CN117373828A - Method and apparatus for manufacturing electronic component - Google Patents

Abstract

The invention provides a method for cutting a mother block with high precision and a device for the method, wherein unexpected cutting is not easy to generate. A method for manufacturing an electronic component includes a cutting step of cutting a workpiece having an upper main surface and a lower main surface, in which a plurality of internal electrodes are embedded, into a plurality of processed products, wherein the workpiece is supported by a curved support member from the lower main surface side of the workpiece in the cutting step, and the workpiece is relatively pressed and cut by a cutter from the upper main surface side of the workpiece in a state where the workpiece is supported by the support member.

Description

Method and apparatus for manufacturing electronic component

Technical Field

The present invention relates to a method and an apparatus for manufacturing an electronic component.

Background

Conventionally, a method of cutting a green sheet laminate while suppressing occurrence of layer separation in manufacturing a laminated ceramic electronic component has been proposed. For example, patent document 1 proposes a cutting method in which, when cutting a master block into small pieces, the angle of the blade surface and the surface roughness are set to predetermined ranges.

Prior art literature

Patent literature

Patent document 1: japanese patent application laid-open No. 2012-71374

Miniaturization of electronic components such as laminated ceramic electronic components is advancing. Therefore, a technique for cutting a mother block such as a green sheet laminate with improved accuracy is demanded.

Disclosure of Invention

Problems to be solved by the invention

The invention aims to provide a method for cutting a master block with high precision, which is not easy to generate unexpected cutting and the like, and a device for the method.

Technical scheme for solving problems

The method for manufacturing an electronic component of the present invention comprises: a cutting step of cutting a workpiece having an upper main surface and a lower main surface, in which a plurality of internal electrodes are embedded, into a plurality of processed products,

in the cutting-off process,

the workpiece is supported by a curved support member from the lower main surface side of the workpiece,

the workpiece is pressed and cut by a cutter from the upper main surface side of the workpiece in a state of being supported by the support member.

The apparatus for manufacturing an electronic component according to the present invention includes:

a support body; and

a frame body for holding the periphery of the support body,

the apparatus for manufacturing an electronic component further includes:

a curved support member that is pushed from one main surface side of the support body toward the other main surface side; and

a cutter blade disposed on the other main surface side of the support body at a position facing the curved support member,

by pushing the curved support member against the support body, the support body is curved,

the workpiece disposed on the other main surface of the support is cut by relatively pressing the cutter toward the curved support.

Effects of the invention

According to the present invention, it is possible to provide a method of cutting a master batch with high accuracy, which is less likely to cause unexpected cutting or the like, and an apparatus for use in the method.

Drawings

Fig. 1 is a perspective view of a cutting device, and shows an outline of the cutting device.

Fig. 2 is a plan view schematically showing a ceramic green sheet on which electrodes are printed.

Fig. 3 is a partial perspective view of the master block, showing an outline of the master block.

Fig. 4 is a diagram showing an outline of the cutting method according to the present embodiment.

Fig. 5 is an enlarged view of a portion of the parent block cut.

Fig. 6 is a diagram showing an outline of a cutting method according to another embodiment.

Fig. 7 is a diagram showing the shape of a support member of another embodiment.

Fig. 8 is a diagram showing an outline of a conventional cutting method.

Fig. 9 is an enlarged view of a portion of a parent block cut in a conventional cutting method.

Description of the reference numerals

1: a master block;

2: a dielectric;

3: an internal electrode;

4: a reference mark;

5: a ceramic green sheet;

10: a cutting device;

12: cutting knives (pressing knives);

14: a retainer;

16: a work table;

18: a table driving unit;

20: a camera;

22: a support member (push-up member);

22T: a front end portion;

24: a holding member;

26: laminating a clamp;

26a: a support body (base member);

26b: a frame;

100: a cutting device;

110: a cutting table;

120: cracking in advance;

130: obliquely cutting;

MF: upper main surface of mother block

MB: a lower major face of the master block;

SF: upper main surface of support

SB: a lower main surface of the support;

l: cutting off the predetermined position.

