JP2002252459A - Multilayer wiring board and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a highly reliable multilayer wiring board which can prevent via-hole conductors from causing a resistance change even under a high-humidity environmental condition by preventing the instruction of moisture into the board through an interface between conductor wiring layers and insulating layers by improving adhesion between the layers. SOLUTION: This multilayer wiring board is provided with the insulating layers 1 containing at least a thermosetting resin, respectively, the conductor wiring layers 2 buried in the surfaces of the layers 1, and the via-hole conductors 3 which are filled with conductor component containing metallic powder into through holes for connecting the wiring layers 2 to each other. The cross sections of the wiring layers 2 connected with the conductors 3 are formed in inverted trapezoids having formed angles (θ) of 45-80 deg. and side faces having surface roughness (Ra) of >=0.2 μm. In addition, an organic matter containing a hydrophilic group and a hydrophobic group is interposed between the contact faces of the wiring layers 2 and insulating layers 1 on the side faces of the wiring layers 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board suitable for, for example, a multilayer wiring board and a package for accommodating a semiconductor device, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, electronic devices have been reduced in size.
In recent years, with the development of portable information terminals and the spread of so-called mobile computing in which a computer is carried and operated, there is a tendency that a smaller, thinner, and higher-definition multilayer wiring board is required.

[0003] Further, electronic devices that require high-speed operation, such as communication devices, have been widely used. The requirement for high-speed operation includes various requirements such as accurate switching of high-frequency signals. In order to cope with such electronic devices, a multilayer printed wiring board suitable for high-speed operation is required.

In order to perform high-speed operation, it is necessary to reduce the length of wiring and shorten the time required for transmitting an electric signal. In order to reduce the length of the wiring, there is a tendency for a small, thin, and high-definition multilayer wiring substrate in which the width of the wiring is reduced and the gap between the wirings is reduced.

In order to meet such a demand for high-density wiring, a manufacturing method called a build-up method is used. The basic structure of the build-up method is classified into two types in the JPCA standard: (1) base + build-up method and (2) all-layer build-up method.

(1) In the base + build-up method, a photosensitive resin is applied to the surface of a core substrate having a conductor wiring layer, a through-hole conductor, etc. formed on the surface of an insulating substrate such as a double-sided copper-clad glass epoxy substrate. After the exposure phenomenon to form via holes, apply a plating layer such as copper to the entire surface of the photosensitive insulating layer, and then apply a photosensitive resist to the plating layer,
After exposing and developing the circuit pattern, the non-resist forming portion is etched to form a circuit, and then the resist is removed to form a conductor wiring layer. This process is repeated to form a multilayer.

[0007] (2) A method of manufacturing an all-layer build-up is to form a via hole in an insulating layer with a laser or the like and fill a conductive paste in the via hole as disclosed in, for example, Japanese Patent No. 2587593. A wiring layer is formed by electrically connecting the conductive wiring layers formed on the surface of the insulating layer, and the wiring layer thus manufactured is repeatedly formed to form a multilayer.

[0008]

However, (1)
In the base + build-up method, photosensitive epoxy resin is often used as the insulating layer. However, the epoxy resin originally has a low glass transition point and is made photosensitive to increase the water absorption rate, and it is insulated when left at high temperature and high humidity. There is a problem that reliability decreases, such as deterioration of reliability. In addition, the surface of the core substrate has irregularities corresponding to the thickness of the conductor wiring layer formed of copper foil, and the photosensitive resin used in the build-up method is in a liquid state. The unevenness was also reflected on the surface of the finished substrate, which was not suitable for mounting on a silicon chip such as a flip chip. Further, in a temperature cycle test or a high-temperature and high-humidity test, peeling was likely to occur at the interface between the core substrate and the insulating layer of the build-up layer.

Various solutions to the above problem have been proposed, and are described in Electronics Packaging Technology Magazine 1998, 1 (V
ol. 14 No. 1) describes a method for producing a smooth build-up substrate by transferring a circuit pattern formed on a stainless steel plate by a pattern plating method using a lamination press. However, the chemical bonding between the core substrate and the insulating resin of the build-up layer has not been improved, and there has been a problem in reliability.

In the above (2) all-layer build-up method, a via conductor is formed by filling a conductive paste into a through hole, but the via conductor is oxidized in a reliability test such as leaving at a high temperature, and the electric resistance is lowered. There is a problem that rises. Also, a multilayer wiring board in which a conductor wiring layer is buried in the surface of the insulating layer to achieve a flat surface has been proposed.
Even in a wiring board in which such a conductive wiring layer is buried, the adhesion between the buried side surface of the conductive wiring layer and the organic resin in the insulating layer is not sufficient, and moisture is generated from the interface between the conductive wiring layer and the insulating layer. There is a problem in that the via conductor invades and oxidizes the via conductor to increase the resistance.

An object of the present invention is to solve the above-mentioned problems in the conventional multilayer wiring board, and more specifically, to improve the adhesion between the conductive wiring layer and the insulating layer, To provide a highly reliable multilayer wiring board that prevents moisture penetration from the interface between the layer and the insulating layer and that does not change the resistance of the via conductor even in a high-humidity environment, and a manufacturing method that can easily manufacture this. It is intended to do so.

[0012]

According to the present invention, there is provided a multilayer wiring board comprising at least an insulating layer containing a thermosetting resin, a conductive wiring layer buried on the surface of the insulating layer, and a through-hole for connecting the conductive wiring layers. A via conductor filled with a conductor component containing a metal powder in a hole, wherein the surface roughness (Ra) of at least the surface of the conductor wiring layer on at least the surface of the multilayer wiring board is 0.2 μm or more and the insulating layer Characterized by the presence of an organic substance containing a hydrophilic group and a hydrophobic group at the interface with. More specifically, the water absorption of the thermosetting resin of the insulating layer is 0.5% or less, the conductive wiring layer is obtained by etching a metal foil, and the conductive wiring layer embedded in the insulating layer is It is an inverted trapezoid and the formation angle (θ) is 45 ° to 80 °.

Further, according to the method for manufacturing a multilayer wiring board of the present invention, (a) a step of adhering a metal foil to a resin film via an adhesive, and (b) the resin film produced by (a) A step of forming a trapezoidal conductor wiring layer having a cross section of 45 ° to 80 ° by applying a resist in a mirror image wiring pattern on the surface of the metal foil and removing the non-resist portion by etching; (C) roughening the trapezoidal side surface of the conductor wiring layer formed by (b) to a surface roughness (Ra) of 0.2 μm or more; and (d).
(C) applying an organic material containing a hydrophilic group and a hydrophobic group to the trapezoidal side surface of the conductor wiring layer after the roughening treatment;
(E) a step of removing the resist on the upper surface of the conductor wiring layer; and (f) a through hole is formed in at least a B-stage-shaped insulating layer containing a thermosetting resin, and a conductor paste containing a metal powder is filled. Forming a via conductor with
(G) After the conductor wiring layer on the surface of the resin film prepared in (a) to (e) is laminated and pressed on the via conductor forming portion on the surface of the insulating layer prepared in (f), the resin film is peeled off and the conductor wiring layer is removed. (A) a step of forming a wiring layer in which a conductor wiring layer is embedded on the surface of the insulating layer, and (h) laminating a plurality of wiring layers prepared in (a) to (g), and curing at once while applying pressure And a step of performing In order to enhance the adhesion, it is preferable that the cross section of the conductor wiring layer formed on the surface of the resin film is a trapezoid having a formation angle (θ) of 45 ° to 80 °.

According to the multilayer wiring board of the present invention, since the conductor wiring layer is embedded so as to be flush with the surface of the insulating layer, the surface of the multilayer wiring board is excellent in smoothness. Further, in the multilayer wiring board of the present invention, the side surface of the buried conductor wiring layer is roughened to have a surface roughness (Ra) of 0.2 μm or more, and an organic substance having a hydrophilic group and a hydrophobic group at the interface with the insulating layer. , The adhesive strength between the insulating layer containing the organic resin and the metal foil interface is strong, there is no intrusion of moisture or the like from the gap between the insulating layer and the conductor wiring layer, and the deterioration of the resistance of the via conductor is small. In addition, the peel strength of the conductor wiring layer can be increased, and a highly reliable multilayer wiring board free from parts loss even when the board falls can be obtained.

