JP2002254423A - Method for cutting ceramic laminated body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a method for cutting a ceramic laminated body by which the ceramic laminated body can be cut with good accuracy, conveniently and with excellent mass productivity. SOLUTION: The method for cutting the ceramic laminated body characterized by using cutting blades 2 and 3 integrally formed in a mold when the ceramic laminated body 1 is force-cut is provided and the method for cutting the ceramic laminated body in which the cutting blades 2 and 3 are provided as a mold for integral forming wherein a plurality of blades with the number of cuttings by required cutting pitch intervals are provided and the angles of the edges of the cutting blades 2 and 3 are in the range of 10-45 degrees is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a ceramic laminate suitable for cutting a ceramic laminate formed by laminating ceramic green sheets.

[0002]

2. Description of the Related Art For example, a surface-mounted ceramic electronic component such as a chip-type multilayer ceramic capacitor or a multilayer coil component usually includes a plurality of ceramic green sheets on which conductor patterns are wired, and upper and lower ceramic green sheets. After cutting an unfired ceramic laminate formed by laminating and crimping an outer layer sheet (ceramic green sheet on which no conductor pattern is wired) at a predetermined position, the chip-sized element is fired, and the inside of the chip is fired. It is manufactured through a process of forming an external electrode on a side surface from which a conductor is drawn.

[0003] Since chip-type ceramic electronic components are usually surface-mounted on a circuit board or the like using a mounting machine, dimensions such as the length, width and thickness of the chip are determined by standards. Devices having small dimensional variations are required. Therefore, in order to manufacture a ceramic electronic component with small dimensional variations, it is necessary to accurately cut the ceramic laminate at a predetermined position.

[0004] One of the methods for cutting the ceramic laminate is to position the ceramic laminate against a positioning guide, and then lower the cutting blade vertically by a driving means such as a motor so as to be perpendicular to the ceramic laminate. There is a cutting method in which the blade is penetrated by penetrating the ceramic laminate to push off the ceramic laminate. There is also a means for fixing the laminate to a table and cutting it with an outer peripheral blade.

[0005]

However, according to these cutting methods, cutting is performed while moving the blade for each cutting line or moving the table on which the laminate is fixed.
There is a time loss in which the blade moves at the next cutting line, and there is a problem that the cost as a part increases.

An object of the present invention is to solve the above-mentioned problems, and to provide a method for cutting a ceramic laminate which can cut the ceramic laminate accurately, easily, and with excellent mass productivity. That is.

[0007]

In order to achieve the above object, a method for cutting a ceramic laminate according to the present invention is to integrally form a mold provided with a plurality of cutting blades for a desired number of cuts at a desired pitch interval. Then, the cutting blade is made to enter from one side or both sides of the unfired laminate positioned by the guide pins to form a V-shaped cut groove in the laminate. This operation forms a grid-shaped kerf in a direction orthogonal to the above. This laminate is characterized in that it is divided by defatting and firing after laminating.

[0008] That is, the present invention is a method for cutting a ceramic laminate using a cutting blade integrally formed by a mold when the ceramic laminate is cut off.

Further, the present invention is a method for cutting a ceramic laminate, wherein the cutting blade is provided with a plurality of blades for a desired number of cuts at a desired cutting pitch interval as a mold integrally formed.

[0010] The present invention is also a method for cutting a ceramic laminate in which the angle of the tip of the cutting blade is in the range of 10 ° to 45 °.

Further, the present invention is a method for cutting a ceramic laminate in which the cutting blade enters before the ceramic laminate is degreased and fired.

Further, the present invention is a method for cutting a ceramic laminate wherein the cutting blade enters only from one side of the laminate.

Further, the present invention is a method for cutting a ceramic laminate in which the cutting blade enters at the same time on both sides of the laminate.

Further, the present invention is a method of cutting a ceramic laminate in which the angle of the blade is larger on one side than on the other when the blade is advanced simultaneously on both sides.

Further, the present invention is a method for cutting a ceramic laminated body in which the directions of the front and rear blades are perpendicular to each other when the blades enter the front and rear surfaces simultaneously.

Further, the present invention is a method for cutting a ceramic laminate in which the blade enters the laminate surface at a distance of not less than 5% of the laminate thickness at the time of cutting.

Further, the present invention is a method for cutting a ceramic laminate to be divided by bending after degreasing and firing.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for cutting a ceramic laminate according to the present invention will be described below.

The method for cutting a ceramic laminate according to the present invention comprises:
As shown in FIG. 1, the mold blades are constituted by the two mold cutting blades 1 and 2 and integrally formed with a plurality of cutting blades having a predetermined pitch interval so that the blades are in the X direction and the Y direction. Are arranged to face each other. The ceramic laminate 3 positioned is sandwiched between the molds, the molds are brought close to each other, and a blade is made to penetrate the ceramic laminate 3, thereby forming a cut groove 4 in the ceramic laminate 3. At that time, the upper and lower cutting blades are in either the X direction or the Y direction,
Further, the tip angle of one of the upper and lower blades is increased so that the cutting depth in the same surface is made uniform.

Then, a kerf is machined by the same apparatus as described above using a combination of the mold blades of the other pitch. After the upper and lower surfaces of the laminate are cut in a grid pattern at two pitches in the X and Y directions by the above method, the ceramic laminate 3 is degreased and fired. Then, for example, FIG.
The laminated body fired on a curved surface plate with the above configuration is divided by sandwiching an elastic sheet made of rubber or the like and pressing a roller to bend the sheet.

As described above, the method for cutting a ceramic laminate of the present invention does not require a complicated structure, the cutting operation is easy, and the mass productivity is excellent. In addition, there is no cause of the blade entering obliquely with respect to the cut surface unlike the conventional single-blade push-cut, which is excellent in terms of dimensional accuracy.

According to the method for cutting a ceramic laminate of the present invention, it is possible to cut a desired number of times at a time, thereby greatly improving the cutting speed and reducing the cost of chip electronic components. . Further, in the conventional push-cut method, the blade cannot be lowered vertically to the laminate, the cut surface becomes oblique, or the blade moves or the table moves, and the cutting pitch shifts. There was also a problem that the subsequent dimensional variation was large, but since the blade was integrally formed with the mold, the blade always entered vertically into the ceramic laminate, and the cutting pitch was always constant. Can be accurately cut.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for cutting a ceramic laminate according to an embodiment of the present invention will be described below.

In this embodiment, in the manufacturing process of the multilayer ceramic capacitor, a plurality of ceramic green sheets on which strip-shaped internal electrode patterns are printed and upper and lower ceramic sheets on which no internal electrode patterns are printed are formed. An example in which an unfired ceramic laminate formed by laminating and crimping is cut will be described.

FIG. 1 is an explanatory view showing a method for cutting a ceramic laminate according to an embodiment of the present invention. Upper mold blade 3 and lower mold blade 2 for cutting ceramic laminate 1
And an arm 7 for holding a cutting die, and positioning guide pins 6 for positioning the ceramic laminate 1 to be cut.

When cutting the ceramic laminate using this cutting device, first, the ceramic laminate 1 is pressed against the positioning guide pins 6 and mounted on the lower mold blade 2, and then the ceramic laminate 1 is removed. The mold blade 3 is sandwiched from above using the vertical drive motor 5. And mold blade 2,
3 is lowered by a vertical drive motor 5 set at a predetermined distance to form a cut groove 4 in the ceramic laminate 1.

Then, the upper and lower mold blades 3 are returned to their original positions, and the ceramic laminate 1 is set in a cutting device provided with mold blades having different pitches. On both upper and lower surfaces, cut grooves at two pitch intervals in the X direction and the Y direction are formed in a grid pattern. Then, the ceramic laminate 1 was degreased and fired, and the fired body of the ceramic laminate 1 was placed on a curved plate, and each chip was bent by a rubber roller to be divided into chip sizes.

