JP2018129318A - Method for manufacturing light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting device, which is arranged so that a ceramic substrate is hardly damaged.SOLUTION: A method for manufacturing a light-emitting device comprises the steps of: preparing a light-emitting device assembly including a ceramic board assembly having an upper-face groove portion in an upper face and a lower-face groove portion in a lower face; holding the light-emitting device assembly between a first elastic sheet disposed on an upper face side of the ceramic board assembly, and a second elastic sheet disposed on a lower face side of the ceramic board assembly; and pressing the first elastic sheet from above by a first roller and the second elastic sheet from below by a second roller disposed just below the first roller, thereby stretching the first and second elastic sheets laterally and dividing the light-emitting device assembly at positions including the upper-face groove portion and lower-face groove portion of the ceramic board assembly.SELECTED DRAWING: Figure 3B

Description

  The present invention relates to a method for manufacturing a light emitting device.

  As a light-emitting device using a semiconductor light-emitting element (hereinafter also referred to as “light-emitting element”), a light-emitting device using a ceramic substrate is known. A light emitting device using a ceramic substrate is handled as an aggregate substrate for a plurality of light emitting devices in the manufacturing process. And finally, it is divided into individual light emitting devices. As a dividing method, for example, a method is known in which conveyor belts are arranged above and below a ceramic substrate, and upper and lower conveyor belt contact surfaces are arranged in a stepped shape and divided using this step (for example, Patent Document 1)

Japanese Utility Model Publication No. 62-185009

  In the method described in Patent Document 1, the ceramic substrate is divided so as to be inclined in the vertical direction. Therefore, adjacent ceramic substrates are easy to contact. For this reason, damage such as a part of the ceramic substrate is easily generated.

The manufacturing method of the light-emitting device which concerns on embodiment of this invention contains the following structures.
A step of preparing an assembly of a light emitting device including an assembly of ceramic substrates having an upper surface groove on the upper surface and a lower surface groove on the lower surface; a first elastic sheet disposed on the upper surface side of the ceramic substrate assembly; and a ceramic A step of sandwiching the assembly of the light emitting devices with a second elastic sheet disposed on the lower surface side of the assembly of substrates, a first elastic sheet is pressed from above with a first roller, and disposed immediately below the first roller. By pressing the second elastic sheet from the lower side with the second roller, the first elastic sheet and the second elastic sheet are stretched in the lateral direction, at a position including the upper surface groove portion and the lower surface groove portion of the ceramic substrate assembly. Dividing the aggregate of light emitting devices. A method of manufacturing a light emitting device.

  Thus, a method for manufacturing a light-emitting device in which a ceramic substrate is hardly damaged can be obtained.

FIG. 1 is a schematic top view occupying an example of a light-emitting device obtained by the method for manufacturing a light-emitting device according to the embodiment. FIG. 2A is a schematic top view illustrating the method for manufacturing the light emitting device according to the embodiment. 2B is a schematic cross-sectional view taken along line 2B-2B in FIG. 2A. FIG. 3A is a schematic cross-sectional view illustrating the method for manufacturing the light emitting device according to the embodiment. FIG. 3B is a schematic cross-sectional view illustrating the method for manufacturing the light emitting device according to the embodiment.

  A mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the manufacturing method of the light-emitting device for materializing the technical idea of this invention, and this invention does not limit the manufacturing method of a light-emitting device below.

  Further, the present specification by no means specifies the member shown in the claims as the member of the embodiment. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the extent that there is no specific description. It is just an example. It should be noted that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate.

  FIG. 1 is a schematic top view showing an example of a light emitting device 1 obtained by the method for manufacturing a light emitting device according to this embodiment. The light emitting device 1 includes a ceramic substrate 10 having a recess. The ceramic substrate 10 includes a ceramic 11 that is a base material, and conductive members 12 that are disposed on the upper and lower surfaces of the ceramic 11. The conductive member 12 on the upper surface of the ceramic 11 and the conductive member 12 on the lower surface are electrically connected by vias or the like.

  A light emitting element 20 is placed on the bottom surface of the recess of the ceramic substrate 10. The light emitting element 20 and the conductive member 12 are electrically connected by a wire 30. A sealing member 40 is disposed in the recess so as to cover the light emitting element 20 and the wire 30. Such a light emitting device 1 can be obtained by the manufacturing method shown below.

(Process for preparing an assembly of light emitting devices)
2A is a schematic top view showing an assembly 1A of the light emitting device according to the embodiment, and FIG. 2B is a schematic cross-sectional view taken along line 2B-2B of FIG. 2A. Here, for convenience, a schematic top view in which a region including four light emitting devices is enlarged is shown. It goes without saying that the number of light emitting devices included in one light emitting device assembly 1A is not limited thereto.

  The light emitting device assembly 1A includes a ceramic substrate assembly 10A. The aggregate 10A of ceramic substrates has a flat plate shape as a whole and includes an upper surface 110 and a lower surface 120. The ceramic substrate assembly 10 </ b> A includes a ceramic 11 and a conductive member 12. The conductive member 12 is disposed on the upper and lower surfaces of the ceramic 11 and is electrically connected by vias or the like. The ceramic substrate assembly 10A includes a recess 13 on the upper surface 110 side where the light emitting element 20 is placed. A conductive member 12 is disposed on the bottom surface of the recess 13. The light emitting element 20 is electrically connected to the conductive member 12 by a wire 30. The shape of the ceramic substrate assembly 10A viewed from above is, for example, a quadrangle, a rectangle, or the like, and the corners are rounded to prevent cracking and chipping. The size of the ceramic substrate aggregate 10A is, for example, about 100 mm × 60 mm, and about 500 to 800 light-emitting devices can be obtained therefrom.

The thickness of the ceramic substrate assembly 10A is 500 μm to 1000 μm, and one or more ceramic layers of 200 μm to 500 μm are laminated. As ceramic, Al ₂ O ₃ , AlN, SiC, and the like can be used, and as the conductive member, W, Cu, and the like can be used. Moreover, you may provide plating, such as Ag, Al, Au, on the surface of a collar member with copper.

  As the light emitting element 20, a semiconductor light emitting element can be used. As the light-emitting element 20, a semiconductor light-emitting element that emits visible light such as blue, green, and red can be used. Alternatively, a light emitting element that emits ultraviolet light may be used. Further, a protective element such as a Zener diode may be placed. A sealing member 40 that covers the light emitting element or the like is disposed in the recess 13. The sealing member 40 is translucent, and examples thereof include a silicone resin and an epoxy resin. The sealing member 40 may be a single layer or a plurality of layers of two or more layers, and a diffusing material, a pigment, a phosphor or the like may be mixed in any or all of them depending on the purpose and application.

  The upper surface 110 of the ceramic substrate assembly 10A includes an upper surface groove portion 111 at a division position (division planned position). Similarly, the lower surface 120 of the ceramic substrate assembly 10 </ b> A includes a lower surface groove 121 at a division position (scheduled division position). The upper surface groove 111 is disposed so as to surround the recess 13 in a top view. In addition, the upper surface groove part 111 is arrange | positioned here so that the one recessed part 13 may be enclosed. That is, the upper surface groove portion 111 is provided so that one light emitting device includes one concave portion. One light-emitting device may include two or more recesses. In that case, the upper surface groove 111 is disposed at a position surrounding the two or more recesses 13.

  The position of the upper surface groove portion 111 is preferably arranged at a position overlapping the lower surface groove portion 121 in a top view. The width of the upper surface groove 111 can be about 50% to 100% of the width of the lower surface groove 121 and is preferably substantially the same. Moreover, the depth of the upper surface groove part 111 can be about 20% to 100% of the depth of the lower surface groove part 121, and is preferably substantially the same. The depth of the upper surface groove 111 and the depth of the lower surface groove 121 can be about 10% to 70% of the thickness of the ceramic. The upper surface groove portion 111 and the lower surface groove portion 121 can be V-shaped, U-shaped or the like in cross-sectional view, and are preferably V-shaped.

  The upper surface groove part 111 and the lower surface groove part 121 can be formed using a scriber, for example. Moreover, you may purchase the aggregate | assembly of the ceramic substrate provided with the upper surface groove part 111 and the lower surface groove part 121. FIG.

(Process of sandwiching the assembly of light emitting devices with an elastic sheet)
The light emitting device assembly 1 </ b> A prepared as described above is sandwiched between the first elastic sheet 51 and the second elastic sheet 52. Specifically, as shown in FIG. 3A, a ceramic substrate assembly constituting an assembly of light emitting devices is sandwiched between a first elastic sheet 51 and a second elastic sheet 52. The first elastic sheet 51 is disposed on the upper surface 110 side of the ceramic substrate assembly 10A. The second elastic sheet 52 is disposed on the lower surface 120 side of the ceramic substrate assembly 10A.