Further, according to the manufacturing method of the present invention, since the via conductor for connecting the conductor wiring layers in the above-mentioned multilayer wiring layer is formed by laser irradiation, it is not necessary to use a photosensitive resin, and it is not necessary to use a photosensitive resin. As the layer material, any organic resin insulating material excellent in material properties such as a high glass transition point and a small water absorption can be selected. Further, by applying an organic substance having a hydrophilic group and a hydrophobic group to the interface side of the conductor wiring layer with the insulating layer, the adhesion between the insulating layer containing the organic resin and the metal foil interface can be increased. In addition, since the formation of the insulating layer and the formation of the conductor wiring layer can be performed simultaneously in parallel, the manufacturing process can be simplified and shortened.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A multilayer wiring board according to the present invention will be described with reference to the drawings together with a manufacturing method. FIG. 1 is a schematic diagram for explaining a multilayer wiring board according to the present invention. FIG. 2 is a process chart for explaining an example of a method for manufacturing a multilayer wiring board according to the present invention.

As shown in FIG. 2A, the resin film 1
The metal foil 11 is adhered to the surface of 2 via an adhesive. At this time, it is desirable to use a copper foil as the metal foil 11 in consideration of the ease of forming the wiring thereafter, electric resistance, and the like. Then, a photoresist 13 is further attached to the surface of the metal foil 11 (b). Then, the photoresist 13 is exposed and developed to leave the photoresist 14 on the conductor wiring portion (c). When the photoresist 14 is of a negative type, the processing is easier to perform when the subsequent conductor wiring layer 15 is roughened. Thereafter, the conductor wiring layer 15 is formed by etching the metal foil 11 (d). At this time, it is important that the cross section of the conductive wiring layer 15 formed on the surface of the resin film 12 is formed in a trapezoidal shape, and the angle of formation of the trapezoid is (θ) of 45 ° to 80 °, preferably 50 °. ~ 7
5 ° is good. This is because the peel strength of the conductive wiring layer 15 can be increased when the multilayer wiring board is manufactured by setting the trapezoidal formation angle to 45 ° or more, and when the trapezoid is smaller than 45 °, the peel strength of the conductive wiring layer is reduced. It is because it becomes low. If the angle of formation of the trapezoid is larger than 80 °, the length of the side surface of the conductor wiring layer 15 becomes short, so that moisture penetrates into the interface with the insulating layer and reaches the via conductor 18 quickly. This is because resistance increases faster.

In order to set the trapezoidal formation angle (θ) of the cross section of the conductor wiring layer 15 to 45 ° to 80 °, it is preferable to perform etching at 2 to 50 μm / min, although it varies slightly depending on the type of the metal foil 11.

Next, the side surface of the conductor wiring layer 15 is made to have a surface roughness (R
a) is roughened to 0.2 μm or more. Depending on the type of metal, formic acid, NaClO ₂ , NaOH, Na ₂ PO
_It is preferable to spray or dipping an acidic solution such as ₄ or a mixture thereof, and it is particularly preferable to spray formic acid in that the surface roughness can be finely controlled. If the surface roughness (Ra) of the side surface of the conductor wiring layer 15 is smaller than 0.2 μm, the adhesion to the resin in the insulating substrate becomes low,
The via conductors 18 connected to the conductor wiring layer 15 are easily connected to the conductor wiring layer 15 because the water easily penetrates and the path for the water to penetrate becomes short.
And the peel strength of the conductor wiring layer 15 decreases.

Next, an organic material having a hydrophilic group and a hydrophobic group is applied to at least the side surfaces of the roughened conductor wiring layer 15.
According to the organic substance having a hydrophilic group and a hydrophobic group, the hydrophilic group includes at least one selected from the group consisting of a silanol group, a carboxyl group, and a hydroxyl group, and the hydrophobic group includes a vinyl group, an epoxy group, a methacryl group, At least one selected from the group consisting of an amino group and a mercapto group is exemplified.

As such an organic substance having a hydrophilic group and a hydrophobic group, a silane compound having a hydrophilic group and a hydrophobic group is preferable. In particular, N-phenyl-γ-aminopropyltrimethoxysilane, γ-glycide At least one silane coupling agent selected from the group consisting of xylpropyltrimethoxysilane and N-β (aminoethyl) γ-aminopropyltrimethoxysilane can be suitably used.

