JP2002252136A - Laminated electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated electronic component which is restrained from releasing heat and prevented from deteriorating in electric properties, even if a heavy current is applied to it. SOLUTION: A three-terminal capacitor 1 (laminated electronic component) is equipped with laminated ground-side internal electrodes 4 and signal-side internal electrodes 5, which are laminated through the intermediary of a ceramic dielectric layer 3 and provided inside a rectangular parallelepiped part body, a ground-side external electrode and a signal-side external electrode provided on the outer surface of the part body, connecting electrodes 11 and 12 which are insulated and separated from the ground-side internal electrodes 4 by a spade 10, provided on the same plane with the ground-side internal electrodes 4, and connected to the signal-side external electrode, and heat-dissipating electrodes 14 and 15 which are insulated and separated from the signal-side internal electrodes 5 by a space 13, provided in the same plane with the signal- side internal electrodes 5, and connected to the ground-side external electrode.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component having a ground electrode and a signal electrode.

[0002]

2. Description of the Related Art A conventional laminated electronic component is disclosed in
There is known a three-terminal capacitor described in JP-A-144997.

FIG. 7 is an exploded perspective view of a conventional laminated electronic component, and FIG. 8 is an external perspective view of the laminated electronic component.

In FIGS. 7 and 8, reference numeral 50 denotes a laminated electronic component. The laminated electronic component 50 has signal-side external electrodes 52 and 53 on both left and right sides of a rectangular parallelepiped sintered component body 51 made of dielectric ceramic. Ground-side external electrodes 54 and 55 are formed on both front and rear sides, and the signal-side external electrodes 52 and 5 are formed.
3 is conducted by a signal side internal electrode 56, and the ground side external electrodes 54 and 55 are conducted by a ground side internal electrode 57. Protective layers 58 are formed on the upper and lower surfaces of the component body 51.
And the signal side external electrodes 52 and 53 are stacked.
And a ground-side external electrode 54 and 55 constitutes a capacitor.

[0005] The operation of the laminated electronic component configured as described above will be described below.

The laminated electronic component 50 constitutes a three-terminal capacitor, and is mounted so that one (or both) of the ground-side external electrodes 54 and 55 is grounded to the ground circuit of the device, and the signal-side external electrode is mounted. By passing a signal current through the signal-side internal electrode 56 using the electrodes 52 and 53 as input / output electrodes, a noise component superimposed on the signal current can be guided to the ground circuit.

[0007]

The laminated electronic component 50
In the case where a large current is applied to the signal-side internal electrode 56 and the signal-side external electrodes 52 and 53, electric resistance is consumed by the resistances of the electrodes and heat is generated. However, since the dielectric constant changes to change the capacitance, there is a problem that the insertion loss characteristic as a noise filter changes.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a laminated electronic component capable of suppressing heat generation even when a large current is applied and preventing deterioration of electric characteristics. .

[0009]

In order to achieve the above object, the present invention has the following arrangement.

[0010] The invention according to claim 1 of the present invention has a ground-side internal electrode and a signal-side internal electrode laminated through a functional material layer inside a rectangular parallelepiped component main body, and has a front face of the component main body. A laminated electronic component having first and second ground-side external electrodes connected to the ground-side internal electrode on the back and signal-side external electrodes connected to the signal-side internal electrode on both side surfaces of the component body In the above, on the same plane as the ground-side internal electrode, a connection countermeasure electrode formed at an interval insulated from the ground-side internal electrode is formed, connected to the signal-side external electrode, and on the same plane as the signal-side internal electrode. A laminated electronic component formed with a heat radiation electrode formed with an interval insulated from the signal side internal electrode and connected to the ground side external electrode, whereby the signal side internal electrode and the signal side external electrode are At the time of baking connection, the connection prevention electrode is also baking-connected at the same time, so that the oxygen concentration in the baking atmosphere with respect to the exposed area of the electrode can be suppressed to a low level to prevent oxidation of the electrode which causes a connection failure, thereby ensuring reliable connection. Since the connection resistance can be reduced, when a large current flows through the signal-side external electrode and the signal-side internal electrode, it is possible to suppress heat generation at this connection portion. Further, heat generated from the signal-side internal electrode is reduced by the signal-side internal electrode. The heat radiation electrode provided on the same plane as the electrode absorbs heat and can radiate heat to the outside of the multilayer electronic component through the ground-side external electrode, thereby suppressing the heat generation of the multilayer electronic component and preventing the deterioration of electrical characteristics. Is obtained.

