TW200518642A - Un-symmetric printed circuit board and method for fabricating the same - Google Patents

Un-symmetric printed circuit board and method for fabricating the same

Info

Publication number
TW200518642A
TW200518642A TW092132535A TW92132535A TW200518642A TW 200518642 A TW200518642 A TW 200518642A TW 092132535 A TW092132535 A TW 092132535A TW 92132535 A TW92132535 A TW 92132535A TW 200518642 A TW200518642 A TW 200518642A
Authority
TW
Taiwan
Prior art keywords
circuit board
fabricating
same
printed circuit
layers
Prior art date
Application number
TW092132535A
Other languages
Chinese (zh)
Other versions
TWI227100B (en
Inventor
Kun-Chen Tsai
Chih-Chin Liao
Lin-Yin Wong
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW92132535A priority Critical patent/TWI227100B/en
Application granted granted Critical
Publication of TWI227100B publication Critical patent/TWI227100B/en
Publication of TW200518642A publication Critical patent/TW200518642A/en

Links

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  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

An un-symmetric semiconductor package substrate and a method for fabricating the same are provided. A plurality of inner substrates formed with patterned circuit layers on surfaces thereof are provided to form a core substrate with an insulating layer formed there between. A multi-layers circuit board is formed with build-up circuit layers on both sides of the core substrate. After the multi-layers circuit board is formed, the insulating layer of the middle portion of the core substrate is removed to form a plurality of printed circuit board with un-symmetric build-up circuit layers.
TW92132535A 2003-11-20 2003-11-20 Un-symmetric printed circuit board and method for fabricating the same TWI227100B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92132535A TWI227100B (en) 2003-11-20 2003-11-20 Un-symmetric printed circuit board and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92132535A TWI227100B (en) 2003-11-20 2003-11-20 Un-symmetric printed circuit board and method for fabricating the same

Publications (2)

Publication Number Publication Date
TWI227100B TWI227100B (en) 2005-01-21
TW200518642A true TW200518642A (en) 2005-06-01

Family

ID=35654749

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92132535A TWI227100B (en) 2003-11-20 2003-11-20 Un-symmetric printed circuit board and method for fabricating the same

Country Status (1)

Country Link
TW (1) TWI227100B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI470757B (en) * 2009-10-22 2015-01-21 Unimicron Technology Corp Package substrate and fabrication method thereof
TWI748758B (en) * 2020-11-20 2021-12-01 健鼎科技股份有限公司 Circuit board having asymmetrical structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI470757B (en) * 2009-10-22 2015-01-21 Unimicron Technology Corp Package substrate and fabrication method thereof
TWI748758B (en) * 2020-11-20 2021-12-01 健鼎科技股份有限公司 Circuit board having asymmetrical structure

Also Published As

Publication number Publication date
TWI227100B (en) 2005-01-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees