JP2002252272A - Glass substrate conveyance device and aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the time required for transferring a substrate and reduce unevenness in exposure. SOLUTION: A chuck moves between an exposure position for exposing substrates 1a, 1b and a transfer position for transferring the substrate. A transfer means transfers the substrate to the chuck in a transfer position. A movable member 12 arranged in the chuck opens a space into which a transfer means 40 or 50 is inserted, in the transfer position, and closes the space into which the transfer means 40 or 50 is inserted, in the exposure position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a liquid crystal display (LCD).
The present invention relates to a substrate transport device for transporting a substrate in the manufacture of an electronic device such as play (play) or the like and an exposure apparatus using the same.

[0002]

2. Description of the Related Art Liquid crystal displays have characteristics of being thin, lightweight and low power consumption, and are widely applied as display devices. In the manufacture of liquid crystal displays, using an exposure device,
This is performed by forming a pattern on a substrate such as glass or a color filter by a photolithography technique. As an exposure device, a photomask (hereinafter, referred to as a lens or a mirror) is used.
There is a projection system in which a pattern of a “mask” is projected onto a substrate, and a proximity system in which a pattern of a mask is transferred by providing a minute gap (proximity gap) between the mask and the substrate. The proximity exposure apparatus is inferior in pattern resolution performance to the projection method, but has a simple configuration of an irradiation optical system and has a high processing capability, and is suitable for mass production.

The proximity exposure apparatus performs exposure by bringing a substrate fixed on a chuck very close to a mask.
Usually, the chuck is mounted on a stage for performing position alignment and gap alignment with the mask, and fixes the substrate by vacuum suction. Removal of the substrate from the chuck is usually
This is performed by a handling arm such as a robot, but is performed at a transfer position distant from the exposure unit where the mask is placed in order to avoid contact between the mask and the substrate. Conventionally, the transfer of the substrate between the chuck and the handling arm at the transfer position is performed by lifting the substrate with a plurality of push-up pins provided on the chuck, inserting the handling arm between the substrate and the chuck, and transferring the substrate. The pin method or the chuck groove method in which a handling arm is inserted into a groove provided on the surface of the chuck to transfer a substrate has been used.

[0004]

In the conventional push-up pin method, the substrate cannot be delivered unless the push-up pins are raised to a height at which the handling arm can be inserted between the surface of the chuck and the substrate. It was long. In addition, since the two-stage delivery of the chuck surface and the push-up pin, and the push-up pin and the handling arm, is performed, there is a problem that a large positional shift occurs at the time of delivery. On the other hand, in the conventional chuck groove method, the reflectance of exposure light differs between the groove portion provided on the surface of the chuck and the other suction portion, and a temperature difference occurs between the space of the groove portion and the other suction portion. Therefore, there is a problem that uneven printing occurs during exposure.

An object of the present invention is to reduce the time required for transferring a substrate. Another object of the present invention is to reduce uneven printing during exposure. A further object of the present invention is to reduce the displacement that occurs when a substrate is transferred.

[0006]

According to the present invention, there is provided a substrate transfer apparatus, comprising: a moving unit for moving a substrate between a processing position for processing a substrate and a transfer position for transferring a substrate; And a transfer means for transferring the transfer means to the transfer means, wherein the transfer means opens a space where the transfer means is inserted at the transfer position,
At the processing position, there is provided a movable portion for closing a space in which the delivery means is inserted.

Further, the exposure apparatus according to the present invention moves an exposure section for exposing a substrate, a transfer means for transferring the substrate at a transfer position remote from the exposure section, and moves between the exposure section and the transfer position. In the delivery position, a space in which the delivery unit is inserted is opened, and in the exposure unit, a moving unit having a movable unit that closes the space in which the delivery unit is inserted is provided.

In the substrate transport apparatus and the exposure apparatus according to the present invention,
At the transfer position, the movable portion of the transfer means opens a space in which the transfer means is inserted, and the substrate is directly transferred between the surface of the transfer means and the transfer means inserted into the transfer means. Then, at the exposure position (exposure section), the movable section of the moving means closes the space in which the transfer means is inserted, thereby reducing the difference in the reflectance of exposure light and the temperature difference on the surface of the moving means.

[0009] The moving means of the substrate transfer apparatus and the exposure apparatus of the present invention comprises first and second chuck sections which move down or rise at the transfer position and rise or fall at the exposure position (exposure section). be able to.