According to a second aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein the connection prevention electrodes are formed on both sides of the ground-side internal electrode, whereby the signal-side internal electrode is exposed. The oxidation of the end of the electronic component can be prevented and the connection with the signal-side external electrode can be surely made, and the connection resistance on the both side surfaces can be reduced. The operation and effect that heat generation can be suppressed and deterioration of electrical characteristics can be prevented can be obtained.

According to a third aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein the width of the connection prevention electrode is formed to be wider than the width of the opposing ground-side internal electrode. As the exposed area of the electrode is increased, the oxygen concentration in the baking atmosphere is further suppressed to prevent oxidation of the exposed end of the signal-side internal electrode and to reduce the connection resistance with the signal-side external electrode. Therefore, even when a large current is applied, heat generation of the laminated electronic component can be suppressed, and the effect of preventing deterioration of electrical characteristics can be obtained.

The invention according to claim 4 of the present invention is the multilayer electronic component according to claim 1, wherein the width of the signal-side internal electrode is formed wider than the connection countermeasure electrode overlapping via the functional material layer. The connection area between the signal-side internal electrode and the signal-side external electrode is increased, the connection resistance is reduced, and even when a large current is applied, the heat generation of the laminated electronic components can be suppressed and the electrical characteristics can be prevented from deteriorating. Is obtained.

According to a fifth aspect of the present invention, the exposed width of the connection preventing electrode exposed on the surface of the rectangular parallelepiped component body is formed wider than the width of the connection preventing electrode inside the component main body. The exposed area of the connection prevention electrode exposed on the surface of the component body is further increased, and the oxidation of the signal side internal electrode can be reliably prevented and the signal side internal electrode can be connected to the signal side external electrode. Therefore, even when a large current is supplied, the heat generation of the laminated electronic component can be suppressed, and the deterioration of the electrical characteristics can be prevented.

According to a sixth aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein the thickness of the signal-side internal electrode is larger than that of the connection prevention electrode. The effect is obtained that the connection resistance can be reduced by further increasing the connection area of the external electrodes, and the heat generation of the laminated electronic component can be suppressed even when a large current is applied, thereby preventing the deterioration of the electrical characteristics.

According to a seventh aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein the distance between the connection prevention electrode and the ground-side internal electrode layer is formed to be larger than the thickness of the functional material layer. Accordingly, the stray capacitance generated between the connection countermeasure electrode and the ground-side internal electrode layer can be suppressed to a small value, thereby preventing the deterioration of the electric characteristics and securing the insulation characteristics.

According to an eighth aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein the heat radiation electrodes are formed on both sides of the signal side internal electrode. Heat is absorbed by the heat-radiating electrodes on both sides of the signal-side internal electrode, and is radiated to the outside of the multilayer electronic component through the ground-side external electrode. Is obtained.

According to a ninth aspect of the present invention, the heat radiation electrode is arranged outside the ground side internal electrode laminated with a functional material interposed therebetween so as not to overlap. This has the effect of preventing stray capacitance caused by overlapping of the heat dissipation electrode and the ground-side internal electrode and preventing deterioration of electrical characteristics.

According to a tenth aspect of the present invention, the heat radiation electrode is provided in a rectangular shape inside the component body in parallel with the signal side internal electrode, and is connected to the ground side external electrode continuously in the rectangular shape. The multilayer electronic component according to claim 1, wherein the heat generated from the signal-side internal electrode is uniformly absorbed at any position of the signal-side internal electrode, and is radiated to the outside of the component through the ground-side external electrode. However, the effect of suppressing heat generation of the laminated electronic component and preventing deterioration of electrical characteristics can be obtained.

According to the eleventh aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein the exposed width of the heat radiation electrode exposed on the surface of the component body is formed wider than the exposed width of the ground side internal electrode. Yes, this improves the heat conduction at the connection between the heat-radiating electrode and the ground-side external electrode, so that the heat generated at the signal-side internal electrode can be efficiently radiated out of the multilayer electronic component, suppressing the heat generated by the multilayer electronic component. The effect of being able to prevent the deterioration of the electrical characteristics can be obtained.

According to a twelfth aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein the heat radiation electrode is formed to be thicker than the signal side internal electrode. The thermal conductivity of the connection part of the external electrode can be further improved, the heat generated at the signal side internal electrode can be efficiently radiated out of the multilayer electronic component, and the heat generation of the multilayer electronic component is suppressed to prevent changes in electrical characteristics The operation and effect can be obtained.

According to a thirteenth aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein the distance between the heat radiation electrode and the signal side internal electrode is formed larger than the thickness of the functional material layer. In addition, the stray capacitance generated between the heat radiation electrode and the signal side internal electrode can be suppressed to a small value to prevent the deterioration of the electric characteristics, and the effect of securing the insulation distance can be obtained.

According to a fourteenth aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein the functional material layer is a dielectric material and constitutes a capacitor function. The effect of forming a capacitor and exhibiting an excellent effect of absorbing high frequency noise as a noise filter can be obtained.

According to a fifteenth aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein the functional material layer is a varistor material and has a varistor function. The effect that the varistor can be constituted to exhibit the excellent effect of absorbing the surge voltage as a noise filter can be obtained.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described using a three-terminal capacitor as a laminated electronic component.

FIG. 1 is an exploded perspective view of a three-terminal capacitor of the present invention, FIG. 2 is an external perspective view of the three-terminal capacitor, and FIG. 3 is a perspective view of a green chip before forming external electrodes of the three-terminal capacitor. is there.

1 to 3, reference numeral 1 denotes a three-terminal capacitor (multilayer electronic component), which is a ground-side internal electrode laminated as a functional material layer via a ceramic dielectric layer 3 inside a rectangular parallelepiped component body 2. 4 and a signal-side internal electrode 5, ground-side external electrodes 6 and 7 connected to the ground-side internal electrode 4 on the front and back of the component body 2, and the signal on both sides of the component body 2. The signal side external electrodes 8 and 9 connected to the side internal electrode 5 are formed, and the ground side internal electrode 4 is disposed on both sides of the ground side internal electrode 4 on the same plane as the ground side internal electrode 4. The connection-preventing electrodes 11 and 12 formed with an insulating space 10 are formed and connected to the signal-side external electrodes 8 and 9, respectively, on both sides of the signal-side internal electrode 5 on the same plane as the signal-side internal electrode 5. This message Heat radiating electrode provided with extensions 16, 17 are formed with a gap 13 to insulate the side internal electrode 5 1
4 and 15 are formed and connected to the ground-side external electrodes 6 and 7.
9, and a capacitor function is provided between the signal-side external electrodes 8, 9 and the ground-side external electrodes 6, 7.

Further, the width W of the connection preventing electrodes 11 and 12
Is formed wider than the width M of the opposing ground-side internal electrode 4, and the width N of the signal-side internal electrode 5 is set to be equal to the width of the connection-preventive electrode 1 overlapping the ceramic dielectric layer 3 as a functional material layer.
1 and 12 are formed wider than the widths W and P, and the exposed width P of the connection prevention electrodes 11 and 12 exposed on the surface of the rectangular parallelepiped component body 2
To the width W of the connection prevention electrodes 11 and 12 inside the component body 2.
Formed more widely.

Further, the thickness of the signal side internal electrode 5 is made larger than that of the connection preventing electrodes 11 and 12, and
The space 10 between the ground electrode 2 and the ground-side internal electrode 4 is formed to be larger than the thickness of the ceramic dielectric layer 3 serving as a functional material layer.

The heat-dissipating electrodes 14 and 15 are disposed outside the ground-side internal electrodes 4 laminated via the ceramic dielectric layer 3 and are formed in a rectangular shape inside the component body 2 so as not to overlap. The exposed width L of the heat radiation electrodes 14 and 15 exposed on the surface of the component body 2 is wider than the exposed width K of the ground side internal electrode 4. And the radiation electrode 14,
15 is formed thicker than the signal-side internal electrode 5, and the heat-radiating electrodes 14 and 15 are connected to the ground-side external electrodes 6 and 7, respectively.

The operation of the three-terminal capacitor 1 configured as described above will be described below. When a large signal current flows between the signal-side external electrodes 8 and 9, electric energy is consumed by the resistances of the signal-side internal electrodes 5 and the signal-side external electrodes 8 and 9, thereby generating heat. The heat is absorbed by the heat radiation electrodes 14 and 15 and is radiated to the outside of the three-terminal capacitor 1 via the ground-side external electrodes 6 and 7. Further, the noise component superimposed on the signal current is reduced by the capacitor components composed of the signal-side internal electrode 5 and the ground-side internal electrode 4 to the ground-side external electrodes 6 and 7.
Is removed via

A method of manufacturing the three-terminal capacitor 1 configured as described above will be described below.

First, a green sheet of the ceramic dielectric layer 3 is manufactured by using a known method for manufacturing a three-terminal capacitor. Next, a plurality of green sheets of the manufactured ceramic dielectric layer 3 are laminated to form an upper ineffective layer 18 and a lower ineffective layer 19. Next, a first-layer green sheet of the ceramic dielectric layer 3 is laminated on the lower inactive layer 19, and the first-layer signal-side internal electrode 5 and the heat-radiating electrode 14,
15 is printed.

Next, a green sheet of the second-layer ceramic dielectric layer 3 is laminated thereon, and the second-layer ground-side internal electrodes 4 and connection prevention electrodes 11 and 12 are printed thereon. Further, a green sheet of the third ceramic dielectric layer 3 is laminated thereon, and the signal side internal electrode 5 and the heat radiation electrodes 14 and 15 are printed in the same manner as the first layer, and the fourth layer is formed thereon. The green sheet of the ceramic dielectric layer 3 of the eye is laminated, and the ground side internal electrode 4 and the connection prevention electrodes 11 and 12 are printed similarly to the second layer.

In this manner, the signal side internal electrode 5 and the heat radiation electrode 1 are sequentially placed on the green sheet of the ceramic dielectric layer 3.
4, 15 and the ground-side internal electrodes 4 are printed and laminated in a predetermined number, and then the ineffective layer 18 is laminated and press-laminated on the upper stage to produce a laminated green block (not shown).

Thereafter, the green block of the laminate is
The green chip 20 is cut into a sintered body (not shown) at a predetermined temperature, and the obtained sintered body is chamfered 21 by barrel polishing to obtain the component body 2. Each end of the signal-side internal electrode 5, the heat-radiating electrodes 14, 15 and the ground-side internal electrode 4, and the connection-preventing electrodes 11, 12 formed inside are exposed on the surface of the sintered body of the component body 2. .

Next, the signal-side internal electrode 5, the heat-radiating electrodes 14, 15, the ground-side internal electrode 4, and the connection-preventing electrodes 11, 12 exposed on the surface of the component body 2 are entirely covered. A conductive paste is applied and baked at a predetermined temperature in an oxidizing atmosphere to form ground-side external electrodes 6 and 7 and signal-side external electrodes 8 and 9.

Next, the surfaces of the ground-side external electrodes 6, 7 and the signal-side external electrodes 8, 9 are plated to obtain solderability and corrosion resistance, thereby completing the three-terminal capacitor 1.

The characteristics of the three-terminal capacitor 1 manufactured as described above will be described below. Here, a description will be given using a three-terminal capacitor whose capacitance value is designed to be 22 nF.

FIG. 4 shows a comparison of the heat generation characteristics when a current flows between the three-terminal capacitor 1 described in the present embodiment and the three-terminal capacitor 50 described in the prior art.
FIGS. 5 and 6 show a comparison of the insertion loss characteristics with temperature change.

The heat generation characteristic was determined by soldering a three-terminal capacitor to a predetermined substrate and measuring the heat generation temperature when a DC current was applied between the signal-side external electrodes 8, 9, and 52, 53 using an infrared radiation thermometer (Keyence Corporation). It is measured by the measuring unit IT2-02 / controller IT2-50).

The comparison of the insertion loss characteristics was performed by soldering the three-terminal capacitors 1 and 50 to a predetermined substrate, and changing the temperature of the measurement environment based on the result of (Table 1).
Network analyzer (HEWLETT PACK
ARD 8753ES).

As shown in FIG. 4, the DC current is 1A and 3A.
The exothermic temperature when electricity was supplied was measured. According to it 6
The exothermic temperature ΔT after 0 seconds is 2.1 ° C. at 1 A for the product of the present invention,
The temperature was 17.3 ° C at 3A, whereas the conventional product was 7.2 ° C at 1A and 62.5 ° C at 3A. From this result, it can be seen that the heat generation temperature is proportional to the square of the current flowing, and that the heat generation temperature of the present invention can be suppressed to be lower than that of the conventional product.

As shown in FIG. 5 and FIG.
Based on the results, the product of the present invention is 22 ° C (normal temperature ΔT = 0 ° C)
・ 24 ° C (ΔT = 2 ° C) ・ 39 ° C (ΔT = 17), conventional products 22 ° C (normal temperature ΔT = 0 ° C) ・ 29 ° C (ΔT = 7
C.) · 85 ° C. (ΔT = 63 ° C.), and the insertion loss characteristics were measured. According to this, the product of the present invention has ΔT of 1
It can be seen that the insertion loss characteristic hardly changes up to 7 ° C., whereas the bandwidth and the resonance frequency of the insertion loss characteristic of the conventional product greatly change when ΔT reaches 63 ° C. That is, by suppressing the heat generation temperature, the change in insertion loss can be suppressed to a small value.

As described above, in the three-terminal capacitor 1 of the present embodiment, since the signal-side internal electrodes 5 and the signal-side external electrodes 8 and 9 are securely connected by providing the connection prevention electrodes 12 and 13, The resistance does not increase, and even when a large current flows through the signal-side external electrodes 8 and 9 and the signal-side internal electrode 5, heat generation can be suppressed. Further, by providing the heat radiation electrodes 14 and 15, the heat generated at the signal side electrode absorbs heat from the heat radiation electrodes 14 and 15 and is radiated to the outside of the component through the ground side external electrodes 6 and 7. 2 can be suppressed, and a change in insertion loss characteristics can be prevented.

In the above-described embodiment, the ceramic dielectric layer is used as the functional material layer, but a varistor component is formed by using a varistor layer containing strontium titanate or zinc oxide as a main component instead. It is possible to suppress the self-heating of the varistor component and obtain characteristics excellent in absorbing surge voltage.

[0047]

As described above, the laminated electronic component of the present invention is
Even if a large current is applied to the signal side external electrode and the signal side internal electrode by forming the connection prevention electrode on the same plane as the ground side internal electrode and forming the heat dissipation electrode on the same plane as the signal side internal electrode. The heat generated at the signal side internal electrode can be reduced, and the generated heat is absorbed by the heat dissipation electrode and radiated to the outside through the ground side external electrode. This can be prevented.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a three-terminal capacitor according to an embodiment of the present invention.

FIG. 2 is an external perspective view of the three-terminal capacitor of the embodiment.

FIG. 3 is a perspective view of a green chip of the three-terminal capacitor of the embodiment.