Using the cutting method of the above embodiment, a ceramic laminate having a size of 100 mm × 80 mm and a thickness of 1.0 mm was cut into a chip size of 2012 by the above method. Cutting total length is 100mm x 50 times + 80mm
× 48 times = 8840 mm, and the number of chips to be taken is 2499. The cutting ability at that time is pushed with a conventional single blade,
The comparison was made with cutting with the outer peripheral blade. Table 1 shows the results.
The dimensional variation at that time was examined. The result is shown in FIG.

[0029]

[Table 1]

As shown in Table 1, it can be seen that the cutting method according to the present invention has a higher cutting speed and superior mass productivity than the conventional cutting method. In addition, as shown in FIG. 3, it can be seen that the dimensional accuracy maintains the quality without the conventional cutting method.

FIG. 4 is a view showing the distance of the cutting blade into the laminate and the variation in dimensions after cutting in the method for cutting a ceramic laminate according to the present invention. The level of dimensional accuracy of the conventional cutting method has been obtained at 5% or more of the thickness of the ceramic laminate. If the dimensional variation ± 100 μm is judged to be acceptable, the penetration depth of 5% or more of the thickness is optimal. There are certain results.

FIG. 5 shows the relationship between the tip angle of the cutting blade and the dimensional accuracy. ± 100μm dimensional variation
Was judged to be acceptable, the result that the range of the tip angle of 10 ° to 45 ° was optimal was also obtained.

[0033]

As described above, according to the method for cutting a ceramic laminate of the present invention, a desired cutting line can be easily cut at a time, which leads to speeding up of a cutting process, excellent mass productivity, and cost of parts. It is effective for down. Furthermore, the dimensional accuracy after cutting is at a level higher than that of the conventional method, so that the quality as a chip component is not reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a method for cutting a ceramic laminate according to the present invention.

FIG. 2 is a view showing a method of dividing a fired body of a ceramic laminate according to the present invention.

FIG. 3 is a diagram comparing the dimensional variation after cutting by the cutting method of the ceramic laminate of the present invention with the conventional method.

FIG. 4 is a diagram showing a distance of approach of a cutting blade to a laminate and variation in dimensions after cutting in the method for cutting a ceramic laminate of the present invention.

FIG. 5 is a diagram showing a tip angle of a cutting blade and a dimensional variation after cutting in the method for cutting a ceramic laminate of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ceramic laminated body 2, 3 Mold blade 4 Cutting groove 5 Vertical drive motor 6 Positioning guide pin 7 Arm

Claims (10)

[Claims] 1. A method for cutting a ceramic laminate, wherein a cutting blade used for cutting off the ceramic laminate is formed integrally with a mold. 2. The method for cutting a ceramic laminate according to claim 1, wherein the cutting blade includes a plurality of blades for a desired number of cuts at a desired cutting pitch interval. 3. The method for cutting a ceramic laminate according to claim 1, wherein the angle of the tip of the cutting blade is in a range from 10 ° to 45 °. 4. The method for cutting a ceramic laminate according to claim 1, wherein the cutting blade enters before the ceramic laminate is degreased and fired. 5. The method for cutting a ceramic laminate according to claim 1, wherein the cutting blade enters only from one side of the laminate. 6. The method for cutting a ceramic laminate according to claim 1, wherein the cutting blade enters at the same time on both sides of the laminate. 7. The method for cutting a ceramic laminate according to claim 6, wherein when the cutting blade is made to enter the front and back surfaces simultaneously, the angle of the cutting blade is larger on one side than on the other. 8. The method for cutting a ceramic laminate according to claim 6, wherein when the cutting blades are made to enter the front and rear surfaces simultaneously, the directions of the front and rear cutting blades are orthogonal to each other. 9. The method for cutting a ceramic laminate according to claim 1, wherein an approach distance of the cutting blade to a surface of the laminate is not less than 5% of a thickness of the laminate. 10. The cutting method of the ceramic laminate,
The method for cutting a ceramic laminate according to any one of claims 1 to 9, wherein the ceramic laminate is divided by bending after degreasing and firing.