  The first elastic sheet 51 preferably has an area larger than the area of the upper surface 110 of the ceramic substrate assembly 10A. The second elastic sheet 52 preferably has an area larger than the area of the lower surface 120 of the ceramic substrate assembly 10A. As the first elastic sheet 51 and the second elastic sheet 52, for example, a sheet having an elastic modulus of 2 GPa to 5 GPa can be used. As the first elastic sheet 51 and the second elastic sheet 52, for example, acrylic, rubber, or the like can be used. The thickness of the 1st elastic sheet 51 and the 2nd elastic sheet 52 can be 1 mm-20 mm, for example.

(Step of dividing the assembly of light emitting devices)
Next, the ceramic substrate assembly 10A is pressed using a roller to divide the light emitting device assembly 1A.

  As shown in FIG. 3A, the first roller 61 is disposed on the upper side of the first elastic sheet 51. The first roller 61 is rotated while being pressed downward to move in the traveling direction (rightward in FIG. 3A).

  At the same time, the second roller 62 is disposed below the second elastic sheet 52. The second roller 62 is rotated while being pressed upward and moved in the traveling direction (rightward in FIG. 3A).

  The first roller 61 and the second roller 62 may be rotated at the same position without being moved, and the light emitting device assembly 10 </ b> A sandwiched between the first elastic sheet 51 and the second elastic sheet 52 may be moved. .

  The first roller 61 and the second roller 62 are preferably rollers having the same diameter. Moreover, it is preferable that the center of the rotation axis of the first roller 61 and the center of the rotation axis of the second roller 62 are arranged at the same position in the top and bottom of the light emitting device assembly 1A. It is preferable that the 1st roller 61 and the 2nd roller 62 each press the aggregate | assembly 1A of a light-emitting device with the same pressing force.

  As shown in FIG. 3B, the first roller 61 and the second roller 62 are moved while being rotated to press the upper surface groove portion 111 and the lower surface groove portion 121 from above and below to cleave the aggregate 10A of ceramic substrates. At this time, the first elastic sheet 51 and the second elastic sheet 52 are pressed in the vertical direction by the first roller 61 and the second roller 62 and are extended in the horizontal direction. The aggregate 10A of ceramic substrates is pulled in the left-right direction as the first elastic sheet 51 and the second elastic sheet 52 are extended in the left-right direction. Such a lateral force acts to break the ceramic substrate aggregate 10A. At the time of cleaving, an equal force is acting on the ceramic substrate aggregate 10A in the vertical direction, so that the cleaved surfaces of the light emitting devices 1 obtained by cleaving are difficult to contact. Therefore, damage such as cracks or chipping of the ceramic substrate 10 is unlikely to occur.

  The light-emitting device of the present invention can be used for various light sources such as illumination light sources, various indicator light sources, in-vehicle light sources, display light sources, liquid crystal backlight light sources, sensor light sources, traffic lights, in-vehicle components, signboard channel letters, etc. Can be used.

DESCRIPTION OF SYMBOLS 1 ... Light-emitting device 10 ... Ceramic substrate 11 ... Ceramic 12 ... Conductive member 13 ... Recessed part 20 ... Light emitting element 30 ... Wire 40 ... Sealing member 1A ... Assembly of light-emitting device 10A ... Assembly of ceramic substrate 110 ... Upper surface 111 ... Upper surface Groove 120 ... lower surface 121 ... lower surface groove 51 ... first elastic sheet 52 ... second elastic sheet 61 ... first roller 62 ... second roller

Claims (5)

Preparing an assembly of light emitting devices comprising an assembly of ceramic substrates having an upper surface groove on the upper surface and a lower surface groove on the lower surface;
Sandwiching the assembly of light emitting devices with a first elastic sheet disposed on the upper surface side of the assembly of ceramic substrates and a second elastic sheet disposed on the lower surface side of the assembly of ceramic substrates;
While pressing the first elastic sheet from above with a first roller, and pressing the second elastic sheet from below with a second roller disposed directly below the first roller, the first elastic sheet and Extending the second elastic sheet in a lateral direction, and dividing the assembly of light emitting devices at a position including the upper surface groove portion and the lower surface groove portion of the ceramic substrate assembly;
A method for manufacturing a light emitting device.   The method for manufacturing the light emitting device according to claim 1, wherein the upper surface groove portion and the lower surface groove portion are arranged at positions overlapping each other when viewed from above.   The method for manufacturing a light emitting device according to claim 1, wherein a width of the upper surface groove is about 50% to 100% of a width of the lower surface groove.   4. The method for manufacturing a light emitting device according to claim 1, wherein a depth of the upper surface groove is about 20% to 100% of a depth of the lower surface groove. 5.   The method for manufacturing a light emitting device according to any one of claims 1 to 4, wherein the upper surface groove portion and the lower surface groove portion are V-shaped in cross-sectional view.

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