The organic substance having a hydrophilic group and a hydrophobic group is
It is desirable to have a boiling point of 250 ° C. or higher. this is,
If the boiling point is lower than 250 ° C., swelling occurs at the interface between the conductor wiring layer 15 and the insulating layer in a soldering heat test or the like, and the conductor wiring layer 15
This is because there is a risk of causing poor adhesion between the via conductor 18 and the insulating layer and an increase in the resistance of the via conductor 18.

After applying an organic material having a hydrophilic group and a hydrophobic group after roughening the side surface of the conductor wiring layer 15, the resist 14 is removed (e). The application of the organic substance may be performed after the resist is removed. However, since the upper and lower surfaces of the conductor wiring layer 15 are connected to the metal-metal connection with the via conductor 18, the upper surface of the conductor wiring layer 15 has a hydrophilic surface. It is better not to apply an organic substance having a group and a hydrophobic group, because the contact resistance with the via conductor 18 can be reduced.

On the other hand, as shown in FIG. 2F, first, an insulating sheet 16 is prepared. The insulating sheet 16 contains an uncured or semi-cured thermosetting resin, and is made of, for example, a thermosetting resin and an inorganic filler. Insulation sheet 16
The thermosetting resin constituting (1) preferably has a water absorption of 0.5% or less, more preferably 0.3% or less. If the water absorption of the thermosetting resin is higher than 0.5%, the resistance of the via conductor 18 increases due to the influence of moisture. Specifically, A-PP
Resins such as E (allylated polyphenylene ether), BT resin (bismaleimide triazine), polyimide resin, and polyamide bismaleimide are desirable. The inorganic filler of the insulating sheet 16 is SiO ₂ , Al ₂ O ₃ , A
1N or the like is preferable, and the average particle size is 20 μm or less, particularly 1 μm.
Substantially spherical powder of 0 μm or less, optimally 7 μm or less is used. Further, in order to impart the strength of the multilayer wiring board, it is desirable to contain a fibrous woven fabric or a nonwoven fabric. In a multilayer structure, it is preferable to use an insulating sheet containing at least one layer containing a fibrous filler. These inorganic fillers have an organic resin: inorganic filler volume ratio of 15: 8.
It is mixed in a ratio range of 5 to 95: 5.

Next, the insulating sheet 1 is irradiated with a laser beam.
The via hole 17 of No. 6 is processed. The processing of the via hole 17 can use CO ₂ , YAG laser or the like. Thereafter, a binder is added to a metal powder containing at least one selected from gold, silver, copper, aluminum, and the like, to produce a conductive paste. Then, the via hole 17 is filled with a conductive paste to form the via conductor 18. It is desirable to use a binder that is non-volatile and reacts with the thermosetting resin in the insulating layer as the binder in the conductive paste. A normal pressure printing machine or the like can also be used as a method for filling the conductive paste, but using a vacuum printing machine can further increase the filling rate.

Thereafter, the mirror-image conductor wiring layer 15 formed on the resin film 12 is transferred to the insulating sheet 16 on which the via conductor 18 is formed by thermocompression bonding. Then, the resin film 12 having the pattern of the conductor wiring layer 15 of the mirror image is laminated on the surface of the B-stage-shaped insulating sheet 16 and 3 kg
After applying a pressure of at least / cm ² , the resin film 12 is peeled off (FIG. 1 (i)), whereby the conductor wiring layer 15 is transferred to the surface of the insulating layer and the conductor wiring layer 15 is transferred to the surface of the insulating layer. And the wiring sheet 19 can be obtained.

Next, a plurality of wiring sheets 19-1 to 19-5 prepared by a method similar to the above (a) to (j).
A plurality of are aligned with each other, and are cured together to provide an insulating layer 1, a conductive wiring layer 2, and a via conductor 3 as shown in FIG. 1, and the conductive wiring layer 2 is embedded in the surface of the insulating layer 1. Thus, a multilayer wiring board having excellent surface flatness can be manufactured.

Further, according to the multilayer wiring board of the present invention, as shown in FIG. 1B, in the conductive wiring layer 2 connected to the via conductor 3, the cross section of the conductive wiring layer 2 has a formation angle (θ ) Is an inverted trapezoidal shape of 45 ° to 80 °, so that the embedding property of the conductor wiring layer 2 in the insulating layer 1 can be improved in such a shape, and the adhesion of the conductor wiring layer 2 to the insulating layer 1 can be improved. Can be increased.

When the surface roughness (Ra) of the side surface of the conductive wiring layer 2 in the inverted trapezoidal shape is 0.2 μm or more, the contact area of the conductive wiring layer 2 with the insulating layer 1 is increased. Conductor wiring layer 2 and insulating layer 1 on the surface of
When moisture invades from the interface with the via conductor, the via conductor 3
The distance to reach is longer.

Further, by allowing an organic substance having a hydrophilic group and a hydrophobic group to be present at the interface between the conductor wiring layer 2 and the insulating layer 1, it is possible to prevent moisture from entering the via conductor 3.

As a result, since the intrusion of moisture through the interface between the conductor wiring layer 2 and the insulating layer 1 which has conventionally occurred can be prevented, the resistance of the via conductor does not change even in a high humidity environment. A highly reliable multilayer wiring board applicable to flip-chip mounting can be obtained.

Further, in the manufacturing method, the processing of the conductor wiring layer and the processing of the insulating layer can be performed in parallel on each layer, and the multilayered insulating resin can be cured at a time. A wiring substrate can be manufactured.

[0033]

EXAMPLES (Production of multilayer wiring board) The following two types of insulating layers were prepared. An allylated polyphenylene ether resin (A-PPE resin) -based and BT resin-based prepreg were prepared on a glass cloth. As a comparative example, an epoxy resin prepreg was prepared.

Further, an A-PPE resin and a BT resin are used, spherical silica is used as an inorganic filler, and a composition in which the volume ratio of the A-PPE resin or the BT resin: the inorganic filler is 50:50 is used. This was formed into an insulating layer in a B-stage state with a thickness of 40 μm by a doctor blade method.

As a comparative example, an epoxy resin was used, and spherical silica was further used as an inorganic filler.
Using the composition shown below, an insulating layer in the B-stage state having a thickness of 40 μm was formed by the doctor blade method as described above.

Through holes are formed in these two types of insulating layers with a CO ₂ laser, and then a powder obtained by coating a copper surface with silver and a binder are mixed, and a conductive paste is filled in the through holes to form via conductors. did.

On the other hand, 12 μm is applied to a 38 μm PET film.
An electrolytic copper foil having a thickness of m was attached to prepare a film with a copper foil for transfer. A dry film resist is stuck on the copper foil surface, exposed, developed with sodium carbonate, and etched with ferric chloride to form a trapezoidal formation angle of 45 ° to 80 °.
The wiring having the formation angle of was formed.

Thereafter, the side surface of the conductor wiring layer is roughened to 0.1 to 0.8 μm with 10% formic acid, and then N-phenyl-γ-aminopropyltrimethoxysilane or N-β (aminoethyl ) Γ-Aminopropyltrimethoxysilane was applied. Thereafter, the resist was stripped off with sodium hydroxide to form a wiring pattern on the PET film.

Thereafter, the pattern formed on the PET film was transferred to the above two kinds of insulating layers at 130 ° C. and 20 kg / cm ² to prepare a wiring sheet.

Four wiring sheets made of an insulating layer containing a glass cloth were superposed on each other to produce a multilayer wiring board having five conductive wiring layers. In addition, two insulating layers each containing a silica filler were superposed on and under the insulating layer made of a glass cloth, and a multilayer wiring board having nine conductive wiring layers was simultaneously manufactured. Thereafter, all the insulating layers were simultaneously cured at 200 ° C. and 20 kg / cm ² .

(Evaluation) In the manufactured multilayer wiring board,
The surface roughness (Ra) of the side surface of the conductor wiring layer was measured by an atomic force microscope (AFM) after the roughening treatment. Further, the formation angle of the trapezoidal conductor wiring was measured by observing the cross section by SEM. The water absorption of the resin is 50 mm x 50 mm,
The cured sheet having a thickness of 1 mm was dried at 50 ° C. for 24 hours, then immersed in water at 23 ° C., and determined by the weight difference.

The prepared multilayer wiring board was heated at 150.degree.
1. High temperature storage test for 00 hours, 130 ° C., 85% RH,
A pressure PCT cooker test was performed at 3 atm for 200 hours.

A daisy chain in which 800 via conductors are connected in series by a conductor wiring layer before and after the above test has a resistance change of 10% or less as a good product, and a daisy chain having a resistance change of more than 10% as a defective product. The substrate was tested.

