TW200518642A - Un-symmetric printed circuit board and method for fabricating the same - Google Patents
Un-symmetric printed circuit board and method for fabricating the sameInfo
- Publication number
- TW200518642A TW200518642A TW092132535A TW92132535A TW200518642A TW 200518642 A TW200518642 A TW 200518642A TW 092132535 A TW092132535 A TW 092132535A TW 92132535 A TW92132535 A TW 92132535A TW 200518642 A TW200518642 A TW 200518642A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- fabricating
- same
- printed circuit
- layers
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
An un-symmetric semiconductor package substrate and a method for fabricating the same are provided. A plurality of inner substrates formed with patterned circuit layers on surfaces thereof are provided to form a core substrate with an insulating layer formed there between. A multi-layers circuit board is formed with build-up circuit layers on both sides of the core substrate. After the multi-layers circuit board is formed, the insulating layer of the middle portion of the core substrate is removed to form a plurality of printed circuit board with un-symmetric build-up circuit layers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92132535A TWI227100B (en) | 2003-11-20 | 2003-11-20 | Un-symmetric printed circuit board and method for fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92132535A TWI227100B (en) | 2003-11-20 | 2003-11-20 | Un-symmetric printed circuit board and method for fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI227100B TWI227100B (en) | 2005-01-21 |
TW200518642A true TW200518642A (en) | 2005-06-01 |
Family
ID=35654749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92132535A TWI227100B (en) | 2003-11-20 | 2003-11-20 | Un-symmetric printed circuit board and method for fabricating the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI227100B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI470757B (en) * | 2009-10-22 | 2015-01-21 | Unimicron Technology Corp | Package substrate and fabrication method thereof |
TWI748758B (en) * | 2020-11-20 | 2021-12-01 | 健鼎科技股份有限公司 | Circuit board having asymmetrical structure |
-
2003
- 2003-11-20 TW TW92132535A patent/TWI227100B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI470757B (en) * | 2009-10-22 | 2015-01-21 | Unimicron Technology Corp | Package substrate and fabrication method thereof |
TWI748758B (en) * | 2020-11-20 | 2021-12-01 | 健鼎科技股份有限公司 | Circuit board having asymmetrical structure |
Also Published As
Publication number | Publication date |
---|---|
TWI227100B (en) | 2005-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |