
2005-08-11
JP2002280748A5
(https= )
2004-08-19
JPH06181389A
(ja )
1994-06-28
多層印刷配線板
JP2011181642A5
(https= )
2013-02-14
TW200610463A
(en )
2006-03-16
Circuit board and method of manufacturing the same
JP2846803B2
(ja )
1999-01-13
多層配線基板
TW200721929A
(en )
2007-06-01
Method for manufacturing circuit substrate
WO2006023034A3
(en )
2006-10-05
Probe pad arrangement for an integrated circuit and method of forming
WO2017179748A9
(ko )
2017-12-14
인쇄회로기판의 제조방법 및 그 방법에 의해 제조된 인쇄회로기판
TW200802766A
(en )
2008-01-01
Substrate strip and substrate structure and method for manufacturing the same
JPH0680964B2
(ja )
1994-10-12
ストリップラインを有する回路装置
JP2005333011A5
(https= )
2010-02-04
JPH06196832A
(ja )
1994-07-15
スルホール付き絶縁基板
JP2010034951A
(ja )
2010-02-12
インピーダンスマッチング回路及びインピーダンスマッチング方法
JPH09246725A
(ja )
1997-09-19
多層プリント基板のスルーホール
JP2006173400A5
(https= )
2008-02-14
TW200518642A
(en )
2005-06-01
Un-symmetric printed circuit board and method for fabricating the same