Detailed Description

The method for manufacturing an electronic component according to the present invention will be described below. In the following description, a laminated ceramic capacitor is given as an example of an electronic component. However, the electronic component manufactured by the method for manufacturing an electronic component of the present invention is not limited to the multilayer ceramic capacitor. The electronic component may be another component such as a laminated wiring board.

< method for producing multilayer ceramic capacitor >

The laminated ceramic capacitor is generally manufactured through the following steps. That is, the laminated ceramic capacitor is manufactured through the following steps: a lamination step of laminating a plurality of ceramic green sheets each having an internal electrode provided on a surface thereof, to obtain a laminate; a press molding step of press-bonding the laminate to form an unfired master batch; a 1 st cutting step of cutting the mother block in a cross shape so as to be, for example, 4 blocks in accordance with the arrangement of the internal electrodes; a pressing step of placing the plurality of cut blocks into a mold frame and pressing the blocks; a cutting step 2 of cutting the pressed block into individual pieces to obtain small pieces; a firing step of firing the chips; and an external electrode forming step of forming an external electrode on the fired chip. Among the above steps, the present invention relates to the 1 st cutting step and the 2 nd cutting step.

< outline of cutting device >

The cutting device 10 used in the 1 st cutting step and the 2 nd cutting step will be described with reference to fig. 1. Fig. 1 is a perspective view of cutting device 10, and shows an outline of cutting device 10.

Hereinafter, the cutting device 10 will be described by taking a case where the cutting device 10 is used in the 1 st cutting step as an example. When the cutting device 10 is used in the 1 st cutting step, the mother block 1 as the workpiece is cut by the cutter 12. Then, a block as a processed product was obtained.

The cutting device 10 can also be used in the 2 nd cutting step. When the cutting device 10 is used in the 2 nd cutting step, the workpiece is a block obtained by cutting the master block 1. Then, the block is cut into individual pieces by the cutting device 10, and small pieces as a processed product are obtained.

The cutting device 10 includes a cutter blade 12, a table 16, and a camera 20.

< cutting knife >

The cutter blade 12 is a portion for cutting the master batch 1. The cutter blade 12 is held by a holder 14. The cutter 12 is a press cutter.

The thickness of the cutter 12 is preferably 0.05mm or more and 0.25mm or less. The cutter blade 12 is, for example, a rectangular plate. A knife is disposed on one side of the rectangular shape in the longitudinal direction. The other side becomes thick-walled, and this portion is held to the holder 14.

< workbench >

The table 16 is a part on which the mother block 1 is placed. The mother block 1 is held on the table 16 via a lamination jig (not shown in fig. 1) and a holding member (not shown in fig. 1).

The table 16 can move or rotate the mounted mother block 1. In fig. 1, the direction of movement is shown by arrow D1, and the direction of rotation is shown by arrow D2. The movement and rotation are performed by the table driving unit 18.

< Camera >

The camera 20 is a part that photographs the master batch 1. In the cutting device 10, positional alignment is performed based on the image captured by the camera 20 so that the master batch 1 is cut at an appropriate position. Specifically, the table driving section 18 moves or rotates the table 16, thereby performing positional alignment.

In detail, the camera 20 may be integrated with an illumination device (not shown). The camera 20 may be a camera that captures wavelengths other than visible light such as X-rays. The camera 20 is configured to be able to capture a reference mark described later from the side of the master block 1. Then, based on the position of the reference mark imaged by the camera 20, the position where the cutter blade 12 enters the master block 1 is determined, and the position and orientation of the table 16 are determined.

The stage 16 is capable of rotating at least 90 degrees or more in an in-plane direction. For example, the 1 st cutting is performed, and then the table 16 is rotated by 90 degrees. Then, the cutting of the 2 nd time is performed in a direction orthogonal to the cutting direction of the 1 st time. This makes it possible to reduce the mother block 1 into dice-shaped blocks. The mother block 1 is not necessarily required to be reduced in size, and may be cut into a letter-like shape. In the case of such cutting, it is not necessary to provide the mother block 1 with a reference mark 4 to be described later.