Further, the chuck of the substrate transfer apparatus and the exposure apparatus according to the present invention has a chuck portion having a groove as a space into which a transfer means is inserted on the surface, and lowers and opens the groove at the transfer position to open the exposure position (exposure position). Part) can be configured by a groove contact which rises to close the groove.

[0011]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 7 is a configuration diagram of an exposure apparatus according to an embodiment of the present invention. The exposure apparatus according to the present embodiment includes an exposure apparatus main body 30 including a chuck 10 for fixing a substrate and an exposure unit 20 for exposing the substrate, and a chuck 1.
The supply arm 40 supplies a substrate to the chuck 10, a recovery arm 50 that recovers the substrate from the chuck 10, a supply conveyor 60, a supply buffer 70, a recovery buffer 80, and a recovery conveyor 90. The actual exposure apparatus includes a mask changer for automatically changing the mask of the exposure unit 20 and a temperature control unit for controlling the temperature in the apparatus. However, in the present embodiment, parts not directly related to the present invention are omitted. It is. FIG. 7 shows a state where the chuck 10 is at a transfer position where the chuck 10 transfers the substrate.

In FIG. 7, a substrate to be exposed to form a pattern is supplied from a loader (not shown) to a supply conveyor 60 in a direction shown by an arrow. Supply conveyor 60
Has a plurality of rollers 61 and transports the substrate supplied from the loader to the supply buffer 70. Supply buffer 70
Has a plurality of rollers 71, has a groove into which the supply arm 40 is inserted, and is configured to be movable up and down. The substrate conveyed from the supply conveyor 60 is supplied to the supply buffer 70.
Is temporarily held.

The supply arm 40 has two arms for holding a substrate, and is configured to be movable between a supply buffer 70 and a transfer position. In a state where the supply arm 40 is inserted into the groove of the supply buffer 70 as shown by a solid line in FIG. 7, the supply buffer 70 descends in the depth direction of the drawing and transfers the held substrate to the supply arm 40. The supply arm 40 that has received the substrate moves to the transfer position as indicated by the broken line in FIG.

The chuck 10 is configured to be able to move between the exposure unit 20 and a delivery position. The supply arm 40 that has moved to the transfer position transfers the substrate to the chuck 10 that has moved to the transfer position. The chuck 10 that has received the substrate from the supply arm 40 at the transfer position moves to the exposure unit 20. When the exposure is completed in the exposure unit 20, the chuck 10 moves to the delivery position.

The collection arm 50 has two arms for holding a substrate, and is configured to be movable between a transfer position and a collection buffer 80. The collection arm 50 waiting at the transfer position as shown by the broken line in FIG. 7 receives the substrate from the chuck 10 moved to the transfer position, and
Move to the position of the collection buffer 80 as shown by the solid line in FIG.

The collection buffer 80 has a plurality of rollers 81, has a groove into which the collection arm 50 is inserted, and is configured to be movable up and down. The collection buffer 80 is lowered in the depth direction of the drawing and stands by. When the collection arm 50 moves to the position of the collection buffer 80, the collection buffer 80 moves up and receives the substrate from the collection arm 50. The collection buffer 80 conveys the substrate received from the collection arm 50 to the collection conveyor 90. The recovery conveyor 90 has a plurality of rollers 91 and transports the substrate transported from the recovery buffer 80 to an unloader (not shown) in the direction shown by the arrow.

FIG. 1 is a diagram for explaining the operation of the substrate transfer apparatus according to one embodiment of the present invention. FIG. 2 is a perspective view of the substrate transfer device according to one embodiment of the present invention. The substrate transfer apparatus according to the present embodiment includes a chuck 10 for vacuum-sucking and fixing a substrate 1a, and a next substrate 1b attached to the chuck 10.
And a recovery arm 50 that recovers the substrate 1a from the chuck 10. The chuck 10 according to the present embodiment includes a movable part chuck 1 that moves down at the transfer position and rises at the exposure position with the fixed part chuck 11.
And 2.

FIG. 2 shows a state where the chuck 10 is at an exposure position where the substrate is exposed, the supply arm 40 is at the position of the supply buffer 70 in FIG. 7, and the collection arm 50 is at a transfer position where the substrate is transferred. In FIG. 2, a chuck 10 is mounted on a stage 13 for performing position alignment and gap alignment with a mask. As the stage 13 moves on the guide 14, the chuck 10 moves between the exposure position and the delivery position. Although a linear motor or the like is used as the driving means, it is not shown.