[0044]

[Table 1]

As shown in Table 1, the cross section has a formation angle of 45 ° or more.
Surface roughness (Ra) of 80 ° inverted trapezoidal type conductor wiring layer side surface
Was set to 0.2 μm or more, and an organic substance having a hydrophilic group and a hydrophobic group was present at the interface with the insulating layer, whereby a multilayer wiring board having no increase in resistance even in a high-temperature storage test or a PCT test could be manufactured. In addition, the multilayer wiring board of the present invention can perform the processing of the insulating layer and the processing of the conductor wiring layer in parallel, and can simultaneously cure the thermosetting resin of the insulating layer, thereby greatly reducing the cycle time. did it.

[0046]

As described in detail above, according to the present invention,
Even in a high humidity environment, the resistance of the via conductors can be prevented from increasing due to the oxidation of the via conductors due to the intrusion of moisture, the reliability of the conductor wiring layer can be improved, and multilayer wiring suitable for flip-chip mounting of semiconductor elements A substrate can be obtained. In addition, according to the manufacturing method of the present invention, the processing of the insulating layer and the processing of the conductor wiring layer can be performed in parallel compared with the conventional build-up method and the like, and the resin of the insulating layer can be cured at a time, so that the cycle time is reduced. It can be greatly reduced.

[Brief description of the drawings]

FIG. 1A illustrates a multilayer wiring board according to the present invention.
It is a schematic sectional view, and (b) a principal part enlarged sectional view.

FIG. 2 is a process diagram illustrating an example of a method for manufacturing a multilayer wiring board according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 insulating layer 2 conductor wiring layer 3 via conductor 11 metal foil 12 resin film 13, 14 resist 15 conductor wiring layer 16 insulating sheet 17 via hole 18 via conductor 19 wiring sheet 19-1 to 19-5 wiring sheet

Claims (7)

[Claims] An insulating layer containing at least a thermosetting resin,
A multilayer wiring board comprising: a conductor wiring layer buried on the surface of the insulating layer; and a via conductor filled with a conductor component containing a metal powder in a through hole for connecting the conductor wiring layers. The cross section of the formed conductor wiring layer has an inverted trapezoidal shape having a formation angle (θ) of 45 ° to 80 °, and the side roughness (Ra) of the side surface of the inverted trapezoidal shape is 0.2 μ
m or more, and an organic substance having a hydrophilic group and a hydrophobic group is present at a contact interface with a side insulating layer. 2. The thermosetting resin of the insulating layer has a water absorption of 0.1.
2. The multilayer wiring board according to claim 1, wherein the content is 5% or less. 3. The multilayer wiring board according to claim 1, wherein the conductive wiring layer is formed by processing a metal foil. 4. The multilayer wiring board according to claim 1, wherein the compound having a hydrophobic group and a hydrophilic group comprises a silane-based compound. 5. A step of (a) adhering a metal foil to a resin film via an adhesive, and (b) a resist in a mirror image wiring pattern on the surface of the metal foil of the resin film produced in (a). Forming a trapezoidal conductor wiring layer having a cross-section angle of 45 ° to 80 ° by removing the non-resist portion by etching, and (c) forming the conductor wiring layer formed by (b). Roughening the trapezoidal side surface of the layer to a surface roughness (Ra) of 0.2 μm or more; (d)
(C) applying an organic material containing a hydrophilic group and a hydrophobic group to the trapezoidal side surface of the conductor wiring layer after the roughening treatment;
(E) a step of removing the resist on the upper surface of the conductor wiring layer; and (f) a through hole is formed in at least a B-stage-shaped insulating layer containing a thermosetting resin, and a conductor paste containing a metal powder is filled. Forming a via conductor with
(G) After the conductor wiring layer on the surface of the resin film prepared in (a) to (e) is laminated and pressed on the via conductor forming portion on the surface of the insulating layer prepared in (f), the resin film is peeled off and the conductor wiring layer is removed. (A) a step of forming a wiring layer in which a conductor wiring layer is embedded on the surface of the insulating layer, and (h) laminating a plurality of wiring layers prepared in (a) to (g), and curing at once while applying pressure A method of manufacturing a multilayer wiring board. 6. The method according to claim 5, wherein the thermosetting resin has a water absorption of 0.5% or less. 7. The method according to claim 5, wherein the compound having a hydrophobic group and a hydrophilic group comprises a silane compound.