< ceramic Green sheet >

The parent block 1 cut by the cutting device 10 will be described with reference to fig. 2 and 3. Fig. 2 is a plan view showing the ceramic green sheet 5 on which the internal electrodes 3 are printed.

As shown in fig. 2, a plurality of internal electrodes 3 arranged in a lattice shape and a plurality of fiducial marks 4 arranged near the outer peripheral portion of the ceramic green sheet 5 are printed on the ceramic green sheet 5.

The thickness of the ceramic green sheet 5 is, for example, 0.4 μm or more and 5.0 μm or less. The thickness of the internal electrode 3 is, for example, 0.1 μm or more and 2.0 μm or less.

The mother block 1 is formed by stacking a plurality of ceramic green sheets 5 on which the internal electrodes 3 are printed.

< mother block >

Fig. 3 is a partial perspective view of the master block 1, showing an outline of the master block 1. The mother block 1 shown in fig. 3 is the mother block 1 after the remainder is cut off so that the reference mark 4 and the internal electrode 3 are exposed from the side surface of the mother block 1.

As described above, the reference mark 4 and the internal electrode 3 exposed from the side surface of the master batch 1 are photographed by the camera 20, the dicing blade 12 and the master batch 1 are aligned, and then the master batch 1 is cut. The parent block 1 is cut at a cutting scheduled position L shown in fig. 3, for example.

The internal electrodes 3 are arranged in a high density in the mother block 1. The internal electrode 3 is laminated with, for example, 50 to 2000 sheets in the mother block 1. The distance between adjacent internal electrodes 3 in the same layer can be, for example, a narrow pitch of 50 μm or more and 200 μm or less.

< details of cleavage >

Fig. 4 is a diagram showing an outline of the cutting method according to the present embodiment. Fig. 4 is a view of the mother block 1 as it is cut from the side.

As shown in fig. 4, the mother block 1 is placed on the lamination jig 26.

< lamination jig >

The lamination jig 26 includes a support 26a and a frame 26b.

The frame 26b is a frame having a rectangular shape or a square shape in a plan view. The frame 26b is formed of, for example, metal.

< support body >

The support 26a is a member that is spread out at a portion surrounded by the frame 26b. The support 26a is sometimes also referred to as a base member. The support 26a is formed of a relatively thin support. The mother block 1 is placed on the support 26a and held.

The method of holding the master batch 1 to the support 26a is not limited. For example, the mother block 1 may be held by the support 26a via an adhesive sheet whose adhesiveness decreases when the temperature increases. In this case, the heat is applied to reduce the adhesiveness of the adhesive sheet, and the mother block 1 and the support 26a can be easily separated.

The material of the support 26a is preferably a metal such as stainless steel. The thickness of the support 26a is, for example, 0.2mm or more and 1.0mm or less. When the support 26a is made of metal, it is preferable to apply an adhesive substance such as an adhesive to the surface of the support 26a and place the master batch 1 thereon.

< holding Member >

The lamination jig 26 is fixed to a table (not shown in fig. 4) by the holding member 24. Specifically, the holding member 24 holds the frame 26b, thereby fixing the lamination jig 26.

The holding member 24 can be used not only when the stacking jig 26 is fixed to a table, but also when the stacking jig 26 is conveyed. That is, the holding member 24 is moved in a state where the frame 26b is held, whereby the stacking jigs 26 and, further, the mother block 1 can be conveyed.

The above-described positioning of the master batch 1 based on the image captured by the camera 20 can also be performed by moving and rotating the holding member 24.

The holding member 24 may be a different member for conveyance and alignment.

< cutting off >

The mother block 1 is cut as follows.

As shown in fig. 4, the dicing blade 12 is disposed on the upper main surface SF side of the support 26a, and the dicing blade 12 is fixed at this position. Then, the support member 22 as the push-up member is pushed from the lower main surface SB side of the support body 26a to contact the support body 26a. Specifically, the support member 22 is moved in the direction of arrow a.

Thereby, the cutter 12 relatively enters into the mother block 1. As a result, the master block 1 is cut.

Fig. 5 is an enlarged view of the portion of the master block 1 cut. The state in which the mother block 1 is cut is described more specifically with reference to fig. 5.

As shown in fig. 5, the front end portion 22T of the support member 22 has a curved shape. Therefore, when the support member 22 moves in the direction of arrow a and the distal end 22T comes into contact with the support 26a, the support 26a bends and protrudes the upper main surface SF. With the bending of the support 26a, the mother block 1 placed on the support 26a is also bent to make the upper main surface MF convex.

Then, as the supporting member 22 moves further in the direction of arrow a and the cutter blade 12 enters the master batch 1, the master batch 1 is continuously cracked toward both sides of the cutter blade 12 as indicated by arrow B. Then, the master batch 1 is finally cut by being relatively pressed by the cutter 12.

During the cutting process, a force that causes the mother block 1 to crack in the direction of arrow B is applied to the mother block 1, so that the load when the dicing blade 12 enters the ceramic green sheet 5 can be reduced.

Further, the mother block 1 is continuously cracked toward both sides of the cutter blade 12, whereby the compressive stress applied in the in-plane direction of the mother block 1 (i.e., the thickness direction of the mother block 1) can be released. Therefore, the shape of the cut surface of the master batch 1 can be suppressed from becoming uneven.

In addition, even if a preceding crack occurs in the master batch 1, the direction of the preceding crack can be guided in a direction perpendicular to the main surface of the master batch 1. This can suppress occurrence of a defective cutting due to the passage of the preceding crack in a direction other than the direction perpendicular to the main surface of the master batch 1.

< conventional cutting method >

A conventional cutting method will be described. Fig. 8 is a diagram showing an outline of a conventional cutting method.

In the conventional cutting device 100, the mother block 1 is placed on the cutting table 110 via the support 26a. Then, the cutter blade 12 moves in the direction of arrow D, whereby the mother block 1 is cut.

The cutting failure generated in the conventional cutting method will be described with reference to fig. 9 (a) and 9 (b). Fig. 9 (a) and 9 (b) are enlarged views of the portion of the parent block cut by the conventional cutting method. Fig. 9 (a) shows a defective cutting due to a preceding crack, and fig. 9 (b) shows a defective cutting due to an oblique cut.

< previous crack >

The previous crack will be described with reference to fig. 9 (a).

As shown in fig. 9 (a), as the cutter blade 12 moves in the direction of arrow D, it enters the master block 1, and compressive stress is applied in the in-plane direction from the upper main surface MF of the master block 1. Then, due to the compressive stress, a preceding crack 120 is generated in the master batch 1. The direction of the leading crack 120 is not controlled and is not foreseeable. This is because, unlike the cutting by the cutting method according to the present embodiment shown in fig. 5, no force is applied to determine the direction of the cracking of the mother block 1.

As described above, in the conventional cutting method, the preceding crack 120 whose direction cannot be controlled is generated, and thus unexpected cutting is generated. This becomes a cutting failure.

< oblique cutting >

The oblique cutting will be described based on fig. 9 (b).

As shown in fig. 9 (b), the tip of the cutter blade 12 may bend as the cutter blade 12 moves in the direction of arrow D and enters the mother block 1. This is because resistance is received from the master batch 1 when the cutter 12 enters the master batch 1. When the tip of the cutter 12 is bent, the cut surface of the mother block 1 is inclined. This is a cutting defect of the oblique cut 130.

In recent years, a multilayer ceramic capacitor has been advanced in terms of large capacitance and miniaturization. Therefore, inside the mother block 1, the internal electrodes are buried at high density and pressed at high pressure. As a result, the master batch 1 becomes stronger. Therefore, unexpected cutting due to the previous crack and cutting failure due to the oblique cutting are liable to occur.

In the cutting method of the present embodiment, as shown in fig. 5, the supporting member 22 is in contact with the supporting body 26a, whereby the mother block 1 can be subjected to a force that causes the mother block 1 to split toward both sides of the cutter blade 12. Therefore, the cracking direction of the master batch 1 can be determined. Therefore, the preceding crack 120 in an uncontrolled direction as shown in fig. 9 (a) is not likely to occur.