FIG. 4 is a comparison diagram of heat generation characteristics of the three-terminal capacitor according to the embodiment of the present invention and a conventional three-terminal capacitor.

FIG. 5 is a graph showing an insertion loss characteristic of the three-terminal capacitor according to the embodiment of the present invention with a temperature change.

FIG. 6 is a graph showing an insertion loss characteristic of a conventional three-terminal capacitor with a change in temperature.

FIG. 7 is an exploded perspective view of a conventional multilayer electronic component.

FIG. 8 is an external perspective view of a conventional three-terminal capacitor.

[Explanation of symbols]

 1, 50 3-terminal capacitor (multilayer electronic component) 2, 51 Component body 3 Ceramic dielectric layer 4, 57 Ground-side internal electrode 5, 56 Signal-side internal electrode 6, 7, 54, 55 Ground-side external electrode 8, 9, 52, 53 Signal side external electrode 10, 13 Interval 11, 12 Connection prevention electrode 14, 15 Heat radiation electrode 16, 17 Extension 18, 19 Invalid layer 20 Green chip 21 Chamfer

Claims (15)

[Claims] 1. A component body having a ground side and a signal side internal electrode laminated via a functional material layer inside a rectangular parallelepiped component body, and connected to the ground side internal electrode on the front and back surfaces of the component body. The first and second ground-side external electrodes and the signal-side external electrodes connected to the signal-side internal electrodes on both side surfaces of the component body, in the same plane as the ground-side internal electrodes. A connection countermeasure electrode formed at an interval insulated from the ground-side internal electrode is formed thereon, connected to the signal-side external electrode, and provided on the same plane as the signal-side internal electrode with an interval insulated from the signal-side internal electrode. A laminated electronic component in which the formed heat radiation electrode is formed and connected to the ground-side external electrode. 2. The multilayer electronic component according to claim 1, wherein connection prevention electrodes are formed on both sides of the ground-side internal electrode. 3. The multilayer electronic component according to claim 1, wherein the width of the connection prevention electrode is formed larger than the width of the opposing ground-side internal electrode. 4. The multilayer electronic component according to claim 1, wherein the width of the signal-side internal electrode is wider than that of the connection countermeasure electrode overlapping with the functional material layer interposed therebetween. 5. The multilayer electronic component according to claim 1, wherein an exposed width of the connection prevention electrode exposed on the surface of the rectangular parallelepiped component main body is formed wider than a width of the connection prevention electrode inside the component main body. 6. The multilayer electronic component according to claim 1, wherein the thickness of the signal-side internal electrode is larger than that of the connection prevention electrode. 7. The distance between the connection prevention electrode and the ground-side internal electrode layer is formed larger than the thickness of the functional material layer.
3. The laminated electronic component according to item 1. 8. The multilayer electronic component according to claim 1, wherein the heat radiation electrodes are formed on both sides of the signal side internal electrode. 9. The multilayer electronic component according to claim 1, wherein the heat radiation electrode is disposed outside the ground-side internal electrode laminated with the functional material interposed therebetween so as not to overlap. 10. The multilayer electronic component according to claim 1, wherein the heat radiation electrode has a rectangular shape inside the component body and is arranged in parallel with the signal side internal electrode, and is connected to the ground side external electrode continuously in the rectangular shape. 11. The multilayer electronic component according to claim 1, wherein the exposed width of the heat radiation electrode exposed on the surface of the component body is formed wider than the exposed width of the ground side internal electrode. 12. The multilayer electronic component according to claim 1, wherein the heat radiation electrode is formed to be thicker than the signal side internal electrode. 13. The multilayer electronic component according to claim 1, wherein a distance between the heat radiation electrode and the signal side internal electrode is larger than a thickness of the functional material layer. 14. The multilayer electronic component according to claim 1, wherein the functional material layer is a dielectric material and has a capacitor function. 15. The multilayer electronic component according to claim 1, wherein the functional material layer is a varistor material and has a varistor function.