On the other hand, the supply arm 40 and the recovery arm 50
Is connected to the arm 45. The arm 45 moves along a guide 46 provided on a support member 47, and accordingly, the supply arm 40 and the recovery arm 50 move up and down. In addition, the arm 45 moves left and right as the base 48 fixing the support member 47 moves on the guide 44. Accordingly, the supply arm 40 moves between the supply buffer 70 and the transfer position in FIG. 7, and the collection arm 50 moves between the transfer position and the collection buffer 80 in FIG. In addition, although a feed screw or the like connected to a motor is used as these driving means, illustration is omitted.

First, the operation of collecting the substrate will be described.
In FIG. 1, at the end of the exposure, the chuck that has vacuum-sucked the substrate 1a is at the exposure position (FIG. 1A). At this time, the movable part chuck 12 is at the raised position,
The space where 0 is inserted is closed. Next, the chuck moves to the transfer position. (FIG. 1 (b)). At this time, the movable part chuck 12 is in the lowered position,
The space in which 0 is inserted is opened, and the collection arm 50 is inserted. Then, after the vacuum suction of the chuck is released, the collection arm 50 is raised and the substrate 1 is moved from the fixed portion chuck 11.
a is scooped up (FIG. 1 (c)).

Subsequently, the supply operation of the substrate will be described. The supply arm 40 holding the next substrate 1b moves to the transfer position. (FIG. 1 (d)). Next, the supply arm 40 is lowered while the vacuum suction of the chuck is started, and the next substrate 1b is lowered onto the fixed portion chuck 11 (FIG. 1).
(E)). At this time, the movable part chuck 12 is at the lowered position, the space into which the supply arm 40 is inserted is opened, and the supply arm 40 is inserted. Then, the next substrate 1b
Is moved to the exposure position (FIG. 1).
(F)). At this time, the movable part chuck 12 is at the raised position, and the space into which the supply arm 40 is inserted is closed.

As shown in FIGS. 1B and 1E, the movable portion chuck 12 is provided with a stopper portion 12a, and the fixed portion chuck 11 is provided with a stopper portion 11a. When the movable part chuck 12 is at the raised position at the exposure position as shown in FIGS. 1A and 1F, the stopper part 12a comes into contact with the stopper part 11a and the upper surface of the movable part chuck 12 And the upper surface of the fixed portion chuck 11 are configured to be flush with each other.

In the present embodiment, the central part of the chuck is the fixed part chuck and the peripheral part of the chuck is the movable part chuck. However, the central part of the chuck is the movable part chuck and the peripheral part of the chuck is the fixed part chuck. , The movable part chuck at the center of the chuck rises at the transfer position,
At the exposure position, the structure may be lowered. Also, both the central and peripheral chucks are movable chucks, and the central chuck is raised and the peripheral chuck is lowered at the transfer position, and conversely, the central chuck is lowered at the exposure position and the peripheral The configuration may be such that the chuck rises.

FIG. 3 is a diagram for explaining the operation of a substrate transfer apparatus according to another embodiment of the present invention. FIG. 4 is a perspective view of a substrate transfer apparatus according to another embodiment of the present invention. 3 and 4, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted. This embodiment differs from the embodiment shown in FIGS. 1 and 2 in that
The point is that the supply arm 40 and the collection arm 50 are configured to move independently.

In FIG. 4, the supply arm 40 moves up and down along a guide 41 provided on a support member 42. The supply arm 40 moves between the supply buffer 70 and the transfer position in FIG. 7 by the movement of the base 43 that fixes the support member 42 on the guide 44. Note that a feed screw or the like connected to a motor is used as the driving means, but is not shown. On the other hand, the collection arm 50
Moves up and down along a guide 51 provided on a support member 52. Further, a base 5 for fixing the support member 52 is provided.
3 moves on the guide 44, the collection arm 5
0 moves between the transfer position and the collection buffer 80 in FIG. Note that a belt connected to a motor or the like is used as the driving unit, but is not illustrated. FIG. 4 shows a state in which the chuck 10 is in the exposure position, the supply arm 40 is in the position of the supply buffer 70 in FIG. 7, and the collection arm 50 is in the delivery position. Supply arm 40 holding substrate 1b
Moves to the delivery position.

FIG. 3 shows a state in which the chuck has moved to the transfer position, the recovery arm 50 has been lifted, and the substrate 1 a has been scooped up from the fixed portion chuck 11. At this time,
The supply arm 40 that moves independently of the collection arm 50,
The next substrate 1b has already been held and is waiting above the collection arm 50. Then, when the collection arm 50 moves to the collection buffer 80 in FIG. 7, the supply arm 40 descends and lowers the next substrate 1b onto the fixed portion chuck 11.

According to the present embodiment, there is no need to wait for the supply arm 40 holding the next substrate 1b to move to the transfer position after the collection arm 50 collects the substrate 1a, so that the time required for the transfer is eliminated. Can be further shortened.

In the present embodiment described above, various methods can be used to move the movable portion chuck 12 up and down. For example, the movable part chuck 12 is fixed part chuck 11
May be configured to move up and down along a guide provided in the above, and a feed screw or the like connected to a motor may be used as the driving means. The lowering and raising operations of the movable part chuck 12 may be performed in a state where the chuck 10 is at the exposure position. However, by performing the operation while the chuck 10 moves between the exposure position and the transfer position, the time required for transfer is reduced. It can be even shorter.

FIG. 5 is a diagram for explaining the operation of a substrate transfer apparatus according to still another embodiment of the present invention. FIG. 6 is a partial cross-sectional side view of a substrate transfer apparatus according to still another embodiment of the present invention. In the present embodiment, the chuck includes a fixed part chuck 15 having a groove on the surface into which the supply arm 40 or the recovery arm 50 is inserted, a groove which is lowered at the transfer position to open the groove, and which is raised at the exposure position to close the groove. Hit 15
a.

In FIG. 6, the rod of the air cylinder 16 is connected to the groove contact 15a, and the groove contact 15a is raised and lowered by driving the air cylinder 16. FIG.
(A) has shown the state where the groove contact 15a rose.
A stopper 17 is provided on the rod of the air cylinder 16.
Are in contact with the lower surface of the fixed portion chuck 15 so that the upper surface of the groove contact 15a and the upper surface of the fixed portion chuck 15 are flush with each other. FIG. 6B shows a state where the groove contact 15a is lowered.

First, the operation of collecting the substrate will be described.
In FIG. 5, at the end of exposure, the chuck that has vacuum-sucked the substrate 1a is at the exposure position (FIG. 5A). At this time, the groove contact 15a is at the raised position,
The groove provided with the collecting arm 50 is closed. Next, the chuck moves to the transfer position. (FIG. 5
(B)). At this time, the groove contact 15a is at the lowered position, the groove into which the collection arm 50 is inserted is opened, and the collection arm 50 is inserted. Then, after the vacuum suction of the chuck is released, the recovery arm 50 is lifted to scoop up the substrate 1a from the fixed part chuck 15 (FIG. 5C).

Subsequently, the supply operation of the substrate will be described. The supply arm 40 holding the next substrate 1b moves to the transfer position. (FIG. 5 (d)). Next, the supply arm 40 descends while the vacuum suction of the chuck is started, and the next substrate 1b is lowered onto the fixed portion chuck 15 (FIG. 5).
(E)). At this time, the groove contact 15a is at the lowered position, the groove into which the supply arm 40 is inserted is opened, and the supply arm 40 is inserted. Then, the chuck having vacuum-sucked the next substrate 1b moves to the exposure position (FIG. 5 (f)).
At this time, the groove contact 15a is at the raised position, and the groove into which the supply arm 40 is inserted is closed.

The lowering and raising operations of the groove contact 15a may be performed in a state where the chuck is at the exposure position. However, by performing the operation while the chuck moves between the exposure position and the transfer position, the time required for transfer is reduced. It can be even shorter.

In this embodiment, the case where the supply arm 40 and the recovery arm 50 move together as in the embodiment of FIGS. 1 and 2 has been described. However, this embodiment is similar to the embodiment of FIGS. The supply arm 40 and the recovery arm 50 may be configured to move independently. In this case, if the supply arm 40 is made to wait above the collection arm 50 at the delivery position as in FIG. 3, it is not necessary to wait while the supply arm 40 moves to the delivery position, and the time required for delivery can be further reduced. Can be.

[0035]

According to the substrate transfer apparatus and the exposure apparatus of the present invention, the movable portion of the chuck opens the space where the transfer means is inserted at the transfer position, and transfers the substrate directly between the surface of the chuck and the transfer means. Therefore, the time required for delivery of the substrate can be shortened, and the processing capacity can be improved. Further, according to the substrate transport apparatus and the exposure apparatus of the present invention, at the exposure position (exposure section), the movable portion of the chuck closes the space where the transfer means is inserted, and reduces the difference in the reflectance of exposure light and the temperature difference. Therefore, uneven printing at the time of exposure can be reduced. Furthermore, according to the substrate transfer apparatus and the exposure apparatus of the present invention, the substrate can be directly transferred between the surface of the chuck and the transfer unit, so that the positional shift generated when transferring the substrate can be reduced. .

[Brief description of the drawings]

FIG. 1 is an operation explanatory view of a substrate transfer device according to an embodiment of the present invention.

FIG. 2 is a perspective view of the substrate transfer device according to one embodiment of the present invention.

FIG. 3 is an explanatory diagram of an operation of a substrate transfer device according to another embodiment of the present invention.

FIG. 4 is a perspective view of a substrate transfer apparatus according to another embodiment of the present invention.

FIG. 5 is an operation explanatory view of a substrate transfer apparatus according to still another embodiment of the present invention.

FIG. 6 is a partial sectional side view of a substrate transfer apparatus according to still another embodiment of the present invention.

FIG. 7 is a configuration diagram of an exposure apparatus according to an embodiment of the present invention.

[Explanation of symbols]

1a, 1b: substrate, 10: chuck, 11: fixed portion chuck, 12: movable portion chuck, 15: fixed portion chuck,
15a: groove contact, 16: air cylinder, 20: exposure unit,
Reference numeral 30: exposure apparatus main body, 40: supply arm, 50: collection arm, 60: supply conveyor, 70: supply buffer, 80
... Recovery buffer, 90 ... Recovery conveyor

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/30 509 (72) Inventor Satoshi Takahashi 3-16-3 Higashi, Shibuya-ku, Tokyo Hitachi Electronics Engineering Co., Ltd. In-house F term (reference) 2H097 BA10 DB07 DB11 GA45 LA12 5F031 CA05 FA02 FA07 FA12 FA15 GA02 GA03 GA48 GA49 GA50 GA53 HA13 HA32 HA52 HA57 HA58 HA60 LA08 LA12 LA13 LA15 MA27 PA02 5F046 BA02 CD01 CD04

Claims (10)

[Claims] A transfer means for transferring the substrate between a processing position for processing the substrate and a transfer position for transferring the substrate; and a transfer means for transferring the substrate to the transfer means at the transfer position. The substrate transfer apparatus according to claim 1, wherein the moving unit has a movable unit that opens a space where the transfer unit is inserted at the transfer position and closes a space where the transfer unit is inserted at the processing position. 2. The moving means according to claim 1, wherein the moving means includes a first chuck portion, and a second chuck portion that moves down at the transfer position and rises at the processing position. Substrate transfer device. 3. The moving device according to claim 1, wherein the moving unit includes a first chuck portion, and a second chuck portion that rises at the transfer position and descends at the processing position. Substrate transfer device. 4. The moving means comprises: a first chuck portion that moves down at the transfer position and rises at the processing position; and a second chuck portion that moves up at the transfer position and moves down at the processing position. The substrate transfer device according to claim 1, further comprising: 5. The moving means comprises: a chuck portion having a groove as a space into which the transfer means is inserted on a surface; and a lowering part for opening the groove at the transfer position, and a raising part for the groove at the processing position. The substrate transfer device according to claim 1, further comprising a groove contact for closing the groove. 6. An exposing section for exposing a substrate, a transfer means for transferring the substrate at a transfer position distant from the exposure section, and moving between the exposure section and the transfer position, wherein the transfer is performed at the transfer position. Open the space where the means will be inserted,
An exposing device comprising: a moving unit having a movable unit that closes a space into which the delivery unit is inserted in the exposing unit. 7. The moving means according to claim 6, further comprising a first chuck portion, and a second chuck portion which is lowered at the transfer position and is raised at the exposure portion.
3. The exposure apparatus according to claim 1. 8. The moving means according to claim 6, wherein said moving means includes a first chuck portion, and a second chuck portion which rises at said transfer position and descends at said exposure portion.
3. The exposure apparatus according to claim 1. 9. The moving means includes: a first chuck portion that moves down at the transfer position and rises at the processing position; and a second chuck portion that moves up at the transfer position and moves down at the processing position. The substrate transfer device according to claim 6, further comprising: 10. The moving means includes: a chuck portion having a groove as a space into which the transfer means is inserted on a surface; and a lowering portion at the transfer position to open the groove, and a rising portion at the exposure portion to raise the groove. 7. The exposure apparatus according to claim 6, further comprising: a groove contact for closing.