In the cutting method of the present embodiment, the master batch 1 is subjected to a force that causes the master batch 1 to split toward both sides of the cutter blade 12. Therefore, when the cutter blade 12 enters the master block 1, the resistance force received by the cutter blade 12 from the master block 1 can be reduced. Therefore, the oblique cut 130 as shown in fig. 9 (b) is not easily generated.

< action in cutting Process >

A typical operation in the cutting step will be described below.

The master batch 1 is introduced from the introduction portion in a state held by the support 26a, and is conveyed to the processing portion. The cutting device 10 is provided in the processing section.

In the processing section, the master batch 1 is cut by the cutter 12.

In the processing section, the following (1) to (7) are performed.

(1) The camera 20 reads the reference mark 4 from the side of the master block 1 conveyed to the processing section.

(2) The alignment fiducial marks 4 fine tune the table 16, thereby positioning the master block 1 in coordination with the configuration of the cutting blade 12.

(3) The mother block 1 is relatively pushed up by the support member 22 together with the support body 26a with respect to the cutter blade 12, and is cut by the cutter blade 12.

(4) The support member 22 returns to the original position and returns to (1).

(5) Repeating (1) to (5), thereby cutting off the master batch 1.

(6) The table 16 rotates and the holding member 24 rotates, thereby rotating the master batch 1 by 90 degrees in the plane.

(7) Repeating (1) to (5).

After the cutting is completed, the cut mother block 1 is carried to the take-out section in a state held by the support 26a and taken out.

< other actions >

Other operations in the cutting process will be described.

Fig. 6 is a diagram showing an outline of a cutting method accompanied by other operations in the cutting step.

In the cutting method described with reference to fig. 4, the cutter 12 is fixed. In contrast, in the cutting method shown in fig. 6, the cutter 12 is configured to move.

Specifically, the cutter blade 12 moves in conjunction with the movement of the support member 22 to arrow a as indicated by arrow C in fig. 6. That is, the cutter 12 moves in a direction approaching the support member 22 in accordance with the movement of the support member 22.

This makes it possible to cut the master batch 1 with the degree of bending of the support 26a and the master batch 1 small.

In the cutting method shown in fig. 4, the cutter blade 12 is fixed, and the mother block 1 is cut only by pushing up the support member 22. Therefore, the support 26a and the mother block 1 need to be bent to such an extent that the mother block 1 is completely cut.

In contrast, in the cutting method shown in fig. 5, the cutter 12 moves so as to enter the master 1 from the upper main surface MF side of the master 1. Therefore, the mother block 1 is cut by the entry of the cutter blade 12 in addition to the pushing-up of the support member 22. Thus, even if the degree of bending of the support body 26a and the mother block 1 due to the upward pushing of the support member 22 is reduced, the mother block 1 can be cut.

As a result, in the cutting method shown in fig. 6, the durability of the support 26a can be prolonged. This is because deformation of the support 26a at each cutting can be suppressed.

Further, the mother block 1 can be restrained from receiving a force to flex the mother block 1. This can suppress the accumulation of internal stress in the master batch 1.

< shape of support Member, etc.)

The support member 22 will be described in more detail.

The material of the support member 22 is preferably high in hardness. For example, the support member 22 is preferably formed of a material having a rockwell Hardness (HRC) of 50 or more.

In addition, the hardness of the support member 22 needs to be higher than that of the support body 26a. This allows the support 26a to be bent by pushing up from below the support member 22.

The support member 22 is disposed so as to face the cutter blade 12 with the support 26a interposed therebetween. The support member 22 is relatively close to the cutter blade 12 and moves simultaneously with the cutter blade 12 so as to sandwich the support 26a. The distance of movement at this time (i.e., the stroke of the support member 22) is preferably within 1 mm. This can achieve a higher speed of the cutting process.

The shape of the support member 22 will be described with reference to fig. 7 (a) to 7 (c).

Each of fig. 7 is a diagram showing the shape of the support member 22. Each of fig. 7 is a side view of the support member 22. The term "side view" as used herein means a view in the longitudinal direction of the cutting edge of the cutter blade 12.

Fig. 7 (a) shows the support member 22 described previously in fig. 4 and the like. In this support member 22, the front end portion 22T has a curved shape, that is, has a curved surface. The radius of curvature of the curved surface is preferably not less than lmm and not more than 2.5 mm.

In the support member 22 shown in fig. 7 (b), the front end portion 22T has a triangular shape, in particular, a shape having an acute angle. In the case where the shape of the distal end portion 22T is a triangular shape, if the distal end portion 22T comes into contact with the support 26a, the support 26a is bent at a smaller radius. Therefore, the distance by which the distal end 22T is moved to cut the master batch 1 can be shortened. This can further increase the speed of the cutting process.

In the support member 22 shown in fig. 7 (c), the front end 22T is flat and becomes substantially parallel to the lower main surface MB of the parent block 1 before cutting. When the distal end 22T is flat (i.e., planar) and substantially parallel to the lower main surface MB of the parent block 1 before cutting, the stress received by the support 26a is easily dispersed in the plane when the distal end 22T is in contact with the support 26a. As a result, the durability of the support 26a can be prolonged.

As described above, the shape of the distal end portion 22T of the support member 22 may be a curved shape, an acute angle shape, a plane shape, or the like. This is because various required items such as the degree of bending of the support 26a and the master batch 1, and the time required for cutting can be realized in a well-balanced manner.

<1>

A method for manufacturing an electronic component includes: a cutting step of cutting a workpiece having an upper main surface and a lower main surface, in which a plurality of internal electrodes are embedded, into a plurality of processed products,

in the cutting-off process,

the workpiece is supported by a curved support member from the lower main surface side of the workpiece,

the workpiece is pressed and cut by a cutter from the upper main surface side of the workpiece in a state of being supported by the support member.

<2>

The method for manufacturing an electronic component according to <1>, wherein,

the object to be processed is a master block,

the processed product is a small piece that is small.

<3>

The method for manufacturing an electronic component according to <1>, wherein,

the object to be processed is a master block,

the processing product is a block and the processing product is a block,

the method for manufacturing an electronic component further comprises:

and a pressing step of placing the blocks into mold frames and pressing the blocks.

<4>

The method for manufacturing an electronic component according to any one of <1> to <3>, wherein,

the cutter is held fixed, and cuts the workpiece only by a pushing force from the support member.

<5>

The method for manufacturing an electronic component according to any one of <1> to <4>, wherein,

the object to be processed is supported by a bendable support,

the curved support member pushes the workpiece against the knife via the support.

The embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various modifications and variations are possible.

Claims (6)

1. A method for manufacturing an electronic component includes: a cutting step of cutting a workpiece having an upper main surface and a lower main surface, in which a plurality of internal electrodes are embedded, into a plurality of processed products,

in the cutting-off process,

the workpiece is supported by a curved support member from the lower main surface side of the workpiece,

the workpiece is pressed and cut by a cutter from the upper main surface side of the workpiece in a state of being supported by the support member.

2. The method for manufacturing an electronic component according to claim 1, wherein,

the object to be processed is a master block,

the processed product is a small piece that is small.

3. The method for manufacturing an electronic component according to claim 1, wherein,

the object to be processed is a master block,

the processing product is a block and the processing product is a block,

the method for manufacturing an electronic component further comprises:

and a pressing step of placing the blocks into mold frames and pressing the blocks.

4. The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein,

the cutter is held fixed, and cuts the workpiece only by a pushing force from the support member.

5. The method for manufacturing an electronic component according to any one of claims 1 to 4, wherein,

the object to be processed is supported by a bendable support,

the curved support member pushes the workpiece against the knife via the support.

6. An apparatus for manufacturing an electronic component, comprising:

a support body; and

a frame body for holding the periphery of the support body,

the apparatus for manufacturing an electronic component further includes:

a curved support member that is pushed from one main surface side of the support body toward the other main surface side; and

a cutter blade disposed on the other main surface side of the support body at a position facing the curved support member,

by pushing the curved support member against the support body, the support body is curved,

the workpiece disposed on the other main surface of the support is cut by relatively pressing the cutter toward the curved support.